IM68A130 [INFINEON]
The IM68A130 is a high performance, single-ended, analog MEMS microphone designed for applications which require a low LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP).;
| 型号： | IM68A130 |
| 厂家： | 
Infineon |
| 描述： | The IM68A130 is a high performance, single-ended, analog MEMS microphone designed for applications which require a low LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP). |
| 文件： | 总16页 (文件大小：1345K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IM68A130V01
Datasheet
IM68A130V01
h
™
High performance analog XENSIV MEMS microphone
Features
• Surface mount package: 3.35mm x 2.5mm x 0.98mm
• Analog single-ended output
• Flat frequency response with low-frequency roll-off at 10Hz
• Acoustic overload point at 130dBSPL
• Signal-to-noise ratio of 68dB(A) SNR
• Narrow sensitivity and phase tolerances
• Omnidirectional pickup pattern
Potential applications
• Active Noise Cancellation (ANC) headphones and earphones
• Smartphones and mobile devices
• Devices with Voice User Interface (VUI)
- Smart speakers
- Home automation
- IOT devices
• High quality audio capturing
- Laptops and tablets
- Conference systems
- Cameras and camcorders
• Industrial or home monitoring with audio pattern detection
Product validation
Technology qualified for industrial applications.
Ready for validation in industrial applications according to the relevant tests of IEC 60747 and
60749 or alternatively JEDEC47/20/22.
Description
The IM68A130V01 is a high performance, single-ended, analog MEMS microphone designed for applications which require a low
LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP).
The high signal-to-noise ratio (SNR) of 68dB(A) enables far field and low volume audio pick-up. The flat frequency response
and tight manufacturing tolerance improve the performance of Active Noise Cancellation (ANC) and multi-microphone array
applications.
The high performance analog microphone ASIC contains an extremely low noise preamplifier providing constant current
consumption (110µA) over VDD.
Each IM68A130V01 microphone is calibrated with an advanced Infineon calibration algorithm, resulting in small sensitivity
tolerances ( 1dB).
Type
Package
Marking
IM68A130V01
PG-TLGA-4-2
I68A04
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
1.00
2022-12-02
IM68A130V01
Datasheet
Table of contents
Table of contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Typical microphone interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1
2
3
4
Acoustic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1
Free field frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Electrical characteristics and parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
5.1
5.2
5.3
6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Footprint and stencil recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering and board assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
7
8
9
10
Datasheet
2
1.00
2022-12-02
IM68A130V01
Datasheet
1 Block diagram reference
1
Block diagram reference
VDD
CALIBRATION
BAND GAP
LDO
MEMS BIAS
CHARGE PUMP
BACKPLATE
MEMBRANE
AMP
OUT+
ASIC
MEMS
GROUND
Figure 1
Block diagram
2
Typical microphone interface
VDD
VDD
>1µF
VDD
OUT
Input
GND
MIC
CVDD
GND
CODEC
Figure 2
Single ended analog microphone interface example
Note:
Power supply filtering capacitors should be placed physically as close to the microphone as possible.
Detailed information on electrical, acoustical, and mechanical implementation can be found in the
application note on XENSIV™ MEMS microphone web page
Datasheet
3
1.00
2022-12-02
IM68A130V01
Datasheet
3 Typical performance characteristics
3
Typical performance characteristics
Test conditions (unless otherwise specified): VDD = 2.75V, TA= 25°C, output unloaded
12
30
9
6
25
20
15
10
5
3
0
0
-3
-6
-9
-12
-5
-10
-15
-20
0
20000
40000
60000
80000
10
100
1000
10000
Frequency [Hz]
Frequency [Hz]
Figure 3
Typical amplitude response
Figure 4
Typical ultrasonic response
90
60
30
0
10000
1000
100
10
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
Phase
-30
-60
Group delay
1
-90
0.1
10
100
1000
10000
10
100
1000
10000
Frequency [Hz]
Frequency [Hz]
Figure 5
Typical group delay and phase
response
Figure 6
Typical noise floor (unweighted)
130 dB SPL
118 dB SPL
10
1
10
1
94 dB SPL
0.1
0.1
0.01
90
0.01
100
95
100
105
110
115
120
125
130
1000
10000
Input Sound Pressure Level [dB]
Frequency [Hz]
Figure 7
Typical THD vs SPL
Figure 8
Typical THD vs frequency
Datasheet
4
1.00
2022-12-02
IM68A130V01
Datasheet
3 Typical performance characteristics
200
180
160
140
120
100
80
75
72
69
66
63
60
SNR=68dB
60
40
20
0
10
100
1000
10000
2.20
2.40
2.60
2.80
3.00
3.20
3.40
Frequency [Hz]
V
DD [V]
Figure 9
Typical PSRR
Figure 10
Typical IDD vs VDD
Datasheet
5
1.00
2022-12-02
IM68A130V01
Datasheet
4 Acoustic characteristics
4
Acoustic characteristics
Test conditions (unless otherwise specified in the table): VDD = 2.75V, TA = 23°C 5°C, 55ꢀ R.H., audio bandwidth 20Hz
to 20kHz, output unloaded.
Table 1
IM68A130V01 acoustic specifications
Symbol
Parameter
Values
Typ.
-38
Unit
dBV/Pa
Note or Test
Condition
Min.
Max.
-37
Sensitivity
S
-39
1kHz, 94 dB SPL
Sensitivity stability over VDD
Signal-to-noise ratio
Low-frequency roll-off
-0.5
+0.5
dB
dB(A)
Hz
SNR
68
10
A-Weighted
LFRO
-3dB relative to
1kHz sensitivity
High frequency flatness
15
30
kHz
+3dB relative to
1kHz sensitivity
Resonant frequency peak
Total harmonic distortion
Fres
THD
kHz
ꢀ
94dBSPL
118dBSPL
10 ꢀ THD
250Hz
1kHz
0.5
Measuring 2nd to
5th harmonics,
1kHz
1
Acoustic overload point
Phase response
AOP
130
2.5
-0.5
-2.0
45
°
4kHz
Group delay
250Hz
1kHz
µs
3.0
1.0
4kHz
Directivity
Polarity
Omnidirectional
Pickup pattern
Increasing output
voltage
Increasing sound
pressure level
Datasheet
6
1.00
2022-12-02
IM68A130V01
Datasheet
4 Acoustic characteristics
4.1
Free field frequency response
12
9
Upper limit
Lower limit
6
3
0
-3
-6
-9
-12
10
100
1000
10000
Frequency [Hz]
Figure 11
Table 2
1 free field frequency response TBD
free field frequency response, normalized to 1kHz sensitivity value
Frequency [Hz]
Upper limit [dB]
Lower limit [dB]
-1.5
-1.5
-1
-4.5
0.5
1
100
800
1000
1200
6000
10000
15000
0
0
-1
1
-1
1.5
2
-1
-0.5
3
Datasheet
7
1.00
2022-12-02
IM68A130V01
Datasheet
5 Electrical characteristics and parameters
5
Electrical characteristics and parameters
5.1
Absolute maximum ratings
Stresses exceeding the listed maximum ratings may affect device reliability or cause permanent device damage. Functional
device operation at these conditions is not guaranteed.
Table 3
Absolute maximum ratings
Parameter
Symbol
Values
Unit Note / Test
Condition
Min.
Max.
Supply voltage
VDDmax
TS
3.6
100
85
V
Storage temperature
-40
-40
°C
°C
Operating temperature
TA
5.2
Electrical parameters
Table 4
IM68A130V01 electrical parameters
Values
Typ.
Parameter
Symbol
Unit
Note / Test Condition
Min.
Max.
1)
Supply voltage
Output load
VDD
Cl
2.4
2.75
3.3
150
10
V
Cload
Rload
pF
DC-coupled
Rl
MΩ AC-coupled
5.3
Electrical characteristics
Test conditions (unless otherwise specified in the table): VDD = 2.75V, TA = 23°C 5°C, 55ꢀ R.H.
Table 5
IM68A130V01 electrical characteristics
Values
Parameter
Symbol
Unit
Note / Test Condition
Input ≤ 94 dBSPL
Min.
Typ.
Max.
Current consumption
IDD
110
135
µA
µA
Startup current
consumption
Current peak during startup
process
IDD_STARTUP
1
Startup time
Time from application of supply
until functionality is given
tstartup
VOUT_DC
PSRR
Zout
10
ms
V
Vout DC-voltage
1.3
71
Power supply rejection
ratio
dB
Ω
1 kHz sine wave of 200 mVpp
@ 1kHz
Output Impedance
400
1
A 100nF bypass capacitor should be placed close to the microphone VDD pin to ensure best SNR performance
Datasheet
8
1.00
2022-12-02
IM68A130V01
Datasheet
6 Package information
6
Package information
Figure 12
Table 6
IM68A130V01 package drawing
IM68A130V01 pin configuration
Pin Number
Name
Output
GND
Description
Microphone output
Ground
1
2
3
4
VDD
Power supply
Ground
GND
Datasheet
9
1.00
2022-12-02
IM68A130V01
Datasheet
7 Footprint and stencil recommendation
7
Footprint and stencil recommendation
The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS microphone to
ensure optimal performance. A PCB sound port size of diameter 0.6 mm is recommended.
The board pad and stencil aperture recommendations shown in Figure 13 are based on Solder Mask Defined (SMD) pads. The
specific design rules of the board manufacturer should be considered for individual design optimizations or adaptations.
Figure 13
Footprint and stencil recommendation
Datasheet
10
1.00
2022-12-02
IM68A130V01
Datasheet
8 Packing information
8
Packing information
For shipping and assembly the Infineon microphones are packed in product specific tape-and-reel carriers. A detailed drawing of
the carrier can be seen in Figure 14
Figure 14
Table 7
IM68A130V01 tape and reel packing information
IM68A130V01 packaging infomration
Product
Type code
Reel diameter
13"
Quantity per reel
IM68A130V01
I68A04
5000
Datasheet
11
1.00
2022-12-02
IM68A130V01
Datasheet
9 Reflow soldering and board assembly
9
Reflow soldering and board assembly
Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture sensitivity
level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely used reflow
soldering using a forced convection oven is recommended.
The soldering profile should be in accordance with the recommendations of the solder paste manufacturer to reach
an optimal solder joint quality. The reflow profile shown in Figure 15 is recommended for board manufacturing with
Infineon MEMS microphones.
Figure 15
Table 8
Recommended reflow profile
Reflow profile limits
Profile feature
Temperature Min (Tsmin
Pb-Free assembly
150 °C
Sn-Pb Eutectic assembly
100 °C
)
Temperature Max (Tsmax
Time (Tsmin to Tsmax) (ts)
Ramp-up rate (TL to TP)
)
200 °C
150 °C
60-120 seconds
3 °C/second max.
217 °C
60-120 seconds
3 °C/second max.
183 °C
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak Temperature (Tp)
60-150 seconds
260°C +0°C/-5°C
60-150 seconds
235°C +0°C/-5°C
Time within 5°C of actual peak
temperature (tp) 2)
20-40 seconds
10-30 seconds
Ramp-down rate
6 °C/second max.
8 minutes max.
6 °C/second max.
6 minutes max.
Time 25°C to peak temperature
Note:
For further information please consult the 'General recommendation for assembly of Infineon packages'
document which is available on the Infineon Technologies web page
2
Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum
Datasheet
12
1.00
2022-12-02
IM68A130V01
Datasheet
9 Reflow soldering and board assembly
The MEMS microphones can be handled using industry standard pick and place equipment. Care should be taken to
avoid damage to the microphone structure as follows:
•
•
•
Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port hole.
The microphone acoustic port hole should not be exposed to vacuum, this can destroy or damage the MEMS.
Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port hole must
be sealed to prevent particle contamination.
•
•
It is recommended to perform the PCB assembly in a clean room environment in order to avoid microphone
contamination.
Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste is
recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be severely
damaged by cleaning substances.
•
•
To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to cover
the sound port with protective tape during PCB sawing or system assembly.
Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and place tools
is recommended in order to limit the mechanical force exerted on the package.
Datasheet
13
1.00
2022-12-02
IM68A130V01
Datasheet
10 Reliability specifications
10
Reliability specifications
The microphone sensitivity afer stress must deviate by no more than 3dB from the initial value.
Table 9
Test
Reliability specification
Abbreviation Test Condition
Standard
Low Temperature Operating Life
Low Temperature Storage Life
High Temperature Operation Life
High Temperature Storage Life
LTOL
LTSL
Ta=-40°C, VDD=3.6V, 1000 hours
Ta=-40°C, 1000 hours
JESD22-A108
JESD22-A119
HTOL
HTSL
Ta=+125°C, VDD=3.6V, 1000 hours JESD22-A108
JESD22-A103
Ta=+125°C, 1000 hours
Temperature Cycling
PC + TC
Pre conditioning MSL-1
JESD22-A113
JESD22-A104
1000 cycles, -40°C to +125°C, 30
minutes per cycle
Temperature Humidity Bias
PC + THB
Pre conditioning MSL-1
JESD22-A113
JESD22-A101
Ta=+85°C, R.H. = 85ꢀ, VDD=3.6V,
1000 hours
Vibration Test
VVF
MS
20Hz to 2000Hz with a peak
IEC 60068-2-6
acceleration of 20g in X, Y, and Z
for 4 minutes each, total 4 -cycles
Mechanical Shock
Reflow Solder3)
10000g/0.1msec direction x,y,z, 5 IEC 60068-2-27
shocks in each direction, 5 shocks
in total
RS
3 reflow cycles, peak temperature IPC-JEDEC J-STD-020D-01
= +260°C
Electrostatic Discharge -System
Level Test
ESD - SLT
3 discharges of 8kV direct contact IEC-61000-4-2
to lid while Vdd is supplied
according to the operational
modes; (Vdd ground is separated
from earth ground)
Electrostatic Discharge - Human
Body Model
ESD - HBM
ESD - CDM
1 pulse of 2kV between all I/O pin JEDEC-JS001
combinations
Electrostatic Discharge - Charged
Device Model
3 discharges of 500V direct
contact to I/O pins.
JEDEC JS-002
3
The microphone sensitivity must deviate by no more than 1dB from the initial value afer 3 reflow cycles.
Datasheet
14
1.00
2022-12-02
IM68A130V01
Datasheet
Revision history
Revision history
Document
version
Date of
Description of changes
• Initial release
release
v01.00
2022-12-02
Datasheet
15
1.00
2022-12-02
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-12-02
Published by
Infineon Technologies AG
81726 Munich, Germany
Important notice
Warnings
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
©
2022 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-fbm1652085915221
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
相关型号：
IM69D127
IM69D127 is a digital high performance MEMS microphone based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. Its small size of only 3.60 x 2.50 x 1.00 mm3 makes it a perfect match for compact audio devices, such as TWS earbuds.
INFINEON
IM69D128S
Discover the IM69D128S – an ultra-low power digital XENSIVTM MEMS microphone, designed for applications which require high SNR (low self-noise), long battery life, and high reliability.
INFINEON
IM70A135
Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
INFINEON
IM70D122
High performance digital XENSIVTM MEMS microphone IM70D122 makes the most out of Infineon´s Sealed Dual Membrane technology to meet a very high signal-to-noise ratio of 70 dB(A) and a very high sensitivity of -26 dBFS. Especially thanks to its high sensitivity and high SNR the IM70D122 is perfectly tailored for advanced audio capturing which can uplift the audio experience for laptops, tablets, cameras and conference systems. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level.
INFINEON
IM72D128
The IM72D128V01 is an ultra-high performance digital microphone designed for applications which require a very high SNR (low self-noise) and low distortions (high AOP). This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. Different power modes can be selected in order to suit specific clock frequency and current consumption requirements.
INFINEON
©2020 ICPDF网 联系我们和版权申明