G300HHCK12P2P [INFINEON]

Insulated Gate Bipolar Transistor, 450A I(C), 1200V V(BR)CES, N-Channel, PLASTIC, INT-A-PAK-2, MODULE-3;
G300HHCK12P2P
型号: G300HHCK12P2P
厂家: Infineon    Infineon
描述:

Insulated Gate Bipolar Transistor, 450A I(C), 1200V V(BR)CES, N-Channel, PLASTIC, INT-A-PAK-2, MODULE-3

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PD-97014B  
HiRelTM INT-A-Pak 2, PLASTIC  
HALF-BRIDGE IGBT MODULE  
G300HHCK12P2  
Product Summary  
V
I
V
CE(SAT)  
Part Number  
CE  
C
G300HHCK12P2  
1200V  
300A  
2.2  
HiRelTM INT-A-Pak 2  
The HiRelTM INT-A-Pak series are isolated near  
hermetic power modules which combine the latest  
IGBT and Soft Recovery Rectifier Technology. The  
module uses both high-speed and low Vce(sat)  
IGBT's packaged for ultra low thermal resistance  
junction to case. The G300HHCK12P2 power  
module consists of six IGBT's and six FRED's in a  
Phase- Leg or Half-Bridge configuration.  
Features:  
n
Rugged, Lightweight near Hermetic Package  
with Integrated Power Terminal Cap  
Gen IV IGBT Technology  
n
n
n
n
n
n
n
Soft Recovery Rectifiers  
Ultra-Low Thermal Resistance  
Zener Gate Protection  
Very Low Conduction and Switching Loss  
-55°C to +125°C Operating Temperature  
Screening to meet the intent of  
MIL-PRF-38534 Class H  
n
n
n
Short Circuit Capability  
2.0 Ohms Series Gate Resistor  
High Altitude Operation, 85,000 Feet Above  
Sea Level at Rated Voltage  
Absolute Maximum Ratings @ Tj=25°C (unless otherwise specified)  
Parameter  
Symbol  
Value  
1200  
±20  
Units  
V
CES  
Collector-to-Emitter Voltage  
Gate-to-Emitter Voltage  
V
V
GE  
Continuous Collector Current @ Tc = 25°C  
Continuous Collector Current @ Tc = 100°C  
Isolation Voltage  
450  
A
I
C
300  
2500  
V
V
ISOL  
RMS  
www.irf.com  
1
01/20/14  
G300HHCK12P2  
Electrical Characteristics @ Tj = 25°C (unless otherwise specified)  
Parameter  
Symbol  
Test Conditions  
Min. Typ. Max. Units  
Off Characteristics  
V
V
V
V
= 0V  
Collector Emitter Breakdown Voltage  
Zero Gate Voltage Collector Current  
Gate Emitter Leakage Current  
1200  
-
-
-
-
V
CES  
GE  
GE  
GE  
I
=0V, V = 1200V  
CE  
-
-
1.0  
10  
mA  
µ
A
CES  
I
= ±15V, V = 0V  
CE  
GES  
On Characteristics  
V
V
V
= V , I = 1.0mA  
Gate Threshold Voltage  
3.5  
-
-
7.5  
2.7  
GE(TH)  
CE  
GE  
GE  
C
V
V
= 15V, I = 300A  
C
Collector Emitter Saturation Voltage  
2.2  
CE(SAT)  
Dynamic Characteristics  
Total Gate Charge  
V
V
= 600V, I = 300A, V = 15V  
-
-
-
-
2300  
44  
-
-
-
-
Qg  
nC  
nF  
CE  
GE  
C
GE  
C
Input Capacitance  
IES  
C
OES  
= 0V, V = 25V, f = 1.0MHz  
CE  
Output Capacitance  
3.0  
0.3  
C
Reverse Transfer Capacitance  
RES  
Switching Inductive Load Characteristics  
Turn-On Delay Time  
td(on)  
tr  
-
-
830  
1000  
ns  
mJ  
ns  
Rise Time  
Turn-On Losses  
300  
100  
400  
-
E
on  
V
R
= 600V, I = 300A, V =15V  
CC  
C
GE  
= 20, R  
=10, L=100µH  
Turn-Off Delay Time  
td(off)  
1900 2200  
G(on)  
G(off)  
Fall Time  
Turn-Off Losses  
tf  
-
-
300  
55  
400  
-
E
mJ  
off  
Diode Characteristics  
V
F
I
= 300A  
Forward Voltage  
-
1.9  
2.2  
V
F
µ
C
A
Reverse Recovery Charge  
Peak Reverse Recovery Current  
Qrr  
Irr  
-
-
15  
90  
20  
-
µ
=600V, I =300A, di/dt =-800A/ s  
C
V
R
Reverse Recovery Time  
trr  
-
500  
800  
ns  
2
www.irf.com  
G300HHCK12P2  
Electrical Characteristics @ Tj = 125°C (unless otherwise specified)  
Parameter  
Symbol  
Test Conditions  
Min. Typ. Max. Units  
Off Characteristics  
V
V
V
V
= 0V  
Collector Emitter Breakdown Voltage  
Zero Gate Voltage Collector Current  
Gate Emitter Leakage Current  
1200  
-
-
-
-
V
CES  
GE  
GE  
GE  
I
=0V, V = 1200V  
CE  
-
-
3.0  
10  
mA  
µ
A
CES  
I
= ±15V, V = 0V  
CE  
GES  
On Characteristics  
V
V
V
= V , I = 1.0mA  
Gate Threshold Voltage  
3.5  
-
-
7.5  
2.7  
GE(TH)  
CE  
GE  
GE  
C
V
V
= 15V, I = 300A  
C
Collector Emitter Saturation Voltage  
2.2  
CE(SAT)  
Diode Characteristics  
V
F
I
= 300A  
F
Forward Voltage  
-
1.9  
2.2  
V
Thermal-Mechanical Specifications  
Parameter  
Symbol  
Min  
-
Max  
Units  
IGBT Thermal Resistance, Junction to Case, per Switch  
Diode Thermal Resistance, Junction to Case, per Switch  
Operating Junction Temperature Range  
Storage Temperature Range  
0.06  
R
°C/W  
thJC  
-
0.10  
150  
T
J
-55  
-55  
°C  
T
125  
STG  
Screw Torque - Mounting  
T
-
-
26  
in-lbs  
g
Screw Torque - Terminals  
Module Weight  
270  
Module Screening  
Test or Inspection  
MIL-STD-883  
Comments  
Method  
2017  
Condition  
Internal Visual  
Temperature Cycle  
Mechanical Shock  
Burn-in  
1010  
B
B
A
10 Cycles, -55°C to +125°C  
1500G, 0.5ms, 5 Times (Y1 direction only)  
160 Hrs @ +125°C  
2002  
1015  
Final Electrical Test  
External Visual  
Group A, -55°C, +25°C, +125°C  
2009  
www.irf.com  
3
G300HHCK12P2  
Schematic  
500  
400  
300  
200  
100  
0
25  
50  
75  
100  
125  
150  
T , Case Temperature (°C)  
C
Fig 1: Maximum Collector Current Vs Case Temperature  
4
www.irf.com  
G300HHCK12P2  
90% Vge  
+Vge  
Vce  
90% Ic  
10% Vce  
Ic  
Ic  
5% Ic  
td(off)  
tf  
t1+5µS  
Eoff = Vce ic dt  
VceIc dt  
t1  
t2  
Fig. 3 - Test Waveforms for Circuit of Fig. 2,  
Fig. 2 - Test Circuit for Measurement of Eon,  
Defining Eoff, td(off), tf  
Eoff, trr, Qrr, Irr, td(on), tr, td(off), tf  
trr  
trr  
GATE VOLTAGE D.U.T.  
Qrr =  
Ic dt  
Ic  
tx  
10% +Vg  
+Vg  
tx  
10% Irr  
10% Vcc  
Vcc  
DUT VOLTAGE  
AND CURRENT  
Vce  
Vpk  
Irr  
10% Ic  
Vcc  
Ipk  
90% Ic  
Ic  
DIODE RECOVERY  
WAVEFORMS  
5% Vce  
tr  
td(on)  
t2  
Eon = Vce Ic dt  
t4  
Erec = V
t1  
Vc Ic dt  
t3  
DIODE REVERSE  
RECOVERY ENERGY  
t1  
t2  
t3  
t4  
Fig. 4 - Test Waveforms for Circuit of Fig. 2,  
Fig. 3 - Test Waveforms for Circuit of Fig. 2,  
Defining Erec, trr, Qrr, Irr  
Defining Eon, td(on), tr  
www.irf.com  
5
G300HHCK12P2  
Case Outline and Dimensions - HiRelTM INT-A-Pak 2  
Notes: 1) All dimensions are in inches  
2) Unless otherwise specified,  
Tolerances .XX = ±0.01, .XXX = ±0.005  
Part Numbering Nomenclature  
G 300 HH C K 12 P2 H  
Screening Level  
P = Unscreened, 25°C Electrical Test  
( Not intended for Qualification)  
H = Screened per MIL-PRF-38534  
IGBT Module - Hirel  
Current Capability  
300 = 300 Amps  
Package Type  
P2 = HiRelTM INT-A-Pak 2,  
2.5" X 4.0" X 1.0"  
Circuit Configuration  
HH = Half Bridge  
Voltage  
12 = 1200V  
Generation  
IGBT / FWD Configuration  
C = GEN 5 (NPT) / GEN 3  
IGBT Speed / SC Capability  
K = Fast, SC Capable  
WORLD HEADQUARTERS: 101 N. Sepulveda Blvd, El Segundo, California 90245, Tel: (310) 252-7105  
IR LEOMINSTER: 205 Crawford St., Leominster, Massachusetts 01453, Tel: (978) 534-5776  
Visit us at www.irf.com for Sales contact information  
Data and specifications subject to change without notice.  
01/2014  
6
www.irf.com  

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