IPP77N06S3-09 [INFINEON]

OptiMOS㈢-T Power-Transistor; OptiMOS㈢ -T电源晶体管
IPP77N06S3-09
型号: IPP77N06S3-09
厂家: Infineon    Infineon
描述:

OptiMOS㈢-T Power-Transistor
OptiMOS㈢ -T电源晶体管

晶体 晶体管
文件: 总8页 (文件大小:156K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
OptiMOS®-T Power-Transistor  
Product Summary  
V DS  
Features  
55  
8.8  
77  
V
• N-channel - Enhancement mode  
• Automotive AEC Q101 qualified  
R
DS(on),max (SMD version)  
m  
A
I D  
• MSL1 up to 260°C peak reflow  
• 175°C operating temperature  
Green package (lead free)  
PG-TO263-3-2  
PG-TO262-3-1  
PG-TO220-3-1  
• Ultra low Rds(on)  
• Avalanche tested  
• ESD Class 2 (HBM)  
EIA/JESD22-A114-B  
Type  
Package  
Ordering Code Marking  
IPB77N06S3-09  
IPI77N06S3-09  
IPP77N06S3-09  
PG-TO263-3-2  
PG-TO262-3-1  
PG-TO220-3-1  
SP0000-88715  
SP0000-88716  
SP0000-88717  
3N0609  
3N0609  
3N0609  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
Continuous drain current1)  
I D  
T C=25 °C, V GS=10 V  
T C=100 °C,  
77  
A
55  
V
GS=10 V2)  
Pulsed drain current2)  
I D,pulse  
E AS  
T C=25 °C  
I D=38 A  
308  
170  
Avalanche energy, single pulse3)  
mJ  
Drain gate voltage2)  
Gate source voltage4)  
V DG  
55  
±20  
V GS  
V
P tot  
T C=25 °C  
Power dissipation  
107  
W
°C  
T j, T stg  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55 ... +175  
55/175/56  
Rev. 0.9  
page 1  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Thermal characteristics2)  
R thJC  
R thJA  
Thermal resistance, junction - case  
-
-
-
-
1.4  
62  
K/W  
Thermal resistance, junction -  
ambient, leaded  
R thJA  
SMD version, device on PCB  
minimal footprint  
-
-
-
-
62  
40  
6 cm2 cooling area5)  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS  
V GS(th)  
V
V
GS=0 V, I D=250 µA  
DS=V GS, I D=55 µA  
Drain-source breakdown voltage  
Gate threshold voltage  
55  
-
-
V
2.1  
3
4
V
DS=25 V, V GS=0 V,  
I DSS  
Zero gate voltage drain current  
-
-
0.1  
1
1
µA  
T j=25 °C  
V
DS=25 V, V GS=0 V,  
100  
T j=125 °C1)  
I GSS  
V
V
GS=20 V, V DS=0 V  
GS=10 V, I D=39 A  
Gate-source leakage current  
-
-
1
100 nA  
R DS(on)  
Drain-source on-state resistance  
7.7  
9.1  
mΩ  
V
GS=10 V, I D=39 A,  
-
7.4  
8.8  
SMD version  
Rev. 0.9  
page 2  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Dynamic characteristics2)  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
-
-
-
-
-
-
-
5335  
812  
775  
29  
-
-
-
-
-
-
-
pF  
ns  
V
GS=0 V, V DS=25 V,  
C oss  
Crss  
t d(on)  
t r  
f =1 MHz  
V
V
DD=27.5 V,  
GS=10 V, I D=77 A,  
51  
t d(off)  
t f  
Turn-off delay time  
Fall time  
29  
R G=10 Ω  
51  
Gate Charge Characteristics2)  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
41  
17  
77  
7.1  
-
nC  
Q gd  
-
103  
-
V
V
DD=11 V, I D=77 A,  
GS=0 to 10 V  
Q g  
V plateau  
Gate plateau voltage  
V
A
Reverse Diode  
I S  
Diode continous forward current  
Diode pulse current2)  
-
-
-
-
77  
T C=25 °C  
I S,pulse  
308  
V
GS=0 V, I F=77 A,  
Diode forward voltage2)  
Reverse recovery time2)  
Reverse recovery charge2)  
V SD  
-
-
-
1
1.3  
V
T j=25 °C  
V R=27.5 V, I F=I S,  
di F/dt =100 A/µs  
t rr  
43  
58  
-
-
ns  
nC  
Q rr  
1) Current is limited by bondwire; with an R thJC = 1.4 K/W the chip is able to carry 77A at 25°C. For detailed  
information see Application Note ANPS071E at www.infineon.com/optimos  
2) Defined by design. Not subject to production test.  
3) See diagrams 12 and 13.  
4) Qualified at -5V and +20V.  
5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev. 0.9  
page 3  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
1 Power dissipation  
2 Drain current  
P tot=f(T C); V GS6 V  
I D=f(T C); V GS10 V  
120  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
T
C [°C]  
T
C [°C]  
3 Safe operating area  
I D=f(V DS); T C=25 °C; D =0  
parameter: t p  
4 Max. transient thermal impedance  
thJC=f(t p)  
Z
parameter: D =t p/T  
101  
1000  
1 µs  
10 µs  
limited by on-state  
resistance  
0.5  
100  
100  
10  
1
0.2  
0.1  
100 µs  
1 ms  
10-1  
0.05  
0.02  
0.01  
10-2  
single pulse  
10-3  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
0.1  
1
10  
100  
V
DS [V]  
t
p [s]  
Rev. 0.9  
page 4  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
5 Typ. output characteristics  
I D=f(V DS); T j=25 °C  
6 Typ. drain-source on resistance  
DS(on)=f(I D); T j=25 °C  
R
parameter: V GS, pulsed  
parameter: V GS  
25  
160  
7V  
10 V  
140  
120  
100  
80  
20  
15  
10  
8 V  
7 V  
8V  
60  
6.5 V  
9V  
40  
6 V  
5.5 V  
10V  
20  
5
0
0
20  
40  
60  
80  
100  
0
1
2
3
V
DS [V]  
I
D [A]  
7 Typ. transfer characteristics  
I D=f(V GS); V DS=10 V  
parameter: T j  
8 Drain-source on-state resistance  
R
DS(on)=f(T j); I D=77 A; V GS=10 V  
20  
18  
16  
14  
12  
10  
8
200  
150  
100  
50  
-55 °C  
25 °C  
6
175 °C  
4
2
0
0
2
3
4
5
6
7
8
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
V
GS [V]  
Rev. 0.9  
page 5  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
9 Typ. gate threshold voltage  
GS(th)=f(T j); V GS=V DS  
10 Typ. capacitances  
V
C =f(V DS); V GS=0 V; f =1 MHz  
parameter: I D  
104  
4
Ciss  
3.5  
3
600µA  
Coss  
60µA  
2.5  
2
Crss  
103  
1.5  
1
0.5  
102  
0
0
5
10  
15  
20  
25  
30  
-60  
-20  
20  
60  
T j [°C]  
100  
140  
180  
V
DS [V]  
11 Forward characteristics of reverse diode  
I F=f(V SD), pulsed  
12 Typ. avalanche characteristics  
AS=f(t AV  
I
)
parameter: T j  
parameter: T j(start)  
100  
1000  
25°C  
100  
100°C  
150°C  
175 °C  
25 °C  
10  
10  
1
1
1
10  
100  
1000  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8  
SD [V]  
V
t
AV [µs]  
Rev. 0.9  
page 6  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
13 Typ. avalanche energy  
AS=f(T j )  
15 Drain-source breakdown voltage  
BR(DSS)=f(T j); I D=1 mA  
E
V
parameter: I D  
66  
64  
62  
60  
58  
56  
54  
52  
50  
48  
46  
350  
20 A  
300  
250  
30 A  
200  
38 A  
150  
100  
50  
0
0
-60  
-20  
20  
60  
100  
140  
180  
50  
100  
150  
200  
T j [°C]  
T j [°C]  
14 Typ. gate charge  
GS=f(Q gate); I D=77 A pulsed  
16 Gate charge waveforms  
V
parameter: V DD  
12  
VGS  
44 V  
11 V  
10  
8
Qg  
6
4
2
Qgate  
Qgd  
Qgs  
0
0
20  
40  
60  
80  
100  
120  
Q
gate [nC]  
Rev. 0.9  
page 7  
2005-09-16  
IPB77N06S3-09  
IPI77N06S3-09, IPP77N06S3-09  
Published by  
Infineon Technologies AG  
St.-Martin-Straße 53  
D-81541 München  
© Infineon Technologies AG 2004  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as  
a guarantee of characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact your  
nearest Infineon Technologies Office (www.infineon.com)  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact your nearest Infineon Technologies Office.  
Infineon Technologies' components may only be used in life-support devices or systems with the  
expressed written approval of Infineon Technologies, if a failure of such components can reasonably  
be expected to cause the failure of that life-support device or system, or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted  
in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons may be endangered.  
Rev. 0.9  
page 8  
2005-09-16  

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