FSL23A0D1 [INFINEON]
Power Field-Effect Transistor, 6A I(D), 200V, 0.35ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-205AF, HERMETIC SEALED, METAL CAN-3;
| 型号： | FSL23A0D1 |
| 厂家： | 
Infineon |
| 描述： | Power Field-Effect Transistor, 6A I(D), 200V, 0.35ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-205AF, HERMETIC SEALED, METAL CAN-3 开关 脉冲 晶体管 |
| 文件： | 总8页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FSL23A0D, FSL23A0R
Data Sheet
December 2001
6A, 200V, 0.350 Ohm, Radiation Hardened,
SEGR Resistant, N-Channel Power
MOSFETs
Features
• 6A, 200V, r
• Total Dose
= 0.350Ω
DS(ON)
The Discrete Products Operation of Fairchild Corporation
has developed a series of Radiation Hardened MOSFETs
specifically designed for commercial and military space
applications. Enhanced Power MOSFET immunity to Single
Event Effects (SEE), Single Event Gate Rupture (SEGR) in
particular, is combined with 100K RADS of total dose
hardness to provide devices which are ideally suited to harsh
space environments. The dose rate and neutron tolerance
necessary for military applications have not been sacrificed.
- Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event
- Safe Operating Area Curve for Single Event Effects
2
- SEE Immunity for LET of 36MeV/mg/cm with
V
V
up to 80% of Rated Breakdown and
of 10V Off-Bias
DS
GS
• Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BV
DSS
- Typically Survives 2E12 if Current Limited to I
The Fairchild portfolio of SEGR resistant radiation hardened
MOSFETs includes N-Channel and P-Channel devices in a
variety of voltage, current and on-resistance ratings.
Numerous packaging options are also available.
DM
• Photo Current
- 3.0nA Per-RAD(Si)/s Typically
• Neutron
This MOSFET is an enhancement-mode silicon-gate power
field-effect transistor of the vertical DMOS (VDMOS)
structure. It is specially designed and processed to be
radiation tolerant. The MOSFET is well suited for
- Maintain Pre-RAD Specifications
for 1E13 Neutrons/cm
2
2
- Usable to 1E14 Neutrons/cm
applications exposed to radiation environments such as
switching regulation, switching converters, motor drives,
relay drivers and drivers for high-power bipolar switching
transistors requiring high speed and low gate drive power.
This type can be operated directly from integrated circuits.
Symbol
D
G
Reliability screening is available as either commercial, TXV
equivalent of MIL-S-19500, or Space equivalent of
MIL-S-19500. Contact Fairchild for any desired deviations
from the data sheet.
S
Ordering Information
Package
TO-205AF
RAD LEVEL SCREENING LEVEL PART NUMBER/BRAND
10K
Commercial
TXV
FSL23A0D1
FSL23A0D3
FSL23A0R1
FSL23A0R3
FSL23A0R4
10K
100K
100K
100K
Commercial
TXV
Space
G
D
S
Formerly available as type TA17697.
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
FSL23A0D, FSL23A0R
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
C
FSL23A0D, FSL23A0R
UNITS
Drain to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
200
200
V
V
DS
Drain to Gate Voltage (R
= 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DGR
GS
Continuous Drain Current
o
T
T
= 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
6
4
A
A
A
V
C
D
D
o
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
C
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
18
20
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Maximum Power Dissipation
o
T
T
= 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
25
10
W
W
C
T
o
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
C
T
o
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulsed Avalanche Current, L = 100µH, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . . . . . .I
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
0.20
18
W/ C
A
A
A
AS
6
S
SM
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
18
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
-55 to 150
300
C
J
STG
o
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
(Distance >0.063in (1.6mm) from Case, 10s Max)
C
L
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
o
Electrical Specifications
T
= 25 C, Unless Otherwise Specified
C
PARAMETER
Drain to Source Breakdown Voltage
Gate Threshold Voltage
SYMBOL
BV
TEST CONDITIONS
= 1mA, V = 0V
MIN
TYP
MAX
-
UNITS
V
I
200
-
DSS
D
GS
o
V
V
I
= V
,
T
T
T
T
T
T
T
= -55 C
-
-
5.0
4.0
-
V
GS(TH)
GS
= 1mA
DS
C
C
C
C
C
C
C
o
D
= 25 C
1.5
-
V
o
= 125 C
0.5
-
-
V
o
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I
V
V
= 160V,
= 0V
= 25 C
-
25
µA
µA
nA
nA
V
DSS
DS
GS
o
= 125 C
-
-
250
100
200
2.21
0.350
0.637
20
o
I
V
=
20V
= 25 C
-
-
GSS
GS
o
= 125 C
-
-
Drain to Source On-State Voltage
Drain to Source On Resistance
V
V
= 12V, I = 6A
-
-
DS(ON)
GS
D
o
r
I
= 4A,
T
T
= 25 C
-
0.280
Ω
DS(ON)12
D
C
V
= 12V
o
GS
= 125 C
-
-
-
Ω
C
Turn-On Delay Time
Rise Time
t
V
= 100V, I = 6A,
-
ns
ns
ns
ns
nC
nC
nC
nC
nC
V
d(ON)
DD
D
R = 16.7Ω, V
= 12V,
L
GS
t
-
-
30
r
R
= 7.5Ω
GS
Turn-Off Delay Time
Fall Time
t
-
-
55
d(OFF)
t
-
-
15
f
Total Gate Charge
Gate Charge at 12V
Threshold Gate Charge
Gate Charge Source
Gate Charge Drain
Plateau Voltage
Q
V
V
V
= 0V to 20V
= 0V to 12V
= 0V to 2V
V
= 100V,
-
-
57
g(TOT)
GS
GS
GS
DD
= 6A
I
D
Q
-
34
-
38
g(12)
g(TH)
Q
-
1.9
6.8
20
Q
-
6.0
18
7
gs
gd
Q
-
V
I
= 6A, V
= 15V
-
-
(PLATEAU)
D
DS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
V
= 25V, V = 0V,
GS
-
750
180
50
-
-
pF
pF
pF
ISS
DS
f = 1MHz
C
C
-
-
OSS
-
-
RSS
o
Thermal Resistance Junction to Case
R
-
5.0
175
C/W
JC
θ
o
Thermal Resistance Junction to Ambient
R
-
-
C/W
JA
θ
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
FSL23A0D, FSL23A0R
Source to Drain Diode Specifications
PARAMETER
Forward Voltage
Reverse Recovery Time
SYMBOL
TEST CONDITIONS
MIN
0.6
-
TYP
MAX
1.8
UNITS
V
V
I
I
= 6A
-
-
SD
SD
t
= 6A, dI /dt = 100A/µs
290
ns
rr
SD
SD
o
Electrical Specifications up to 100K RAD T = 25 C, Unless Otherwise Specified
C
PARAMETER
Drain to Source Breakdown Volts
Gate to Source Threshold Volts
Gate to Body Leakage
SYMBOL
BV
TEST CONDITIONS
= 0, I = 1mA
MIN
MAX
-
UNITS
(Note 3)
V
V
V
V
V
V
200
V
V
DSS
GS
GS
GS
GS
GS
GS
D
(Note 3)
V
= V , I = 1mA
DS
1.5
4.0
GS(TH)
D
(Notes 2, 3)
(Note 3)
I
=
20V, V
= 0V
= 160V
-
-
-
-
100
25
nA
µA
V
GSS
DS
Zero Gate Leakage
I
= 0, V
DS
DSS
Drain to Source On-State Volts
Drain to Source On Resistance
NOTES:
(Notes 1, 3)
(Notes 1, 3)
V
= 12V, I = 6A
2.21
0.350
DS(ON)
D
r
= 12V, I = 4A
Ω
DS(ON)12
D
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both V
= 12V, V
= 0V and V
= 0V, V
= 80% BV
.
DSS
GS
DS
GS
DS
Single Event Effects (SEB, SEGR) (Note 4)
ENVIRONMENT (NOTE 5)
APPLIED
(NOTE 6)
ION
SPECIES
TYPICAL LET
(MeV/mg/cm)
TYPICAL
RANGE (µ)
V
BIAS
MAXIMUM
GS
(V)
TEST
SYMBOL
V
BIAS (V)
DS
Single Event Effects Safe Operating Area
SEESOA
Ni
Br
Br
Br
Br
26
37
37
37
37
43
36
36
36
36
-20
-5
200
200
-10
-15
-20
160
100
40
NOTES:
4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.
2
o
5. Fluence = 1E5 ions/cm (typical), T = 25 C.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
Typical Performance Curves Unless Otherwise Specified
2
2
LET = 26MeV/mg/cm , RANGE = 43µ
LET = 37MeV/mg/cm , RANGE = 36µ
1E-3
2
FLUENCE = 1E5 IONS/cm (TYPICAL)
200
1E-4
ILM = 10A
30A
160
1E-5
120
100A
300A
80
1E-6
40
o
TEMP = 25 C
1E-7
0
10
30
100
DRAIN SUPPLY (V)
300
1000
0
-5
-10
-15
-20
-25
V
(V)
GS
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA
FIGURE 2. DRAIN INDUCTANCE REQUIREDTO LIMIT
GAMMA DOT CURRENT TO I
AS
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
FSL23A0D, FSL23A0R
Typical Performance Curves Unless Otherwise Specified (Continued)
8
100
o
T
= 25 C
C
6
10
4
100µs
1ms
1
2
10ms
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
100ms
0
0.1
-50
0
T
50
100
o
150
1
10
100
1000
, CASE TEMPERATURE ( C)
V
, DRAIN TO SOURCE VOLTAGE (V)
C
DS
FIGURE 3. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
2.5
PULSE DURATION = 250ms, V
GS
= 12V, I = 4A
D
2.0
1.5
1.0
0.5
0.0
12V
Q
G
Q
Q
GD
GS
V
G
-80
-40
0
40
80
120
160
o
T , JUNCTION TEMPERATURE ( C)
CHARGE
J
FIGURE 5. BASIC GATE CHARGE WAVEFORM
10
FIGURE 6. NORMALIZED r
vs JUNCTIONTEMPERATURE
DS(ON)
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
SINGLE PULSE
P
DM
0.01
NOTES:
DUTY FACTOR: D = t /t
t
1
1
2
t
2
PEAK T = P
x Z
+ T
J
DM
θJC
C
0.001
-5
-4
10
-3
10
-2
10
-1
10
0
1
10
10
10
t, RECTANGULAR PULSE DURATION (s)
FIGURE 7. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
FSL23A0D, FSL23A0R
Typical Performance Curves Unless Otherwise Specified (Continued)
30
o
STARTING T = 25 C
J
10
o
STARTING T = 150 C
J
IF R = 0
AV
IF R ≠ 0
t
= (L) (I ) / (1.3 RATED BV
- V
DD
)
AS DSS
t
= (L/R) ln [(I *R) / (1.3 RATED BV
AS
- V ) + 1]
DD
AV
DSS
1
0.01
0.1
1
10
t
,TIME IN AVALANCHE (ms)
AV
FIGURE 8. UNCLAMPED INDUCTIVE SWITCHING
Test Circuits and Waveforms
ELECTRONIC SWITCH OPENS
WHEN I IS REACHED
AS
V
DS
L
BV
DSS
+
CURRENT
TRANSFORMER
I
AS
t
P
-
V
DS
I
AS
V
VARY t TO OBTAIN
DD
P
+
50Ω
REQUIRED PEAK I
AS
V
DD
V
≤ 20V
GS
-
50V-150V
DUT
50Ω
t
P
0V
t
AV
FIGURE 9. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 10. UNCLAMPED ENERGY WAVEFORMS
t
t
ON
OFF
t
d(OFF)
V
DD
t
d(ON)
t
t
f
r
R
L
V
DS
90%
90%
V
DS
V
= 12V
GS
10%
10%
DUT
0V
90%
50%
R
GS
50%
V
GS
10%
PULSE WIDTH
FIGURE 11. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 12. RESISTIVE SWITCHING WAVEFORMS
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
FSL23A0D, FSL23A0R
Screening Information
Screening is performed in accordance with the latest revision in effect of MIL-S-19500, (Screening Information Table).
o
Delta Tests and Limits (JANTXV Equivalent, JANS Equivalent) T = 25 C, Unless Otherwise Specified
C
PARAMETER
Gate to Source Leakage Current
Zero Gate Voltage Drain Current
Drain to Source On Resistance
Gate Threshold Voltage
NOTES:
SYMBOL
TEST CONDITIONS
20V
MAX
UNITS
nA
I
V
V
=
20 (Note 7)
25 (Note 7)
20% (Note 8)
20% (Note 8)
GSS
GS
DS
I
= 80% Rated Value
o
µA
DSS
r
T
= 25 C at Rated I
D
Ω
DS(ON)
C
V
I
= 1.0mA
V
GS(TH)
D
7. Or 100% of Initial Reading (whichever is greater).
8. Of Initial Reading.
Screening Information
TEST
JANTXV EQUIVALENT
= 30V, t = 250µs
JANS EQUIVALENT
Gate Stress
V
V
= 30V, t = 250µs
GS
Optional
MIL-S-19500 Group A,
GS
Required
MIL-S-19500 Group A,
Pind
Pre Burn-In Tests (Note 9)
o
o
Subgroup 2 (All Static Tests at 25 C)
Subgroup 2 (All Static Tests at 25 C)
Steady State Gate
Bias (Gate Stress)
MIL-STD-750, Method 1042, Condition B
MIL-STD-750, Method 1042, Condition B
V
= 80% of Rated Value,
V
= 80% of Rated Value,
GS
= 150 C, Time = 48 hours
GS
T = 150 C, Time = 48 hours
A
o
o
T
A
Interim Electrical Tests (Note 9)
All Delta Parameters Listed in the Delta Tests
and Limits Table
All Delta Parameters Listed in the Delta Tests
and Limits Table
Steady State Reverse
Bias (Drain Stress)
MIL-STD-750, Method 1042, Condition A
MIL-STD-750, Method 1042, Condition A
V
= 80% of Rated Value,
V
= 80% of Rated Value,
DS
= 150 C, Time = 160 hours
DS
T = 150 C, Time = 240 hours
A
o
o
T
A
PDA
10%
5%
Final Electrical Tests (Note 9)
MIL-S-19500, Group A, Subgroup 2
MIL-S-19500, Group A,
Subgroups 2 and 3
NOTE:
9. Test limits are identical pre and post burn-in.
Additional Screening Tests
PARAMETER
Safe Operating Area
SYMBOL
TEST CONDITIONS
= 160V, t = 10ms
MAX
0.46
18
UNITS
A
SOA
V
V
DS
Unclamped Inductive Switching
Thermal Response
I
= 15V, L = 0.1mH
A
AS
GS(PEAK)
∆V
∆V
t
t
= 10ms; V = 25V; I = 1A
60
mV
mV
SD
SD
H
H
H
H
Thermal Impedance
= 500ms; V = 25V; I = 1A
230
H
H
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
FSL23A0D, FSL23A0R
Rad Hard Data Packages - Fairchild Power Transistors
TXV Equivalent
Class S - Equivalents
1. RAD HARD TXV EQUIVALENT - STANDARD DATA
PACKAGE
1. RAD HARD “S” EQUIVALENT - STANDARD DATA
PACKAGE
A. Certificate of Compliance
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
B. Assembly Flow Chart
C. Preconditioning - Attributes Data Sheet
D. Group A
E. Group B
F. Group C
G. Group D
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
E. Preconditioning - Attributes Data Sheet
- Hi-Rel Lot Traveler
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
2. RAD HARD TXV EQUIVALENT - OPTIONAL DATA
PACKAGE
F. Group A
G. Group B
H. Group C
I. Group D
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
A. Certificate of Compliance
B. Assembly Flow Chart
C. Preconditioning - Attributes Data Sheet
- Precondition Lot Traveler
- Pre and Post Burn-In Read and Record
Data
2. RAD HARD MAX. “S” EQUIVALENT - OPTIONAL
DATA PACKAGE
D. Group A
- Attributes Data Sheet
- Group A Lot Traveler
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
E. Group B
- Attributes Data Sheet
- Group B Lot Traveler
- Pre and Post Read and Record Data for
Intermittent Operating Life (Subgroup B3)
- Bond Strength Data (Subgroup B3)
- Pre and Post High Temperature Operating
Life Read and Record Data (Subgroup B6)
E. Preconditioning - Attributes Data Sheet
- Hi-Rel Lot Traveler
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
F. Group C
G. Group D
- Attributes Data Sheet
- Group C Lot Traveler
- Pre and Post Read and Record Data for
Intermittent Operating Life (Subgroup C6)
- Bond Strength Data (Subgroup C6)
- X-Ray and X-Ray Report
F. Group A
G. Group B
H. Group C
I. Group D
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups A2, A3, A4, A5 and A7 Data
- Attributes Data Sheet
- Group D Lot Traveler
- Pre and Post RAD Read and Record Data
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups B1, B3, B4, B5 and B6 Data
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups C1, C2, C3 and C6 Data
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Pre and Post Radiation Data
©2001 Fairchild Semiconductor Corporation
FSL23A0D, FSL23A0R Rev. B
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â
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GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
CROSSVOLT™
DenseTrench™
DOME™
POP™
Power247™
PowerTrenchâ
QFET™
EcoSPARK™
E2CMOSTM
TinyLogic™
QS™
EnSignaTM
TruTranslation™
UHC™
QT Optoelectronics™
Quiet Series™
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STAR*POWER is used under license
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OFANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICESORSYSTEMSWITHOUTTHEEXPRESSWRITTENAPPROVALOFFAIRCHILDSEMICONDUCTORCORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H4
相关型号：
FSL23A0R3
Power Field-Effect Transistor, 6A I(D), 200V, 0.35ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-205AF, HERMETIC SEALED, METAL CAN-3
INFINEON
FSL23A0R4
Power Field-Effect Transistor, 6A I(D), 200V, 0.35ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-205AF, HERMETIC SEALED, METAL CAN-3
INFINEON
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