IPP030N10N3 G [INFINEON]

英飞凌的 100V OptiMOS™ 功率 MOSFET 可以为高效率、高功率密度的 SMPS 提供卓越的解决方案。与下一代出色技术相比,该系列在 R Ds(on)和 FOM(品质因数)方面均降低了30%。;
IPP030N10N3 G
型号: IPP030N10N3 G
厂家: Infineon    Infineon
描述:

英飞凌的 100V OptiMOS™ 功率 MOSFET 可以为高效率、高功率密度的 SMPS 提供卓越的解决方案。与下一代出色技术相比,该系列在 R Ds(on)和 FOM(品质因数)方面均降低了30%。

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IPP030N10N3 G  
IPI030N10N3 G  
OptiMOS3 Power-Transistor  
Features  
Product Summary  
VDS  
100  
3
V
• N-channel, normal level  
RDS(on),max  
ID  
mW  
A
• Excellent gate charge x R DS(on) product (FOM)  
• Very low on-resistance R DS(on)  
100  
• 175 °C operating temperature  
• Pb-free lead plating; RoHS compliant  
• Qualified according to JEDEC1) for target application  
• Ideal for high-frequency switching and synchronous rectification  
Type  
IPP030N10N3 G  
IPI030N10N3 G  
Package  
Marking  
PG-TO220-3  
030N10N  
PG-TO262-3  
030N10N  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
T C=25 °C2)  
I D  
Continuous drain current  
100  
100  
A
T C=100 °C  
Pulsed drain current2)  
I D,pulse  
E AS  
T C=25 °C  
400  
I D=100 A, R GS=25 W  
Avalanche energy, single pulse  
Gate source voltage  
1000  
mJ  
V
V GS  
±20  
P tot  
T C=25 °C  
Power dissipation  
300  
W
°C  
T j, T stg  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55 ... 175  
55/175/56  
1)J-STD20 and JESD22  
2) See figure 3  
Rev. 2.1  
page 1  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
Values  
Parameter  
Symbol Conditions  
Unit  
min.  
typ.  
max.  
Thermal characteristics  
R thJC  
Thermal resistance, junction - case  
Thermal resistance,  
-
-
-
-
-
-
0.5  
62  
40  
K/W  
R thJA  
minimal footprint  
6 cm2 cooling area3)  
junction - ambient  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS=0 V, I D=1 mA  
V GS(th) V DS=V GS, I D=275 µA  
Drain-source breakdown voltage  
Gate threshold voltage  
100  
2
-
-
V
2.7  
3.5  
V DS=100 V, V GS=0 V,  
T j=25 °C  
I DSS  
Zero gate voltage drain current  
-
-
0.1  
10  
1
µA  
V DS=100 V, V GS=0 V,  
T j=125 °C  
100  
I GSS  
V GS=20 V, V DS=0 V  
Gate-source leakage current  
-
-
-
-
1
100 nA  
R DS(on) V GS=10 V, I D=100 A  
V GS=6 V, I D=50 A  
R G  
Drain-source on-state resistance  
2.6  
3.1  
1.9  
3
4.8  
-
mW  
Gate resistance  
W
|V DS|>2|I D|R DS(on)max  
I D=100 A  
,
g fs  
Transconductance  
94  
188  
-
S
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev. 2.1  
page 2  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
Values  
Parameter  
Symbol Conditions  
Unit  
min.  
typ.  
max.  
Dynamic characteristics  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
-
-
-
-
-
-
-
11100  
1940  
69  
14800 pF  
V GS=0 V, V DS=50 V,  
f =1 MHz  
C oss  
C rss  
t d(on)  
t r  
2580  
-
34  
-
-
-
-
ns  
58  
V DD=50 V, V GS=10 V,  
I D=100 A, R G=1.6 W  
t d(off)  
t f  
Turn-off delay time  
Fall time  
84  
28  
Gate Charge Characteristics4)  
Gate to source charge  
Gate to drain charge  
Switching charge  
Q gs  
-
-
-
-
-
-
49  
28  
-
nC  
Q gd  
-
V DD=50 V, I D=100 A,  
V GS=0 to 10 V  
Q sw  
Q g  
43  
-
206  
-
Gate charge total  
155  
4.4  
205  
V plateau  
Q oss  
Gate plateau voltage  
Output charge  
V
V DD=50 V, V GS=0 V  
273 nC  
Reverse Diode  
I S  
Diode continous forward current  
Diode pulse current  
-
-
-
-
100  
400  
A
T C=25 °C  
I S,pulse  
V GS=0 V, I F=100 A,  
T j=25 °C  
V SD  
Diode forward voltage  
-
1
1.2  
V
t rr  
Reverse recovery time  
-
-
86  
-
-
ns  
V R=50 V, I F=I S ,  
di F/dt =100 A/µs  
Q rr  
Reverse recovery charge  
232  
nC  
4) See figure 16 for gate charge parameter definition  
Rev. 2.1  
page 3  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
1 Power dissipation  
2 Drain current  
P tot=f(T C)  
I D=f(T C); V GS≥10 V  
350  
300  
250  
200  
150  
100  
50  
120  
100  
80  
60  
40  
20  
0
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
TC [°C]  
TC [°C]  
3 Safe operating area  
I D=f(V DS); T C=25 °C; D =0  
parameter: t p  
4 Max. transient thermal impedance  
Z thJC=f(t p)  
parameter: D =t p/T  
103  
100  
limited by on-state  
resistance  
1 µs  
10 µs  
100 µs  
102  
101  
100  
10-1  
0.5  
1 ms  
10 ms  
0.2  
10-1  
DC  
0.1  
0.05  
0.02  
0.01  
single pulse  
10-2  
10-1  
100  
101  
102  
103  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
tp [s]  
VDS [V]  
Rev. 2.1  
page 4  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
5 Typ. output characteristics  
I D=f(V DS); T j=25 °C  
6 Typ. drain-source on resistance  
R DS(on)=f(I D); T j=25 °C  
parameter: V GS  
parameter: V GS  
300  
6
10 V  
6 V  
250  
5
7.5 V  
5.5 V  
4.5 V  
5 V  
200  
150  
100  
50  
4
5 V  
6 V  
3
7.5 V  
10 V  
4.5 V  
2
1
0
0
0
1
2
0
40  
80  
120  
160  
VDS [V]  
ID [A]  
7 Typ. transfer characteristics  
I D=f(V GS); |V DS|>2|I D|R DS(on)max  
parameter: T j  
8 Typ. forward transconductance  
g fs=f(I D); T j=25 °C  
300  
250  
200  
150  
100  
50  
240  
200  
160  
120  
80  
25 °C  
40  
175 °C  
0
0
0
2
4
6
0
40  
80  
120  
160  
VGS [V]  
ID [A]  
Rev. 2.1  
page 5  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
9 Drain-source on-state resistance  
10 Typ. gate threshold voltage  
V GS(th)=f(T j); V GS=V DS  
parameter: I D  
R DS(on)=f(T j); I D=100 A; V GS=10 V  
7
6
5
4
3.5  
3
2750 µA  
2.5  
275 µA  
2
4
98 %  
typ  
3
1.5  
1
2
1
0
0.5  
0
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
Tj [°C]  
Tj [°C]  
11 Typ. capacitances  
12 Forward characteristics of reverse diode  
I F=f(V SD  
C =f(V DS); V GS=0 V; f =1 MHz  
)
parameter: T j  
105  
103  
Ciss  
104  
103  
102  
101  
175 °C, 98%  
25 °C  
102  
Coss  
175 °C  
25 °C, 98%  
101  
Crss  
100  
0
0
20  
40  
VDS [V]  
60  
80  
0.5  
1
1.5  
2
VSD [V]  
Rev. 2.1  
page 6  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
13 Avalanche characteristics  
14 Typ. gate charge  
V GS=f(Q gate); I D=100 A pulsed  
parameter: V DD  
I AS=f(t AV); R GS=25 W  
parameter: T j(start)  
1000  
100  
10  
10  
8
80 V  
50 V  
25 °C  
6
100 °C  
20 V  
150 °C  
4
2
0
1
1
10  
100  
1000  
0
40  
80  
120  
160  
tAV [µs]  
Qgate [nC]  
15 Drain-source breakdown voltage  
16 Gate charge waveforms  
V BR(DSS)=f(T j); I D=1 mA  
110  
105  
100  
95  
V GS  
Q g  
V gs(th)  
Q g(th)  
Q sw  
Q gd  
Q gate  
Q gs  
90  
-60  
-20  
20  
60  
100  
140  
180  
Tj [°C]  
Rev. 2.1  
page 7  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
PG-TO220-3: Outline  
Rev. 2.1  
page 8  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
PG-TO262-3  
Rev. 2.1  
page 9  
2011-07-18  
IPP030N10N3 G  
IPI030N10N3 G  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of  
conditions or characteristics. With respect to any examples or hints given herein, any typical  
values stated herein and/or any information regarding the application of the device,  
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights  
of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please  
contact the nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information  
on the types in question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with  
the express written approval of Infineon Technologies, if a failure of such components can  
reasonably be expected to cause the failure of that life-support device or system or to affect  
the safety or effectiveness of that device or system. Life support devices or systems are  
intended to be implanted in the human body or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user  
or other persons may be endangered.  
Rev. 2.1  
page 10  
2011-07-18  

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