IGP30N60T_09 [INFINEON]

Low Loss IGBT in TrenchStop and Fieldstop technology; 低损耗IGBT的TRENCHSTOP和场终止技术
IGP30N60T_09
型号: IGP30N60T_09
厂家: Infineon    Infineon
描述:

Low Loss IGBT in TrenchStop and Fieldstop technology
低损耗IGBT的TRENCHSTOP和场终止技术

双极性晶体管
文件: 总13页 (文件大小:442K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
®
Low Loss IGBT in TrenchStop and Fieldstop technology  
C
Very low VCE(sat) 1.5 V (typ.)  
Maximum Junction Temperature 175 °C  
Short circuit withstand time – 5µs  
Designed for :  
G
E
- Frequency Converters  
- Uninterruptible Power Supply  
TrenchStop® and Fieldstop technology for 600 V applications  
offers :  
PG-TO-220-3-1  
PG-TO-247-3  
- very tight parameter distribution  
- high ruggedness, temperature stable behavior  
- very high switching speed  
Positive temperature coefficient in VCE(sat)  
Low EMI  
Low Gate Charge  
Qualified according to JEDEC1 for target applications  
Pb-free lead plating; RoHS compliant  
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  
Type  
VCE  
IC  
VCE(sat),Tj=25°C Tj,max  
Marking Code  
G30T60  
Package  
PG-TO-220-3-1  
PG-TO-247-3  
IGP30N60T  
IGW30N60T  
600V  
600V  
30A  
30A  
1.5V  
1.5V  
175°C  
175°C  
G30T60  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
DC collector current, limited by Tjmax  
TC = 25°C  
VCE  
IC  
600  
V
A
60  
30  
TC = 100°C  
Pulsed collector current, tp limited by Tjmax  
ICpuls  
-
VGE  
tSC  
90  
90  
±20  
5
Turn off safe operating area (VCE 600V, Tj 175°C)  
Gate-emitter voltage  
V
Short circuit withstand time2)  
µs  
VGE = 15V, VCC 400V, Tj 150°C  
Ptot  
Tj  
Tstg  
187  
W
Power dissipation TC = 25°C  
Operating junction temperature  
Storage temperature  
-40...+175  
-55...+175  
260  
°C  
Soldering temperature, 1.6mm (0.063 in.) from case for 10s  
-
1 J-STD-020 and JESD-022  
2) Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
Thermal resistance,  
junction – ambient  
0.80  
RthJC  
RthJA  
K/W  
PG-TO-220-3-1  
PG-TO-247-3-21  
62  
40  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage V(BR)CES  
V
GE=0V, IC=0.2mA  
600  
-
-
V
Collector-emitter saturation voltage  
VCE(sat) VGE = 15V, IC=30A  
Tj=25°C  
-
-
1.5  
1.9  
2.05  
-
Tj=175°C  
Gate-emitter threshold voltage  
VGE(th)  
ICES  
IC=0.43mA,  
4.1  
4.9  
5.7  
V
CE=VGE  
Zero gate voltage collector current  
V
CE=600V,  
µA  
V
GE=0V  
Tj=25°C  
Tj=175°C  
-
-
-
-
-
-
40  
1000  
100  
-
Gate-emitter leakage current  
Transconductance  
IGES  
gfs  
V
V
CE=0V,VGE=20V  
CE=20V, IC=30A  
-
16.7  
-
nA  
S
Integrated gate resistor  
RGint  
Dynamic Characteristic  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Gate charge  
Ciss  
Coss  
Crss  
V
V
CE=25V,  
GE=0V,  
-
-
-
-
1630  
108  
50  
-
-
-
-
pF  
f=1MHz  
V
V
PG-TO-220-3-1  
PG-TO-247-3-21  
QGate  
CC=480V, IC=30A  
GE=15V  
167  
nC  
nH  
A
Internal emitter inductance  
LE  
-
-
-
7
13  
275  
-
-
-
measured 5mm (0.197 in.) from case  
Short circuit collector current1)  
IC(SC)  
V
GE=15V,tSC5µs  
VCC = 400V,  
Tj = 150°C  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
2
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
Switching Characteristic, Inductive Load, at Tj=25 °C  
Value  
Unit  
Parameter  
Symbol  
Conditions  
min.  
Typ.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
Ets  
-
-
-
-
-
-
-
23  
21  
254  
46  
0.69  
0.77  
1.46  
-
-
-
-
-
-
-
ns  
Tj=25°C,  
V
V
CC=400V,IC=30A,  
GE=0/15V,  
RG=10.6 ,  
Lσ 1)=136nH,  
Cσ 1)=39pF  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery. 2)  
Switching Characteristic, Inductive Load, at Tj=175 °C  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
Ets  
-
-
-
-
-
-
-
24  
26  
292  
90  
1.0  
1.1  
2.1  
-
-
-
-
-
-
-
ns  
Tj=175°C,  
V
V
CC=400V,IC=30A,  
GE=0/15V,  
RG= 10.6 Ω  
Lσ 1)=136nH,  
Cσ 1)=39pF  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.2)  
1) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
2) Includes Reverse Recovery Losses from IKW30N60T due to dynamic test circuit in Figure E.  
3
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
100A  
10A  
1A  
tp=2µs  
90A  
80A  
70A  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
10µs  
TC=80°C  
50µs  
TC=110°C  
1ms  
Ic  
10ms  
DC  
Ic  
0.1A  
1V  
100Hz  
1kHz  
10kHz  
100kHz  
10V  
VCE, COLLECTOR  
100V  
1000V  
f, SWITCHING FREQUENCY  
-EMITTER VOLTAGE  
Figure 1. Collector current as a function of  
Figure 2. Safe operating area  
(D = 0, TC = 25°C, Tj 175°C;  
GE=15V)  
switching frequency  
(Tj 175°C, D = 0.5, VCE = 400V,  
V
VGE = 0/+15V, RG = 10)  
50A  
40A  
30A  
20A  
10A  
0A  
160W  
120W  
80W  
40W  
0W  
25°C  
75°C  
125°C  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TC, CASE TEMPERATURE  
TC, CASE TEMPERATURE  
Figure 3. Power dissipation as a function of  
case temperature  
Figure 4. Collector current as a function of  
case temperature  
(Tj 175°C)  
(VGE 15V, Tj 175°C)  
4
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
80A  
70A  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
50A  
V
GE=20V  
15V  
V
GE=20V  
40A  
30A  
20A  
10A  
0A  
15V  
13V  
13V  
11V  
9V  
11V  
9V  
7V  
7V  
0V  
1V  
2V  
3V  
0V  
1V  
2V  
3V  
VCE, COLLECTOR-EMITTER VOLTAGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 5. Typical output characteristic  
Figure 6. Typical output characteristic  
(Tj = 25°C)  
(Tj = 175°C)  
2.5V  
50A  
40A  
30A  
20A  
IC=60A  
2.0V  
1.5V  
1.0V  
0.5V  
0.0V  
IC=30A  
IC=15A  
TJ=175°C  
10A  
25°C  
0A  
0°C  
50°C  
100°C  
150°C  
0V  
2V  
4V  
6V  
8V  
V
GE, GATE-EMITTER VOLTAGE  
Figure 7. Typical transfer characteristic  
TJ, JUNCTION TEMPERATURE  
Figure 8. Typical collector-emitter  
(VCE=20V)  
saturation voltage as a function of  
junction temperature  
(VGE = 15V)  
5
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
td(off)  
td(off)  
tf  
100ns  
10ns  
1ns  
tf  
td(on)  
100ns  
td(on)  
tr  
tr  
10ns  
0A  
10A  
20A  
30A  
10Ω  
20Ω  
30Ω  
40Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 9. Typical switching times as a  
function of collector current  
(inductive load, TJ=175°C,  
Figure 10. Typical switching times as a  
function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 10,  
VCE= 400V, VGE = 0/15V, IC = 30A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
7V  
6V  
td(off)  
max.  
typ.  
5V  
100ns  
4V  
3V  
2V  
1V  
0V  
min.  
tf  
td(on)  
tr  
10ns  
25°C  
50°C  
75°C 100°C 125°C 150°C  
-50°C  
0°C  
50°C  
100°C  
150°C  
TJ, JUNCTION TEMPERATURE  
TJ, JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
Figure 12. Gate-emitter threshold voltage as  
a function of junction temperature  
(IC = 0.43mA)  
function of junction temperature  
(inductive load, VCE = 400V,  
VGE = 0/15V, IC = 30A, RG=10,  
Dynamic test circuit in Figure E)  
6
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
*) Eon and Ets include losses  
*) Eon and Ets include losses  
due to diode recovery  
Ets*  
5.0mJ  
4.0mJ  
3.0mJ  
2.0mJ  
1.0mJ  
0.0mJ  
due to diode recovery  
Ets*  
3.0mJ  
2.0mJ  
1.0mJ  
0.0mJ  
Eoff  
Eoff  
Eon  
*
Eon*  
0A  
10A  
20A  
30A  
40A  
50A  
0Ω  
10Ω  
20Ω  
30Ω  
40Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 13. Typical switching energy losses  
Figure 14. Typical switching energy losses  
as a function of collector current  
as a function of gate resistor  
(inductive load, TJ = 175°C,  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 10,  
VCE = 400V, VGE = 0/15V, IC = 30A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
*) Eon and Ets include losses  
*) Eon and Ets include losses  
2.0mJ  
1.5mJ  
1.0mJ  
0.5mJ  
0.0mJ  
due to diode recovery  
due to diode recovery  
3.0mJ  
2.5mJ  
2.0mJ  
1.5mJ  
1.0mJ  
0.5mJ  
0.0mJ  
Ets*  
Ets*  
Eoff  
Eoff  
Eon*  
Eon*  
300V 350V 400V 450V 500V 550V  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TJ, JUNCTION TEMPERATURE  
VCE, COLLECTOR EMITTER VOLTAGE  
-
Figure 15. Typical switching energy losses  
as a function of junction  
temperature  
Figure 16. Typical switching energy losses  
as a function of collector emitter  
voltage  
(inductive load, VCE = 400V,  
(inductive load, TJ = 175°C,  
V
GE = 0/15V, IC = 30A, RG = 10,  
VGE = 0/15V, IC = 30A, RG = 10,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
7
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
Ciss  
1nF  
15V  
10V  
5V  
120V  
480V  
Coss  
100pF  
Crss  
0V  
0V  
10V  
20V  
30V  
40V  
0nC 30nC 60nC 90nC 120nC 150nC 180nC  
QGE, GATE CHARGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 17. Typical gate charge  
Figure 18. Typical capacitance as a function  
(IC=30 A)  
of collector-emitter voltage  
(VGE=0V, f = 1 MHz)  
12µs  
10µs  
8µs  
400A  
300A  
200A  
100A  
0A  
6µs  
4µs  
2µs  
0µs  
10V  
11V  
12V  
13V  
14V  
12V  
14V  
VGE, GATE  
16V  
18V  
-
EMITTETR VOLTAGE  
VGE, GATE-EMITETR VOLTAGE  
Figure 19. Typical short circuit collector  
current as a function of gate-  
emitter voltage  
Figure 20. Short circuit withstand time as a  
function of gate-emitter voltage  
(VCE=600V, start at TJ=25°C,  
T
Jmax<150°C)  
(VCE 400V, Tj 150°C)  
8
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
D=0.5  
0.2  
10-1K/W  
0.1  
R , ( K / W )  
0.29566  
0.25779  
0.19382  
0.05279  
τ , ( s )  
6.478*10-2  
6.12*10-3  
4.679*10-4  
6.45*10-5  
R2  
0.05  
R1  
0.02  
0.01  
10-2K/W  
C1=τ1/R1 C = /R2  
τ2  
2
single pulse  
1µs 10µs 100µs 1ms 10ms 100ms  
tP, PULSE WIDTH  
Figure 21. IGBT transient thermal resistance  
(D = tp / T)  
9
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
PG-TO-220-3-1  
10  
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
11  
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
i,v  
tr r =tS +tF  
diF /dt  
Qr r =QS +QF  
tr r  
IF  
tS  
tF  
t
QS  
10% Ir r m  
QF  
Ir r m  
dir r /dt  
VR  
90% Ir r m  
Figure C. Definition of diodes  
switching characteristics  
τ1  
τ2  
r 2  
τn  
r1  
r n  
T (t)  
j
p(t)  
r 2  
r1  
rn  
Figure A. Definition of switching times  
T
C
Figure D. Thermal equivalent  
circuit  
Figure E. Dynamic test circuit  
Figure B. Definition of switching losses  
12  
Rev. 2.6 Nov. 09  
Power Semiconductors  
IGP30N60T  
IGW30N60T  
®
TrenchStop Series  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or  
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the  
types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies  
components may be used in life-support devices or systems only with the express written approval of  
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body or to support and/or maintain and  
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other  
persons may be endangered.  
13  
Rev. 2.6 Nov. 09  
Power Semiconductors  

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