FS3L400R10W3S7F_B11 [INFINEON]
PressFIT;
| 型号： | FS3L400R10W3S7F_B11 |
| 厂家： | 
Infineon |
| 描述： | PressFIT |
| 文件： | 总16页 (文件大小：668K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FS3L400R10W3S7F_B11
™
EasyPACK module
™
™
™
EasyPACK module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and PressFIT / NTC
Features
• Electrical features
- VCES = 950 V
- IC nom = 200 A / ICRM = 300 A
- CoolSiCTM Schottky diode gen 5
- Low switching losses
- TRENCHSTOPTM IGBT7
• Mechanical features
- Integrated NTC temperature sensor
- Al2O3 substrate with low thermal resistance
- PressFIT contact technology
- Compact design
Potential applications
• Three-level applications
• Solar applications
• UPS systems
Product validation
• Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068
Description
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
IGBT, Boost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Diode, Reverse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Diode, Boost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
NTC-Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1
2
3
4
5
6
7
8
9
Datasheet
2
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
1 Package
1
Package
Table 1
Insulation coordination
Symbol Note or test condition
Parameter
Values
3.2
Unit
Isolation test voltage
Internal isolation
Creepage distance
Creepage distance
Clearance
VISOL
RMS, f = 50 Hz, t = 1 min
kV
basic insulation (class 1, IEC 61140)
Al2O3
11.2
6.8
dCreep terminal to heatsink
mm
mm
mm
mm
dCreep terminal to terminal
dClear terminal to heatsink
dClear terminal to terminal
CTI
9.4
Clearance
5.5
Comparative tracking
index
> 400
Relative thermal index
(electrical)
RTI
housing
140
°C
Table 2
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
18
Unit
Min.
Max.
Stray inductance module
Storage temperature
LsCE
nH
°C
Tstg
M
-40
1.3
125
1.5
Mounting torque for
module mounting
- Mounting according to M5, Screw
valid application note
Nm
Weight
G
78
g
Note:
The current under continuous operation is limited to 25A rms per connector pin.
2
IGBT, Boost
Table 3
Maximum rated values
Parameter
Symbol Note or test condition
Values
950
Unit
Collector-emitter voltage
VCES
ICN
Tvj = 25 °C
TH = 65 °C
V
A
Implemented collector
current
200
Continuous DC collector
current
ICDC
ICRM
VGES
Tvj max = 175 °C
120
300
20
A
A
V
Repetitive peak collector
current
tp limited by Tvj op
Gate-emitter peak voltage
Datasheet
3
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
2 IGBT, Boost
Table 4
Characteristic values
Parameter
Symbol Note or test condition
Values
Typ.
1.23
1.27
1.27
5.10
0.45
1.5
Unit
Min.
Max.
Collector-emitter
saturation voltage
VCE sat IC = 45 A, VGE = 15 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
1.48
V
Gate threshold voltage
Gate charge
VGEth
QG
IC = 3.25 mA, VCE = VGE, Tvj = 25 °C
4.35
5.85
V
VGE = 15 V, VCC = 600 V
Tvj = 25 °C
µC
Ω
Internal gate resistor
Input capacitance
RGint
Cies
f = 100 kHz, Tvj = 25 °C, VCE = 25 V, VGE = 0 V
f = 100 kHz, Tvj = 25 °C, VCE = 25 V, VGE = 0 V
12.6
0.039
nF
nF
Reverse transfer
capacitance
Cres
Collector-emitter cut-off
ICES
IGES
tdon
VCE = 950 V, VGE = 0 V
Tvj = 25 °C
0.026 mA
current
Gate-emitter leakage
current
VCE = 0 V, VGE = 20 V, Tvj = 25 °C
100
nA
µs
Turn-on delay time
(inductive load)
IC = 45 A, VCC = 500 V,
VGE = 15 V, RGon = 3.9 Ω
Tvj = 25 °C
0.068
0.078
0.080
0.007
0.008
0.009
0.198
0.263
0.280
0.043
0.089
0.097
0.473
0.544
0.557
1.14
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Rise time (inductive load)
tr
tdoff
tf
IC = 45 A, VCC = 500 V,
VGE = 15 V, RGon = 3.9 Ω
µs
µs
Turn-off delay time
(inductive load)
IC = 45 A, VCC = 500 V,
VGE = 15 V, RGoff = 1.5 Ω
Fall time (inductive load)
IC = 45 A, VCC = 500 V,
VGE = 15 V, RGoff = 1.5 Ω
µs
Turn-on energy loss per
pulse
Eon
Eoff
RthJH
IC = 45 A, VCC = 500 V,
Lσ = 35 nH, VGE = 15 V,
RGon = 3.9 Ω, di/dt =
4000 A/µs (Tvj = 150 °C)
mJ
mJ
K/W
Turn-off energy loss per
pulse
IC = 45 A, VCC = 500 V,
Lσ = 35 nH, VGE = 15 V,
RGoff = 1.5 Ω, dv/dt =
3200 V/µs (Tvj = 150 °C)
1.95
2.19
Thermal resistance,
junction to heat sink
per IGBT, λgrease = 3.3 W/(m·K)
0.433
(table continues...)
Datasheet
4
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
3 Diode, Reverse
Table 4
(continued) Characteristic values
Parameter
Symbol Note or test condition
Values
Typ.
Unit
Min.
Max.
Temperature under
switching conditions
Tvj op
-40
150
°C
3
Diode, Reverse
Table 5
Maximum rated values
Parameter
Symbol Note or test condition
Values
Unit
Repetitive peak reverse
voltage
VRRM
Tvj = 25 °C
1200
V
Continuous DC forward
current
IF
75
A
A
Repetitive peak forward
current
I2t - value
IFRM
I2t
tP = 1 ms
150
tP = 10 ms, VR = 0 V
Tvj = 125 °C
Tvj = 175 °C
453
392
A²s
Table 6
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
1.72
Unit
Min.
Max.
Forward voltage
VF
IF = 75 A, VGE = 0 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 175 °C
2.10
V
1.59
1.52
Thermal resistance,
junction to heat sink
RthJH
Tvj op
per diode, λgrease = 3.3 W/(m·K)
0.933
K/W
°C
Temperature under
switching conditions
-40
175
Note:
Tvj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN
2018-14.
4
Diode, Boost
Table 7
Maximum rated values
Parameter
Symbol Note or test condition
Values
Unit
Repetitive peak reverse
voltage
VRRM
Tvj = 25 °C
1200
V
(table continues...)
Datasheet
5
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
5 NTC-Thermistor
Table 7
(continued) Maximum rated values
Parameter
Symbol Note or test condition
Values
Unit
Continuous DC forward
current
IF
60
A
Repetitive peak forward
current
I2t - value
IFRM
I2t
tP = 1 ms
120
A
tP = 10 ms, VR = 0 V
Tvj = 125 °C
Tvj = 150 °C
472
450
A²s
Table 8
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
1.38
Unit
Min.
Max.
Forward voltage
VF
IRM
Qr
IF = 45 A, VGE = 0 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
1.58
V
1.52
1.60
Peak reverse recovery
current
VCC = 500 V, IF = 45 A,
VGE=-15 V, -diF/dt = 4000
A/µs (Tvj = 150 °C)
46.2
A
46.2
46.2
Recovered charge
VCC = 500 V, IF = 45 A,
VGE=-15 V, -diF/dt = 4000
A/µs (Tvj = 150 °C)
1.27
µC
mJ
1.27
1.27
Reverse recovery energy
Erec
VCC = 500 V, IF = 45 A,
VGE=-15 V, -diF/dt = 4000
A/µs (Tvj = 150 °C)
0.128
0.128
0.128
0.689
Thermal resistance,
junction to heat sink
RthJH
Tvj op
per diode, λgrease = 3.3 W/(m·K)
K/W
°C
Temperature under
switching conditions
-40
150
5
NTC-Thermistor
Table 9
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
5
Unit
Min.
Max.
Rated resistance
Deviation of R100
Power dissipation
R25
ΔR/R
P25
TNTC = 25 °C
kΩ
%
TNTC = 100 °C, R100 = 493 Ω
TNTC = 25 °C
-5
5
20
mW
K
B-value
B25/50 R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]
3375
(table continues...)
Datasheet
6
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
5 NTC-Thermistor
Table 9
(continued) Characteristic values
Parameter
Symbol Note or test condition
Values
Typ.
Unit
Min.
Max.
B-value
B-value
B25/80 R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]
B25/100 R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]
3411
K
K
3433
Note:
Specification according to the valid application note.
Datasheet
7
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
6 Characteristics diagrams
6
Characteristics diagrams
Output characteristic (typical), IGBT, Boost
Output characteristic field (typical), IGBT, Boost
IC = f(VCE)
IC = f(VCE)
VGE = 15 V
Tvj = 150 °C
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Transfer characteristic (typical), IGBT, Boost
IC = f(VGE)
Capacity characteristic (typical), IGBT, Boost
C = f(VCE)
VCE = 20 V
f = 100 kHz, VGE = 0 V, Tvj = 25 °C
90
80
70
60
50
40
30
20
10
0
100
10
1
0.1
0.01
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0
10 20 30 40 50 60 70 80 90 100
Datasheet
8
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
6 Characteristics diagrams
Gate charge characteristic (typical), IGBT, Boost
VGE = f(QG)
Switching losses (typical), IGBT, Boost
E = f(IC)
IC = 200 A, Tvj = 25 °C
RGoff = 1.5 Ω, RGon = 3.9 Ω, VCC = 500 V, VGE = 15 V
15
10
5
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
-5
-10
-15
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
0
15
30
45
60
75
90
Switching losses (typical), IGBT, Boost
E = f(RG)
Switching times (typical), IGBT, Boost
t = f(IC)
IC = 45 A, VCC = 500 V, VGE = 15 V
RGoff = 1.5 Ω, RGon = 3.9 Ω, VCC = 500 V, VGE = 15 V, Tvj =
150 °C
3.00
2.75
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
10
1
0.1
0.01
0.001
0
5
10
15
20
25
30
35
40
0
15
30
45
60
75
90
Datasheet
9
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
6 Characteristics diagrams
Switching times (typical), IGBT, Boost
t = f(RG)
Reverse bias safe operating area (RBSOA), IGBT, Boost
IC = f(VCE)
IC = 45 A, VCC = 500 V, VGE = 15 V, Tvj = 150 °C
RGoff = 1.5 Ω, VGE = 15 V, Tvj = 150 °C
10
350
300
250
200
150
100
50
1
0.1
0.01
0.001
0
0
5
10
15
20
25
30
35
40
0
100 200 300 400 500 600 700 800 900 1000
Transient thermal impedance , IGBT, Boost
Forward characteristic (typical), Diode, Reverse
Zth = f(t)
IF = f(VF)
1
150
135
120
105
90
75
0.1
60
45
30
15
0
0.01
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25
0.001
0.01
0.1
1
10
Datasheet
10
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
6 Characteristics diagrams
Transient thermal impedance, Diode, Reverse
Forward characteristic (typical), Diode, Boost
Zth = f(t)
IF = f(VF)
10
90
80
70
60
50
40
30
20
10
1
0.1
0
0.01
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
0.001
0.01
0.1
1
10
Switching losses (typical), Diode, Boost
Erec = f(IF)
Switching losses (typical), Diode, Boost
Erec = f(RG)
RGon = 3.9 Ω, VCC = 500 V
IF = 45 A, VCC = 500 V
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0
10
20
30
40
50
60
70
80
90
0
5
10
15
20
25
30
35
40
Datasheet
11
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
6 Characteristics diagrams
Transient thermal impedance, Diode, Boost
Zth = f(t)
Temperature characteristic (typical), NTC-Thermistor
R = f(TNTC
)
1
100000
10000
1000
0.1
100
0.01
0
25
50
75
100
125
150
175
0.001
0.01
0.1
1
10
Datasheet
12
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
7 Circuit diagram
7
Circuit diagram
Figure 1
8
Package outlines
dimensioned for EJOT Delta PT WN5451 25
choose length according to pcb thickness
max. screw-in depth 8,5mm
4x
r
e
h
s
a
4x P3,5
pcb hole pattern
(P4,2)
w
d
a
e
h
w
26
24
e
DC1+
DC1N
DC1-
DC2-
DC2N
DC2+
r
c
s
20,8
17,6
14,4
11,2
8
o
t
1
,
g
0
n
i
2
14
B
d
GA2
EA2
BSTC-
EC2
GC2
1
r
4
,
P
o
5
c
x
c
P
2
a
BSTA+
x
2
4,8
1,6
5
BSTA-
NTC1
NTC2
4
,
0
0
B
0
2
6
GA1
EA1
EB1
4,8
8
EC1 GC1
GB1
14
)
4
17,6
20,8
24
,
3
P
(
26
BSTB+
BSTB- EB2 GB2
BSTC+
0
3
3
4
4
,
,
7
7
4
4
0
3
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
3
0
8
6
2
0
8
6
2
0
0
2
6
8
0
2
6
8
0
4
4
4
4
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
(99,3 B0,1) Distance of threaded holes in heatsink
6
2
9
3
0
6
3
7
7
3
6
0
3
9
2
6
0
4
4
0
4
4
1
1
1
1
1
1
3
3
2
2
2
2
2
2
3
3
4
4
109,85B0,45
1
0
- Details about hole specification for contacts refer to AN2009-01 chapter 2
.
9
2
8
- Diameters of drill P1,15mm
3
8
1
- Copper thickness in hole 25~50um
0
0
1
W
,
0
)
2
)
B
1
4
(
2
,
,
6
2
1
1
(
recommended pcb design height
Figure 2
Datasheet
13
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
9 Module label code
9
Module label code
Module label code
Code format
Encoding
Data Matrix
ASCII text
Barcode Code128
Code Set A
23 digits
Symbol size
Standard
16x16
IEC24720 and IEC16022
IEC8859-1
Code content
Content
Digit
1 – 5
6 - 11
12 - 19
20 – 21
22 – 23
Example
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
71549
142846
55054991
15
30
Example
71549142846550549911530
71549142846550549911530
Figure 3
Datasheet
14
Revision 1.00
2022-08-24
FS3L400R10W3S7F_B11
™
EasyPACK module
Revision history
Revision history
Document revision
Date of release Description of changes
0.10
1.00
2022-04-29
2022-08-24
Initial version
Final datasheet
Datasheet
15
Revision 1.00
2022-08-24
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-08-24
Published by
Infineon Technologies AG
81726 Munich, Germany
Important notice
Warnings
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
a written document signed by
©
2022 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-ABD624-002
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
相关型号：
©2020 ICPDF网 联系我们和版权申明