IR255SG06H [INFINEON]

Silicon Controlled Rectifier, 600V V(DRM), 600V V(RRM), 1 Element, 4 INCH, WAFER;
IR255SG06H
型号: IR255SG06H
厂家: Infineon    Infineon
描述:

Silicon Controlled Rectifier, 600V V(DRM), 600V V(RRM), 1 Element, 4 INCH, WAFER

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文件: 总3页 (文件大小:126K)
中文:  中文翻译
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Preliminary Data Sheet I0211J 12/99  
IR255SG..HCB  
PHASE CONTROL THYRISTORS  
Junction Size:  
Wafer Size:  
Square 250 mils  
4"  
VRRMClass:  
600 to 1200 V  
Glassivated MESA  
Passivation Process:  
Reference IR Packaged Part: n. a.  
Major Ratings and Characteristics  
Parameters  
Units  
Test Conditions  
VTM  
Maximum On-state Voltage  
1.25V  
TJ=25°C, IT = 2 5 A  
VDRM/VRRM DirectandReverse Breakdown Voltage  
600 to 1200 V TJ = 25°C, IDRM/IRRM = 100 µA  
(1)  
IGT  
VGT  
IH  
Max.RequiredDCGateCurrent toTrigger  
Max. RequiredDCGateVoltagetoTrigger  
Holding Current Range  
80mA  
2 V  
TJ=25°C,anodesupply=6V,resistiveload  
TJ=25°C,anodesupply=6V,resistiveload  
5 to 100 mA Anodesupply=6V, resistiveload  
IL  
Maximum Latching Current  
300mA  
Anodesupply=6V, resistiveload  
(1)Nitrogen flow on die edge.  
Mechanical Characteristics  
Nominal Back Metal Composition,Thickness  
Cr -Ni -Ag (1 KA-4 KA -6 KA)  
Cr-Ni-Ag(1KA-4KA -6KA)  
250x250mils(seedrawing)  
100mm,withstd.<110>flat  
330µm±10µm  
Nominal Front Metal Composition,Thickness  
Chip Dimensions  
WaferDiameter  
Wafer Thickness  
Maximum Width of SawingLine  
Reject Ink Dot Size  
130µm  
0.25mmdiameterminimum  
Seedrawing  
Ink Dot Location  
Recommended Storage Environment  
Storage in original container, in dessicated  
nitrogen, with no contamination  
www.irf.com  
1
IR255SG..HCB  
Preliminary Data Sheet I0211J 12/99  
Ordering Information Table  
Device Code  
IR 255  
S
G
12  
H
CB  
1
2
3
4
5
6
7
1
2
3
-
-
-
International Rectifier Device  
Chip Dimension in Mils  
Type of Device: S = Solderable SCR  
Available Class  
06 = 600 V  
08 = 800 V  
12 =1200 V  
4
5
-
-
Passivation Process: G = Glassivated MESA  
Voltage code: Code x 100 = VRRM  
6
7
-
-
Metallization: H = Silver (Anode) - Silver (Cathode)  
CB = Probed Uncut Die (wafer in box)  
None = Probed Die in chip carrier  
Outline Table  
All dimensions are in millimiters  
2
www.irf.com  
IR255SG..HCB  
Preliminary Data Sheet I0211J 12/99  
Wafer Layout  
TOP VIEW  
N° 148 Basic Cells  
All dimensions are in millimiters  
www.irf.com  
3

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