IRF7807VD1 [INFINEON]
FETKY⑩ MOSFET / SCHOTTKY DIODE; FETKY ™ MOSFET /肖特基二极管型号: | IRF7807VD1 |
厂家: | Infineon |
描述: | FETKY⑩ MOSFET / SCHOTTKY DIODE |
文件: | 总9页 (文件大小:119K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PD-94078
IRF7807VD1
FETKY™ MOSFET / SCHOTTKY DIODE
• Co-Pack N-channel HEXFET Power MOSFET
and Schottky Diode
• Ideal for Synchronous Rectifiers in DC-DC
Converters Up to 5A Output
• Low Conduction Losses
• Low Switching Losses
1
2
3
4
8
7
K/D
K/D
A/S
A/S
6
5
A/S
G
K/D
K/D
• Low Vf Schottky Rectifier
Top View
Description
SO-8
The FETKY™ family of Co-Pack HEXFET MOSFETs and
Schottky diodes offers the designer an innovative, board
space saving solution for switching regulator and power
management applications. HEXFET power MOSFETs
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. Combining
this technology with International Rectifier’s low forward
drop Schottky rectifiers results in an extremely efficient
device suitable for use in a wide variety of portable
electronics applications.
DEVICE CHARACTERISTICSꢀ
IRF7807VD1
RDS
QG
17mΩ
9.5nC
3.4nC
12nC
(on)
Qsw
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics.The SO-
8 package is designed for vapor phase, infrared or wave
soldering techniques.
Qoss
Absolute Maximum Ratings
Parameter
Symbol
VDS
Max.
30
Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (VGS ≥ 4.5V)
Pulsed Drain Current
Power Dissipation
V
VGS
±20
8.3
6.6
66
25°C
70°C
ID
A
IDM
PD
25°C
70°C
25°C
70°C
2.5
1.6
3.5
2.2
W
A
Schottky and Body Diode
IF (AV)
TJ,TSTG
Average ForwardCurrent
Junction & Storage Temperature Range
–55 to 150
°C
Thermal Resistance
Parameter
Max.
50
Units
°C/W
°C/W
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
RθJA
RθJL
20
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1
03/05/01
IRF7807VD1
Electrical Characteristics
Parameter
Min Typ Max Units
Conditions
Drain-to-Source
BVDSS
30
–
–
V
VGS = 0V, ID = 250µA
Breakdown Voltage
Static Drain-Source
on Resistance
RDS
17
25
mΩ
VGS = 4.5V, ID = 7.0A
(on)
Gate Threshold Voltage
VGS(th)
IDSS
1.0
V
VDS = VGS,ID = 250µA
VDS = 24V, VGS = 0
Drain-Source Leakage
20
µA
mA
Current
2.0
VDS = 24V, VGS = 0,
Tj = 100°C
Gate-Source Leakage
Current*
IGSS
±100
14
nA
nC
VGS = ±20V
Total Gate Charge*
QG
9.5
2.3
VGS=4.5V, ID=7.0A
VDS = 16V
Pre-Vth
Gate-Source Charge
QGS1
Post-Vth
QGS2
1.0
Gate-Source Charge
Gate to Drain Charge
Switch Chg(Qgs2 + Qgd)
Output Charge*
QGD
Qsw
Qoss
RG
2.4
3.4
12
5.2
16.8
VDS = 16V, VGS = 0
Gate Resistance
2.0
6.3
Ω
Turn-on Delay Time
td (on)
VDD = 16V, ID = 7.0A
VGS = 5V, RG= 2Ω
Resistive Load
Rise Time
tr
1.2
11
ns
Turn-off Delay Time
Fall Time
td
(off)
tf
2.2
Schottky Diode & Body Diode Ratings and Characteristics
Parameter
Diode Forward Voltage
Min
Typ
Max
0.5
0.39
Units
V
Conditions
Tj = 25°C, Is = 1.0A, VGS =0V
Tj = 125°C, Is = 1.0A, VGS =0V
VSD
trr
Reverse Recovery Time
51
48
ns Tj = 25°C, Is = 7.0A, VDS = 16V
Reverse Recovery Charge
Forward Turn-On Time
Qrr
ton
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
ꢀ
Repetitive rating; pulse width limited by max.junction temperature.
Pulse width ≤ 400 µs; duty cycle ≤ 2%.
When mounted on 1 inch square copper board
50% Duty Cycle, Rectangular
Typical values of RDS(on) measured at VGS = 4.5V, QG, QSW and QOSS
measured at VGS = 5.0V, IF = 7.0A.
*
Device are 100% tested to these parameters.
2
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IRF7807VD1
Power MOSFET Selection for DC/DC
Converters
4
Drain Current
Control FET
1
Special attention has been given to the power losses
in the switching elements of the circuit - Q1 and Q2.
Power losses in the high side switch Q1, also called
the Control FET, are impacted by the Rds(on) of the
MOSFET, but these conduction losses are only about
one half of the total losses.
Gate Voltage
t2
t3
t1
VGTH
t0
Power losses in the control switch Q1 are given
by;
2
Drain Voltage
Ploss = Pconduction+ Pswitching+ Pdrive+ Poutput
This can be expanded and approximated by;
Figure 1: Typical MOSFET switching waveform
2
P
I
R
×
ds(on)
=
+
(
)
loss
rms
Synchronous FET
Qgd
ig
Qgs2
ig
The power loss equation for Q2 is approximated
by;
I
V
f
I
V
f
×
×
×
×
+
×
×
in
in
Q
V
f
×
+
+
×
(
)
P
P
P
P*
+
output
=
=
+
g
g
loss
conduction
drive
2
Qoss
2
P
Irms
R
×
ds(on)
V
f
×
×
in
loss
( )
Q
(
V
f
×
+
×
)
g
g
This simplified loss equation includes the terms Qgs2
and Qoss which are new to Power MOSFET data sheets.
Qgs2 is a sub element of traditional gate-source
charge that is included in all MOSFET data sheets.
The importance of splitting this gate-source charge
into two sub elements, Qgs1 and Qgs2, can be seen from
Fig 1.
Qoss
2
V
f
Q
V
×
in
f
×
+
×
×
+
(
)
in
rr
*dissipated primarily in Q1.
Qgs2 indicates the charge that must be supplied by
the gate driver between the time that the threshold
voltage has been reached (t1) and the time the drain
current rises to Idmax (t2) at which time the drain volt-
age begins to change. Minimizing Qgs2 is a critical fac-
tor in reducing switching losses in Q1.
Qoss is the charge that must be supplied to the out-
put capacitance of the MOSFET during every switch-
ing cycle. Figure 2 shows how Qoss is formed by the
parallel combination of the voltage dependant (non-
linear) capacitance’s Cds and Cdg when multiplied by
the power supply input buss voltage.
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3
IRF7807VD1
For the synchronous MOSFET Q2, Rds(on) is an im-
portant characteristic; however, once again the im-
portance of gate charge must not be overlooked since
it impacts three critical areas. Under light load the
MOSFET must still be turned on and off by the con-
trol IC so the gate drive losses become much more
significant. Secondly, the output charge Qoss and re-
verse recovery charge Qrr both generate losses that
are transfered to Q1 and increase the dissipation in
that device. Thirdly, gate charge will impact the
MOSFETs’ susceptibility to Cdv/dt turn on.
the MOSFET on, resulting in shoot-through current .
The ratio of Qgd/Qgs1 must be minimized to reduce the
potential for Cdv/dt turn on.
Spice model for IRF7807V can be downloaded in
machine readable format at www.irf.com.
The drain of Q2 is connected to the switching node
of the converter and therefore sees transitions be-
tween ground and Vin. As Q1 turns on and off there is
a rate of change of drain voltage dV/dt which is ca-
pacitively coupled to the gate of Q2 and can induce
a voltage spike on the gate that is sufficient to turn
Figure 2: Qoss Characteristic
Typical Mobile PC Application
The performance of these new devices has been tested
in circuit and correlates well with performance predic-
tions generated by the system models. An advantage of
this new technology platform is that the MOSFETs it
produces are suitable for both control FET and synchro-
nous FET applications. This has been demonstrated with
the 3.3V and 5V converters. (Fig 3 and Fig 4). In these
applications the same MOSFET IRF7807V was used for
both the control FET (Q1) and the synchronous FET
(Q2). This provides a highly effective cost/performance
solution.
3.3V Supply : Q1=Q2= IRF7807V
5.0V Supply : Q1=Q2= IRF7807V
95
94
93
92
91
93
92
91
90
89
88
87
90
Vin=24V
89
Vin=14V
Vin=24V
Vin=14V
Vin=10V
86
85
84
83
88
Vin=10V
87
86
1
2
3
4
5
1
2
3
4
5
Load current (A)
Load current (A)
Figure 3
Figure 4
4
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IRF7807VD1
2.0
1.5
1.0
0.5
0.0
0.030
0.025
0.020
0.015
0.010
7.0A
=
I
D
I
= 7.0A
D
V
=4.5V
GS
-60 -40 -20
0
20 40 60 80 100 120 140 160
2.0
4.0
V
6.0
8.0
10.0
12.0 14.0 16.0
°
T , Junction Temperature ( C)
J
Gate -to -Source Voltage (V)
GS,
Fig 5. Normalized On-Resistance
Fig 7. On-Resistance Vs. Gate Voltage
Vs. Temperature
70
60
50
40
30
20
10
0
VGS
VGS
4.5V
3.5V
3.0V
2.5V
2.0V
TOP
4.5V
3.5V
3.0V
2.5V
2.0V
TOP
60
50
40
30
20
10
0
BOTTOM 0.0V
BOTTOM 0.0V
0.0V
380µS PULSE WIDTH
380µs PULSE WIDTH
Tj = 150°C
Tj = 25°C
0.0V
0.4
0
0.2
0.6
0.8
1
0
0.2
0.4
0.6
0.8
1
V
, Source-to-Drain Voltage (V)
V
, Source-to-Drain Voltage (V)
SD
SD
Fig 7. Typical Reverse Output Characteristics
Fig 8. Typical Reverse Output Characteristics
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5
IRF7807VD1
100
D = 0.50
0.20
10
0.10
0.05
P
DM
0.02
1
t
1
0.01
t
2
SINGLE PULSE
(THERMAL RESPONSE)
Notes:
1. Duty factor D =
t / t
1 2
2. Peak T = P
J
x Z
+ T
thJA A
DM
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Rectangular Pulse Duration (sec)
1
Figure 9. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
5
I
D
= 7.0A
V
= 16V
DS
4
3
2
1
0
0
2
4
6
8
10
12
Q
, Total Gate Charge (nC)
G
Fig 10. Typical Gate Charge Vs.
Gate-to-Source Voltage
6
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IRF7807VD1
MOSFET , Body Diode & Schottky Diode Characteristics
100
10
100
10
1
Tj = 150°C
125°C
1
100°C
75°C
Tj = 125°C
Tj = 25°C
0.1
50°C
25°C
0.01
0.001
0.0001
0
5
10
15
20
25
30
Reverse Voltage - V (V)
R
Fig. 12 - Typical Values of
Reverse Current Vs. Reverse Voltage
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Forward Voltage Drop - V
( V )
F
Fig. 11 - Typical Forward Voltage Drop
Characteristics
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7
IRF7807VD1
SO-8 Package Details
INCH ES
M ILLIMET ERS
D IM
D
MIN
MAX
.0688
.0098
.018
MIN
1.35
0.10
0.36
0.19
4.80
3.81
M AX
1.75
0.25
0.46
0.25
4.98
3.99
5
- B -
A
.0532
.0040
.014
A1
B
8
1
7
2
6
3
5
4
5
H
E
C
D
E
.0075
.189
.0098
.196
- A -
0.25 (.010)
M
A M
.150
.157
e
e
.050 BASIC
.025 BASIC
1.27 BASIC
K x 45°
6X
e1
e1
H
K
0.635 BASIC
θ
.2284
.011
.2440
5.80
0.28
0.41
6.20
0.48
1.27
A
.019
.050
8°
- C -
0.10 (.004)
6
C
8X
L
8X
L
0.16
A1
B
8X
θ
0°
0°
8°
0.25 (.010)
M
C A S B S
RECOMMENDED FOOTPRINT
NOTES:
0.72 (.028 )
8X
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M-1982.
2. CONTROLLING DIMENSION : INCH.
3. DIMENSIONS ARE SHOW N IN MILLIMETERS (INCHES).
4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.
6.46 ( .255 )
1.78 (.070)
5
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS
MOLD PROTRUSIONS NOT TO EXCEED 0.25 (.006).
8X
DIMENSIONS IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE..
6
1.27 ( .050 )
3X
SO-8 Part Marking
8
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IRF7807VD1
SO-8 Tape and Reel
TER M IN AL N UM BER
1
12.3 ( .484
11.7 ( .461
)
)
8.1 ( .318
7.9 ( .312
)
)
FE ED D IREC TIO N
N O T E S :
1 . C O N T R O LL IN G D IM E N S IO N : M IL LIM E T E R .
2 . A L L D IM E N S IO N S A R E S H O W N IN M ILL IM E TE R S (IN C H E S ).
3 . O U T L IN E C O N FO R M S TO E IA -4 8 1
& E IA -54 1.
330.00
(12.992)
M A X.
14.40 ( .566
12.40 ( .488
)
)
N O TES
1. CO N TR O LLIN G DIM EN SIO N : M ILLIME TER .
2. O UTLIN E C O N FO R M S T O EIA -481 EIA-541.
:
&
This product has been designed and qualified for the commercial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 03/01
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9
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