IRF1405SPBF [INFINEON]

AUTOMOTIVE MOSFET ( VDSS = 55V , RDS(on) = 5.3mヘ , ID = 131A ); 汽车MOSFET ( VDSS = 55V , RDS ( ON) = 5.3米ヘ, ID = 131A )
IRF1405SPBF
型号: IRF1405SPBF
厂家: Infineon    Infineon
描述:

AUTOMOTIVE MOSFET ( VDSS = 55V , RDS(on) = 5.3mヘ , ID = 131A )
汽车MOSFET ( VDSS = 55V , RDS ( ON) = 5.3米ヘ, ID = 131A )

文件: 总12页 (文件大小:236K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD-95331  
IRF1405SPbF  
IRF1405LPbF  
AUTOMOTIVE MOSFET  
Typical Applications  
O
O
O
O
O
O
Electric Power Steering (EPS)  
Anti-lock Braking System (ABS)  
Wiper Control  
Climate Control  
Power Door  
Lead-Free  
HEXFET® Power MOSFET  
D
VDSS = 55V  
RDS(on) = 5.3mΩ  
Benefits  
G
O
O
O
O
O
O
Advanced Process Technology  
Ultra Low On-Resistance  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
ID = 131A†  
S
Description  
Stripe Planar design of HEXFET® Power MOSFETs  
utilizes the lastest processing techniques to achieve  
extremelylow on-resistancepersiliconarea. Additional  
features of this HEXFET power MOSFET are a 175°C  
junction operating temperature, fast switching speed  
and improved repetitive avalanche rating. These  
benefits combine to make this design an extremely  
efficient and reliable device for use in Automotive  
applications and a wide variety of other applications.  
Absolute Maximum Ratings  
D2Pak  
IRF1405S  
TO-262  
IRF1405L  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
131†  
93†  
680  
A
PD @TC = 25°C  
Power Dissipation  
200  
W
W/°C  
V
Linear Derating Factor  
1.3  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
590  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
See Fig.12a, 12b, 15, 16  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
0.75  
40  
Units  
°C/W  
RθJC  
RθJA  
Junction-to-Ambient (PCB mount)ˆ  
–––  
www.irf.com  
1
05/27/04  
IRF1405S/LPbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
55 ––– –––  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 0.057 ––– V/°C Reference to 25°C, ID = 1mA  
RDS(on)  
VGS(th)  
gfs  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
2.0  
69  
4.6 5.3  
––– 4.0  
––– –––  
mVGS = 10V, ID = 101A „  
V
VDS = 10V, ID = 250µA  
Forward Transconductance  
S
VDS = 25V, ID = 110A  
––– ––– 20  
––– ––– 250  
––– ––– 200  
––– ––– -200  
––– 170 260  
VDS = 55V, VGS = 0V  
IDSS  
Drain-to-Source Leakage Current  
µA  
nA  
VDS = 44V, VGS = 0V, TJ = 150°C  
VGS = 20V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
IGSS  
VGS = -20V  
Qg  
ID = 101A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
44  
62  
66  
93  
nC VDS = 44V  
VGS = 10V„  
VDD = 38V  
13 –––  
––– 190 –––  
––– 130 –––  
––– 110 –––  
ID = 110A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 1.1Ω  
VGS = 10V „  
D
Between lead,  
4.5  
LD  
LS  
Internal Drain Inductance  
Internal Source Inductance  
–––  
–––  
–––  
–––  
6mm (0.25in.)  
nH  
G
from package  
7.5  
and center of die contact  
S
Ciss  
Input Capacitance  
––– 5480 –––  
––– 1210 –––  
––– 280 –––  
––– 5210 –––  
––– 900 –––  
––– 1500 –––  
VGS = 0V  
Coss  
Output Capacitance  
pF  
VDS = 25V  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
ƒ = 1.0MHz, See Fig. 5  
Coss  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
VGS = 0V, VDS = 44V, ƒ = 1.0MHz  
VGS = 0V, VDS = 0V to 44V  
Coss  
Output Capacitance  
Coss eff.  
Effective Output Capacitance ꢀ  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
D
IS  
MOSFET symbol  
––– –––  
131†  
showing the  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
––– ––– 680  
S
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
Forward Turn-On Time  
––– ––– 1.3  
––– 88 130  
––– 250 380  
V
TJ = 25°C, IS = 101A, VGS = 0V „  
ns  
TJ = 25°C, IF = 101A  
Qrr  
ton  
nC di/dt = 100A/µs „  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
2
www.irf.com  
IRF1405S/LPbF  
1000  
100  
10  
1000  
100  
10  
VGS  
VGS  
15V  
TOP  
TOP  
15V  
10V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
BOTTOM 4.5V  
BOTTOM 4.5V  
4.5V  
4.5V  
20µs PULSE WIDTH  
20µs PULSE WIDTH  
°
T = 175 C  
J
°
T = 25 C  
J
1
0.1  
0.1  
1
10  
100  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
3.0  
169A  
=
I
D
°
T = 25 C  
J
°
T = 175 C  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
J
100  
10  
1
V
= 25V  
DS  
V
=10V  
GS  
20µs PULSE WIDTH  
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
°
4
6
8
10 12  
T , Junction Temperature ( C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRF1405S/LPbF  
20  
16  
12  
8
100000  
I
D
= 101A  
V
= 0V,  
f = 1 MHZ  
GS  
V
V
= 44V  
= 27V  
C
= C + C  
,
C
ds  
SHORTED  
DS  
DS  
iss  
gs  
gd  
C
= C  
rss  
gd  
C
= C + C  
ds gd  
oss  
10000  
1000  
100  
Ciss  
Coss  
Crss  
10  
4
FOR TEST CIRCUIT  
SEE FIGURE 13  
0
1
100  
0
60  
120  
180  
240  
300  
Q , Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
G
DS  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
100  
10  
10000  
1000  
100  
10  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
°
T = 175 C  
J
10us  
100us  
°
T = 25 C  
J
1ms  
10ms  
°
T = 25 C  
C
°
T = 175 C  
Single Pulse  
J
V
= 0 V  
GS  
2.5  
1
0.0  
1
0.5  
1.0  
1.5  
2.0  
3.0  
1
10  
100  
V
,Source-to-Drain Voltage (V)  
V
, Drain-to-Source Voltage (V)  
SD  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
www.irf.com  
IRF1405S/LPbF  
160  
120  
80  
40  
0
RD  
VDS  
LIMITED BY PACKAGE  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
25  
50  
75  
100  
125  
150  
175  
°
T , Case Temperature ( C)  
C
10%  
V
GS  
Fig 9. Maximum Drain Current Vs.  
t
t
r
t
t
f
d(on)  
d(off)  
Case Temperature  
Fig 10b. Switching Time Waveforms  
1
D = 0.50  
0.20  
0.10  
0.05  
0.1  
0.01  
0.02  
0.01  
SINGLE PULSE  
(THERMAL RESPONSE)  
P
2
DM  
t
1
t
2
Notes:  
1. Duty factor D =  
t / t  
1
2. Peak T =P  
x Z  
+ T  
C
J
DM  
thJC  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.irf.com  
5
IRF1405S/LPbF  
1400  
1200  
1000  
800  
600  
400  
200  
0
15V  
I
D
TOP  
41A  
71A  
BOTTOM 101A  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
20V  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
175  
°
Starting T , Junction Temperature ( C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
Vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
V
G
Charge  
I
= 250µA  
D
Fig 13a. Basic Gate Charge Waveform  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
.3µF  
+
V
DS  
D.U.T.  
-
V
GS  
-75 -50 -25  
0
25 50 75 100 125 150 175  
, Temperature ( °C )  
3mA  
T
J
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage Vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
6
www.irf.com  
IRF1405S/LPbF  
1000  
100  
10  
Duty Cycle = Single Pulse  
0.01  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming  
Tj = 25°C due to  
avalanche losses  
0.05  
0.10  
1
0.1  
1.0E-07  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
1.0E+00  
tav (sec)  
Fig 15. Typical Avalanche Current Vs.Pulsewidth  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
600  
500  
400  
300  
200  
100  
0
TOP  
BOTTOM 10% Duty Cycle  
= 101A  
Single Pulse  
I
D
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Fig 16. Maximum Avalanche Energy  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Vs. Temperature  
www.irf.com  
7
IRF1405S/LPbF  
Peak Diode Recovery dv/dt Test Circuit  
+
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
D.U.T*  
ƒ
-
+
‚
-
„
-
+

RG  
dv/dt controlled by RG  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
+
-
VDD  
VGS  
* Reverse Polarity of D.U.T for P-Channel  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
V
[
=10V  
] ***  
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
]
[
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
[
]
SD  
Ripple 5%  
*** VGS = 5.0V for Logic Level and 3V Drive Devices  
Fig 17. For N-channel HEXFET® power MOSFETs  
8
www.irf.com  
IRF1405S/LPbF  
D2Pak Package Outline  
Dimensions are shown in millimeters (inches)  
D2Pak Part Marking Information  
T HIS IS AN IRF530S WITH  
LOT CODE 8024  
PART NUMBER  
INT ERNATIONAL  
RECTIFIER  
LOGO  
AS S EMBLED ON WW 02, 2000  
IN THE ASSEMBLY LINE "L"  
F530S  
DATE CODE  
YEAR 0 = 2000  
WEEK 02  
Note: "P" in as s e mbly line  
pos ition indicates "Lead-Fre e"  
ASSEMBLY  
LOT CODE  
LINE L  
OR  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
F530S  
DATE CODE  
P = DESIGNATES LEAD-FREE  
PRODUCT (OPTIONAL)  
YEAR 0 = 2000  
AS S E MB L Y  
LOT CODE  
WE EK 02  
A = AS S E MB LY S IT E CODE  
www.irf.com  
9
IRF1405S/LPbF  
TO-262 Package Outline  
Dimensions are shown in millimeters (inches)  
TO-262 Part Marking Information  
EXAMPLE: THIS IS AN IRL3103L  
LOT CODE 1789  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
ASSEMBLED ON WW 19, 1997  
IN THE ASSEMBLY LINE "C"  
DATE CODE  
YEAR 7 = 1997  
WE E K 19  
Note: "P" in assembly line  
position indicates "Lead-Free"  
ASSEMBLY  
LOT CODE  
LINE C  
OR  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
DATE CODE  
P = DE S IGNAT E S L E AD-F RE E  
PRODUCT (OPTIONAL)  
YEAR 7 = 1997  
AS S E MB L Y  
LOT CODE  
WEEK 19  
A = ASSEMBLYSITE CODE  
10  
www.irf.com  
IRF1405S/LPbF  
D2Pak Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TRR  
1.60 (.063)  
1.50 (.059)  
1.60 (.063)  
1.50 (.059)  
4.10 (.161)  
3.90 (.153)  
0.368 (.0145)  
0.342 (.0135)  
FEED DIRECTION  
1.85 (.073)  
11.60 (.457)  
11.40 (.449)  
1.65 (.065)  
24.30 (.957)  
23.90 (.941)  
15.42 (.609)  
15.22 (.601)  
TRL  
1.75 (.069)  
1.25 (.049)  
10.90 (.429)  
10.70 (.421)  
4.72 (.136)  
4.52 (.178)  
16.10 (.634)  
15.90 (.626)  
FEED DIRECTION  
13.50 (.532)  
12.80 (.504)  
27.40 (1.079)  
23.90 (.941)  
4
330.00  
(14.173)  
MAX.  
60.00 (2.362)  
MIN.  
30.40 (1.197)  
MAX.  
NOTES :  
1. COMFORMS TO EIA-418.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION MEASURED @ HUB.  
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.  
26.40 (1.039)  
24.40 (.961)  
4
3
Notes:  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Starting TJ = 25°C, L = 0.11mH  
RG = 25, IAS = 101A. (See Figure 12).  
ƒ ISD 101A, di/dt 210A/µs, VDD V(BR)DSS  
TJ 175°C  
„ Pulse width 400µs; duty cycle 2%.  
Coss eff. is a fixed capacitance that gives the same charging time  
as Coss while VDS is rising from 0 to 80% VDSS  
.
†
Calculated continuous current based on maximum allowable  
junction temperature. Package limitation current is 75A.  
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive  
avalanche performance.  
,
‡
ˆ This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).  
For recommended footprint and soldering techniques refer to application note #AN-994.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the industrial market.  
Qualification Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.05/04  
www.irf.com  
11  
Note: For the most current drawings please refer to the IR website at:  
http://www.irf.com/package/  

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