IRF7201PBF [INFINEON]

HEXFET㈢ Power MOSFET; HEXFET㈢功率MOSFET
IRF7201PBF
型号: IRF7201PBF
厂家: Infineon    Infineon
描述:

HEXFET㈢ Power MOSFET
HEXFET㈢功率MOSFET

文件: 总7页 (文件大小:174K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD- 95022  
IRF7201PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l N-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
A
A
D
1
2
3
4
8
S
S
S
G
VDSS = 30V  
7
D
6
D
5
D
RDS(on) = 0.030Ω  
l Lead-Free  
Top View  
Description  
Fifth Generation HEXFET® power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance  
per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that  
HEXFET MOSFETs are well known for, provides the  
designerwithanextremelyefficientandreliabledevice  
for use in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Power dissipation of greater than 0.8W is possible in  
a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain- Source Voltage  
30  
V
ID @ TC = 25°C  
ID @ TC = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
Power Dissipation  
7.3  
5.8  
A
58  
PD @TC = 25°C  
PD @TC = 70°C  
2.5  
W
Power Dissipation  
1.6  
0.02  
Linear Derating Factor  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 20  
VGSM  
EAS  
Gate-to-Source Voltage Single Pulse tp<10µs  
Single Pulse Avalanche Energy‚  
30  
V
70  
mJ  
V/ns  
°C  
dv/dt  
TJ, TSTG  
Peak Diode Recovery dv/dt ƒ  
5.0  
Junction and Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient  
Typ.  
–––  
Max.  
50  
Units  
°C/W  
RθJA  
www.irf.com  
1
9/30/04  
IRF7201PbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
30 ––– –––  
V
VGS = 0V, ID = 250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
––– 0.024 ––– V/°C Reference to 25°C, ID = 1mA  
––– ––– 0.030  
––– ––– 0.050  
1.0 ––– –––  
5.8 ––– –––  
––– ––– 1.0  
––– ––– 25  
––– ––– -100  
––– ––– 100  
VGS = 10V, ID = 7.3A „  
GS = 4.5V, ID = 3.7A „  
RDS(on)  
Static Drain-to-Source On-Resistance  
V
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
VDS = VGS, ID = 250µA  
VDS = 15V, ID = 2.3A  
Forward Transconductance  
VDS = 24V, VGS = 0V  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
VDS = 24V, VGS = 0V, TJ = 125°C  
VGS = -20V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = 20V  
Qg  
––– 19  
28  
ID = 4.6A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
––– 2.3 3.5  
––– 6.3 9.5  
––– 7.0 –––  
––– 35 –––  
––– 21 –––  
––– 19 –––  
––– 550 –––  
––– 260 –––  
––– 100 –––  
nC VDS = 24V  
VGS = 10V, See Fig. 10 „  
VDD = 15V  
ID = 4.6A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 6.2Ω  
RD = 3.2, „  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
pF  
VDS = 25V  
Reverse Transfer Capacitance  
ƒ = 1.0MHz, See Fig. 9  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
showing the  
D
S
IS  
––– ––– 2.5  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
––– ––– 58  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
––– ––– 1.2  
––– 48 73  
––– 73 110  
V
TJ = 25°C, IS = 4.6A, VGS = 0V ƒ  
ns  
TJ = 25°C, IF = 4.6A  
Qrr  
nC di/dt = 100A/µs ƒ  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ ISD 4.6A, di/dt 120A/µs, VDD V(BR)DSS  
TJ 150°C  
,
max. junction temperature. (See fig. 11)  
‚ VDD = 15V, starting TJ = 25°C, L = 6.6mH  
RG = 25, IAS = 4.6A. (See Figure 8)  
„ Pulse width 300µs; duty cycle 2%.  
When mounted on 1 inch square copper board, t<10 sec  
2
www.irf.com  
IRF7201PbF  
100  
10  
1
100  
10  
1
VGS  
15V  
VGS  
15V  
TOP  
TOP  
10V  
10V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
BOTTOM 3.0V  
BOTTOM 3.0V  
3.0V  
3.0V  
20µs PULSE WIDTH  
= 25°C  
20µs PULSE WIDTH  
T
J
T
J
= 150°C  
A
A
0.1  
1
10  
0.1  
1
10  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
100  
TJ = 25°C  
TJ = 150°C  
10  
T = 150°C  
J
10  
T = 25°C  
J
1
VDS = 10V  
20µs PULSE WIDTH  
V
GS  
= 0V  
A
0.1  
1
5.5A  
0.4  
0.6  
0.8  
1.0  
1.2  
3.0  
3.5  
4.0  
4.5  
5.0  
V
, Source-to-Drain Voltage (V)  
VGS , Gate-to-Source Voltage (V)  
SD  
Fig 4. Typical Source-Drain Diode  
Fig 3. Typical Transfer Characteristics  
Forward Voltage  
www.irf.com  
3
IRF7201PbF  
0.20  
0.15  
0.10  
0.05  
0.00  
2.0  
I
= 4.6A  
D
1.5  
1.0  
0.5  
0.0  
V
GS  
= 4.5V  
V
= 10V  
GS  
30  
V
= 10V  
GS  
A
A
0
10  
20  
40  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
T
, Junction Temperature (°C)  
J
I
, Drain Current (A)  
D
Fig 5. Normalized On-Resistance  
Fig 6. On-Resistance Vs. Drain Current  
Vs. Temperature  
200  
0.05  
I
D
TOP  
2.1A  
3.7A  
BOTTOM 4.6A  
160  
120  
80  
40  
0
0.04  
0.03  
0.02  
I
= 7.3A  
D
A
150  
A
2
4
6
8
10  
12  
14  
16  
25  
50  
75  
100  
125  
Starting T , Junction Temperature (°C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 8. Maximum Avalanche Energy  
Vs. Drain Current  
Fig 7. On-Resistance Vs. Gate Voltage  
4
www.irf.com  
IRF7201PbF  
20  
16  
12  
8
1000  
800  
600  
400  
200  
0
I
= 4.6A  
V
C
C
C
= 0V,  
f = 1MHz  
D
GS  
iss  
rss  
oss  
= C + C  
,
C
SHORTED  
V
V
= 24V  
= 15V  
gs  
gd  
gd  
ds  
DS  
DS  
= C  
= C + C  
ds  
gd  
C
iss  
C
oss  
4
C
rss  
0
A
A
0
5
10  
15  
20  
25  
30  
1
10  
100  
Q , Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
G
DS  
Fig 10. Typical Gate Charge Vs.  
Fig 9. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
100  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
P
2
DM  
0.02  
0.01  
t
1
t
2
Notes:  
1. Duty factor D =  
2. Peak T =P  
J
SINGLE PULSE  
t / t  
1
x Z  
(THERMAL RESPONSE)  
+ T  
thJA A  
DM  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
www.irf.com  
5
IRF7201PbF  
SO-8 Package Outline  
Dimensions are shown in milimeters (inches)  
INCHES  
MILLIMETERS  
DIM  
A
D
B
MIN  
.0532  
MAX  
.0688  
.0098  
.020  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
5
A
E
A1 .0040  
b
c
D
E
.013  
8
1
7
2
6
3
5
.0075  
.189  
.0098  
.1968  
.1574  
6
H
0.25 [.010]  
A
.1497  
4
e
.050 BASIC  
1.27 BASIC  
0.635 BASIC  
e1 .025 BASIC  
H
K
L
.2284  
.0099  
.016  
0°  
.2440  
.0196  
.050  
8°  
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
e
6X  
y
e1  
A
K x 45°  
A
C
y
0.10 [.004]  
8X c  
A1  
B
8X L  
8X b  
0.25 [.010]  
7
C
F OOT PRINT  
8X 0.72 [.028]  
NOT ES :  
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.  
2. CONTROLLING DIMENSION: MILLIMETER  
3. DIMENS IONS ARE S HOWN IN MIL L IME T E RS [INCHES ].  
4. OUT L INE CONF OR MS T O JEDEC OU T LINE MS -012AA.  
5
6
7
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.  
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].  
6.46 [.255]  
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.  
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].  
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO  
ASUBSTRATE.  
3X 1.27 [.050]  
8X 1.78 [.070]  
SO-8 Part Marking Information (Lead-Free)  
EXAMPLE: THIS IS AN IRF7101 (MOSFET)  
DAT E CODE (YWW)  
P = DE S IGNAT E S L E AD-F RE E  
PRODUCT (OPTIONAL)  
Y = LAST DIGIT OF THE YEAR  
WW = WE E K  
XXXX  
F7101  
INTERNATIONAL  
RECTIFIER  
LOGO  
A = AS S E MB LY S IT E CODE  
LOT CODE  
PART NUMBER  
6
www.irf.com  
IRF7201PbF  
SO-8 Tape and Reel  
Dimensions are shown in milimeters (inches)  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Consumer market.  
Qualifications Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.09/04  
www.irf.com  
7

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