IR2302SPBF [INFINEON]
HIGH AND LOW SIDE DRIVER; 高端和低端驱动器
| 型号： | IR2302SPBF |
| 厂家： | 
Infineon |
| 描述： | HIGH AND LOW SIDE DRIVER |
| 文件： | 总18页 (文件大小：188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet No. PD60201 Rev.D
IR2301(S) &(PbF)
HIGH AND LOW SIDE DRIVER
Features
Packages
Floating channel designed for bootstrap operation
•
Fully operational to +600V
Tolerant to negative transient voltage dV/dt immune
8 Lead PDIP
IR2301
Gate drive supply range from 5 to 20V
•
Undervoltage lockout for both channels
•
3.3V, 5V and 15V input logic compatible
•
Matched propagation delay for both channels
•
Logic and power ground +/- 5V offset.
•
Lower di/dt gate driver for better noise immunity
•
8 Lead SOIC
IR2301S
Outputs in phase with inputs
•
Also available LEAD-FREE (PbF)
•
Description
2106/2301//2108//2109/2302/2304 Feature Comparison
The IR2301(S) are high voltage, high speed
power MOSFET and IGBT drivers with indepen-
dent high and low side referenced output
channels. Proprietary HVIC and latch immune
CMOS technologies enable ruggedized mono-
lithic construction. The logic input is compatible
with standard CMOS or LSTTL output, down to
3.3V logic. The output drivers feature a high
pulse current buffer stage designed for minimum
driver cross-conduction. The floating channel
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can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to
600 volts.
Typical Connection
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(Refer to Lead
ꢀ
ꢁꢁ
Assignments for
correct pin con-
figuration). This/
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ꢂ
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T
h
e
s
e
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d i a g r a m ( s )
show electrical
connect ions
only. Please re-
fer to our Appli-
cation Notes
and DesignTips
for proper circuit
board layout.
ꢑꢅ
ꢆꢅꢒꢓ
ꢀ
ꢃ
ꢁꢅꢇ
ꢆꢅ
IR2301
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1
(
IR2301 S)&(PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
Definition
High side floating absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Min.
Max.
Units
V
B
-0.3
625
V
S
V
- 25
V
+ 0.3
+ 0.3
25
B
B
B
V
HO
V
S
- 0.3
V
V
-0.3
-0.3
V
CC
V
LO
V
+ 0.3
CC
V
Logic input voltage
COM - 0.3
V
+ 0.3
CC
IN
dV /dt
S
Allowable offset supply voltage transient
—
—
50
V/ns
W
P
D
Package power dissipation @ T ≤ +25°C
A
(8 lead PDIP)
1.0
(8 lead SOIC)
(8 lead PDIP)
(8 lead SOIC)
—
—
0.625
125
200
150
150
300
Rth
JA
Thermal resistance, junction to ambient
°C/W
—
T
J
Junction temperature
—
°C
T
S
Storage temperature
-50
—
T
L
Lead temperature (soldering, 10 seconds)
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V offset rating is tested with all supplies biased at 15V differential.
S
Symbol
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Min.
Max.
Units
VB
V
+ 5
V + 20
S
S
V
S
Note 1
600
V
HO
V
S
V
B
V
V
5
0
20
CC
V
LO
V
CC
V
Logic input voltage
COM
-ꢦ0
V
IN
CC
T
A
Ambient temperature
150
°C
Note 1: Logic operational for V of -5 to +600V. Logic state held for V of -5V to -V . (Please refer to the Design Tip
S S BS
DTꢤꢥ-3 for more details).
2
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( )
IR2301 S &(PbF)
Dynamic Electrical Characteristics
V
(V , V ) = 15V, C = 1000 pF, T = 25°C.
BIAS CC BS
L
A
Symbol
Definition
Min. Typ. Max. Units Test Conditions
t
Turn-on propagation delay
Turn-off propagation delay
—
—
—
—
—
220
200
0
300
280
50
V = 0V
S
on
t
V = 0V or 600V
S
off
MT
Delay matching, HS ꢧ LS turn-on/off
Turn-on rise time
nsec
t
130
50
220
80
V
V
= 0V
= 0V
r
S
S
t
f
Turn-off fall time
Static Electrical Characteristics
V
(V , V ) = 15V, and T = 25°C unless otherwise specified. The V , V and I parameters are referenced to
BIAS
CC BS
A
IL IH
IN
COM and are applicable to the respective input leads. The V , I and Ron parameters are referenced to COM and are
O
O
applicable to the respective output leads: HO and LO.
Symbol
Definition
Min. Typ. Max. Units Test Conditions
2.ꢤ
VCC = 10V to 20V
VCC = 10V to 20V
V
Logic “1” input voltage
—
—
IH
V
Logic “0” input voltage
—
—
—
—
20
50
—
0.8
1.ꢦ
0.6
50
IL
V
V
OH
High level output voltage, V
- V
0.8
0.3
—
I
I
= 20 mA
= 20 mA
BIAS
O
O
O
V
OL
Low level output voltage, V
O
I
Offset supply leakage current
V
= V = 600V
B S
LK
I
Quiescent V supply current
BS
60
100
1ꢤ0
V
= 0V or 5V
QBS
IN
IN
µA
I
Quiescent V
supply current
CC
120
V
= 0V or 5V
= 5V
IN
QCC
I
Logic “1” input bias current
Logic “0” input bias current
V
—
—
5
20
2
IN+
I
VIN = 0V
—
ꢦ.1
IN-
V
V
and V supply undervoltage positive
BS
3.3
5
CCUV+
CC
V
going threshold
BSUV+
V
V
and V supply undervoltage negative
BS
3
3.8
0.3
ꢦ.ꢥ
—
CCUV-
CC
V
V
negative going threshold
Hysteresis
BSUV-
V
0.1
CCUVH
V
BSUVH
I
Output high short circuit pulsed current
Output low short circuit pulsed current
120
250
200
350
—
—
V = 0V,
O
O+
PW ≤ 10 µs
= 15V,
mA
I
V
O
O-
PW ≤ 10 µs
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3
(
IR2301 S)&(PbF)
Functional Block Diagrams
VB
UV
DETECT
HO
R
R
Q
PULSE
FILTER
HV
LEVEL
S
SHIFTER
VSS/COM
VS
HIN
LEVEL
SHIFT
PULSE
GENERATOR
VCC
LO
UV
DETECT
VSS/COM
LEVEL
SHIFT
LIN
DELAY
COM
Lead Definitions
Symbol Description
HIN
LIN
Logic input for high side gate driver output (HO), in phase
Logic input for low side gate driver output (LO), in phase
High side floating supply
V
B
HO
High side gate drive output
V
S
High side floating supply return
Low side and logic fixed supply
Low side gate drive output
V
CC
LO
COM
Low side return
ꢦ
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( )
IR2301 S &(PbF)
Lead Assignments
V
V
1
2
3
ꢦ
V
CC
B
8
ꢥ
1
2
3
ꢦ
V
CC
B
8
ꢥ
HO
HO
HIN
LIN
HIN
LIN
V
S
V
S
6
5
6
5
LO
LO
COM
COM
8 Lead PDIP
8 Lead SOIC
IR2301
IR2301S
9ꢐ]
9ꢐ]
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ꢄꢈꢉ
ꢆꢈꢉ
ꢍ
ꢍ
ꢍ
ꢨ
ꢍ
ꢎꢗ
ꢎꢨꢨ
ꢖ
>ꢐ]
>ꢐ]
ꢄꢅ
ꢆꢅ
ꢄꢅ
ꢆꢅ
&ꢐ]
&ꢐ]
Figure 1. Input/Output Timing Diagram
Figure 2. Switching Time Waveform Definitions
9ꢐ]
9ꢐ]
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&ꢐ]
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>ꢐ]
ꢆꢅ
ꢄꢅ
Figure 3. Delay Matching Waveform Definitions
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5
(
IR2301 S)&(PbF)
500
400
300
800
700
600
500
400
300
200
100
Max.
Typ.
Max.
200
Typ.
100
0
-50
-25
0
25
Temperature (oC)
Figure 4A. Turn-on Propagation Delay
50
75
100
125
5
10
Supply Voltage (V)
Figure 4B. Turn-on Propagation Delay
15
20
vs. Temperature
vs. Supply Voltage
600
500
400
300
200
100
0
700
600
500
400
300
200
100
Max.
Max.
Typ.
Typ.
-50
-25
0
25
Temperature (oC)
Figure 5A. Turn-off Propagation Delay
50
75
100
125
5
10
Supply Voltage (V)
Figure 5B. Turn-off Propagation Delay
15
20
vs. Temperature
vs. Supply Voltage
6
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( )
IR2301 S &(PbF)
700
600
500
400
300
200
100
0
500
400
300
200
100
0
Max.
Typ.
Max.
Typ.
-50
-25
0
25
Temperature (oC)
Figure 6A. Turn-on Rise Time
50
75
100
125
5
10
Supply Voltage (V)
Figure 6B. Turn-on Rise Time
15
20
vs. Temperature
vs. Supply Voltage
200
150
100
50
200
150
100
50
Max.
Max.
Typ.
Typ.
0
0
-50
-25
0
25
Temperature (oC)
Figure 7A. Turn-off Fall Time
50
75
100
125
5
10
Supply Voltage (V)
Figure 7B. Turn-off Fall Time
15
20
vs. Temperature
vs. Supply Voltage
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ꢥ
(
IR2301 S)&(PbF)
6
5
4
6
5
4
3
2
1
0
Max.
Max.
3
2
1
0
-50
-25
0
25
Temperature (oC)
Figure 8A. Logic “1” Input Voltage
50
75
100
125
5
10
Supply Voltage (V)
Figure 8B. Logic “1” Input Voltage
15
20
vs. Temperature
vs. Supply Voltage
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Min.
Min.
5
10
15
20
-50
-25
0
25
Temperature (oC)
Figure 9A. Logic “0” Input Voltage
50
75
100
125
Supply Voltage (V)
Figure 9B. Logic “0” Input Voltage
vs. Supply Voltage
vs. Temperature
8
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( )
IR2301 S &(PbF)
6
5
4
3
2
1
0
4
3
2
1
0
Max.
Max.
Typ.
Typ.
5
10
Supply Voltage (V)
Figure 10B. High Level Output Voltage
15
20
-50
-25
0
25
Temperature (oC)
Figure 10A. High Level Output Voltage
50
75
100
125
vs. Temperature
vs. Supply Voltage
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
Max.
Max.
Typ.
Typ.
-50
-25
0
25
Temperature (oC)
Figure 11A. Low Level Output Voltage
50
75
100
125
5
10
Supply Voltage (V)
Figure 11B. Low Level Output Voltage
15
20
vs. Temperature
vs. Supply Voltage
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ꢤ
(
IR2301 S)&(PbF)
500
400
300
200
500
400
300
200
100
0
100
Max.
Max.
0
-50
-25
0
25
50
75
100
125
100
200
300
400
500
600
Temperature (oC)
Offset Supply Voltage (V)
Figure 12A. Offset Supply Leakage Current
vs. Temperature
Figure 12B. Offset Supply Leakage Current
vs. Supply Voltage
200
150
100
50
200
150
100
50
Max.
Typ.
Max.
Typ.
Min.
Min.
0
0
-50
-25
0
25
50
75
100
125
5
10
15
20
Temperature (oC)
VBS Supply Voltage (V)
Figure 13A. Quiescent V
Supply Current
Figure 13B. Quiescent V
Supply Current
vs. Supply Voltage
BS
BS
vs. Temperature
10
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( )
IR2301 S &(PbF)
400
300
200
100
0
400
300
200
100
0
Max.
Typ.
Min.
Max.
Typ.
Min.
-50
-25
0
25
50
75
100
125
5
10
VCC Supply Voltage (V)
Figure 14B. Quiescent V Supply Current
15
20
Temperature (oC)
Figure 14A. Quiescent V
Supply Current
vs. Temperature
CC
CC
vs. V
CC
Supply Voltage
60
50
40
30
20
10
0
50
40
30
20
10
0
Max.
Typ.
Max.
Typ.
-50
-25
0
25
50
75
100
125
5
10
15
20
Temperature (oC)
Supply Voltage (V)
Figure 15A. Logic “1” Input Bias Current
vs. Temperature
Figure 15B. Logic “1” Input Bias Current
vs. Supply Voltage
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11
(
IR2301 S)&(PbF)
5
4
3
2
1
0
5
4
3
Max.
Max.
2
1
0
-50
-25
0
25
50
75
100
125
5
10
Supply Voltage (V)
Figure 16B. Logic “0” Input Bias Currentt
15
20
Temperature (oC)
Figure 16A. Logic “0” Input Bias Current
vs. Temperature
vs. Supply Voltage
6
6
Max.
Max.
5
4
3
2
5
4
3
2
Typ.
Min.
Typ.
Min.
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (oC)
Temperature (oC)
Figure 18. V
CC
and V
Undervoltage Threshold (-)
vs. Temperature
Figure 17. V
CC
and V
Undervoltage Threshold (+)
BS
BS
vs. Temperature
12
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( )
IR2301 S &(PbF)
400
300
200
100
0
400
300
200
100
0
Typ.
Min.
Typ.
Min.
5
10
15
20
-50
-25
0
25
50
75
100
125
Temperature (oC)
Supply Voltage (V)
Figure 19A. Output Source Current
vs. Temperature
Figure 19B. Output Source Current
vs. Supply Voltage
600
500
400
300
200
100
0
600
500
400
300
200
100
0
Typ.
Min.
Typ.
Min.
-50
-25
0
25
50
75
100
125
5
10
15
20
Temperature (oC)
Supply Voltage (V)
Figure 20A. Output Sink Current
vs. Temperature
Figure 20B. Output Sink Current
vs. Supply Voltage
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13
(
IR2301 S)&(PbF)
0
140
120
100
80
Typ.
-2
-4
-6
140V
70V
0V
60
-8
40
-10
-12
20
1
10
Frequency (KHz)
Figure 22. IR2301 vs. Frequency (IRFBC20),
=33 , V =15V
100
1000
5
10
15
20
VBS Floating Supply Voltage (V)
Figure 21. Maximum V Negative Offset
S
vs. V Floating Supply Voltage
R
BS
Ω
gate
CC
140
120
100
80
140
120
100
80
140V
70V
0V
140V
70V
0V
60
60
40
40
20
20
1
10
100
1000
1
10
Frequency (KHz)
Figure 23. IR2301 vs. Frequency (IRFBC30),
gate=22W, Vcc=15V
100
1000
Frequency (KHz)
Figure 24. IR2301 vs. Frequency (IRFBC40),
=15 , VCC=15V
R
Ω
R
gate
1ꢦ
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( )
IR2301 S &(PbF)
140V 70V
140
120
100
80
140
120
100
80
0V
140V
70V
0V
60
60
40
40
20
20
1
10
100
1000
1
10
100
1000
Frequency (KHz)
Frequency (KHz)
Figure 26. IR2301S vs. Frequency (IRFBC20),
=33 , V =15V
Figure 25. IR2301 vs. Frequency (IRFPE50),
=10 , V =15V
R
R
gate
Ω
Ω
gate
CC
CC
140V70V
140
120
100
80
140
120
100
80
140V
70V
0V
0V
60
60
40
40
20
20
1
10
100
1000
1
10
Frequency (KHz)
Figure 27. IR2301S vs. Frequency (IRFBC30),
=22 , VCC=15V
100
1000
Frequency (KHz)
Figure 28. IR2301S vs. Frequency (IRFBC40),
=15 , VCC=15V
R
Ω
R
gate
Ω
gate
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15
(
IR2301 S)&(PbF)
140V70V 0V
140
120
100
80
60
40
20
1
10
100
1000
Frequency (KHz)
Figure 29. IR2301S vs. Frequency
(IRFPE50), R =10 , V =15V
Ω
gate
CC
Case Outlines
01-601ꢦ
8 Lead PDIP
01-3003 01 (MS-001AB)
16
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( )
IR2301 S &(PbF)
IN C H E S
MILLIMETERS
DIM
A
D
B
MIN
.0532
MAX
.0688
.0098
.020
MIN
1.35
0.10
0.33
0.19
4.80
3.80
MAX
1.75
0.25
0.51
0.25
5.00
4.00
FOOTPRINT
8X 0.72 [.028]
5
A
E
A1 .0040
b
c
.013
.0075
.189
.0098
.1968
.1574
8
1
7
2
6
3
5
6
D
E
e
H
.1497
0.25 [.010]
A
.050 BASIC
1.27 BASIC
6.46 [.255]
4
e 1 .025 BASIC
0.635 BASIC
H
K
L
y
.2284
.0099
.016
0°
.2440
.0196
.050
8°
5.80
0.25
0.40
0°
6.20
0.50
1.27
8°
3X 1.27 [.050]
e
6X
8X 1.78 [.070]
K x 45°
e1
A
C
y
0.10 [.004]
8X c
8X L
A1
B
8X b
0.25 [.010]
7
C
A
5
6
7
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
NOTES:
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. CONTROLLING DIMENSION: MILLIMETER
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
A SUBSTRATE.
01-602ꢥ
01-0021 11 (MS-012AA)
8 Lead SOIC
www.irf.com
1ꢥ
(
IR2301 S)&(PbF)
LEADFREE PART MARKING INFORMATION
Part number
Date code
IRxxxxxx
YWW?
IR logo
?XXXX
Pin 1
Identifier
Lot Code
(Prod mode - 4 digit SPN code)
?
MARKING CODE
P
Lead Free Released
Non-Lead Free
Released
Assembly site code
Per SCOP 200-002
ORDER INFORMATION
Basic Part (Non-Lead Free)
Leadfree Part
8-Lead PDIP IR2301 order IR2301
8-Lead SOIC IR2301S order IR2301S
8-Lead PDIP R2301 order IR2301PbF
8-Lead SOIC IR2301S order IR2301SPbF
This product has been designed and qualified for the Automotive market.
Qualification Standards can be found on IR’s Web Site http://www.irf.com
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
9/7/2004
18
www.irf.com
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