IR370SG12HCBPBF [INFINEON]
Silicon Controlled Rectifier, 1200V V(DRM), 1200V V(RRM), 1 Element, 4 INCH, WAFER;
| 型号： | IR370SG12HCBPBF |
| 厂家： | 
Infineon |
| 描述： | Silicon Controlled Rectifier, 1200V V(DRM), 1200V V(RRM), 1 Element, 4 INCH, WAFER 栅 栅极 |
| 文件： | 总3页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Data Sheet I0212J 12/99
IR370SG..HCB
PHASE CONTROL THYRISTORS
Junction Size:
Wafer Size:
Square 370 mils
4 "
VRRMClass:
600 to 1200 V
Glassivated MESA
Passivation Process:
Reference IR Packaged Part: 50RIA Series
Major Ratings and Characteristics
Parameters
Units
Test Conditions
VTM
MaximumOn-stateVoltage
1.2 V
TJ=25°C, IT = 2 5 A
VDRM/VRRM DirectandReverseBreakdownVoltage
600 to 1200 V TJ = 25°C, IDRM /I RRM = 100 µA
(1)
IGT
VGT
IH
Max.RequiredDCGateCurrenttoTrigger
Max. RequiredDCGateVoltagetoTrigger
HoldingCurrentRange
150mA
2 V
TJ=25°C,anodesupply=6V,resistiveload
TJ=25°C,anodesupply=6V,resistiveload
5 to 200 mA Anodesupply=6V, resistiveload
IL
MaximumLatchingCurrent
400mA
Anodesupply=6V, resistiveload
(1)Nitrogen flow on die edge.
Mechanical Characteristics
NominalBackMetalComposition,Thickness
Cr-Ni-Ag(1KA-4KA -6KA)
Cr-Ni-Ag(1KA-4KA -6KA)
370x370mils(seedrawing)
100mm,withstd.<110>flat
370µm±10µm
NominalFrontMetalComposition,Thickness
ChipDimensions
WaferDiameter
WaferThickness
MaximumWidthofSawingLine
RejectInkDotSize
130µm
0.25mmdiameterminimum
Seedrawing
InkDotLocation
RecommendedStorageEnvironment
Storageinoriginalcontainer,indessicated
nitrogen,withnocontamination
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1
IR370SG..HCB
Preliminary Data Sheet I0212J 12/99
OrderingInformationTable
Device Code
IR 370
S
G
12H
CB
1
2
3
4
5
6
7
1
2
3
-
-
-
International Rectifier Device
Chip Dimension in Mils
Type of Device: S = Solderable SCR
4
5
-
-
Passivation Process: G = Glassivated MESA
Voltage code: Code x 100 = VRRM
Available Class
06 = 600 V
08 = 800 V
12 =1200 V
6
7
-
-
Metallization: H = Silver (Anode) - Silver (Cathode)
CB = Probed Uncut Die (wafer in box)
None = Probed Die in chip carrier
OutlineTable
All dimensions are in millimeters
2
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IR370SG..HCB
Preliminary Data Sheet I0212J 12/99
Wafer Layout
TOP VIEW
N° 69 Basic Cells
All dimensions are in millimiters
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3
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