IMZA65R048M1H [INFINEON]
CoolSiC™ MOSFET 技术通过最大限度地发挥碳化硅强大的物理特性,从而增强了设备性能、稳健性和易用性等独特优势。IMZA65R048M1H 650V CoolSiC™ MOSFET 基于先进的沟槽半导体技术,并经过优化,在毫不折衷的情况下,在应用中实现最低损耗,并在运行中实现最佳可靠性。;型号: | IMZA65R048M1H |
厂家: | Infineon |
描述: | CoolSiC™ MOSFET 技术通过最大限度地发挥碳化硅强大的物理特性,从而增强了设备性能、稳健性和易用性等独特优势。IMZA65R048M1H 650V CoolSiC™ MOSFET 基于先进的沟槽半导体技术,并经过优化,在毫不折衷的情况下,在应用中实现最低损耗,并在运行中实现最佳可靠性。 半导体 |
文件: | 总15页 (文件大小:1483K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IMZA65R048M1H
MOSFET
PG-TOꢀ247-4-3
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
Theꢀ650ꢀVꢀCoolSiC™ꢀisꢀbuiltꢀoverꢀtheꢀsolidꢀsiliconꢀcarbideꢀtechnology
developedꢀinꢀInfineonꢀinꢀmoreꢀthanꢀ20ꢀyears.ꢀLeveragingꢀtheꢀwideꢀbandgap
SiCꢀmaterialꢀcharacteristics,ꢀtheꢀ650VꢀCoolSiC™ꢀMOSFETꢀoffersꢀaꢀunique
combinationꢀofꢀperformance,ꢀreliabilityꢀandꢀeaseꢀofꢀuse.ꢀSuitableꢀforꢀhigh
temperatureꢀandꢀharshꢀoperations,ꢀitꢀenablesꢀtheꢀsimplifiedꢀandꢀcost
effectiveꢀdeploymentꢀofꢀtheꢀhighestꢀsystemꢀefficiency.
Tab
1
2
3
4
Features
•ꢀOptimizedꢀswitchingꢀbehaviorꢀatꢀhigherꢀcurrents
•ꢀCommutationꢀrobustꢀfastꢀbodyꢀdiodeꢀwithꢀlowꢀQrr
•ꢀSuperiorꢀgateꢀoxideꢀreliability
•ꢀBestꢀthermalꢀconductivityꢀandꢀbehavior
•ꢀLowerꢀRDS(on)ꢀandꢀpulseꢀcurrentꢀdependencyꢀonꢀtemperature
•ꢀIncreasedꢀavalancheꢀcapability
Drain
Pin 1, Tab
*1
•ꢀCompatibleꢀwithꢀstandardꢀdriversꢀ(recommendedꢀdrivingꢀvoltage:ꢀ18V)
•ꢀKelvinꢀsourceꢀprovidesꢀupꢀtoꢀ4ꢀtimesꢀlowerꢀswitchingꢀlosses
Gate
Pin 4
Driver
Source
Pin 3
Power
Source
Pin 2
Benefits
*1: Internal body diode
•ꢀUniqueꢀcombinationꢀofꢀhighꢀperformance,ꢀhighꢀreliabilityꢀandꢀeaseꢀofꢀuse
•ꢀEaseꢀofꢀuseꢀandꢀintegration
•ꢀSuitableꢀforꢀtopologiesꢀwithꢀcontinuousꢀhardꢀcommutation
•ꢀHigherꢀrobustnessꢀandꢀsystemꢀreliability
•ꢀEfficiencyꢀimprovement
•ꢀReducedꢀsystemꢀsizeꢀleadingꢀtoꢀhigherꢀpowerꢀdensity
Potentialꢀapplications
•ꢀSMPS
•ꢀUPSꢀ(uninterruptableꢀpowerꢀsupplies)
•ꢀSolarꢀPVꢀinverters
•ꢀEVꢀchargingꢀinfrastructure
•ꢀEnergyꢀstorageꢀandꢀbatteryꢀformation
•ꢀClassꢀDꢀamplifiers
Productꢀvalidation
FullyꢀqualifiedꢀaccordingꢀtoꢀJEDECꢀforꢀIndustrialꢀApplications
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters
Parameter
VDSꢀ@ꢀTJꢀ=ꢀ25ꢀ°C
RDS(on),typ
Value
650
48
Unit
V
mΩ
nC
A
QG,typ
33
ID,pulse
100
78
Qossꢀ@ꢀ400ꢀV
Eossꢀ@ꢀ400ꢀV
nC
µJ
11.7
Typeꢀ/ꢀOrderingꢀCode
Package
Marking
RelatedꢀLinks
IMZA65R048M1H
PG-TO 247-4-3
65R048M1
see Appendix A
Final Data Sheet
1
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
TableꢀofꢀContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Final Data Sheet
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Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
1ꢀꢀꢀꢀꢀMaximumꢀratings
atꢀTJꢀ=ꢀ25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified
Tableꢀ2ꢀꢀꢀꢀꢀMaximumꢀratings
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Typ.
Max.
-
-
-
-
39
24
TCꢀ=ꢀ25ꢀ°C
A
Continuous drain current1)
Pulsed drain current2)
ID
TCꢀ=ꢀ100ꢀ°C
ID,pulse
EAS
-
-
-
-
100
171
A
TCꢀ=ꢀ25ꢀ°C
IDꢀ=ꢀ6.4ꢀA,ꢀVDDꢀ=ꢀ50ꢀV,ꢀLꢀ=ꢀ8.3ꢀmH;
see table 10
Avalanche energy, single pulse
mJ
Avalanche energy, repetitive
Avalanche current, single pulse
MOSFETꢀdv/dtꢀruggedness
EAR
IAS
-
-
-
-
-
-
0.85
6.4
mJ
A
IDꢀ=ꢀ6.4ꢀA,ꢀVDDꢀ=ꢀ50ꢀV;ꢀseeꢀtableꢀ10
-
dv/dt
200
V/ns VDSꢀ=ꢀ0...400ꢀV
Gate source voltage (recommended
driving voltage)
VGS
0
-
18
V
ACꢀ(fꢀ>ꢀ1ꢀHz)
Gate source voltage (dynamic)
Power dissipation
VGS
Ptot
Tstg
TJ
-5
-
-
-
-
-
-
-
-
23
V
tpulse,negativeꢀ<=ꢀ15ꢀns
-
125
150
150
60
W
°C
°C
TCꢀ=ꢀ25ꢀ°C
Storage temperature
-55
-
-
Operating junction temperature
-55
Mounting torque
-
-
-
-
-
Ncm M3 and M3.5 screws
Continuous diode forward current1)
Diode pulse current2)
IS
39
A
A
V
TCꢀ=ꢀ25ꢀ°C
IS,pulse
VISO
100
n.a.
TCꢀ=ꢀ25ꢀ°C
Insulation withstand voltage
Vrms,ꢀTCꢀ=ꢀ25ꢀ°C,ꢀtꢀ=ꢀ1ꢀmin
1)ꢀLimitedꢀbyꢀTJ,max
2)ꢀPulseꢀwidthꢀtpꢀlimitedꢀbyꢀTJ,max
Final Data Sheet
3
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
2ꢀꢀꢀꢀꢀThermalꢀcharacteristics
Tableꢀ3ꢀꢀꢀꢀꢀThermalꢀcharacteristics
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Typ.
Max.
1.0
Thermal resistance, junction - case
RthJC
-
-
-
-
°C/W -
Thermal resistance, junction - ambient RthJA
62
°C/W leaded
Thermal resistance, junction - ambient
for SMD version
RthJA
-
-
-
-
-
°C/W n.a.
Soldering temperature, wavesoldering
only allowed at leads
Tsold
260
°C
1.6mm (0.063 in.) from case for 10s
Final Data Sheet
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Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
3ꢀꢀꢀꢀꢀElectricalꢀcharacteristics
atꢀTJꢀ=ꢀ25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified
Tableꢀ4ꢀꢀꢀꢀꢀStaticꢀcharacteristics
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
650
3.5
Typ.
-
Max.
-
Drain-source breakdown voltage
Gate threshold voltage1)
V(BR)DSS
V(GS)th
V
V
VGSꢀ=ꢀ0ꢀV,ꢀIDꢀ=ꢀ0.6ꢀmA
VDSꢀ=ꢀVGS,ꢀIDꢀ=ꢀ6ꢀmA
4.5
5.7
-
-
1
2
150
-
VDSꢀ=ꢀ650ꢀV,ꢀVGSꢀ=ꢀ0ꢀV,ꢀTJꢀ=ꢀ25ꢀ°C
VDSꢀ=ꢀ650ꢀV,ꢀVGSꢀ=ꢀ0ꢀV,ꢀTJꢀ=ꢀ150ꢀ°C
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
IDSS
µA
nA
Ω
IGSS
-
-
100
VGSꢀ=ꢀ20ꢀV,ꢀVDSꢀ=ꢀ0ꢀV
-
-
0.048 0.064
0.063
VGSꢀ=ꢀ18ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,ꢀTJꢀ=ꢀ25ꢀ°C
VGSꢀ=ꢀ18ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,ꢀTJꢀ=ꢀ150ꢀ°C
RDS(on)
RG
-
-
6.0
-
Ω
fꢀ=ꢀ1ꢀMHz,ꢀopenꢀdrain
Tableꢀ5ꢀꢀꢀꢀꢀDynamicꢀcharacteristics
Values
Typ.
1118
13
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
-
Input capacitance
Reverse capacitance
Output capacitance2)
Output charge2)
Ciss
Crss
Coss
Qoss
-
-
-
-
pF
pF
pF
nC
VGSꢀ=ꢀ0ꢀV,ꢀVDSꢀ=ꢀ400ꢀV,ꢀfꢀ=ꢀ250ꢀkHz
VGSꢀ=ꢀ0ꢀV,ꢀVDSꢀ=ꢀ400ꢀV,ꢀfꢀ=ꢀ250ꢀkHz
VGSꢀ=ꢀ0ꢀV,ꢀVDSꢀ=ꢀ400ꢀV,ꢀfꢀ=ꢀ250ꢀkHz
calculationꢀbasedꢀonꢀCoss
-
129
168
101
78
Effective output capacitance, energy
related3)
VGSꢀ=ꢀ0ꢀV,
VDSꢀ=ꢀ0...400ꢀV
Co(er)
Co(tr)
td(on)
tr
-
-
-
-
-
-
146
194
14.8
12.6
17
-
-
-
-
-
-
pF
pF
ns
ns
ns
ns
Effective output capacitance, time
related4)
IDꢀ=ꢀconstant,ꢀVGSꢀ=ꢀ0ꢀV,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
VDSꢀ=ꢀ0...400ꢀV
VDDꢀ=ꢀ400ꢀV,ꢀVGSꢀ=ꢀ18ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,
RGꢀ=ꢀ1.8ꢀΩ;ꢀseeꢀtableꢀ9
Turn-on delay time
Rise time
VDDꢀ=ꢀ400ꢀV,ꢀVGSꢀ=ꢀ18ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,
RGꢀ=ꢀ1.8ꢀΩ;ꢀseeꢀtableꢀ9
VDDꢀ=ꢀ400ꢀV,ꢀVGSꢀ=ꢀ18ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,
RGꢀ=ꢀ1.8ꢀΩ;ꢀseeꢀtableꢀ9
Turn-off delay time
Fall time
td(off)
tf
VDDꢀ=ꢀ400ꢀV,ꢀVGSꢀ=ꢀ18ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,
RGꢀ=ꢀ1.8ꢀΩ;ꢀseeꢀtableꢀ9
13
1)ꢀTestedꢀafterꢀ1ꢀmsꢀpulseꢀatꢀVGSꢀ=ꢀ+20ꢀV
2)ꢀMaximumꢀspecificationꢀisꢀdefinedꢀbyꢀcalculatedꢀsixꢀsigmaꢀupperꢀconfidenceꢀbound
3)ꢀCo(er)ꢀisꢀaꢀfixedꢀcapacitanceꢀthatꢀgivesꢀtheꢀsameꢀstoredꢀenergyꢀasꢀCossꢀwhileꢀVDSꢀisꢀrisingꢀfromꢀ0ꢀtoꢀ400ꢀV
4)ꢀCo(tr)ꢀisꢀaꢀfixedꢀcapacitanceꢀthatꢀgivesꢀtheꢀsameꢀchargingꢀtimeꢀasꢀCossꢀwhileꢀVDSꢀisꢀrisingꢀfromꢀ0ꢀtoꢀ400ꢀV
Final Data Sheet
5
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
Tableꢀ6ꢀꢀꢀꢀꢀGateꢀchargeꢀcharacteristics
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Typ.
Max.
VDDꢀ=ꢀ400ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
VGSꢀ=ꢀ0ꢀtoꢀ18ꢀV
Gate to source charge
Gate to drain charge
Gate charge total
Qgs
Qgd
Qg
-
9
-
nC
VDDꢀ=ꢀ400ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
VGSꢀ=ꢀ0ꢀtoꢀ18ꢀV
-
-
8
-
-
nC
VDDꢀ=ꢀ400ꢀV,ꢀIDꢀ=ꢀ20.1ꢀA,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
VGSꢀ=ꢀ0ꢀtoꢀ18ꢀV
33
nC
Tableꢀ7ꢀꢀꢀꢀꢀReverseꢀdiodeꢀcharacteristics
Values
Typ.
4.0
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
Diode forward voltage
Reverse recovery time
VSD
trr
-
-
V
VGSꢀ=ꢀ0ꢀV,ꢀIFꢀ=ꢀ20.1ꢀA,ꢀTJꢀ=ꢀ25ꢀ°C
VRꢀ=ꢀ400ꢀV,ꢀIFꢀ=ꢀ20.1ꢀA,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
diF/dtꢀ=ꢀ1000ꢀA/µs;ꢀseeꢀtableꢀ8
-
-
-
68
-
-
-
ns
VRꢀ=ꢀ400ꢀV,ꢀIFꢀ=ꢀ20.1ꢀA,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
diF/dtꢀ=ꢀ1000ꢀA/µs;ꢀseeꢀtableꢀ8
Reverse recovery charge
Qrr
Irrm
125
8.4
nC
A
VRꢀ=ꢀ400ꢀV,ꢀIFꢀ=ꢀ20.1ꢀA,ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
diF/dtꢀ=ꢀ1000ꢀA/µs;ꢀseeꢀtableꢀ8
Peak reverse recovery current
Final Data Sheet
6
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
4ꢀꢀꢀꢀꢀElectricalꢀcharacteristicsꢀdiagrams
Diagramꢀ1:ꢀPowerꢀdissipation
Diagramꢀ2:ꢀSafeꢀoperatingꢀarea
150
103
102
101
100
10-1
10-2
10-3
1 µs
125
100
75
50
25
0
10 µs
100 µs
1 ms
10 ms
DC
0
25
50
75
100
125
150
100
101
102
103
TCꢀ[°C]
VDSꢀ[V]
Ptot=f(TC)
ID=f(VDS);ꢀTC=25ꢀ°C;ꢀD=0;ꢀparameter:ꢀtp
Diagramꢀ3:ꢀSafeꢀoperatingꢀarea
Diagramꢀ4:ꢀMax.ꢀtransientꢀthermalꢀimpedance
103
101
102
101
1 µs
100
10 µs
0.5
100
100 µs
1 ms
0.2
0.1
10-1
10-2
10-3
10-1
0.05
10 ms
DC
0.02
0.01
single pulse
10-2
100
101
102
103
10-5
10-4
10-3
10-2
10-1
VDSꢀ[V]
tpꢀ[s]
ID=f(VDS);ꢀTC=80ꢀ°C;ꢀD=0;ꢀparameter:ꢀtp
ZthJC=f(tP);ꢀparameter:ꢀD=tp/T
Final Data Sheet
7
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
Diagramꢀ5:ꢀTyp.ꢀoutputꢀcharacteristics
Diagramꢀ6:ꢀTyp.ꢀoutputꢀcharacteristics
150
150
125
100
75
18 V
125
100
75
50
25
0
18 V
15 V
12 V
15 V
50
12 V
10 V
8 V
25
10 V
8 V
0
0
5
10
15
20
0
5
10
15
20
VDSꢀ[V]
VDSꢀ[V]
ID=f(VDS);ꢀTj=25ꢀ°C;ꢀparameter:ꢀVGS
ID=f(VDS);ꢀTj=125ꢀ°C;ꢀparameter:ꢀVGS
Diagramꢀ7:ꢀTyp.ꢀdrain-sourceꢀon-stateꢀresistance
Diagramꢀ8:ꢀDrain-sourceꢀon-stateꢀresistance
0.200
2.0
10 V
15 V
12 V
0.160
0.120
0.080
0.040
1.5
1.0
0.5
18 V
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
IDꢀ[A]
TJꢀ[°C]
RDS(on)=f(ID);ꢀTj=125ꢀ°C;ꢀparameter:ꢀVGS
RDS(on)=f(Tj);ꢀID=20.1ꢀA;ꢀVGS=18ꢀV
Final Data Sheet
8
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
Diagramꢀ9:ꢀTyp.ꢀtransferꢀcharacteristics
Diagramꢀ10:ꢀTyp.ꢀgateꢀcharge
200
20
18
16
14
12
10
8
150
100
400 V
6
50
150 °C
4
25 °C
2
0
0
0
2
4
6
8
10
12
14
16
18
20
0
5
10
15
20
25
30
35
40
VGSꢀ[V]
Qgateꢀ[nC]
ID=f(VGS);ꢀVDS=20V;ꢀparameter:ꢀTj
VGS=f(Qgate);ꢀID=20.1ꢀAꢀpulsed;ꢀparameter:ꢀVDD
Diagramꢀ11:ꢀForwardꢀcharacteristicsꢀofꢀreverseꢀdiode
Diagramꢀ12:ꢀForwardꢀcharacteristicsꢀofꢀreverseꢀdiode
103
103
102
102
25 °C
101
101
150 °C
150 °C
25 °C
100
100
10-1
10-1
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VSDꢀ[V]
VSDꢀ[V]
IF=f(VSD);ꢀparameter:ꢀTj
IF=f(VSD);ꢀVGS=18ꢀV;ꢀparameter:ꢀTj
Final Data Sheet
9
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
Diagramꢀ13:ꢀAvalancheꢀenergy
Diagramꢀ14:ꢀDrain-sourceꢀbreakdownꢀvoltage
200
690
680
670
660
650
640
630
620
150
100
50
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
TJꢀ[°C]
TJꢀ[°C]
EAS=f(Tj);ꢀID=6.4ꢀA;ꢀVDD=50ꢀV
VBR(DSS)=f(Tj);ꢀID=0.6ꢀmA
Diagramꢀ15:ꢀTyp.ꢀcapacitances
Diagramꢀ16:ꢀTyp.ꢀCossꢀstoredꢀenergy
104
20
15
10
5
Ciss
103
102
101
Coss
Crss
0
0
50 100 150 200 250 300 350 400 450 500
0
50 100 150 200 250 300 350 400 450 500
VDSꢀ[V]
VDSꢀ[V]
C=f(VDS);ꢀVGS=0ꢀV;ꢀf=250ꢀkHz
Eoss=f(VDS)
Final Data Sheet
10
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
Diagramꢀ17:ꢀTyp.ꢀQossꢀoutputꢀcharge
100
80
60
40
20
0
0
50 100 150 200 250 300 350 400 450 500
VDSꢀ[V]
Qoss=f(VDS
)
Final Data Sheet
11
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
5ꢀꢀꢀꢀꢀTestꢀCircuits
Tableꢀ8ꢀꢀꢀꢀꢀDiodeꢀcharacteristics
Test circuit for diode characteristics
Diode recovery waveform
Rg1
VDS
Rg 2
IF
Rg1 = Rg 2
Tableꢀ9ꢀꢀꢀꢀꢀSwitchingꢀtimesꢀ(ss)
Switching times test circuit for inductive load
Switching times waveform
VDS
90%
10%
VDS
VGS
VGS
td(off)
tf
td(on)
ton
tr
toff
Tableꢀ10ꢀꢀꢀꢀꢀUnclampedꢀinductiveꢀloadꢀ(ss)
Unclamped inductive load test circuit
Unclamped inductive waveform
V(BR)DS
ID
VDS
VDS
VDS
ID
Final Data Sheet
12
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
6ꢀꢀꢀꢀꢀPackageꢀOutlines
MILLIMETERS
MIN. MAX.
DIMENSIONS
A
A1
A2
A3
b
4.90
2.31
1.90
0.05
1.10
0.65
-
5.10
2.51
2.10
0.25
1.30
0.79
0.20
1.44
0.66
21.10
16.85
1.35
25.27
5.10
15.90
13.50
2.60
b1
b2
b3
c
1.34
0.58
20.90
16.25
1.05
24.97
4.90
15.70
13.10
2.40
D
D1
D2
D3
D4
E
DOCUMENT NO.
Z8B00184785
REVISION
03
E1
E2
e1
e2
e3
L
SCALE 2:1
0
5
10mm
5.08
2.79
2.54
19.80
-
20.10
4.30
3.70
7.40
2.60
6.00
EUROPEAN PROJECTION
L1
øP
øP1
øP2
Q
3.50
7.00
2.40
5.60
S
6.15
ISSUE DATE
21.08.2017
T
9.80
6.00
10.20
6.40
U
Figureꢀ1ꢀꢀꢀꢀꢀOutlineꢀPG-TOꢀ247-4-3,ꢀdimensionsꢀinꢀmm
Final Data Sheet
13
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
7ꢀꢀꢀꢀꢀAppendixꢀA
Tableꢀ11ꢀꢀꢀꢀꢀRelatedꢀLinks
• IFXꢀCoolSiCꢀM1ꢀWebpage:ꢀwww.infineon.com
• IFXꢀCoolSiCꢀM1ꢀapplicationꢀnote:ꢀwww.infineon.com
• IFXꢀCoolSiCꢀM1ꢀsimulationꢀmodel:ꢀwww.infineon.com
• IFXꢀDesignꢀtools:ꢀwww.infineon.com
Final Data Sheet
14
Rev.ꢀ2.0,ꢀꢀ2019-12-16
650ꢀVꢀCoolSiCªꢀM1ꢀSiCꢀTrenchꢀPowerꢀDevice
IMZA65R048M1H
RevisionꢀHistory
IMZA65R048M1H
Revision:ꢀ2019-12-16,ꢀRev.ꢀ2.0
Previous Revision
Revision Date
Subjects (major changes since last revision)
Release of final version
2.0
2019-12-16
Trademarks
Allꢀreferencedꢀproductꢀorꢀserviceꢀnamesꢀandꢀtrademarksꢀareꢀtheꢀpropertyꢀofꢀtheirꢀrespectiveꢀowners.
WeꢀListenꢀtoꢀYourꢀComments
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Publishedꢀby
InfineonꢀTechnologiesꢀAG
81726ꢀMünchen,ꢀGermany
©ꢀ2019ꢀInfineonꢀTechnologiesꢀAG
AllꢀRightsꢀReserved.
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(“Beschaffenheitsgarantie”)ꢀ.
Withꢀrespectꢀtoꢀanyꢀexamples,ꢀhintsꢀorꢀanyꢀtypicalꢀvaluesꢀstatedꢀhereinꢀand/orꢀanyꢀinformationꢀregardingꢀtheꢀapplicationꢀofꢀthe
product,ꢀInfineonꢀTechnologiesꢀherebyꢀdisclaimsꢀanyꢀandꢀallꢀwarrantiesꢀandꢀliabilitiesꢀofꢀanyꢀkind,ꢀincludingꢀwithoutꢀlimitation
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Warnings
Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,
pleaseꢀcontactꢀtheꢀnearestꢀInfineonꢀTechnologiesꢀOffice.
TheꢀInfineonꢀTechnologiesꢀcomponentꢀdescribedꢀinꢀthisꢀDataꢀSheetꢀmayꢀbeꢀusedꢀinꢀlife-supportꢀdevicesꢀorꢀsystemsꢀand/or
automotive,ꢀaviationꢀandꢀaerospaceꢀapplicationsꢀorꢀsystemsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineonꢀTechnologies,ꢀifꢀa
failureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-support,ꢀautomotive,ꢀaviationꢀand
aerospaceꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffectꢀtheꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀare
intendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀtoꢀsupportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀis
reasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersonsꢀmayꢀbeꢀendangered.
Final Data Sheet
15
Rev.ꢀ2.0,ꢀꢀ2019-12-16
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