IR1176 [INFINEON]

SYNCHRONOUS RECTIFIER DRIVER; 同步整流驱动器
IR1176
型号: IR1176
厂家: Infineon    Infineon
描述:

SYNCHRONOUS RECTIFIER DRIVER
同步整流驱动器

驱动器 MOSFET驱动器 驱动程序和接口 接口集成电路 光电二极管
文件: 总12页 (文件大小:419K)
中文:  中文翻译
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Preliminary Data Sheet PD60185-C  
IR1176  
SYNCHRONOUS RECTIFIER DRIVER  
Product Summary  
Features  
Provides constant and proper gate drive to power  
MOSFETs regardless of transformer output  
Minimizes loss due to power MOSFET body  
drain diode conduction  
V
dd  
5Vdc  
I
4A/4A  
2MHz  
O+/- (peak)  
Stand alone operation - no ties to primary side  
Schmitt trigger input with double pulse suppress-  
ion allows operation in noisy environments  
High peak current drive capability - 4A  
High speed operation - 2MHz  
F
max  
Max lead time  
500nsec  
Adaptable to multiple topologies  
Description  
Packages  
The IR1176 is a high speed CMOS controller designed  
to drive N-channel power MOSFETs used as synchro-  
nous rectifiers in high current, high frequency forward  
converters with output voltages equal or below 5VDC.  
Schmitt trigger inputs with double pulse suppression  
allow the controller to operate in noisy environments.  
The circuit does not require any ties to the primary  
side and derives its operating power directly from  
the secondary. The circuit functions by anticipating  
transformer output transitions, then turns the power  
MOSFETs on or off before the transitions of the trans-  
former to minimize body drain diode conduction and  
reduce associated losses. Turn on/off lead time can  
be adjusted to accommodate a variety of power  
MOSFET sizes and circuit conditions. The IR1176 also  
provides gate drive overlap/dead-time control via  
external components to further minimize diode con-  
duction by nulling effects of secondary loop and de-  
vice package inductance.  
IR1176S  
20 Lead Surface Mount  
(SSOP-20)  
IR1176SS  
20 Lead SOIC (MS-013AC)  
IR1176  
20 Lead PDIP  
(MS-001AD)  
IR1176  
Absolute Maximum Ratings  
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur.  
Symbol  
Definition  
Min.  
Max.  
7
Units  
VDC  
mADC  
mW  
V
Supply voltage  
dd  
in  
I
Input clamp current  
Power dissipation  
+/- 10  
400  
P
(SSOP-20)  
(SOIC)  
D
(PDIP)  
Rth  
Rth  
Thermal resistance (SSOP-20) junction-to-case  
(SOIC) junction-to-case  
28.5  
20  
JC  
JA  
(PDIP) junction-to-case  
28.1  
90.5  
45  
°C/W  
Thermal resistance (SSOP-20) junction-to-ambient  
(SOIC) junction-to-ambient  
(PDIP) junction-to-ambient  
62.4  
150  
150  
T
T
Junction temperature  
J
Storage temperature  
-55  
°C  
S
T
Lead temperature (soldering, 10 seconds)  
300  
L
Recommended Operating Conditions  
Symbol  
Definition  
Min.  
Typ.  
Max.  
Units  
VDC  
°C  
Vdd  
Supply voltage operating range  
5
T
A
Ambient temperature  
−40  
250  
85  
Freq  
Rbias  
UV  
Operating frequency  
500  
KHz  
K  
Required bias resistor (+/- 1%)  
Voltage at UVSET pin  
34.0  
1.75  
2.25  
5.6  
VDC  
VDC  
pF  
Xin  
Maximum voltage at X1 and X2 inputs  
Capacitance at pins DTIN1 and DTIN2  
Cd1/Cd2  
100  
2
www.irf.com  
IR1176  
Dynamic Electrical Characteristics  
Vdd=5V, T = 25oC, Rbias = 34.0K unless otherwise specified.  
A
Symbol  
Vdd  
Definition  
Min.  
4.0  
Typ.  
Max.  
Units  
VDC  
A
Supply voltage operating range  
Vdd quiescent current (x1 = x2 = 0V or 5V, Iout = 0)  
Operating frequency  
5.25  
Iqdd  
4
5
Freq  
100  
1.10  
0.8  
2000  
1.4  
1.1  
KHz  
V
UVSET+  
UVSET-  
Vxth+  
Vxth-  
Tadv  
UVSET positive going threshold  
UVSET negative going threshold  
X1/X2 Input positive going threshold  
X1/X2 Input negative going threshold  
Externally adjustable lead time (advance)  
Externally adjustable dead-time for Q1 and Q2  
Q1,Q2 output sink current (Vdd=5.0V,  
pulsed, 10 usec)  
V
1.4  
1.0  
VDC  
VDC  
nsec  
nsec  
500  
Td  
20  
Isink  
4
(peak)  
Isource  
(peak)  
VOH  
A
Q1,Q2 output source current (Vdd=5.0V,  
pulsed, 10 usec)  
4
Q1, Q2 High level voltage (Iout = 20mA)  
Q1, Q2 Low level voltage (Iout = 20mA)  
Input to output delay (PLL bypassed, cross coupled  
mode)  
V
-
0.20  
dd  
V
VOL  
0.10  
20  
tio  
nsec  
tr  
tf  
Gate turn-on rise time (C1=1000pf, Vdd=5V)  
Gate turn-off fall time (C1=1000pf, Vdd=5V)  
Cross-over voltage (Vdd=5Vdc, DTIN shorted to  
DTOUT, C1=1000pf) Fig. 3  
20  
20  
nsec  
nsec  
VDC  
Vtr  
2.5  
Rbias  
Vbias  
Required bias resistor (1%)  
34.0  
1.25  
KΩ  
VDC  
Voltage at Rbias pin  
Tjitter  
Phase-lock loop output jitter  
-20  
20  
nsec  
µADC  
VDC  
Ichgpump  
Charge pump output current (at VFLTR pin)  
50  
Vchgpump Charge pump output voltage (at VFLTR pin)  
1.3  
1.5  
62  
1.7  
Kvco_dc  
PLL Vco DC gain (per design)  
KHz/  
Volt  
www.irf.com  
3
IR1176  
Lead Definitions and Assignments  
Symbol Description  
AVDD  
Power - + 5 VDC to MOSFET drivers  
Q1  
Output - gate drive for Q1 power MOSFET  
DTOUT1 Output - sets dead time for Q1 output - used with DTIN1  
DTIN1  
Input - sets dead time for Q1 - used with DTOUT1  
Output - sets lead time (advance) for Q1  
RADV1  
VFLTR1 Output - PLL loop filter for Q1 output  
RVCO1  
X1  
Output - sets PLL center frequency for Q1 output  
Input - transformer input for Q1  
VDD  
Power - +5 Vdc for internal logic  
UVSET  
Input - sets UVLO+  
If this pin is pulled below 1.25VDC externally, then both Q1 and Q2  
outputs will be at Vss (disabled)  
RBIAS  
AVSS  
X2  
Output - connected to 34.0K +/- 1% resistor - sets operating current  
Ground for MOSFET driver supply (VDD)  
Input - transformer input for Q2  
RVCO2  
Output - sets PLL center frequency for Q2 output  
VFLTR2 Output - PLL loop filter for Q2  
RADV2  
DTIN2  
Output - sets lead time (advance) for Q2  
Input - sets dead time for Q2 - used with DTOUT2  
DTOUT2 Output - sets dead time for Q2 - used with DTIN2  
VSS  
Q2  
Ground for logic supply (AVDD)  
Output - gate drive for Q2 power MOSFET  
1*VDD  
20  
1*VDD  
20  
Q2  
Q2  
1*VDD  
20  
Q2  
2
Q1  
VSS 19  
2
Q1  
VSS 19  
2
Q1  
VSS 19  
3DTOUT2  
4DTIN2  
5RADV1  
6VFLTRI  
7RVCO1  
18  
3DTOUT2  
4DTIN2  
5RADV1  
6VFLTRI  
7RVCO1  
18  
17  
DTOUT1  
DTOUT1  
3DTOUT2  
4DTIN2  
5RADV1  
6VFLTRI  
7RVCO1  
18  
DTOUT1  
DTIN1 17  
RADV2 16  
DTIN1  
DTIN1 17  
RADV2 16  
RADV2 16  
15  
14  
15  
14  
VFLTR2  
VFLTR2  
15  
14  
VFLTR2  
RVCO2  
RVCO2  
RVCO2  
8
9AVDD  
X1  
13  
12  
8
9AVDD  
10  
X1  
13  
12  
11  
X2  
X2  
AVSS  
RBIAS  
8
9AVDD  
X1  
13  
12  
X2  
AVSS  
AVSS  
10UVSET  
RBIAS 11  
UVSET  
10UVSET  
RBIAS 11  
IR1176S  
(SSOP-20)  
IR1176SS  
SOIC (wide body)  
IR1176  
PDIP  
4
www.irf.com  
IR1176  
Fig. 1 Typical application circuit when supply Vout < 5.0 VDC  
Fig. 2 Typical application circuit when supply Vout = 5.0 VDC  
www.irf.com  
5
IR1176  
Fig. 3 Gate drive characteristics and definitions  
Phase Lock Loop Design Equations:  
1 - Resistor to set VCO Ceter Frequency:  
Rvco (K) = [1E2 x Vchgpump(VDC) / fvco(KHz)] x Kvco _ dc(KHz/Volt)  
Example (A): Choose Vchgpump = 1.5V, desired frequency (fvco) = 300KHz  
Rvco = [1E2 x 1.5 /300] x 62 Hz = 31 KΩ  
2 - Small Signal gain for VCO:  
Kvco_ac (KHz/Volt) = 1E2 x Kvco_dc (KHz/Volt)/Rvco(K)  
Example (B): Choosing same conditions as in example A:  
Kvco_ac = 1E2 x 62 / 31 = 200 KHz/volt  
6
www.irf.com  
IR1176  
3-PLLNaturalfrequency:  
wn =2pfn(KHz)= Ichpump(uA) x Kvco_ac(KHz/V) / C(nF)  
ChooseCfsuchthat Cf=C/16  
4-PLLDampingfactorcalculations:  
P = pE-3 x Rf (KOhms) x C(nF) x fn(KHz)  
TypicalvalueforPis0.707.(Criticallydamped)  
5-Advancetiming:  
Tadv(nsec) = RADV (KOhms)*10 +6
WhereRADVisresistancefromRADV1orRADV2toground.  
ExampleC:RADV=10Kohms willresultinTadv=10*10+6=106nsec.  
6-Deadtimecalculations:  
Td(nsec)=0.69*Cdt(pF)*(Rdt(K)+0.15) (For Vdd=5V)  
WhereRdtisresistancebetweenpinsDTIN1andDTOUT1orDTIN2and  
DTOUT2.CdtiscapacitancefromDTIN1orDTIN2toground.  
Example D: Rd=2KW and Cdt=100pF will result in Td=148.35nsec.  
Fig. 4 PLL loop filter component definitions  
www.irf.com  
7
IR1176  
IR1176  
Fig. 5 IR1176 Block Diagram  
8
www.irf.com  
IR1176  
500  
400  
300  
200  
100  
0
500  
400  
300  
200  
100  
0
T_DT (ns)@R=1K  
T_DT (ns)@R=5K  
T_DT (ns)@R=10K  
0
2K  
4K  
6K  
8K 10K  
-60 -30  
0
30  
60  
90 120  
resistance  
temperature  
Response at 25oC  
T_DT vs R_DT, C = 100pF  
Temperature Response  
T_DT vs R_DT, C = 100pF  
500  
400  
300  
200  
100  
0
500  
400  
300  
200  
100  
0
T_ADV (ns)R=5K  
T_ADV (ns)R=10K  
T_ADV (ns)R=20K  
T_ADV (ns)R=45K  
0
10K 20K 30K 40K 50K  
resistance  
-60 -30  
0
30  
60  
90  
120  
temperature  
Response at 25oC  
Temperature Response  
T_ADV vs R_ADV  
T_ADV vs R_ADV  
www.irf.com  
9
IR1176  
Case Outline  
01-6057 00  
20 Lead Surface Mount (SSOP-20)  
01-3078 00 (MS013AC)  
10  
www.irf.com  
IR1176  
Case Outline  
01-6070 00  
01-3080 00 (MS013AC)  
20 Lead SOIC  
www.irf.com  
11  
IR1176  
Case Outline  
01-6069 00  
20 Lead PDIP  
01-3079 00 (MS001AD)  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105  
Data and specifications subject to change without notice. 1/7/2002  
12  
www.irf.com  

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