IRF6626PBF [INFINEON]
RoHs Compliant; 符合RoHS
| 型号： | IRF6626PBF |
| 厂家： | 
Infineon |
| 描述： | RoHs Compliant |
| 文件： | 总10页 (文件大小：289K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 97218
IRF6626PbF
IRF6626TRPbF
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHs Compliant
l Lead-Free (Qualified up to 260°C Reflow)
l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
VDSS
30V max ±20V max
VGS
RDS(on)
RDS(on)
4.0mΩ@ 10V 5.2mΩ@ 4.5V
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
19nC
6.7nC 1.6nC 5.4nC
13nC
1.8V
l High Cdv/dt Immunity
l Low Profile (<0.7mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
DirectFET ISOMETRIC
ST
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF6626PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve
the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection
soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET pack-
age allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6626PbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF6626PbF has been optimized for parameters that are critical in synchronous buck
operating from 12 volt buss converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
Max.
30
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
16
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
13
@ TA = 70°C
@ TC = 25°C
A
72
130
24
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
13
15
10
5
6.0
5.0
4.0
3.0
2.0
1.0
0.0
I = 13A
I
= 16A
D
D
V
V
= 24V
DS
= 15V
DS
T
= 125°C
J
T
= 25°C
5
J
0
3
4
6
7
8
0
10
20
30
Q
Total Gate Charge (nC)
G
V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical On-Resistance vs. Gate Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.29mH, RG = 25Ω, IAS = 13A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
05/29/06
IRF6626PbF
Static @ TJ = 25°C (unless otherwise specified)
Conditions
VGS = 0V, ID = 250µA
Parameter
Min. Typ. Max. Units
BVDSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
30
–––
–––
–––
1.35
–––
–––
–––
–––
–––
64
–––
–––
V
Reference to 25°C, I = 1mA
∆ΒVDSS/∆TJ
RDS(on)
23
––– mV/°C
D
VGS = 10V, ID = 16A i
VGS = 4.5V, ID = 13A i
VDS = VGS, ID = 250µA
4.0
5.2
–––
-6.0
–––
–––
–––
–––
–––
19
5.4
7.1
mΩ
VGS(th)
Gate Threshold Voltage
2.35
V
∆VGS(th)/∆TJ
IDSS
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
––– mV/°C
VDS = 24V, VGS = 0V
1.0
150
100
-100
–––
29
µA
nA
S
VDS = 24V, VGS = 0V, TJ = 125°C
VGS = 20V
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
VGS = -20V
VDS = 15V, ID = 13A
gfs
Qg
–––
–––
–––
–––
–––
–––
–––
–––
VDS = 15V
VGS = 4.5V
ID = 13A
Qgs1
Qgs2
Qgd
Qgodr
Qsw
Qoss
RG
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Qgs2 + Qgd)
Output Charge
5.2
1.6
6.7
5.5
8.3
13
–––
–––
nC
–––
–––
–––
1.5
See Fig. 15
VDS = 16V, VGS = 0V
nC
–––
13
Gate Resistance
Ω
VDD = 16V, VGS = 4.5Vꢁi
ID = 13A
td(on)
tr
td(off)
tf
Turn-On Delay Time
–––
–––
–––
–––
–––
–––
–––
–––
Rise Time
15
Clamped Inductive Load
See Fig. 16 & 17
VGS = 0V
Turn-Off Delay Time
17
ns
Fall Time
4.5
Ciss
Coss
Crss
Input Capacitance
––– 2380 –––
VDS = 15V
Output Capacitance
–––
–––
530
260
–––
–––
pF
ƒ = 1.0MHz
Reverse Transfer Capacitance
Diode Characteristics
Conditions
MOSFET symbol
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
–––
–––
52
showing the
(Body Diode)
A
ISM
integral reverse
Pulsed Source Current
(Body Diode)ꢁe
–––
–––
130
p-n junction diode.
TJ = 25°C, IS = 13A, VGS = 0V i
TJ = 25°C, IF = 13A
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
–––
–––
–––
–––
15
1.0
23
V
ns
nC
Qrr
di/dt = 100A/µs iꢁSee Fig. 18
5.4
8.1
Notes:
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
2
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IRF6626PbF
Absolute Maximum Ratings
Max.
2.2
Parameter
Units
W
P
P
P
@TA = 25°C
@TA = 70°C
@TC = 25°C
Power Dissipation
Power Dissipation
Power Dissipation
D
D
D
P
J
1.4
42
270
T
T
T
Peak Soldering Temperature
Operating Junction and
°C
-40 to + 150
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
Max.
58
Units
°C/W
W/°C
Rθ
Rθ
Rθ
Rθ
Rθ
Junction-to-Ambient
JA
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
–––
–––
3.0
JA
JA
–––
1.0
JC
Junction-to-PCB Mounted
Linear Derating Factor
–––
J-PCB
0.017
100
10
D = 0.50
0.20
0.10
0.05
0.02
0.01
1
Ri (°C/W) τi (sec)
R1
R1
R2
R2
R3
R3
R4
R4
R5
0.6677
1.0463
1.5612
0.000066
0.000896
0.004386
R5
τ
τ
J τJ
τ
Aτ
0.1
τ
1τ1
τ
τ
τ
2τ2
3 τ3
4 τ4
5 τ5
29.2822 0.686180
25.4550 32
Ci= τi/Ri
SINGLE PULSE
( THERMAL RESPONSE )
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t
, Rectangular Pulse Duration (sec)
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
R is measured at TJ of approximately 90°C.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
θ
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
Mounted to a PCB with
small clip heatsink (still air)
Surface mounted on 1 in. square Cu
(still air).
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IRF6626PbF
1000
1000
100
10
VGS
10V
VGS
10V
TOP
TOP
5.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
100
10
BOTTOM
BOTTOM
2.5V
2.5V
1
60µs PULSE WIDTH
Tj = 150°C
≤
60µs PULSE WIDTH
Tj = 25°C
≤
0.1
1
0.1
1
10
100
1000
0.1
1
10
100
1000
V
, Drain-to-Source Voltage (V)
DS
V
, Drain-to-Source Voltage (V)
DS
Fig 4. Typical Output Characteristics
Fig 5. Typical Output Characteristics
1000
100
10
1.5
1.0
0.5
V
= 15V
I
= 16A
DS
D
≤
VGS = 4.5V
60µs PULSE WIDTH
V
= 10
GS
T
T
T
= 150°C
= 25°C
= -40°C
J
J
J
1
0.1
1
2
3
4
-60 -40 -20
0
20 40 60 80 100 120 140 160
T
J
, Junction Temperature (°C)
V
, Gate-to-Source Voltage (V)
GS
Fig 7. Normalized On-Resistance vs. Temperature
Fig 6. Typical Transfer Characteristics
100000
10000
1000
25
V
= 0V,
= C
f = 1 MHZ
GS
T
= 25°C
C
C
C
+ C , C
SHORTED
J
iss
gs
gd
ds
= C
rss
oss
gd
Vgs = 3.0V
Vgs = 3.5V
Vgs = 4.0V
Vgs = 4.5V
Vgs = 5.0V
Vgs = 10V
20
15
10
5
= C + C
ds
gd
C
iss
C
oss
C
rss
100
0
1
10
, Drain-to-Source Voltage (V)
100
0
20
40
60
80
100
V
DS
I , Drain Current (A)
D
Fig 9. Typical On-Resistance vs.
Drain Current and Gate Voltage
Fig 8. Typical Capacitance vs.Drain-to-Source Voltage
4
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IRF6626PbF
1000
100
10
1000
100
10
1
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
100µsec
1msec
10msec
T
T
T
= 150°C
= 25°C
= 40°C
J
J
J
1
0.1
0.01
Ta = 25°C
Tj = 150°C
Single Pulse
V
= 0V
1.2
GS
0
0.01
0.10
1.00
10.00
100.00
0.0
0.2
V
0.4
0.6
0.8
1.0
1.4
V
, Drain-to-Source Voltage (V)
, Source-to-Drain Voltage (V)
DS
SD
Fig11. Maximum Safe Operating Area
Fig 10. Typical Source-Drain Diode Forward Voltage
2.2
80
70
60
50
40
30
20
10
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
I
= 50µA
D
-75 -50 -25
0
25 50 75 100 125 150
25
50
T
75
100
125
150
T , Temperature ( °C )
J
, Case Temperature (°C)
C
Fig 13. Threshold Voltage vs. Temperature
Fig 12. Maximum Drain Current vs. Case Temperature
100
I
D
TOP
5.6A
8.4A
80
60
40
20
0
BOTTOM 13A
25
50
75
100
125
150
Starting T , Junction Temperature (°C)
J
Fig 14. Maximum Avalanche Energy vs. Drain Current
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5
IRF6626PbF
Current Regulator
Same Type as D.U.T.
Id
Vds
Vgs
50KΩ
.2µF
12V
.3µF
+
V
DS
D.U.T.
-
Vgs(th)
Qgs1
V
GS
3mA
I
I
Qgs2
Qgd
Qgodr
G
D
Current Sampling Resistors
Fig 15a. Gate Charge Test Circuit
Fig 15b. Gate Charge Waveform
V
(BR)DSS
15V
t
p
DRIVER
+
L
V
DS
D.U.T
AS
VGS
R
G
V
DD
-
I
A
20V
0.01
Ω
t
p
I
AS
Fig 16b. Unclamped Inductive Waveforms
Fig 16a. Unclamped Inductive Test Circuit
LD
VDS
VDS
90%
+
-
VDD
10%
VGS
D.U.T
VGS
td(on)
td(off)
tr
Pulse Width < 1µs
Duty Factor < 0.1%
tf
Fig 17a. Switching Time Test Circuit
Fig 17b. Switching Time Waveforms
6
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IRF6626PbF
Driver Gate Drive
P.W.
P.W.
Period
D.U.T
Period
D =
+
*
=10V
V
GS
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
-
D.U.T. I Waveform
SD
+
-
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
-
+
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
V
DD
VDD
• di/dt controlled by RG
Re-Applied
Voltage
RG
+
-
• Driver same type as D.U.T.
Body Diode
Inductor Current
Forward Drop
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
I
SD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 18. Diode Reverse Recovery Test Circuit for N-Channel
HEXFET® Power MOSFETs
DirectFET Substrate and PCB Layout, ST Outline
(Small Size Can, T-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET.
This includes all recommendations for stencil and substrate designs.
G = GATE
D = DRAIN
S = SOURCE
D
D
D
D
S
S
G
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7
IRF6626PbF
DirectFET Outline Dimension, ST Outline
(Small Size Can, T-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET.
This includes all recommendations for stencil and substrate designs.
DIMENSIONS
IMPERIAL
METRIC
MAX
MIN
CODE
MIN
MAX
0.191
0.156
0.112
0.018
0.024
0.024
0.031
0.022
0.012
0.039
0.090
0.0274
0.0031
0.007
4.85
3.95
2.85
0.187
0.146
0.108
A
B
C
D
E
F
4.75
3.70
2.75
0.35
0.58
0.58
0.75
0.53
0.26
0.88
2.18
0.616
0.020
0.08
0.45 0.014
0.62
0.62
0.79
0.57
0.023
0.023
0.030
0.021
G
H
J
0.30 0.010
0.98
2.28
0.676
0.035
0.086
0.0235
K
L
M
R
P
0.080 0.0008
0.17
0.003
DirectFET Part Marking
8
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IRF6626PbF
DirectFET Tape & Reel Dimension (Showing component orientation).
NOTE: Controlling dimensions in mm
Std reel quantity is 4800 parts. (ordered as IRF6626TRPBF). For 1000 parts on 7"
reel, order IRF6626TR1PBF
REEL DIMENSIONS
STANDARD OPTION (QTY 4800)
TR1 OPTION (QTY 1000)
METRIC
MAX
IMPERIAL
METRIC
MAX
IMPERIAL
CODE
MIN
MIN
12.992
0.795
0.504
0.059
3.937
N.C
MAX
N.C
MIN
MIN
6.9
MAX
N.C
N.C
0.50
N.C
N.C
0.53
N.C
N.C
A
B
C
D
E
F
330.0
20.2
12.8
1.5
177.77
19.06
13.5
1.5
N.C
N.C
13.2
N.C
N.C
18.4
14.4
15.4
N.C
0.75
0.53
0.059
2.31
N.C
N.C
N.C
0.520
N.C
12.8
N.C
100.0
N.C
N.C
58.72
N.C
N.C
0.724
0.567
0.606
13.50
12.01
12.01
G
H
0.488
0.469
0.47
0.47
12.4
11.9
11.9
11.9
Loaded Tape Feed Direction
DIMENSIONS
METRIC
IMPERIAL
CODE
MIN
7.90
3.90
11.90
5.45
4.00
5.00
1.50
1.50
MIN
MAX
0.319
0.161
0.484
0.219
0.165
0.205
N.C
MAX
8.10
4.10
12.30
5.55
4.20
5.20
N.C
A
B
C
D
E
F
0.311
0.154
0.469
0.215
0.158
0.197
0.059
0.059
G
H
0.063
1.60
Data and specifications subject to change without notice.
This product has been designed and qualified for the Consumer market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 05/06
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9
Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/
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