IRF7204PBF [INFINEON]

HEXFET㈢ Power MOSFET; HEXFET㈢功率MOSFET
IRF7204PBF
型号: IRF7204PBF
厂家: Infineon    Infineon
描述:

HEXFET㈢ Power MOSFET
HEXFET㈢功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 光电二极管
文件: 总9页 (文件大小:244K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 95165  
IRF7204PbF  
HEXFET® Power MOSFET  
l Adavanced Process Technology  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
A
D
1
2
3
4
8
S
S
VDSS = -20V  
7
D
6
S
G
D
RDS(on) = 0.060Ω  
5
D
l Lead-Free  
Description  
ID = -5.3A  
Top View  
Fourth Generation HEXFETs from International  
Rectifier utilize advanced processing techniques to  
achieve the lowest possible on-resistance per silicon  
area. This benefit, combined with the fast switching  
speed and ruggedized device design that HEXFET  
Power MOSFETs are well known for, provides the  
designer with an extremely efficient device for use in  
a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
dual-die capability making it ideal in a variety of power  
applications. With these improvements, multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Power dissipation of greater than 0.8W is possible in  
a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
-5.3  
-4.2  
-21  
A
PD @TC = 25°C  
Power Dissipation  
2.5  
W
W/°C  
±
Linear Derating Factor  
0.020  
VGS  
Gate-to-Source  
Voltage  
12V  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
-1.7  
V/nS  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance Ratings  
Parameter  
Min.  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
–––  
–––  
50  
°C/W  
10/6/04  
IRF7204PbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
-20 ––– –––  
Conditions  
VGS = 0V, ID = -250µA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– -0.022 ––– V/°C Reference to 25°C, I D = -1mA  
––– ––– 0.060  
––– ––– 0.10  
-1.0 ––– -2.5  
––– 7.9 –––  
––– ––– -25  
––– ––– -250  
––– ––– -100  
––– ––– 100  
––– 25 –––  
––– 5.0 –––  
––– 8.0 –––  
VGS = -10V, ID = -5.3A ƒ  
VGS = -4.5V, ID = -2.0A ƒ  
VDS = VGS, ID = -250µA  
RDS(ON)  
Static Drain-to-Source On-Resistance  
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
Forward Transconductance  
VDS = -15V, ID = -5.3A ƒ  
VDS = -16V, VGS = 0V  
µA  
nA  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
VDS = -16V, VGS = 0V, TJ = 125 °C  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
V
V
GS = -12V  
GS = 12V  
Qg  
Qgs  
Qgd  
td(on)  
tr  
ID = -5.3A  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
nC VDS = -10V  
VGS = -10V ƒ  
VDD = -10V  
––– 14  
––– 26  
30  
60  
Rise Time  
ID = -1.0A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
FallTime  
––– 100 150  
––– 68 100  
RG = 6.0Ω  
RD = 10ƒ  
D
S
LD  
LS  
Internal Drain Inductance  
Internal Source Inductance  
––– 2.5 –––  
––– 4.0 –––  
Between lead,6mm(0.25in.)  
nH  
pF  
G
from package and center  
of die contact  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 860 –––  
––– 750 –––  
––– 230 –––  
Output Capacitance  
VDS = -10V  
Reverse Transfer Capacitance  
ƒ = 1.0MHz  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFETsymbol  
D
S
IS  
––– ––– -2.5  
A
showing the  
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
––– ––– -15  
p-n junction diode.  
VSD  
trr  
Diode  
Forward  
Voltage  
––– ––– -1.2V J =T25°C, IS = -1.25A, VGS = 0V ƒ  
Reverse Recovery Time  
––– 85 100  
––– 77 120  
ns  
TJ = 25°C, IF = -2.4A  
Qrr  
ton  
Reverse RecoveryCharge  
Forward Turn-On Time  
nC di/dt = 100A/µs ƒ  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ Pulse width 300µs; duty cycle 2%.  
max. junction temperature.  
‚ ISD -5.3A, di/dt 90A/µs, VDD V(BR)DSS  
,
„ Surface mounted on FR-4 board, t 10sec.  
TJ 150°C  
IRF7204PbF  
-VDS , Drain-to-Source Voltage ( V )  
-VDS , Drain-to-Source Voltage ( V )  
Fig 2. Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
-VGS , Gate-to-Source Voltage ( V )  
TJ , Junction Temperature ( °C )  
Fig 4. Normalized On-Resistance  
Fig 3. Typical Transfer Characteristics  
Vs.Temperature  
IRF7204PbF  
12  
-VDS , Drain-to-Source Voltage ( V )  
QG , Total Gate Charge ( nC )  
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-SourceVoltage  
Gate-to-SourceVoltage  
100  
10  
1
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
1ms  
10ms  
°
T = 25 C  
A
J
°
T = 150 C  
Single Pulse  
0.1  
1
10  
100  
-V , Drain-to-Source Voltage (V)  
DS  
-VSD , Source-to-Drain Voltage ( V )  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
ForwardVoltage  
IRF7204PbF  
RD  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
VDS  
VGS  
D.U.T.  
RG  
-
+
VDD  
-10V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
t
t
r
t
t
f
d(on)  
d(off)  
V
GS  
10%  
25  
50  
75  
100  
125  
150  
°
T , Case Temperature ( C)  
C
90%  
V
DS  
Fig 9. Maximum Drain Current Vs.  
AmbientTemperature  
Fig 10b. Switching Time Waveforms  
100  
D = 0.50  
0.20  
0.10  
0.05  
10  
P
2
DM  
0.02  
0.01  
1
t
1
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =  
t / t  
1
2. Peak T = P  
J
x Z  
+ T  
A
DM  
thJA  
0.1  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig11. MaximumEffectiveTransientThermalImpedance,Junction-to-Ambient  
IRF7204PbF  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
Q
G
.2µF  
.3µF  
12V  
-10V  
-
V
+
DS  
Q
Q
GD  
GS  
D.U.T.  
V
GS  
V
G
-3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 12b. Gate Charge Test Circuit  
Fig 12a. Basic Gate Charge Waveform  
IRF7204PbF  
Peak Diode Recovery dv/dt Test Circuit  
+
ƒ
-
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
D.U.T*  
+
‚
-
„
-
+

RG  
dv/dt controlled by RG  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
+
-
VDD  
VGS  
* Reverse Polarity of D.U.T for P-Channel  
Driver Gate Drive  
P.W.  
Period  
Period  
D =  
P.W.  
V
[
=10V  
] ***  
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
[
DD  
]
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
[
]
SD  
Ripple 5%  
*** VGS = 5.0V for Logic Level and 3V Drive Devices  
Fig13. ForP-ChannelHEXFETS  
IRF7204PbF  
SO-8 Package Outline  
Dimensions are shown in milimeters (inches)  
INCHES  
MILLIMETERS  
DIM  
A
D
B
MIN  
.0532  
MAX  
.0688  
.0098  
.020  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
5
A
E
A1 .0040  
b
c
D
E
.013  
8
1
7
2
6
3
5
.0075  
.189  
.0098  
.1968  
.1574  
6
H
0.25 [.010]  
A
.1497  
4
e
.050 BASIC  
1.27 BASIC  
0.635 BASIC  
e1 .025 BASIC  
H
K
L
.2284  
.0099  
.016  
0°  
.2440  
.0196  
.050  
8°  
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
e
6X  
y
e1  
A
K x 45°  
A
C
y
0.10 [.004]  
8X c  
A1  
B
8X L  
8X b  
0.25 [.010]  
7
C
F OOT PRINT  
8X 0.72 [.028]  
NOT ES :  
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.  
2. CONTROLLING DIMENSION: MILLIMETER  
3. DIMENS IONS ARE S HOWN IN MIL L IME T E RS [INCHES ].  
4. OUT L INE CONF OR MS T O JEDEC OU T LINE MS -012AA.  
5
6
7
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.  
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].  
6.46 [.255]  
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.  
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].  
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO  
ASUBSTRATE.  
3X 1.27 [.050]  
8X 1.78 [.070]  
SO-8 Part Marking Information (Lead-Free)  
EXAMPLE: THIS IS AN IRF7101 (MOSFET)  
DAT E CODE (YWW)  
P = DE S IGNAT E S L E AD-F RE E  
PRODUCT (OPTIONAL)  
Y = LAST DIGIT OF THE YEAR  
WW = WE E K  
XXXX  
F7101  
INTERNATIONAL  
RECTIFIER  
LOGO  
A = AS S E MB LY S IT E CODE  
LOT CODE  
PART NUMBER  
IRF7204PbF  
SO-8 Tape and Reel  
Dimensions are shown in milimeters (inches)  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Consumer market.  
Qualifications Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.10/04  

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