IR2151PBF [INFINEON]

SELF-OSCILLATING HALF-BRIDGE DRIVER; 自振荡半桥驱动器
IR2151PBF
型号: IR2151PBF
厂家: Infineon    Infineon
描述:

SELF-OSCILLATING HALF-BRIDGE DRIVER
自振荡半桥驱动器

驱动器 MOSFET驱动器 驱动程序和接口 接口集成电路 光电二极管
文件: 总6页 (文件大小:100K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Preliminary Data Sheet No. PD60034-J  
(NOTE: For new designs, we  
IR2151  
recommend IR’s new products IR2153 and IR21531)  
SELF-OSCILLATING HALF-BRIDGE DRIVER  
Features  
Product Summary  
Floating channel designed for bootstrap operation  
Fully operational to +600V  
Tolerant to negative transient voltage  
dV/dt immune  
Undervoltage lockout  
Programmable oscillator frequency  
V
600V max.  
50%  
OFFSET  
Duty Cycle  
I +/-  
100 mA / 210 mA  
10 - 20V  
O
1
V
OUT  
f =  
1.4 ×(RT + 75)× CT  
Deadtime (typ.)  
1.2 µs  
Matched propagation delay for both channels  
Low side output in phase with RT  
Packages  
Description  
The IR2151 is a high voltage, high speed, self-os-  
cillating power MOSFET and IGBT driver with both  
high and low side referenced output channels. Pro-  
prietary HVIC and latch immune CMOS technologies  
enable ruggedized monolithic construction. The front  
end features a programmable oscillator which is simi-  
lar to the 555 timer. The output drivers feature a high  
pulse current buffer stage and an internal deadtime  
designed for minimum driver cross-conduction. Propa-  
gation delays for the two channels are matched to sim-  
plify use in 50% duty cycle applications. The floating  
channel can be used to drive an N-channel power  
MOSFET or IGBT in the high side configuration that  
operates off a high voltage rail up to 600 volts.  
8 Lead PDIP  
8 Lead SOIC  
Typical Connection  
up to 600V  
VCC  
RT  
VB  
HO  
VS  
TO  
LOAD  
CT  
COM  
LO  
(Refer to Lead Assignment diagram for correct pin configuration)  
1
IR2151  
Absolute Maximum Ratings  
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-  
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured  
under board mounted and still air conditions.  
Symbol  
Definition  
Min.  
Max.  
Units  
V
High side floating supply voltage  
High side floating supply offset voltage  
High side floating output voltage  
Low side output voltage  
-0.3  
625  
B
S
V
V
- 25  
V + 0.3  
B
B
V
HO  
V
- 0.3  
V + 0.3  
B
S
V
LO  
-0.3  
V
+ 0.3  
+ 0.3  
+ 0.3  
CC  
CC  
V
V
RT  
R voltage  
T
-0.3  
-0.3  
V
V
CT  
C voltage  
T
V
CC  
I
Supply current (note 1)  
25  
CC  
mA  
V/ns  
W
I
R
output current  
T
-5  
5
RT  
dV /dt  
Allowable offset supply voltage transient  
50  
1.0  
s
P
Package power dissipation @ T +25°C  
(8 lead DIP)  
D
A
(8 lead SOIC)  
(8 lead DIP)  
(8 lead SOIC)  
0.625  
125  
R
θJA  
Thermal resistance, junction to ambient  
°C/W  
°C  
200  
150  
T
Junction temperature  
J
T
T
Storage temperature  
-55  
150  
300  
S
L
Lead temperature (soldering, 10 seconds)  
Recommended Operating Conditions  
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the  
recommended conditions. The V offset rating is tested with all supplies biased at 15V differential.  
S
Symbol  
Definition  
High side sloating supply absolute voltage  
High side floating supply offset voltage  
High side floating output voltage  
Low side output voltage  
Min.  
Max.  
Units  
V
B
V
S
+ 10  
V + 20  
S
V
S
600  
V
V
HO  
V
S
V
B
V
LO  
0
V
CC  
I
Supply current (note 1)  
5
mA  
°C  
CC  
T
Ambient temperature  
-40  
125  
A
Note 1:  
Because of the IR2151’s application specificity toward off-line supply systems, this IC contains a zener clamp  
structure between the chip V and COM which has a nominal breakdown voltage of 15.6V. Therefore, the IC  
CC  
supply voltage is normally derived by forcing current into the supply lead (typically by means of a high value  
resistor connected between the chip V and the rectified line voltage and a local decoupling capacitor from  
CC  
V
CC  
to COM) and allowing the internal zener clamp circuit to determine the nominal supply voltage. There-  
fore, this circuit should not be driven by a DC, low impedance power source of greater than V  
.
CLAMP  
2
IR2151  
Dynamic Electrical Characteristics  
V
(V , V ) = 12V, C = 1000 pF and T = 25°C unless otherwise specified.  
BIAS CC BS  
L
A
Symbol  
Definition  
Min. Typ. Max. Units Test Conditions  
t
Turn-on rise time  
Turn-off fall time  
Deadtime  
80  
120  
r
ns  
t
f
40  
70  
DT  
D
0.50  
48  
1.20 2.25  
50 52  
µs  
%
R duty cycle  
T
Static Electrical Characteristics  
V
(V , V ) = 12V, C = 1000 pF, C = 1 nF and T = 25°C unless otherwise specified. The V , V and I  
BIAS CC BS L T A IN TH IN  
parameters are referenced to COM. The V and I parameters are referenced to COM and are applicable to the  
O
O
respective output leads: HO or LO.  
Symbol  
Definition  
Min. Typ. Max. Units Test Conditions  
f
Oscillator frequency  
19.4  
94  
14.4  
7.8  
3.8  
20.0  
100  
15.6  
8.0  
4.0  
20  
20.6  
106  
16.8  
8.2  
4.2  
50  
R = 35.7 kΩ  
T
OSC  
kHz  
R = 7.04 kΩ  
T
V
V
CC  
zener shunt clamp voltage  
I
= 5 mA  
CLAMP  
CC  
V
V
2/3 V threshold  
CC  
CT+  
V
1/3 V threshold  
CC  
CT-  
V
CTUV  
C undervoltage lockout  
T
2.5V<V <V  
CC CCUV+  
V
R
R
R
high level output voltage, V - R  
0
100  
300  
50  
I
= -100 µA  
RT+  
T
T
T
CC  
T
RT  
200  
20  
I
= -1 mA  
RT  
V
Low Level Output Voltage  
I
=100 µA  
RT-  
RT  
mV  
200  
0
300  
100  
100  
100  
50  
I
= 1 mA  
RT  
V
RTUV  
Undervoltage Lockout, V  
- R  
2.5V<V <V  
CC CCUV+  
CC  
T
V
High Level Output Voltage, V  
- V  
I
= 0A  
O
OH  
BIAS  
O
V
Low Level Output Voltage, V  
I
= 0A  
O
OL  
LK  
O
I
Offset Supply Leakage Current  
Quiescent V Supply Current  
V = V = 600V  
B S  
I
10  
50  
QBS  
BS  
µA  
V
I
Quiescent V  
Supply Current  
400  
0.001  
8.4  
950  
1.0  
9.2  
QCC  
CC  
I
CT  
C
T
Input Current  
V
V
CC  
Supply Undervoltage Positive Going  
7.7  
CCUV+  
Threshold  
Supply Undervoltage Negative Going  
V
CCUV-  
V
CC  
7.4  
8.1  
8.9  
Threshold  
Supply Undervoltage Lockout Hysteresis  
V
V
CC  
200  
100  
210  
500  
125  
250  
mV  
mA  
CCUVH  
I
Output High Short Circuit Pulsed Current  
Output Low Short Circuit Pulsed Current  
V = 0V  
O
O+  
I
O-  
V = 15V  
O
3
IR2151  
Functional Block Diagram  
VB  
R
Q
HV  
LEVEL  
SHIFT  
HO  
R
S
PULSE  
FILTER  
RT  
-
+
R
S
Q
Q
PULSE  
GEN  
DEAD  
TIME  
VS  
R
VCC  
15.6V  
-
CT  
+
DEAD  
TIME  
LO  
UV  
DETECT  
DELAY  
R
COM  
Lead Definitions  
Symbol Description  
R
T
Oscillator timing resistor input,in phase with LO for normal IC operation  
C
T
Oscillator timing capacitor input, the oscillator frequency according to the following equation:  
1
f =  
1.4 ×(RT + 75)× CT  
where 75is the effective impedance of the R output stage  
T
V
High side floating supply  
High side gate drive output  
High side floating supply return  
Low side and logic fixed supply  
Low side gate drive output  
Low side return  
B
HO  
V
S
V
CC  
LO  
COM  
Lead Assignments  
8 Lead DIP  
8 Lead SOIC  
IR2151  
IR2151S  
4
IR2151  
8 Lead PDIP  
01-3003 01  
8 Lead SOIC  
01-0021 08  
5
IR2151  
VCLAMP  
VCCUV  
+
VCC  
RT (HO)  
RT (LO)  
RT  
50%  
50%  
t
CT  
t
f
r
HO  
LO  
90%  
90%  
LO  
HO  
10%  
10%  
Figure 1. Input/Output Timing Diagram  
Figure 2. Switching Time Waveform Definitions  
RT  
50%  
50%  
90%  
10%  
HO  
LO  
DT  
90%  
10%  
Figure 3. Deadtime Waveform Definitions  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105  
http://www.irf.com/ Data and specifications subject to change without notice.  
3/30/2001  
6

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