IDD03SG60C [INFINEON]

3rd Generation thinQ!TM SiC Schottky Diode; 第三代的thinQ ! TM SiC肖特基二极管
IDD03SG60C
型号: IDD03SG60C
厂家: Infineon    Infineon
描述:

3rd Generation thinQ!TM SiC Schottky Diode
第三代的thinQ ! TM SiC肖特基二极管

整流二极管 肖特基二极管
文件: 总7页 (文件大小:266K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDD03SG60C  
3rd Generation thinQ!TM SiC Schottky Diode  
Features  
Product Summary  
• Revolutionary semiconductor material - Silicon Carbide  
• Switching behavior benchmark  
V DC  
600  
3.2  
3
V
nC  
A
Q C  
• No reverse recovery / No forward recovery  
• Temperature independent switching behavior  
• High surge current capability  
I F; T C< 130 °C  
• Pb-free lead plating; RoHS compliant  
• Qualified according to JEDEC1) for target applications  
• Breakdown voltage tested at 20mA2)  
• Optimized for high temperature operation  
• Lowest Figure of Merit QC/IF  
• Halogen-free according to IEC 61249-2-21 definition  
thinQ! 3G Diode designed for fast switching applications like:  
• SMPS e.g.; CCM PFC  
• Motor Drives; Solar Applications; UPS  
Type  
Package  
Marking  
Pin 1  
Pin 2  
Pin 3  
IDD03SG60C  
PG-TO252-3  
D03G60C  
n.c.  
A
C
Maximum ratings  
Parameter  
Value  
Symbol Conditions  
Unit  
I F  
T C<130 °C  
Continuous forward current  
3
11.5  
9.7  
A
I F,SM  
T C=25 °C, t p=10 ms  
T C=150 °C, t p=10 ms  
T C=25 °C, t p=10 µs  
T C=25 °C, t p=10 ms  
T C=150 °C, t p=10 ms  
T j=25 °C  
Surge non-repetitive forward current,  
sine halfwave  
I F,max  
Non-repetitive peak forward current  
100  
i 2dt  
A2s  
0.61  
0.44  
600  
i ²t value  
V RRM  
dv/ dt  
P tot  
Repetitive peak reverse voltage  
Diode dv/dt ruggedness  
V
VR= 0….480 V  
50  
V/ns  
W
T C=25 °C  
Power dissipation  
38  
T j, T stg  
Operating and storage temperature  
-55 ... 175  
260  
°C  
Soldering temperature, reflow  
soldering (max)  
T sold  
reflow MSL1  
page 1  
Rev. 2.0  
2010-03-19  
IDD03SG60C  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Thermal characteristics  
R thJC  
Thermal resistance, junction - case  
-
-
-
-
3.9  
75  
K/W  
SMD version, device  
R thJA  
on PCB, minimal  
footprint  
Thermal resistance, junction -  
ambient  
SMD version, device  
on PCB, 6 cm2 cooling  
area5)  
-
50  
-
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V DC  
V F  
I R=0.05 mA, T j=25 °C  
I F=3 A, T j=25 °C  
DC blocking voltage  
Diode forward voltage  
600  
-
-
2.3  
-
V
-
-
-
-
2.1  
2.8  
0.23  
1
I F=3 A, T j=150 °C  
V R=600 V, T j=25 °C  
V R=600 V, T j=150 °C  
I R  
Reverse current  
15  
150  
µA  
AC characteristics  
V R=400 V,I FI F,max  
di F/dt =200 A/µs,  
T j=150 °C  
,
Q c  
t c  
Total capacitive charge  
-
-
-
-
-
3.2  
-
-
nC  
Switching time3)  
<10 ns  
V R=1 V, f =1 MHz  
Total capacitance  
C
60  
8
-
-
-
pF  
V R=300 V, f =1 MHz  
V R=600 V, f =1 MHz  
8
1) J-STD20 and JESD22  
2) All devices tested under avalanche conditions, for a time periode of 10ms, at 20mA.  
3) tc is the time constant for the capacitive displacement current waveform (independent from Tj, ILOAD and  
di/dt), different from trr which is dependent on Tj, ILOAD and di/dt. No reverse recovery time constant trr due to  
absence of minority carrier injection.  
4) Under worst case Zth conditions.  
5) Device on 40mm*40mm*1.5 epoxy PCB FR4 with 6cm² (one layer, 70µm thick) copper area for drain  
connection. PCB is vertical without blown air  
6) Only capacitive charge occuring, guaranteed by design.  
Rev. 2.0  
page 2  
2010-03-19  
IDD03SG60C  
1 Power dissipation  
2 Diode forward current  
I F=f(T C)4); T j175 °C; parameter: D = tp/T  
P
tot=f(T C); parameter: RthJC(max)  
40  
35  
30  
25  
20  
15  
10  
5
30  
25  
0.1  
20  
15  
0.3  
0.5  
10  
0.7  
1
5
0
0
25  
75  
125  
175  
25  
75  
125  
175  
T
C [°C]  
T
C [°C]  
3 Typ. forward characteristic  
4 Typ. forward characteristic in surge current  
mode  
I F=f(VF); t p=400 µs; parameter:T j  
I F=f(VF); t p=400 µs; parameter: T j  
3
15  
12  
9
150ºC  
25ºC  
-55ºC  
100ºC  
175ºC  
2
1
0
25ºC  
-55ºC  
175ºC  
6
3
0
150ºC  
100ºC  
0
1
2
3
4
0
2
4
6
8
V F[V]  
V F[V]  
Rev. 2.0  
page 3  
2010-03-19  
IDD03SG60C  
6 Typ. reverse current vs. reverse voltage  
5 Typ. capacitance charge vs. current slope  
Q C=f(di F/dt )6); I FI F,max  
I R=f(VR); parameter: T j  
10-5  
3.5  
3
10-6  
10-7  
2.5  
2
175 °C  
150 °C  
100 °C  
25 °C  
1.5  
1
10-8  
10-9  
-55 °C  
0.5  
0
10-10  
100  
400  
700  
1000  
100  
200  
300  
400  
500  
600  
V
R [V]  
di F/d t [A/µs]  
7 Typ. transient thermal impedance  
8 Typ. capacitance vs. reverse voltage  
Z
thJC=f(t p); parameter: D = t P/T  
C =f(V R); T C=25 °C, f =1 MHz  
101  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.5  
100  
0.2  
0.1  
0.05  
10-1  
0.02  
0.01  
0
10-2  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
10-1  
100  
101  
102  
103  
V
R [V]  
t
P [s]  
Rev. 2.0  
page 4  
2010-03-19  
IDD03SG60C  
9 Typ. C stored energy  
E C=f(V R)  
1.8  
1.5  
1.3  
1.0  
0.8  
0.5  
0.3  
0.0  
0
100  
200  
300  
400  
500  
600  
V
R [V]  
Rev. 2.0  
page 5  
2010-03-19  
IDD03SG60C  
PG-TO252-3: Outline  
Dimensions in mm/inches  
Rev. 2.0  
page 6  
2010-03-19  
IDD03SG60C  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of  
conditions or characteristics. With respect to any examples or hints given herein, any typical  
values stated herein and/or any information regarding the application of the device,  
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights  
of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please  
contact the nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information  
on the types in question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with  
the express written approval of Infineon Technologies, if a failure of such components can  
reasonably be expected to cause the failure of that life-support device or system or to affect  
the safety or effectiveness of that device or system. Life support devices or systems are  
intended to be implanted in the human body or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user  
or other persons may be endangered.  
Rev. 2.0  
page 7  
2010-03-19  

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