IDB12E120_07 [INFINEON]
Fast Switching EmCon Diode; 快速开关EMCON二极管![IDB12E120_07](http://pdffile.icpdf.com/pdf1/p00175/img/icpdf/IDB12_985818_icpdf.jpg)
型号: | IDB12E120_07 |
厂家: | ![]() |
描述: | Fast Switching EmCon Diode |
文件: | 总8页 (文件大小:208K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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IDB12E120
Fast Switching EmCon Diode
Product Summary
Feature
V
1200
12
V
A
RRM
• 1200 V EmCon technology
• Fast recovery
I
F
V
T
1.65
150
V
F
• Soft switching
°C
jmax
• Low reverse recovery charge
• Low forward voltage
• Easy paralleling
PG-TO263-3-2
2
1
* RoHS compliant
3
Type
Package
Ordering Code Marking Pin 1 PIN 2 PIN 3
IDB12E120
PG-TO263-3-2
-
D12E120 NC
C
A
Maximum Ratings, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Value
Unit
V
Repetitive peak reverse voltage
Continous forward current
V
1200
RRM
I
A
F
T =25°C
28
17
C
T =90°C
C
Surge non repetitive forward current
I
I
63
FSM
FRM
T =25°C, t =10 ms, sine halfwave
C
p
Maximum repetitive forward current
42.5
T =25°C, t limited by T
, D=0.5
C
p
jmax
W
Power dissipation
P
tot
T =25°C
96
46
C
T =90°C
C
-55...+150
°C
°C
Operating and storage temperature
T , T
j stg
Soldering temperature
T
245
S
reflow soldering, MSL1
Page 1
Rev.2.2
2007-09-01
IDB12E120
Thermal Characteristics
Parameter
Symbol
Values
typ. max.
Unit
min.
Characteristics
-
-
-
-
1.3
62
K/W
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
R
R
R
thJC
thJA
thJA
-
-
-
62
-
2
1)
@ 6 cm cooling area
35
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
µA
V
min.
typ. max.
Static Characteristics
Reverse leakage current
I
R
V =1200V, T =25°C
-
-
-
-
100
R
j
V =1200V, T =150°C
1000
R
j
Forward voltage drop
V
F
I =12A, T =25°C
-
-
1.65
1.7
2.15
-
F
j
I =12A, T =150°C
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
Rev.2.2
2007-09-01
IDB12E120
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
typ. max.
Unit
min.
Dynamic Characteristics
ns
A
Reverse recovery time
t
I
rr
V =800V, I =12A, di /dt=800A/µs, T =25°C
-
-
-
150
215
225
-
-
-
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =125°C
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =150°C
R
F
F
j
Peak reverse current
rrm
V =800V, I = 12 A, di /dt=800A/µs, T =25°C
-
-
-
17
-
-
-
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =125°C
20.9
21.5
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =150°C
R
F
F
j
nC
Reverse recovery charge
Q
S
rr
V =800V, I =12A, di /dt=800A/µs, T =25°C
-
-
-
1200
1840
2025
-
-
-
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =125°C
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =150°C
R
F
F
j
Reverse recovery softness factor
V =800V, I =12A, di /dt=800A/µs, T =25°C
-
-
-
5
-
-
-
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =125°C
5.8
5.9
R
F
F
j
V =800V, I =12A, di /dt=800A/µs, T =150°C
R
F
F
j
Page 3
Rev.2.2
2007-09-01
IDB12E120
1 Power dissipation
= f (T )
2 Diode forward current
I = f(T )
P
tot
C
F
C
parameter: T ≤ 150°C
parameter: T ≤ 150°C
j
j
100
30
W
A
80
70
60
50
40
30
20
10
0
20
15
10
5
0
25
50
75
100
150
25
50
75
100
150
°C
°C
T
T
C
C
3 Typ. diode forward current
I = f (V )
4 Typ. diode forward voltage
V = f (T )
F
F
F
j
36
2.4
24A
A
V
-55°C
25°C
28
24
20
16
12
8
100°C
150°C
2
1.8
1.6
1.4
1.2
1
12A
6A
4
0
0
0.5
1
1.5
2
3
-60
-20
20
60
100
160
V
°C
T
V
F
j
Page 4
Rev.2.2
2007-09-01
IDB12E120
5 Typ. reverse recovery time
t = f (di /dt)
6 Typ. reverse recovery charge
Q =f(di /dt)
rr
F
rr
F
parameter: V = 800V, T = 125°C
parameter: V = 800V, T = 125 °C
R j
R
j
800
2500
nC
ns
24A
12A
24A
12A
6A
2300
2200
2100
2000
1900
1800
1700
1600
1500
1400
1300
600
500
400
300
200
100
0
6A
200 300 400 500 600 700 800
1000
200 300 400 500 600 700 800
1000
A/µs
di /dt
A/µs
di /dt
F
F
7 Typ. reverse recovery current
8 Typ. reverse recovery softness factor
S = f(di /dt)
I = f (di /dt)
rr
F
F
parameter: V = 800V, T = 125°C
parameter: V = 800V, T = 125°C
R j
R
j
26
15
A
13
12
11
10
9
24A
12A
6A
22
20
18
16
14
12
10
8
8
7
24A
12A
6A
6
5
4
3
6
2
200 300 400 500 600 700 800
1000
200 300 400 500 600 700 800
1000
A/µs
A/µs
di /dt
di /dt
F
F
Page 5
Rev.2.2
2007-09-01
IDB12E120
9 Max. transient thermal impedance
= f (t )
Z
thJC
p
parameter : D = t /T
p
10 1
IDP12E120
K/W
10 0
10 -1
D = 0.50
0.20
10 -2
0.10
0.05
0.02
10 -3
0.01
single pulse
10 -4
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2
10 0
s
t
p
Page 6
Rev.2.2
2007-09-01
IDB12E120
Page 7
Rev.2.2
2007-09-01
IDB12E120
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 8
Rev.2.2
2007-09-01
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