IDB04E120_07 [INFINEON]

Fast Switching EmCon Diode; 快速开关EMCON二极管
IDB04E120_07
型号: IDB04E120_07
厂家: Infineon    Infineon
描述:

Fast Switching EmCon Diode
快速开关EMCON二极管

二极管 开关
文件: 总8页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDB04E120  
Fast Switching EmCon Diode  
Product Summary  
Feature  
V
1200  
4
V
A
RRM  
1200 V EmCon technology  
Fast recovery  
I
F
V
T
1.65  
150  
V
F
Soft switching  
°C  
jmax  
Low reverse recovery charge  
Low forward voltage  
Easy paralleling  
PG-TO263-3-2  
2
1
* RoHS compliant  
3
Type  
Package  
Ordering Code Marking Pin 1 PIN 2 PIN 3  
D04E120  
C
IDB04E120  
PG-TO263-3-2  
-
NC  
A
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
V
Repetitive peak reverse voltage  
Continous forward current  
V
1200  
RRM  
I
A
F
T =25°C  
11.2  
7.1  
C
T =90°C  
C
Surge non repetitive forward current  
I
I
28  
FSM  
FRM  
T =25°C, t =10 ms, sine halfwave  
C
p
Maximum repetitive forward current  
16.5  
T =25°C, t limited by T  
, D=0.5  
C
p
jmax  
W
Power dissipation  
P
tot  
T =25°C  
43.1  
20.6  
C
T =90°C  
C
-55...+150  
°C  
°C  
Operating and storage temperature  
T , T  
j stg  
Soldering temperature  
T
245  
S
reflow soldering, MSL1  
Page 1  
Rev.2.2  
2007-09-01  
IDB04E120  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
-
-
-
2.9  
62  
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
R
R
R
thJC  
thJA  
thJA  
-
-
-
62  
-
2
1)  
@ 6 cm cooling area  
35  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
µA  
V
min.  
typ. max.  
Static Characteristics  
Reverse leakage current  
V =1200V, T =25°C  
I
R
-
-
-
-
100  
350  
R
j
V =1200V, T =150°C  
R
j
Forward voltage drop  
V
F
I =4A, T =25°C  
-
-
1.65  
1.7  
2.15  
-
F
j
I =4A, T =150°C  
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
Rev.2.2  
2007-09-01  
IDB04E120  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Reverse recovery time  
ns  
A
t
I
rr  
V =800V, I =4A, di /dt=750A/µs, T =25°C  
-
-
-
115  
180  
185  
-
-
-
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =125°C  
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =150°C  
R
F
F
j
Peak reverse current  
rrm  
V =800V, I = 4 A, di /dt=750A/µs, T =25°C  
-
-
-
7.15  
8
-
-
-
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =125°C  
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =150°C  
8.1  
R
F
F
j
nC  
Reverse recovery charge  
Q
S
rr  
V =800V, I =4A, di /dt=750A/µs, T =25°C  
-
-
-
330  
575  
630  
-
-
-
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =125°C  
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =150°C  
R
F
F
j
Reverse recovery softness factor  
V =800V, I =4A, di /dt=750A/µs, T =25°C  
-
-
-
6
-
-
-
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =125°C  
7.8  
7.8  
R
F
F
j
V =800V, I =4A, di /dt=750A/µs, T =150°C  
R
F
F
j
Page 3  
Rev.2.2  
2007-09-01  
IDB04E120  
1 Power dissipation  
= f (T )  
2 Diode forward current  
I = f(T )  
P
tot  
C
F
C
parameter: T 150°C  
parameter: T 150°C  
j
j
45  
12  
A
W
10  
9
8
7
6
5
4
3
2
1
0
35  
30  
25  
20  
15  
10  
5
0
25  
50  
75  
100  
150  
25  
50  
75  
100  
150  
°C  
°C  
T
T
C
C
3 Typ. diode forward current  
I = f (V )  
4 Typ. diode forward voltage  
V = f (T )  
F
F
F
j
2.4  
12  
A
8A  
V
-55°C  
25°C  
10  
9
8
7
6
5
4
3
2
1
0
100°C  
150°C  
2
1.8  
1.6  
1.4  
1.2  
1
4A  
2A  
0
0.5  
1
1.5  
2
3
-60  
-20  
20  
60  
100  
160  
V
°C  
T
V
F
j
Page 4  
Rev.2.2  
2007-09-01  
IDB04E120  
5 Typ. reverse recovery time  
t = f (di /dt)  
6 Typ. reverse recovery charge  
Q =f(di /dt)  
rr  
F
rr  
F
parameter: V = 800V, T = 125°C  
parameter: V = 800V, T = 125 °C  
R j  
R
j
500  
900  
ns  
nC  
8A  
400  
350  
300  
250  
200  
150  
100  
50  
800  
750  
700  
650  
600  
550  
500  
450  
400  
8A  
4A  
2A  
4A  
2A  
0
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/µs  
di /dt  
A/µs  
di /dt  
F
F
7 Typ. reverse recovery current  
8 Typ. reverse recovery softness factor  
S = f(di /dt)  
I = f (di /dt)  
rr  
F
F
parameter: V = 800V, T = 125°C  
parameter: V = 800V, T = 125°C  
R j  
R
j
20  
12  
A
8A  
4A  
2A  
16  
14  
12  
10  
8
8A  
4A  
2A  
10  
9
8
7
6
6
4
5
2
4
0
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/µs  
di /dt  
A/µs  
di /dt  
F
F
Page 5  
Rev.2.2  
2007-09-01  
IDB04E120  
9 Max. transient thermal impedance  
= f (t )  
Z
thJC  
p
parameter : D = t /T  
p
10 1  
IDP04E120  
K/W  
10 0  
10 -1  
D = 0.50  
0.20  
10 -2  
0.10  
single pulse  
0.05  
0.02  
10 -3  
0.01  
10 -4  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
t
p
Page 6  
Rev.2.2  
2007-09-01  
IDB04E120  
Page 7  
Rev.2.2  
2007-09-01  
IDB04E120  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Page 8  
Rev.2.2  
2007-09-01  

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