IRF3711STRL [INFINEON]

High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use; 高频同步整流的电信和工业应用隔离型DC- DC转换器
IRF3711STRL
型号: IRF3711STRL
厂家: Infineon    Infineon
描述:

High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use
高频同步整流的电信和工业应用隔离型DC- DC转换器

转换器 电信
文件: 总12页 (文件大小:275K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD-94062D  
IRF3711  
IRF3711S  
IRF3711L  
SMPS MOSFET  
HEXFET® Power MOSFET  
Applications  
l High Frequency Isolated DC-DC  
VDSS  
20V  
RDS(on) max  
ID  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
†
6.0mΩ  
110A  
l High Frequency Buck Converters for  
Server Processor Power Synchronous FET  
l Optimized for Synchronous Buck  
Converters Including Capacitive Induced  
Turn-on Immunity  
Benefits  
l Ultra-Low Gate Impedance  
D2Pak  
IRF3711S  
TO-262  
IRF3711L  
TO-220AB  
IRF3711  
l Very Low RDS(on) at 4.5V VGS  
l Fully Characterized Avalanche Voltage  
and Current  
Absolute Maximum Ratings  
Symbol  
VDS  
Parameter  
Drain-Source Voltage  
Max.  
20  
Units  
V
VGS  
Gate-to-Source Voltage  
± 20  
V
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
110†  
69  
A
440  
PD @TC = 25°C  
PD @TA = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipationꢀ  
Linear Derating Factor  
120  
W
W
3.1  
0.96  
W/°C  
°C  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Parameter  
Junction-to-Case ‡  
Case-to-Sink, Flat, Greased Surface „  
Junction-to-Ambient„‡  
Junction-to-Ambient (PCB mount)ꢀ‡  
Typ.  
Max.  
1.04  
–––  
62  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
–––  
0.50  
–––  
–––  
°C/W  
40  
Notes  through ‡ are on page 11  
www.irf.com  
1
12/9/04  
IRF3711/3711S/3711L  
Static @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
20 ––– –––  
––– 0.022 ––– V/°C Reference to 25°C, ID = 1mA  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
VGS = 0V, ID = 250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
–––  
–––  
1.0  
4.7  
6.2  
6.0  
8.5  
VGS = 10V, ID = 15A  
VGS = 4.5V, ID = 12A  
VDS = VGS, ID = 250µA  
VDS = 16V, VGS = 0V  
ƒ
ƒ
mΩ  
V
RDS(on)  
VGS(th)  
IDSS  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
––– 3.0  
––– ––– 20  
––– ––– 100  
––– ––– 200  
––– ––– -200  
µA  
Drain-to-Source Leakage Current  
VDS = 16V, VGS = 0V, TJ = 125°C  
VGS = 16V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
IGSS  
nA  
VGS = -16V  
Dynamic @ TJ = 25°C (unless otherwise specified)  
Symbol  
gfs  
Parameter  
Forward Transconductance  
Total Gate Charge  
Min. Typ. Max. Units  
Conditions  
VDS = 16V, ID = 30A  
ID = 15A  
53  
––– –––  
29 44  
S
Qg  
–––  
–––  
–––  
–––  
0.3  
Qgs  
Qgd  
Qoss  
Rg  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Output Gate Charge  
Gate Resistance  
7.3 –––  
8.9 –––  
33 –––  
––– 2.5  
12 –––  
nC VDS = 10V  
VGS = 4.5V  
VGS = 0V, VDS = 10V  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
–––  
VDD = 10V  
ID = 30A  
ns  
––– 220 –––  
Turn-Off Delay Time  
Fall Time  
–––  
–––  
17 –––  
12 –––  
RG = 1.8Ω  
VGS = 4.5V ƒ  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 2980 –––  
––– 1770 –––  
––– 280 –––  
Output Capacitance  
Reverse Transfer Capacitance  
pF  
VDS = 10V  
ƒ = 1.0MHz  
Avalanche Characteristics  
Symbol  
EAS  
Parameter  
Single Pulse Avalanche Energy‚  
Typ.  
–––  
Max.  
460  
Units  
mJ  
IAR  
Avalanche Current  
–––  
30  
A
Diode Characteristics  
Symbol  
IS  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
Continuous Source Current  
(Body Diode)  
MOSFET symbol  
––– –––  
––– –––  
110†  
showing the  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
440  
S
––– 0.88 1.3  
––– 0.82 –––  
V
TJ = 25°C, IS = 30A, VGS = 0V ƒ  
TJ = 125°C, IS = 30A, VGS = 0V ƒ  
TJ = 25°C, IF = 16A, VR=10V  
VSD  
Diode Forward Voltage  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Time  
Reverse Recovery Charge  
––– 50  
––– 61  
––– 48  
––– 65  
75  
92  
72  
98  
ns  
Qrr  
trr  
nC di/dt = 100A/µs ƒ  
ns TJ = 125°C, IF = 16A, VR=10V  
nC di/dt = 100A/µs ƒ  
Qrr  
2
www.irf.com  
IRF3711/3711S/3711L  
1000  
1000  
100  
10  
VGS  
VGS  
15V  
TOP  
TOP  
15V  
10V  
10V  
4.5V  
3.7V  
3.5V  
3.3V  
3.0V  
4.5V  
3.7V  
3.5V  
3.3V  
3.0V  
BOTTOM 2.7V  
BOTTOM 2.7V  
100  
2.7V  
2.7V  
20µs PULSE WIDTH  
°
T = 150 C  
J
20µs PULSE WIDTH  
°
T = 25 C  
J
10  
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
2.0  
110A  
=
I
D
°
T = 25 C  
J
1.5  
1.0  
0.5  
0.0  
°
T = 150 C  
J
100  
V
= 25V  
DS  
V
=10V  
GS  
20µs PULSE WIDTH  
10  
2.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
3.0  
4.0  
5.0  
6.0 7.0 8.0  
T , Junction Temperature ( C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRF3711/3711S/3711L  
14  
12  
10  
8
100000  
I = 30A  
D
V
= 0V,  
f = 1 MHZ  
GS  
V
V
= 16V  
= 10V  
DS  
DS  
C
= C + C  
,
C
ds  
SHORTED  
iss  
gs gd  
C
= C  
rss  
gd  
C
= C + C  
oss  
ds  
gd  
10000  
1000  
100  
Ciss  
Coss  
6
4
Crss  
2
FOR TEST CIRCUIT  
1
10  
, Drain-to-Source Voltage (V)  
100  
SEE FIGURE 13  
0
V
0
20  
40  
60  
80  
DS  
Q , Total Gate Charge (nC)  
G
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
100  
10  
10000  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
°
T = 150 C  
J
100µsec  
1msec  
°
T = 25 C  
J
1
10msec  
Tc = 25°C  
Tj = 150°C  
Single Pulse  
V
= 0 V  
GS  
1
0.1  
0.2  
0.8  
1.4  
2.0  
2.6  
1
10  
, Drain-toSource Voltage (V)  
100  
V
,Source-to-Drain Voltage (V)  
SD  
V
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
www.irf.com  
IRF3711/3711S/3711L  
RD  
120  
100  
80  
60  
40  
20  
0
VDS  
LIMITED BY PACKAGE  
VGS  
D.U.T.  
RG  
+VDD  
-
VGS  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
25  
50  
75  
100  
125  
150  
°
T , Case Temperature ( C)  
C
10%  
V
GS  
t
t
r
t
t
f
Fig 9. Maximum Drain Current Vs.  
d(on)  
d(off)  
Case Temperature  
Fig 10b. Switching Time Waveforms  
10  
1
D = 0.50  
0.20  
P
2
DM  
0.10  
0.05  
0.1  
0.01  
t
1
t
0.02  
0.01  
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =  
2. Peak T =P  
t / t  
1
x Z  
+ T  
thJC C  
J
DM  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.irf.com  
5
IRF3711/3711S/3711L  
1400  
1200  
1000  
800  
600  
400  
200  
0
I
15V  
D
TOP  
13A  
19A  
BOTTOM 30A  
DRIVER  
+
L
V
DS  
D.U.T  
R
G
V
DD  
-
I
A
AS  
20V  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
°
Starting T , Junction Temperature ( C)  
J
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
I
AS  
Fig 12b. Unclamped Inductive Waveforms  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
.3µF  
Q
G
+
VGS  
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Current Sampling Resistors  
Charge  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Basic Gate Charge Waveform  
6
www.irf.com  
IRF3711/3711S/3711L  
Peak Diode Recovery dv/dt Test Circuit  
+
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
D.U.T  
ƒ
-
+
‚
-
„
-
+

RG  
dv/dt controlled by RG  
+
-
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
VDD  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
V
=10V  
*
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 14. For N-Channel HEXFET® Power MOSFETs  
www.irf.com  
7
IRF3711/3711S/3711L  
TO-220AB Package Outline  
Dimensions are shown in millimeters (inches)  
TO-220AB Part Marking Information  
EXAMPLE: THIS IS AN IRF1010  
LOT CODE 1789  
PART NUMBER  
ASS EMBLED ON WW 19, 1997  
IN THE ASSEMBLY LINE "C"  
INTERNATIONAL  
RECTIFIER  
LOGO  
Note: "P" in assembly line  
position indicates "Lead-Free"  
DAT E CODE  
YEAR 7 = 1997  
WEEK 19  
AS S E MB L Y  
LOT CODE  
LINE C  
8
www.irf.com  
IRF3711/3711S/3711L  
D2Pak Package Outline  
Dimensions are shown in millimeters (inches)  
D2Pak Part Marking Information  
THIS IS AN IRF530S WITH  
LOT CODE 8024  
PART NUMBER  
INTERNATIONAL  
ASSEMBLED ON WW 02, 2000  
IN THE ASSEMBLY LINE "L"  
RECTIFIER  
LOGO  
F530S  
DATE CODE  
YEAR 0 = 2000  
WEE K 02  
Note: "P" in ass embly line  
pos ition indicates "Lead-F ree"  
ASSEMBLY  
LOT CODE  
LINE L  
OR  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
F530S  
DAT E CODE  
P = DE S IGNAT E S LE AD-F RE E  
PRODUCT (OPTIONAL)  
YEAR 0 = 2000  
ASSEMBLY  
LOT CODE  
WEEK 02  
A = AS S E MB L Y S IT E CODE  
www.irf.com  
9
IRF3711/3711S/3711L  
TO-262 Package Outline  
Dimensions are shown in millimeters (inches)  
TO-262 Part Marking Information  
EXAMPLE: THIS IS AN IRL3103L  
LOT CODE 1789  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
ASSEMBLED ON WW 19, 1997  
IN THE ASSEMBLY LINE "C"  
DATE CODE  
YEAR 7 = 1997  
WEEK 19  
Note: "P" in assembly line  
position indica tes "Lead-Free"  
ASSEMBLY  
LOT CODE  
LINE C  
OR  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
DATE CODE  
P = DE S IGNAT E S L E AD-F R E E  
PRODUCT (OPTIONAL)  
YEAR 7 = 1997  
ASSEMBLY  
LOT CODE  
WEEK 19  
A = ASSEMBLYSITE CODE  
10  
www.irf.com  
IRF3711/3711S/3711L  
D2Pak Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TRR  
1.60 (.063)  
1.50 (.059)  
1.60 (.063)  
1.50 (.059)  
4.10 (.161)  
3.90 (.153)  
0.368 (.0145)  
0.342 (.0135)  
FEED DIRECTION  
1.85 (.073)  
11.60 (.457)  
11.40 (.449)  
1.65 (.065)  
24.30 (.957)  
23.90 (.941)  
15.42 (.609)  
15.22 (.601)  
TRL  
1.75 (.069)  
1.25 (.049)  
10.90 (.429)  
10.70 (.421)  
4.72 (.136)  
4.52 (.178)  
16.10 (.634)  
15.90 (.626)  
FEED DIRECTION  
13.50 (.532)  
12.80 (.504)  
27.40 (1.079)  
23.90 (.941)  
4
330.00  
(14.173)  
MAX.  
60.00 (2.362)  
MIN.  
30.40 (1.197)  
MAX.  
NOTES :  
1. COMFORMS TO EIA-418.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION MEASURED @ HUB.  
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.  
Notes:  
26.40 (1.039)  
24.40 (.961)  
4
3
 Repetitive rating; pulse width limited by  
ƒ Pulse width 400µs; duty cycle 2%.  
max. junction temperature.  
„ This is only applied to TO-220AB package  
‚ Starting TJ = 25°C, L = 1.0mH  
RG = 25, IAS = 30A.  
This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).  
For recommended footprint and soldering techniques refer to application note #AN-994.  
† Calculated continuous current based on maximum allowable  
junction temperature. Package limitation current is 75A.  
‡ Rθ is measured at TJ approximately 90°C  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the industrial market.  
Qualification Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.12/04  
www.irf.com  
11  
Note: For the most current drawings please refer to the IR website at:  
http://www.irf.com/package/  

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