IDT04S60C_08 [INFINEON]

2nd Generation thinQ SiC Schottky Diode; 第二代的thinQ SiC肖特基二极管
IDT04S60C_08
型号: IDT04S60C_08
厂家: Infineon    Infineon
描述:

2nd Generation thinQ SiC Schottky Diode
第二代的thinQ SiC肖特基二极管

肖特基二极管
文件: 总7页 (文件大小:468K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDT04S60C  
2ndGeneration thinQ!TM SiC Schottky Diode  
Features  
Product Summary  
V DC  
Q c  
I F  
600  
8
V
• Revolutionary semiconductor material - Silicon Carbide  
• Switching behavior benchmark  
nC  
A
4
• No reverse recovery/ No forward recovery  
• No temperature influence on the switching behavior  
• High surge current capability  
PG-TO220-2-2  
• Pb-free lead plating; RoHS compliant  
• Qualified according to JEDEC1) for target applications  
• Breakdown voltage tested at 5mA2)  
thinQ! 2G Diode specially designed for fast switching applications like:  
• CCM PFC  
• Motor Drives  
Type  
Package  
Marking  
Pin 1  
Pin 2  
IDT04S60C  
PG-TO220-2-2  
D04S60C  
C
A
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I F  
T C<140 °C  
f =50 Hz  
Continuous forward current  
RMS forward current  
4
A
I F,RMS  
5.6  
Surge non-repetitive forward current,  
sine halfwave  
I F,SM  
T C=25 °C, t p=10 ms  
32  
18  
T j=150 °C,  
I F,RM  
Repetitive peak forward current  
T C=100 °C, D =0.1  
I F,max  
T C=25 °C, t p=10 µs  
T C=25 °C, t p=10 ms  
Non-repetitive peak forward current  
i ²t value  
132  
5.1  
600  
50  
i 2dt  
A2s  
V
V RRM  
Repetitive peak reverse voltage  
Diode dv/dt ruggedness  
V R = 0….480V  
T C=25 °C  
dv/ dt  
P tot  
V/ns  
Power dissipation  
42  
W
T j, T stg  
Operating and storage temperature  
Mounting torque  
-55 ... 175  
60  
°C  
M3 and M3.5 screws  
page 1  
Mcm  
Rev. 2.1  
2008-06-06  
IDT04S60C  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Thermal characteristics  
R thJC  
Thermal resistance, junction - case  
-
-
-
-
3.6  
62  
K/W  
Thermal resistance,  
junction - ambient  
R thJA  
leaded  
Soldering temperature,  
wavesoldering only allowed at leads  
1.6mm (0.063 in.) from  
case for 10s  
T sold  
-
-
260 °C  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V DC  
V F  
I R=0.05 mA  
DC blocking voltage  
Diode forward voltage  
600  
-
-
V
I F=4 A, T j=25 °C  
I F=4 A, T j=150 °C  
V R=600 V, T j=25 °C  
-
-
-
1.7  
2
1.9  
2.4  
50  
I R  
Reverse current  
0.5  
µA  
V R=600 V, T j=150 °C  
-
2
500  
AC characteristics  
V R=400 V,I FI F,max  
di F/dt =200 A/µs,  
T j=150 °C  
,
Q c  
t c  
Total capacitive charge  
Switching time3)  
-
-
-
-
-
8
-
-
nC  
<10 ns  
V R=1 V, f = MHz  
C
130  
20  
20  
-
-
-
pF  
V R=300 V, f =1 MHz  
V R=600 V, f =1 MHz  
1) J-STD20 and JESD22  
2) All devices tested under avalanche conditions, for a time periode of 5ms, at 5mA.  
3) tc is the time constant for the capacitive displacement current waveform (independent from Tj, ILOAD and  
di/dt), different from trr, which is dependent on Tj, ILOAD, di/dt. No reverse recovery time constant trr due to  
absence of minority carrier injection.  
4) Only capacitive charge occuring, guaranteed by design.  
Rev. 2.1  
page 2  
2008-06-06  
IDT04S60C  
1 Power dissipation  
tot=f(T C)  
2 Diode forward current  
I F=f(T C); T j175 °C  
P
parameter: RthJC(max)  
parameter: R thJC(max); V F(max)  
45  
10  
9
8
7
6
5
4
3
2
1
0
40  
35  
30  
25  
20  
15  
10  
5
0
25  
50  
75  
100  
125  
150  
175  
200  
25  
50  
75  
100  
125  
150  
175  
200  
T C [°C]  
T C [°C]  
3 Typ. forward characteristic  
I F=f(V F); t p=400 µs  
parameter: T j  
4 Typ. forward characteristic in surge current  
mode  
I F=f(V F); t p=400 µs; parameter: Tj  
8
40  
175ºC  
-55ºC  
150ºC  
150ºC  
25ºC  
100ºC  
7
6
5
4
3
2
1
0
30  
-55ºC  
20  
175ºC  
25ºC  
10  
100ºC  
0
0
1
2
3
4
0
2
4
6
8
10  
V F[V]  
V F[V]  
Rev. 2.1  
page 3  
2008-06-06  
IDT04S60C  
6 Typ. reverse current vs. reverse voltage  
5 Typ. forward power dissipation vs.  
average forward current  
I R=f(V R)  
P
F,AV=f(I F), T C=100 °C, parameter: D =t p/T  
parameter: T j  
101  
20  
0.1  
0.5  
1
0.2  
18  
16  
14  
12  
10  
8
100  
175 °C  
150 °C  
10-1  
10-2  
10-3  
100 °C  
25 °C  
6
-55 °C  
4
2
10-4  
100  
0
200  
300  
400  
500  
600  
0
2
4
6
8
I F(AV) [A]  
V R [V]  
7 Transient thermal impedance  
thJC=f(t p)  
8 Typ. capacitance vs. reverse voltage  
Z
C =f(V R); T C=25 °C, f =1 MHz  
parameter: D =t p/T  
101  
200  
175  
150  
125  
100  
75  
0.5  
100  
0.2  
0.1  
0.05  
10-1  
0.02  
50  
single pulse  
25  
10-2  
0
10-5  
10-4  
10-3  
10-2  
10-1  
10-1  
100  
101  
102  
103  
V R [V]  
t P [s]  
Rev. 2.1  
page 4  
2008-06-06  
IDT04S60C  
10 Typ. capacitance charge vs. current slope  
9 Typ. C stored energy  
Q C=f(di F/dt )4); T j=150 °C; I FI F,max  
E C=f(V R)  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
10  
8
6
4
2
0
0
100  
200  
300  
400  
500  
600  
100  
400  
700  
1000  
V R [V]  
di F/dt [A/µs]  
Rev. 2.1  
page 5  
2008-06-06  
IDT04S60C  
Package Outline:PG-TO220-2-2  
Rev. 2.1  
page 6  
2008-06-06  
IDT04S60C  
Rev. 2.1  
page 7  
2008-06-06  

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