IDP15E60_09 [INFINEON]

Fast EmCon Diode; 快EMCON二极管
IDP15E60_09
型号: IDP15E60_09
厂家: Infineon    Infineon
描述:

Fast EmCon Diode
快EMCON二极管

二极管
文件: 总8页 (文件大小:632K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDP15E60  
Fast EmCon Diode  
Product Summary  
Features  
V
600  
15  
V
A
RRM  
600 V diode technology  
I
F
• Fast recovery  
V
T
1.5  
175  
V
F
• Soft switching  
°C  
jmax  
• Low reverse recovery charge  
• Low forward voltage  
PG-TO220-2  
• Easy paralleling  
• Pb-free lead plating; RoHS compliant  
• Halogen-free according to IEC61249-2-21  
• Qualified according to JEDEC for target applications  
Type  
Package  
Ordering Code Marking Pin 1 PIN 2 PIN 3  
-
C
A
-
IDP15E60  
PG-TO220-2  
D15E60  
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Repetitive peak reverse voltage  
Continous forward current  
Symbol  
Value  
600  
Unit  
V
V
RRM  
I
A
F
T =25°C  
29.2  
19.6  
C
T =90°C  
C
Surge non repetitive forward current  
I
I
60  
FSM  
FRM  
T =25°C, t =10 ms, sine halfwave  
C
p
Maximum repetitive forward current  
45  
T =25°C, t limited by T  
, D=0.5  
C
p
jmax  
W
Power dissipation  
P
tot  
T =25°C  
83.3  
47.2  
C
T =90°C  
C
-55...+175  
°C  
°C  
Operating and storage temperature  
Soldering temperature  
wavesoldering, 1.6mm (0.063 in.) from case for 10s  
T , T  
j stg  
T
260  
S
Page 1  
Rev.2.4  
2009-09-28  
IDP15E60  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
-
-
-
1.8  
62  
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
R
R
R
thJC  
thJA  
thJA  
-
-
-
35  
62  
-
2
@ 6 cm cooling area 1)  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
μA  
V
min.  
Static Characteristics  
Reverse leakage current  
I
R
V =600V, T =25°C  
-
-
-
-
50  
1250  
R
j
V =600V, T =150°C  
R
j
Forward voltage drop  
V
F
I =15A, T =25°C  
-
-
1.5  
1.5  
2
-
F
j
I =15A, T =150°C  
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 μm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
Rev.2.4  
2009-09-28  
IDP15E60  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
ns  
A
Reverse recovery time  
t
I
rr  
V =400V, I =15A, di /dt=1000A/μs, T =25°C  
-
-
-
87  
124  
131  
-
-
-
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =125°C  
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =150°C  
R
F
F
j
Peak reverse current  
rrm  
V =400V, I = 15A, di /dt=1000A/μs, T =25°C  
-
-
-
13.7  
16.4  
19.3  
-
-
-
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =125°C  
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =150°C  
R
F
F
j
nC  
Reverse recovery charge  
Q
S
rr  
V =400V, I =15A, di /dt=1000A/μs, T =25°C  
-
-
-
595  
995  
1104  
-
-
-
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =125°C  
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =150°C  
R
F
F
j
Reverse recovery softness factor  
V =400V, I =15A, di /dt=1000A/μs, T =25°C  
-
-
-
3.6  
4.3  
4.5  
-
-
-
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =125°C  
R
F
F
j
V =400V, I =15A, di /dt=1000A/μs, T =150°C  
R
F
F
j
Page 3  
Rev.2.4  
2009-09-28  
IDP15E60  
1 Power dissipation  
= f (T )  
2 Diode forward current  
I = f(T )  
P
tot  
C
F
C
parameter: T 175 °C  
parameter: T 175°C  
j
j
90  
30  
W
A
70  
60  
50  
40  
30  
20  
10  
0
20  
15  
10  
5
0
25  
50  
75  
100  
125  
175  
25  
50  
75  
100  
125  
175  
°C  
°C  
T
T
C
C
3 Typ. diode forward current  
I = f (V )  
4 Typ. diode forward voltage  
V = f (T )  
F
F
F
j
50  
2
V
30A  
A
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1
30  
20  
10  
0
-55°C  
25°C  
15A  
100°C  
150°C  
7.5A  
0.5  
1
1.5  
2.5  
-60  
-20  
20  
60  
100  
160  
V
°C  
T
V
F
j
Page 4  
Rev.2.4  
2009-09-28  
IDP15E60  
5 Typ. reverse recovery time  
t = f (di /dt)  
6 Typ. reverse recovery charge  
Q =f(di /dt)  
rr  
F
rr  
F
parameter: V = 400V, T = 125°C  
parameter: V = 400V, T = 125 °C  
R j  
R
j
500  
1450  
ns  
nC  
30A  
15A  
400  
350  
300  
250  
200  
150  
100  
50  
1250  
1150  
1050  
950  
30A  
15A  
7.5A  
850  
7.5A  
750  
650  
0
550  
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/μs  
di /dt  
A/μs  
di /dt  
F
F
7 Typ. reverse recovery current  
8 Typ. reverse recovery softness factor  
S = f(di /dt)  
I = f (di /dt)  
rr  
F
F
parameter: V = 400V, T = 125°C  
parameter: V = 400V, T = 125°C  
R j  
R
j
11  
18  
A
16  
15  
14  
13  
12  
11  
10  
9
30A  
15A  
7.5A  
9
8
7
6
5
4
3
30A  
15A  
8
7,5A  
7
6
5
4
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/μs  
di /dt  
A/μs  
di /dt  
F
F
Page 5  
Rev.2.4  
2009-09-28  
IDP15E60  
9 Max. transient thermal impedance  
= f (t )  
Z
thJC  
p
parameter : D = t /T  
p
10 1  
IDP15E60  
K/W  
10 0  
10 -1  
D = 0.50  
0.20  
0.10  
0.05  
10 -2  
0.02  
0.01  
single pulse  
10 -3  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
t
p
Page 6  
Rev.2.4  
2009-09-28  
IDP15E60  
Package Outline: TO220-2-1  
Page 7  
Rev.2.4  
2009-09-28  
IDP15E60  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
81726 München, Germany  
© 2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.  
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding  
the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon  
Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in  
life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety  
or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human  
body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the  
health of the user or other persons may be endangered.  
Page 8  
Rev.2.4  
2009-09-28  

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