IM393-X6E3_技术文档

IM393-X6E

CIPOS™ Tiny IPM 600V/20A

IM393-X6E

Description

IM393-X6E is a 20A, 600V Integrated Power Hybrid IC with Open Emitter pins for advanced Appliance Motor

Drives applications such as energy eﬀicient fan and pumps. Infineon’s technology oﬀers an extremely com-

pact, high performance AC motor-driver in a single isolated package to simplify design.

This advanced IPM is a combination of Infineon’s newest low VCE(on) Trench IGBT technology optimized for

best trade-oﬀ between conduction and switching losses and the industry benchmark 3 phase high voltage,

high speed driver (3.3V compatible) in a fully isolated thermally enhanced package. A built-in high precision

temperature monitor and over-current protection feature, along with the short-circuit rated IGBTs and inte-

grated under-voltage lockout function, deliver high level of protection and fail-safe operation. Using a dual in

line package with full transfer mold structure resolves isolation problems to heatsink.

Features



Integrated gate drivers and bootstrap function

Temperature monitor

Protection shutdown pin

Low VCE (on) Trench IGBT technology

Under voltage lockout for all channels

Matched propagation delay for all channels

3.3V Schmitt-triggered input logic

Cross-conduction prevention logic

Isolation 2000V_RMSmin and CTI > 600

Recognized by UL (File Number : E314539)

Tiny DIP

IM393-X6E

Potential applications



Washing machines

Air-conditioners

Refrigerators

Fans

Dishwashers

Low power motor drives

Product validation

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.

Table1

Part Ordering Table

Standard Pack

Form

Base part number

Package Type

Quantity

DIP 34x15

30 Tubes

450

IM393-X6E

IM393-X6E2

IM393-X6E3

Final Datasheet

www.infineon.com

Please read the important Notice and Warnings at the end of this document

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Table of Contents

Description ....................................................................................................................................1

Features ........................................................................................................................................1

Potential Applications ....................................................................................................................1

Product validation .........................................................................................................................1

Table of Contents ...........................................................................................................................2

1

2

Internal Electrical Schematic ..................................................................................................3

Pin Configuration ..................................................................................................................4

2.1 Pin Assignment .................................................................................................................................................5

2.2 Pin Descriptions ...............................................................................................................................................6

3

Absolute Maximum Rating ......................................................................................................8

3.1 Module ..............................................................................................................................................................8

3 .2 Inverter .............................................................................................................................................................8

3 .3 Control ..............................................................................................................................................................8

4

5

6

Thermal Characteristics .........................................................................................................9

Recommended Operating Conditions ……………………………………………………………………...10

Static Parameters …………………………………………………………………………………………... 11

6.1 Inverter …………………………………………………………………………………………………………… 11

6 .2 Control ……………………………………………………………………………………………………………..11

7

Dynamic Parameters ............................................................................................................ 13

7.1 Inverter ...........................................................................................................................................................13

7 .2 Control ........................................................................................................................................................13

8

9

Thermistor Characteristics .................................................................................................... 14

Mechanical Characteristics and Ratings ..................................................................................15

10 Qualification Information ...................................................................................................... 16

11 Diagrams & Tables ................................................................................................................ 17

11.1 Tc Measurement Point ...................................................................................................................................17

11.2 Input-Output Logic Table ..............................................................................................................................17

11.3 Switching Time Definitions ............................................................................................................................18

12 Application Notes ................................................................................................................ 19

12.1 Typical Application Schematic .......................................................................................................................19

12.2 Performance Charts ........................................................................................................................................20

12.3 T_Jvs T_TH...........................................................................................................................................................20

12.4 –V_SImmunity ..................................................................................................................................................21

13 Package Outline ...................................................................................................................22

Revision History ........................................................................................................................... 24

2

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CIPOS™ Tiny

IM393-X6E

Internal Electrical Schematic

1

Internal Electrical Schematic

(35) P

(33) P

(1) P

(3) VS(W)

(4) VB(W)

VB3

VB2

HO3

VS3

(32) W

(31) V

(6) VS(V)

(7) VB(V)

HO2

VS2

(9) VS(U)

(10) VB(U)

VB1

HO1

VS1

(12) VDD

(13) VTH

VDD

(30) U

-t°

(14) COM

(15) COM

(16) ITRIP

(17) RFE

COM

VSS

LO3

LO2

LO1

ITRIP

RFE

(29) N(W)

(28) N(V)

(27) N(U)

(18) HIN(U)

HIN1

(19) HIN(V)

(20) HIN(W)

HIN2

HIN3

(21) LIN(U)

(22) LIN(V)

(23) LIN(W)

(24) N(W)

(25) N(V)

LIN1

LIN2

LIN3

(26) N(U)

Figure 1

Internal electrical schematic

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CIPOS™ Tiny

IM393-X6E

Pin Configuration

2

Pin Configuration

2.1

Pin Assignment

(1) P

(35) P

(3) VS(W)

(4) VB(W)

(6) VS(V)

(7) VB(V)

(9) VS(U)

(33) P

(10) VB(U)

(32) W

(12) VDD

(13) VTH

(14) COM

(15) COM

(31) V

(16) ITRIP

(17) RFE

(18) HIN(U)

(19) HIN(V)

(20) HIN(W)

(21) LIN(U)

(22) LIN(V)

(30) U

(29) N(W)

(23) LIN(W)

(28) N(V)

(27) N(U)

(24) N(W)

(25) N(V)

(26) N(U)

Figure 2

Pin configuration

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CIPOS™ Tiny

IM393-X6E

Pin Configuration

Table 2

Pin Assignment

Name

Description

1

( 2 )

3

P

N/A

Positive bus input voltage

None

VS(W)

VB(W)

N/A

W-phase high side floating supply oﬀset voltage

W-phase high side floating supply voltage

None

4

( 5 )

6

VS(V)

VB(V)

N/A

V - phase high side floating supply oﬀset voltage

V - phase high side floating supply voltage

None

7

( 8 )

9

VS(U)

VB(U)

N/A

U- phase high side floating supply oﬀset voltage

U- phase high side floating supply voltage

None

10

( 11 )

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

( 34 )

35

( 36 )

VDD

VTH

COM

ITRIP

RFE

Low side control supply

Temperature monitor

Low side control negative supply

Over current protection input

RCIN / Fault / Enable

HIN(U)

HIN(V)

HIN(W)

LIN(U)

LIN(V)

LIN(W)

N(W)

N(V)

N(U)

N(V)

N(W)

U

U-phase high side gate driver input

V-phase high side gate driver input

W-phase high side gate driver input

U-phase low side gate driver input

V-phase low side gate driver input

W-phase low side gate driver input

W-phase low side emitter

V-phase low side emitter

U-phase low side emitter

V-phase low side emitter

W-phase low side emitter

U-phase output

V

V-phase output

W

W-phase output

P

Positive bus input voltage

None

N/A

P

Positive bus input voltage

None

N/A

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CIPOS™ Tiny

IM393-X6E

Pin Descriptions

2.2

Pin Descriptions

V_DD, COM (Low side control supply and reference)

HIN(U,V,W) and LIN(U,V,W) (High side and low

side control pins)

V_DDis the control supply and it provides power both

to input logic and to output power stage. Input

logic is referenced to COM ground.

These pins are positive logic and they are

responsible for the control of the integrated

IGBT. The Schmitt-trigger input thresholds of

them are such to guarantee LSTTL and CMOS

compatibility down to 3.3V controller outputs.

Pull-down resistor of about 4k is internally

provided to pre-bias inputs during supply start-

up and an ESD diode is provided for pin

protection purposes. Input Schmitt-trigger and

noise filter provide beneficial noise rejection to

short input pulses.

The under-voltage circuit enables the device to

operate at power on when a supply voltage of at

least a typical voltage of V_DDUV+= 10.4V is present.

The IC shuts down all the gate drivers power

outputs, when the VDD supply voltage is below

V_DDUV-= 9.4V. This prevents the external power

switches from critically low gate voltage levels

during on-state and therefore from excessive power

dissipation.

The noise filter suppresses control pulses which

are below the filter time TFILIN. The filter acts

according to Figure 4.

V_B(U,V,W)and V_S(U,V,W)(High side supplies)

V_Bto V_Sis the high side supply voltage. The high

side circuit can float with respect to COM following

the external high side power device emitter

voltage.

CIPOS^TMTINY

Schmitt-Trigger

HIN(X)

LIN(X)

INPUT NOISE

FILTER

Due to the low power consumption, the floating

driver stage is supplied by integrated bootstrap

circuit.

 4k

SWITCH LEVEL

V_IH; V_IL

COM

The under-voltage detection operates with a rising

supply threshold of typical V_BSUV+= 10.41V and a

falling threshold of V_BSUV-= 9.4V.

Figure 3

Input pin structure

a)

b)

t_FILIN

V_S(U,V,W)provide a high robustness against negative

voltage in respect of COM. This ensures very stable

designs even under rough conditions.

t_FILIN

HIN(X)

LIN(X)

HIN(X)

LIN(X)

high

N (U, V, W) (Low side emitters)

HOx

LOx

HOx

LOx

low

The low side emitters are available for current

measurements of each phase leg. It is

recommended to keep the connection to pin COM

as short as possible in order to avoid unnecessary

inductive voltage drops.

Figure 4

Input filter timing diagram

The integrated gate drive provides additionally a

shoot through prevention capability which avoids

the simultaneous on-state of the high-side and

low-side switch of the same inverter phase. A

minimum deadtime insertion of typically 275ns is

also provided by driver IC, in order to reduce

cross-conduction of the external power switches.

VTH (Thermistor)

A UL certified NTC is integrated in the module with

one terminal of the chip connected to COM and the

other to VTH. When pulled up to a rail voltage such

as VDD or 3.3V by a resistor, the VTH pin provides an

analog voltage signal corresponding to the

temperature of the thermistor.

6

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CIPOS™ Tiny

IM393-X6E

Pin Configuration

RFE (RCIN / Fault / Enable)

V_RFE(t) = 3.3V * e^-t/RC< V_IN,TH-

The RFE pin combines 3 functions in one pin: RCIN or

RC-network based programmable fault clear timer,

fault output and enable input.

C_RCIN< 350ns / ( - ln (V_IN,TH-/ 3.3V) * R_{RFE_ON}

)

Consider V_IN,TH-of 0.8V and R_{RFE_ON}of 50ohm, C_RCIN

should be less than 4.9nF. It is also suggested to

use a R_RCINof between 0.5MΩ and 2MΩ.

The RFE pin is normally connected to an RC network

on the PCB per the schematic in Figure 5. Under

normal operating conditions, R_RCINpulls the RFE pin

to 3.3V, thus enabling all the functions in the IPM.

The microcontroller can pull this pin low to disable

the IPM functionality. This is is the Enable function.

Input

Noise

filter

HIN(X)

Deadtime &

Shoot-Through

Prevention

Input

Noise

filter

LIN(X)

+3.3V

VDD

Under-

voltage

R_RCIN

COM

To Microcontroller

detection

RFE

C_RCIN

ITRIP

Noise

filter

Figure 5

Typical PCB circuit connected

to the RFE pin

The Fault function allows the IPM to report a Fault

condition to the microcontroller by pulling the RFE

pin low in one of two situations. The first is an under-

voltage condition on V_DDand the second is when the

Noise

filter

RFE

ITRIP pin sees a voltage rising above V_IT,TH+

.

The programmable fault clear timer function

provides a means of automatically re-enabling the

module operation a preset amount of time (T_FLT-CLR

)

aꢀer the fault condition has disappeared. Figure 6

shows the RFE-related circuit block diagram inside

the IPM .

Figure 6

RFE internal circuit structure

The length of TFLT-CLR can be determined by using

the formula below.

U,V,W (High side emitter and low side

collector)

V_RFE(t) = 3.3V * (1 – e^-t/RC

)

These pins are motor U, V, W input pins.

T_FLT-CLR= -R_RCIN* C_RCIN* ln(1-VIN,TH+/3.3V)

P (Positive bus input voltage)

For example, if R_RCINis 1.2MΩ and C_RCINis 1nF, the T_FLT-

is about 1.7ms with V_IN,TH+of 2.5V. It is also

i^Cm^LRportant to note that C_RCINneeds to be minimized

in order to make sure it is fully discharged in case of

over current event.

The high side IGBTs are connected to the bus

voltage. It is noted that the bus voltage does not

exceed 450V.

Since the ITRIP pin has a 350ns input filter, it is

appropriate to ensure that C_RCINwill be discharged

below V_IN,TH-by the open-drain MOSFET, aꢀer 350ns.

Therefore, the max C_RCINcan be calculated as:

7

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CIPOS™ Tiny

IM393-X6E

Absolute Maximum Rating

3

Absolute Maximum Rating

3.1

Module

Table 3

Parameter

Symbol

T_J

Conditions

IGBT, diode, HVIC

Value

-40 ~ 150

-40 ~ 125

2000

Units

°C

Operating junction temperature

Operating case temperature

Storage temperature

°C

T_C

°C

T_STG

V_ISO

V

Isolation test voltage

AC RMS, 1 minute, 60Hz

3.2

Inverter

Table 4

Parameter

Symbol

V_CES

Conditions

Value

600

Units

Blocking voltage

IGBT, diode, HVIC

V

A

DC –link supply voltage of P-N

DC –link supply voltage (surge) of P-N

Output current

V_PN

450

Applied between P and N

V_PN(surge)

I_O

500

±20

T_C= 25°C, T_J< 150°C

T_C= 25°C, T_J< 150°C, less than

1ms

Peak output current

I_O(peak)

±30

A

Power dispassion per IGBT

Short Circuit withstand time

P_tot

T_SC

27

3

W

T_J< 150°C, V_DC=360V, V_GE= 15V

μs

3.3

Control

Table 5

Parameter

Symbol

Conditions

Value

Units

Logic supply voltage

Input voltage

V_DD

V_IN

-0.3 ~ 20

V

LIN, HIN, ITRIP, RFE

High side floating supply voltage

V_BS(U,V,W)

-0.3 ~ 20

V

8

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CIPOS™ Tiny

IM393-X6E

Thermal Characteristics

4

Thermal Characteristics

Table 6

Value

Typ.

Parameter

Symbol

Conditions

Units

Min.

Max.

Low side W-phase

IGBT (See Figure 8 for

T_Cmeasurement point)

Single IGBT thermal resistance,

°C/W

R_TH(J-C)

-

4.0

5.4

4.6

junction-case

Low side W-phase

diode (See Figure 8 for

T_Cmeasurement point)

Single diode thermal resistance,

°C/W

R_TH(J-C)D

-

6.2

junction-case

9

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IM393-X6E

Recommended Operating Conditions

5

Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. All voltages are absolute

referenced to COM. The VS oﬀset is tested with all supplies biased at 15V diﬀerential.

Table 7

Value

Min. Typ. Max.

Parameter

Symbol

Conditions

Units

Positive DC bus input voltage

Low side control supply voltage

High side floating supply voltage

Input voltage

V_DC

V_DD

V_BS

-

13.5

12.5

0

-

15

-

450

16.5

17.5

5

V

LIN, HIN, ITRIP, RFE

V_IN

V

PWM carrier frequency

F_PWM

V_COM

DT

PW_IN(ON)

PW_IN(OFF)

-

20

-

kHz

V

Voltage between COM and N (including surge)

-5

5

External dead time between HIN & LIN

Input pulse width

1

-

µs

-

10

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CIPOS™ Tiny

IM393-X6E

Static Parameters

6

Static Parameters

6.1

Inverter

V_BIAS(V_DD, V_BS(U,V,W))=15V, T_J=25°C unless otherwise specified

Table 8

Value

Parameter

Symbol

Conditions

Units

Min. Typ. Max.

-

1.5

1.7

10

1.9

-

V

I_C= 10A

Collector-Emiꢀer saturaꢁon voltage

V_CE(ON)

I_C= 10A, T_J= 150°C

V_IN= 0V, V_CE= 600V

80

μA

Collector-Emitter leakage current

I_CES

V_IN= 0V, V_CE= 600V, T_J=150°C

-

80

-

μA

I_C= 10A

-

1.6

2.2

V

Diode forward voltage drop

V_F

I_C= 10A, T_J= 150°C

-

6.2

Control

V_BIAS(V_DD, V_BS(U,V,W))=15V, T_J=25ºC, unless otherwise specified. The VIN parameters are referenced to COM and are

applicable to all six channels

Table 9

Value

Min. Typ. Max.

Parameter

Symbol

Conditions

LIN, HIN, RFE

Units

V

Logic “1” input voltage

Logic “0” input voltage

V_DD/V_BSsupply undervoltage,

positive going threshold

V_DD/V_BSsupply undervoltage,

negative going threshold

V_IN,TH+

V_IN,TH-

V_DD,UV+, V_BS,UV+

2.5

-

LIN, HIN, RFE

-

0.8

9.6

8.6

10.4

9.4

11.2

10.2

V

V_DD,UV-, V_BS,UV-

V_DD/V_BSsupply undervoltage

V_DDUVH, V_BSUVH

-

1

-

V

lock-out hysteresis

Quiescent V_BSsupply current

Quiescent V_DDsupply current

I_QBS

I_QDD

-

150

3.2

μA

mA

Oﬀset supply leakage

I_LK

V_S= 600V

V_IN= 3.3V

-

50

μA

current

Input bias current for LIN,

HIN

I_IN+

825

1110

Input bias current for RFE

Input bias current for ITRIP

ITRIP threshold voltage

I_IN,RFE+

I_TRIP+

V_REF= 3.3V

V_ITRIP= 3.3V

-

0

4

1

μA

V

16

V_ITRIP

0.44 0.49

0.54

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IM393-X6E

Static Parameters

Value

Parameter

Symbol

Conditions

Units

Min. Typ. Max.

ITRIP input hysteresis

Bootstrap resistance

RFE low on resistance

V_ITRIP,HYS

R_BS

-

0.07

200

50

-

V

Ω

R_RFE

100

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IM393-X6E

Dynamic Parameters

7

Dynamic Parameters

7.1

Inverter

V_BIAS(V_DD, V_BS(U,V,W))=15V, T_J=25ºC, unless otherwise specified.

Table 10

Value

Min. Typ. Max.

Parameter

Symbol

Conditions

Units

Input to output turn-on propagation

T_ON

I_C= 10A, V_DC= 300V

V_RFE= 5V to 0V

-

1.15

1.35

1.5

μs

delay

Input to output turn-oﬀ propagation

T_OFF

T_EN

delay

RFE low to six switch turn-oﬀ

propagation delay

ITRIP to six switch turn-oﬀ propagation

T_ITRIP

I_C= 10A, V_DC= 300V

delay

V_DC= 300V, I_C= 10A

T_J= 25°C

-

290

400

-

IGBT turn-on energy

IGBT turn-oﬀ energy

E_ON

μJ

150°C

V_DC= 300V, I_C= 10A

T_J= 25°C

-

155

210

-

μJ

E_OFF

150°C

V_DC= 300V, I_C= 10A

T_J= 25°C

-

35

70

-

Diode reverse recovery energy

Reverse Bias Safe Operating Area

E_REC

150°C

T_J= 150°C, I_C= 40A, V_P= 600V,

V_DC= 450V,V_DD= +15V to 0V

RBSOA

FULL SQUARE

7.2

Control

V_BIAS(V_DD, V_BS(U,V,W))=15V, T_J=25ºC, unless otherwise specified.

Table 11

Value

Parameter

Symbol

Conditions

V_IN= 0 or V_IN= 5V

Units

Min. Typ. Max.

Input filter time (HIN, LIN, ITRIP)

Input filter time (RFE)

-

350

-

ns

T_FILIN

T_FILRFE

T_FLT

V_RFE= 0 or V_RFE= 5V

100 200

ITRIP to Fault propagation delay

Internal injected dead time

V_IN= 0 or V_IN= 5V, V_ITRIP= 5V

V_IN= 0 or V_IN= 5V

400 600 800

190 275 420

ns

T_DT

Matching propagation delay time

(On & Oﬀ) all channels

M_T

External dead time > 420ns

-

50

ns

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CIPOS™ Tiny

IM393-X6E

Thermistor Characteristics

8

Thermistor Characteristics

Table 12

Value

Typ.

47

Parameter

Symbol

Conditions

Units

Min.

44.65

1.27

3989

-40

Max.

49.35

1.56

Resistance

T = 25°C, ±5% tolerance

R₂₅

R₁₂₅

B

kΩ

K

Resistance

1.41

4050

-

T = 125°C

25-50°C, R₂=R₁e^{[B1/T2-1/T1)]}

B-constant

4111

125

Temperature Range

°C

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

+5V

R_EXT

V_THERM

R_THERM

Max

Typ

Min

-40 -30 -20 -10

0

10

20

30

40

50

60

70

80

90

100 110 120 130

Thermistor Temperature [ C]

Figure 7

Thermistor readout vs. temperature (with 4.7kohm R_EXTpull-up resistor) and typical

thermistor resistance values vs. temperature table (For more details, please refer to the

application note ‘AN2018-13 CIPOS™ IM393-XX IPM technical description_1R0_final’)

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IM393-X6E

Mechanical Characteristics and Ratings

9

Mechanical Characteristics and Ratings

Table 13

Value

Typ.

Parameter

Symbol

Conditions

Units

Min.

Max.

Flat, greased surface. Heatsink

Thermal resistance, case-

R_TH(C-S)

CTI

-

0.25

-

°C/W

compound thermal conductivity

heatsink

1W/mK

Comparative Tracking Index

600

0

-

V

Curvature of module backside BKC

-

150

0.8

-

µm

Nm

g

Mounting torque

Weight

T

W

M3 screw and washer

0.6

-

0.7

6.0

Figure 8

Backside curvature measurement position

15

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IM393-X6E

Qualification Information

10

Qualification Information

Table 14

UL Certified

File Number : E314539

Yes

RoHS Compliant

Human body model

Class 3A

Class C3

ESD

Charge discharge model

16

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IM393-X6E

Diagram & Tables

11

Diagram & Tables

11.1

Tc Measurement Point

Figure 9

TC measurement point

11.2

Input-Output Logic Table

P

Ho

Lo

HIN(U, V, W)

LIN(U, V, W)

U, V, W

Driver

IC

ITRIP

RFE

Figure 10

Table 15

Module block diagram

Input-output logic level table

RFE

ITRIP

HIN(U,V,W)

LIN(U,V,W)

U,V,W

1

0

1

X

1

0

1

X

0

1

0

1

X

V_DC

0

Oﬀ*

1

0

* Voltage depends on direction of phase current

17

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Diagrams & Tables

11.3

Switching Time Definitions

HIN(U, V, W)

LIN(U, V, W)

50%

I_TRIP

T_FLT

50%

RFE

U, V, W

50%

T_ITRIP

T_FLT-CLR

Figure 11

ITRIP time waveform

50%

RFE

T_EN

U, V, W

50%

Figure 12

Output disable timing diagram

HINx

2.1V

LINx

0.9V

t_rr

t_off

t_on

10%

i_Cx

90%

t_f

t_r

10%

v_CEx

t_c(on)

t_c(off)

Figure 13

Switching times definition

18

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Application Guide

12

Application Guide

12.1

Typical Application Schematic

#10

(1) P

P (35)

P (33)

(3) VS(W)

(4) VB(W)

VB3

VB2

HO3

VS3

(6) VS(V)

(7) VB(V)

W (32)

V (31)

#4

(9) VS(U)

HO2

VS2

#3

(10) VB(U)

VB1

3-ph AC

Motor

5 or 3.3V

15V

#8

#2

(12) VDD

(13) VTH

HO1

VS1

VDD

U (30)

-t°

#9

5 or 3.3V

(14) COM

COM

VSS

#5

(15) COM

(16) ITRIP

(17) RFE

LO3

LO2

LO1

ITRIP

RFE

N(W) (29)

N(V) (28)

N(U) (27)

Micro

Controller

(18) HIN(U)

HIN1

#7

#6

(19) HIN(V)

(20) HIN(W)

HIN2

HIN3

(21) LIN(U)

(22) LIN(V)

(23) LIN(W)

Power GND

LIN1

LIN2

LIN3

(24) N(W)

(25) N(V)

#1

(26) N(U)

Figure 14

Typical application connection

1. Input circuit

-RC filter can be used to reduce input signal noise (100Ω, 1nF)

-The capacitors should be located close to CIPOS™ Tiny (to COM terminal especially).

2. Itrip circuit

-To prevent a mis operation of protection function, RC filter is recommended

-The capacitor must be located close to Itrip and COM terminals.

3. VTH circuit

-This terminal should be pulled up to the bias voltage of 5V/3.3V through a proper resistor to define

suitable voltage for temperature monitoring.

-It is recommended that RC filter is placed close to the controller

4. VB-VS circuit

-Capacitors for high side floating supply voltage should be placed close to VB and VS terminals.

-Additional high frequency capacitors, typically 0.1µF, are strongly recommended.

5. Snubber capacitor

-The wiring among CIPOS™ Tiny, snubber capacitor and shunt resistors should be short as possible.

6. Shunt resistor

-SMD type shunt resistors are strongly recommended to minimize its internal stray inductance.

7. Ground pattern

-Pattern overlap of power ground and signal ground should be minimized. The patterns should be

connected at the common end of shunt resistors only for the same potential.

8. COM pattern

-Both of the COM terminals should be connected together.

9. RFE circuit

-To setup R and C parameter for fault clear time, please refer to Figure 5.

-This R is also mandatory for fault out reporting function because it is open drain structure.

10. P pattern

-Both of the P terminals should be connected together.

19

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Application Guide

12.2

Performance Charts

20

18

16

14

12

10

8

F_PWM=6kHz

F_PWM=16kHz

6

V+ = 300V, VDD=VBS=15V,

TJ≤150ꢀC, TC≤125ꢀC, MI=0.8,

PF=0.8, Sinusoidal PWM

4

2

0

10

20

30

40

50

60

70

80

90 100 110 120 130 140 150

Case Temperature Tc [℃]

Figure 15

Maximum operating current SOA

1. This maximum operating current SOA is just one of example based on typical characteristics for this product.

It can be change by each user’s actual operating conditions.

12.3

Tj vs. Tth

160

150

140

130

120

110

100

T_{J avg}= 1.24 x T_Therm+ 21

105

90

65

70

75

80

85

90

95

100

110

115

Internal Thermistor Temperature Equivalent Read Out - °C

Figure 16

Typical Tj vs Tth correlation, sinusoidal modulation, V_DC=300V, Iphase=5Arms, fsw=16kHz,

fmod=50Hz, MI=0.8, PF=0.6

20

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Application Guide

12.4

–V_SImmunity

Figure 17

Negative transient Vs SOA for integrated gate driver

21

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Package Information

13

Package Outline

MISSING PIN : 2, 5, 8, 11, 34

±0.30

32.00

±0.15

5.55

7.62

4X3.81

2X2.54

8X0.70

8X0.60

1.90

33

32

31

30

29

28

27

35

16.00

±0.20

1.70

0°~4°

3

4

9

10

1

15

17

19

21

23

26

7

13

25X1.27

8.30

15.875

31.75

Default tolerance : ± 0.5mm

34.00

Figure 18

IM393-X6E

22

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Package Information

MISSING PIN : 2, 5, 8, 11, 34

±0.30

32.00

±0.15

2.90

7.62

4X3.81

2X2.54

8X0.70

8X0.60

1.90

33

32

31

30

29

28

27

35

16.00

±0.20

1.70

0°~4°

3

1

4

9

10

15

17

19

21

23

26

7

13

25X1.27

5.65

15.875

31.75

Default tolerance : ± 0.5mm

34.00

Figure 19

IM393-X6E2

23

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Package Information

MISSING PIN : 2, 5, 8, 11, 34

±0.30

32.00

±0.15

3.60

7.62

4X3.81

2X2.54

8X0.70

8X0.60

1.90

33

32

31

30

29

28

27

35

16.00

±0.20

1.70

0°~4°

3

1

4

9

10

15

17

19

21

23

26

7

13

25X1.27

6.35

15.875

31.75

Default tolerance : ± 0.5mm

34.00

Figure 20

IM393-X6E3

24

Final Datasheet

V2.0

2019-05-21

CIPOS™ Tiny

IM393-X6E

Revision History

Major changes since the last revision

Page or Reference

Revision

Date

Description of changes

25

Final Datasheet

V2.0

2019-05-21

Other Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

IMPORTANT NOTICE

For further information on the product, technology,

delivery terms and conditions and prices please

contact your nearest Infineon Technologies oﬀice

(www.infineon.com).

The information given in this document shall in no

event be regarded as a guarantee of conditions or

characteristics (“Beschaﬀenheitsgarantie”) .

Edition 2017-09-26

Published by

Infineon Technologies AG

81726 Munich, Germany

With respect to any examples, hints or any typical

values stated herein and/or any information

regarding the application of the product, Infineon

Technologies hereby disclaims any and all

warranties and liabilities of any kind, including

without limitation warranties of non-infringement of

intellectual property rights of any third party.

WARNINGS

Due to technical requirements products may contain

dangerous substances. For information on the types

in question please contact your nearest Infineon

Technologies oﬀice.

Do you have a question about this

document?

Email: erratum@infineon.com

Except as otherwise explicitly approved by Infineon

In addition, any information given in this document

is subject to customer’s compliance with its

obligations stated in this document and any

applicable legal requirements, norms and standards

concerning customer’s products and any use of the

product of Infineon Technologies in customer’s

applications.

Technologies in

a written document signed by

Document reference

authorized representatives of Infineon Technologies,

Infineon Technologies’ products may not be used in

any applications where a failure of the product or

any consequences of the use thereof can reasonably

be expected to result in personal injury.

The data contained in this document is exclusively

intended for technically trained staﬀ. It is the

responsibility of customer’s technical departments

to evaluate the suitability of the product for the

intended application and the completeness of the

product information given in this document with

respect to such application.


型号：	IM393-X6E3
厂家：	Infineon
描述：	CIPOSâ¢ Tiny IPM 600V/20A
文件：	总26页 (文件大小：1945K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IM393-X6E3 [INFINEON]

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