HFA25TB60 [INFINEON]

Ultrafast, Soft Recovery Diode; 超快,软恢复二极管
HFA25TB60
型号: HFA25TB60
厂家: Infineon    Infineon
描述:

Ultrafast, Soft Recovery Diode
超快,软恢复二极管

二极管 软恢复二极管
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中文:  中文翻译
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PD -2.339  
HFA25TB60  
Ultrafast, Soft Recovery Diode  
HEXFREDTM  
Features  
VR = 600V  
VF(typ.)* = 1.3V  
IF(AV) = 25A  
• Ultrafast Recovery  
• Ultrasoft Recovery  
• Very Low IRRM  
• Very Low Qrr  
• Guaranteed Avalanche  
• Specified at Operating Conditions  
Qrr (typ.)= 112nC  
IRRM = 10A  
Benefits  
trr(typ.) = 23ns  
• Reduced RFI and EMI  
• Reduced Power Loss in Diode and Switching  
Transistor  
di(rec)M/dt (typ.) = 250A/µs  
• Higher Frequency Operation  
• Reduced Snubbing  
• Reduced Parts Count  
Description  
International Rectifier's HFA25TB60 is a state of the art ultra fast recovery  
diode. Employing the latest in epitaxial construction and advanced processing  
techniques it features a superb combination of characteristics which result in  
performance which is unsurpassed by any rectifier previously available. With  
basic ratings of 600 volts and 25 amps continuous current, the HFA25TB60 is  
especially well suited for use as the companion diode for IGBTs and MOSFETs.  
In addition to ultra fast recovery time, the HEXFRED product line features  
TO-220AC  
extremely low values of peak recovery current (IRRM) and does not exhibit any  
tendency to "snap-off" during thetb portion of recovery. The HEXFRED features  
combine to offer designers a rectifier with lower noise and significantly lower  
switching losses in both the diode and the switching transistor. These HEXFRED  
advantages can help to significantly reduce snubbing, component count and  
heatsink sizes. The HEXFRED HFA25TB60 is ideally suited for applications in  
power supplies and power conversion systems (such as inverters), motor  
drives, and many other similar applications where high speed, high efficiency  
is needed.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VR  
Cathode-to-Anode Voltage  
600  
V
IF @ TC = 25°C  
IF @ TC = 100°C  
IFSM  
Continuous Forward Current  
Continuous Forward Current  
25  
225  
100  
2.0  
125  
50  
A
Single Pulse Forward Current  
Maximum Repetitive Forward Current  
Maximum Repetitive Avalanche Current  
Maximum Power Dissipation  
IFRM  
IAR  
PD @ TC = 25°C  
PD @ TC = 100°C Maximum Power Dissipation  
W
C
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
* 125°C  
4/2/97  
HFA25TB60  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Test Conditions  
VBR  
VFM  
Cathode Anode Breakdown Voltage  
600 ––– –––  
––– 1.3 1.7  
––– 1.5 2.0  
––– 1.3 1.7  
V
IR = 100µA  
IF = 25A  
IF = 50A  
Max Forward Voltage  
See Fig. 1  
See Fig. 2  
V
IF = 25A, TJ = 125°C  
VR = VR Rated  
––– 1.5  
20  
IRM  
Max Reverse Leakage Current  
µA  
––– 600 2000  
––– 55 100  
TJ = 125°C, VR = 0.8 x VR RatedD Rated  
See Fig. 3  
CT  
LS  
Junction Capacitance  
Series Inductance  
pF  
nH  
VR = 200V  
Measured lead to lead 5mm from  
package body  
––– 8.0 –––  
Dynamic Recovery Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Test Conditions  
trr  
Reverse Recovery Time  
––– 23 –––  
IF = 1.0A, dif/dt = 200A/µs, VR = 30V  
trr1  
trr2  
––– 50  
––– 105 160  
75  
ns TJ = 25°C  
TJ = 125°C  
See Fig. 5, 6 & 16  
IF = 25A  
VR = 200V  
IRRM1  
IRRM2  
Qrr1  
Qrr2  
Peak Recovery Current  
See Fig. 7& 8  
––– 4.5  
––– 8.0  
––– 112 375  
––– 420 1200  
––– 250 –––  
––– 160 –––  
10  
15  
TJ = 25°C  
TJ = 125°C  
TJ = 25°C  
TJ = 125°C  
TJ = 25°C  
TJ = 125°C  
A
Reverse Recovery Charge  
See Fig. 9 & 10  
nC  
dif/dt = 200A/µs  
di(rec)M/dt1 Peak Rate of Fall of Recovery Current  
di(rec)M/dt2 During tb  
A/µs  
See Fig. 11 & 12  
Thermal - Mechanical Characteristics  
Parameter  
Lead Temperature  
Min.  
Typ.  
––––  
––––  
––––  
0.5  
Max.  
300  
1.0  
Units  
°C  
T ‚  
lead  
––––  
––––  
––––  
––––  
––––  
––––  
6.0  
RθJC  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Case to Heat Sink  
K/W  
RθJAƒ  
RθCS„  
80  
––––  
––––  
––––  
12  
2.0  
g
(oz)  
Wt  
Weight  
0.07  
––––  
––––  
Kg-cm  
lbf•in  
Mounting Torque  
5.0  
10  

L=100µH, duty cycle limited by max TJ  
‚
ƒ
„
0.063 in. from Case (1.6mm) for 10 sec  
Typical Socket Mount  
Mounting Surface, Flat, Smooth and Greased  
HFA25TB60  
100  
10  
1
10000  
1000  
100  
10  
T = 150°C  
J
T = 125°C  
J
1
T = 150°C  
J
T = 25°C  
J
T = 125°C  
0.1  
J
A
T = 25°C  
0.01  
J
0
100  
200  
300  
400  
500  
600  
Reverse Voltage - V (V)  
R
Fig. 2 - Typical Reverse Current vs. Reverse  
Voltage  
A
1000  
T = 25°C  
J
100  
A
0.6  
1.0  
1.4  
1.8  
2.2  
2.6  
Forward Voltage Drop - V  
(V)  
FM  
A
10  
Fig. 1 - Maximum Forward Voltage Drop  
1
10  
100  
1000  
vs. Instantaneous Forward Current  
Reverse Voltage - V (V)  
R
Fig. 3 - Typical Junction Capacitance vs.  
Reverse Voltage  
10  
1
D = 0.50  
0.20  
P
DM  
0.10  
0.1  
t
1
0.05  
t
2
0.02  
0.01  
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =  
t / t  
1
2
2. PeakT = P  
x Z  
+ T  
thJC C  
J
DM  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Rectangular Pulse Duration (sec)  
1
Fig. 4 - Maximum Thermal Impedance Zthjc Characteristics  
HFA25TB60  
140  
30  
25  
20  
15  
10  
5
VR = 200V  
TJ = 125°C  
TJ = 25°C  
VR = 200V  
TJ = 125°C  
TJ = 25°C  
120  
100  
I
I
I
= 50A  
= 25A  
= 10A  
F
F
F
I
I
I
= 50A  
= 25A  
= 10A  
F
80  
60  
40  
20  
F
F
A
A
0
100  
100  
1000  
1000  
di /dt - (A/µs)  
f
di /dt - (A/µs)  
f
Fig. 6 - Typical Recovery Current vs. dif/dt  
Fig. 5 - Typical Reverse Recovery vs. dif/dt  
10000  
1400  
VR = 200V  
TJ = 125°C  
TJ = 25°C  
VR = 200V  
TJ = 125°C  
TJ = 25°C  
1200  
1000  
I
I
I
= 50A  
= 25A  
= 10A  
F
F
F
800  
600  
400  
200  
0
I
I
I
= 50A  
= 25A  
= 10A  
F
1000  
F
F
A
A
100  
100  
1000  
100  
1000  
di /dt - (A/µs)  
f
di /dt - (A/µs)  
f
Fig. 7 - Typical Stored Charge vs. dif/dt  
Fig. 8 - Typical di(rec)M/dt vs. dif/dt  
HFA25TB60  
3
t
rr  
I
F
t
t
a
b
0
REVERSE RECOVERY CIRCUIT  
4
Q
rr  
V
= 200V  
2
R
I
0.5 I  
RRM  
RRM  
5
di(rec)M/dt  
0.01  
0.75 I  
RRM  
L = 70µH  
1
di /dt  
f
D.U.T.  
4. Qrr - Area under curve defined by trr  
1. dif/dt - Rate of change of current  
through zero crossing  
D
and IRRM  
dif/dt  
trr X IRRM  
ADJUST  
IRFP250  
G
Qrr  
=
2. IRRM - Peak reverse recovery current  
2
3. trr - Reverse recovery time measured  
from zero crossing point of negative  
going IF to point where a line passing  
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current  
S
5. di(rec)M/dt - Peak rate of change of  
current during tb portion of trr  
Fig. 10 - Reverse Recovery Waveform and  
Fig. 9 - Reverse Recovery Parameter Test  
Definitions  
Circuit  
I
L = 100µH  
L(PK)  
HIGH-SPEED  
SWITCH  
DUT  
FREE-WHEEL  
DIODE  
Rg = 25 ohm  
+
CURRENT  
MONITOR  
DECAY  
TIME  
Vd = 50V  
V
(AVAL)  
V
R(RATED)  
Fig. 11 - Avalanche Test Circuit and Waveforms  
HFA25TB60  
Conforms to JEDEC Outline TO-220AC  
Dimensions in millimeters and inches  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331  
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020  
IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371  
http://www.irf.com/  
Data and specifications subject to change without notice.  
4/97  

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