IRFB3207Z [INFINEON]
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. .;型号: | IRFB3207Z |
厂家: | Infineon |
描述: | The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. . |
文件: | 总13页 (文件大小:491K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IRFB3207ZPbF
IRFS3207ZPbF
IRFSL3207ZPbF
HEXFET® Power MOSFET
Applications
ꢀ High Efficiency Synchronous Rectification in
D
S
VDSS
RDS(on) typ.
max.
ID (Silicon Limited)
ID (Package Limited)
75V
SMPS
3.3mΩ
4.1mΩ
170Aꢁ
120A
ꢀ Uninterruptible Power Supply
ꢀ High Speed Power Switching
ꢀ Hard Switched and High Frequency Circuits
G
Benefits
D
D
ꢀ Improved Gate, Avalanche and Dynamic
D
dv/dt Ruggedness
ꢀ Fully Characterized Capacitance and
Avalanche SOA
ꢀ Enhanced body diode dV/dt and dI/dt
Capability
ꢀ Lead-Free
ꢀ RoHSCompliant,Halogen-Free
S
S
S
D
D
G
G
G
D2Pak
TO-262
TO-220AB
IRFB3207ZPbF
IRFS3207ZPbF
IRFSL3207ZPbF
G
D
S
Gate
Drain
Source
Standard Pack
Base Part Number
Package Type
Orderable Part Number
Form
Quantity
IRFB3207ZPbF
IRFSL3207ZPbF
TO-220
TO-262
Tube
50
IRFB3207ZPbF
Tube
Tube
50
50
IRFSL3207ZPbF
IRFS3207ZPbF
IRFS3207ZPbF
D2Pak
Tape and Reel Left
Tape and Reel Right
800
800
IRFS3207ZTRLPbF
IRFS3207ZTRRPbF
Absolute Maximum Ratings
Symbol
Parameter
Max.
Units
170
ꢁ
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
120
ꢁ
A
120
670
300
Pulsed Drain Current
ꢂ
PD @TC = 25°C
Maximum Power Dissipation
Linear Derating Factor
W
2.0
W/°C
V
± 20
VGS
Gate-to-Source Voltage
16
Peak Diode Recovery
ꢃ
dv/dt
TJ
V/ns
°C
-55 to + 175
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
300
10lb in (1.1N m)
ꢈ
ꢈ
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
EAS (Thermally limited)
Single Pulse Avalanche Energy
ꢄ
170
See Fig. 14, 15, 22a, 22b
mJ
A
Avalanche Current
ꢂ
IAR
Repetitive Avalanche Energy
ꢅ
EAR
mJ
Thermal Resistance
Symbol
Parameter
Junction-to-Case ꢆ
Typ.
–––
Max.
0.50
–––
Units
Rθ
JC
Rθ
Case-to-Sink, Flat Greased Surface , TO-220
0.50
°C/W
CS
Rθ
Junction-to-Ambient, TO-220
Junction-to-Ambient (PCB Mount) , D2Pak
–––
–––
62
40
ꢆ
JA
Rθ
ꢇꢆ
JA
1
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
Static @ TJ = 25°C (unless otherwise specified)
Symbol
V(BR)DSS
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Min. Typ. Max. Units
75 ––– –––
––– 0.091 ––– V/°C Reference to 25°C, ID = 5mAꢂ
Conditions
VGS = 0V, ID = 250µA
V
∆V(BR)DSS/∆TJ
RDS(on)
–––
2.0
–––
3.3
4.1
4.0
V
GS = 10V, ID = 75A ꢅ
mΩ
V
VGS(th)
–––
VDS = VGS, ID = 150µA
RG(int)
IDSS
Internal Gate Resistance
Drain-to-Source Leakage Current
0.80 –––
20
Ω
––– –––
µA VDS = 75V, VGS = 0V
––– ––– 250
––– ––– 100
––– ––– -100
V
V
V
DS = 75V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
nA
GS = 20V
GS = -20V
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
gfs
Qg
Parameter
Forward Transconductance
Total Gate Charge
Min. Typ. Max. Units
Conditions
VDS = 50V, ID = 75A
280 ––– –––
S
––– 120 170
nC ID = 75A
VDS = 38V
Qgs
Gate-to-Source Charge
–––
–––
–––
–––
–––
–––
–––
27
33
87
20
68
55
68
–––
–––
–––
–––
–––
–––
–––
Qgd
Gate-to-Drain ("Miller") Charge
Total Gate Charge Sync. (Qg - Qgd)
VGS = 10V ꢅ
Qsync
ID = 75A, VDS =0V, VGS = 10V
td(on)
Turn-On Delay Time
ns VDD = 49V
ID = 75A
tr
Rise Time
td(off)
Turn-Off Delay Time
RG = 2.7Ω
VGS = 10V ꢅ
tf
Fall Time
Ciss
Input Capacitance
––– 6920 –––
––– 600 –––
––– 270 –––
––– 770 –––
––– 960 –––
pF
V
GS = 0V
Coss
Output Capacitance
VDS = 50V
Crss
Reverse Transfer Capacitance
Effective Output Capacitance (Energy Related)ꢊ
Effective Output Capacitance (Time Related)ꢉ
ƒ = 1.0MHz
Coss eff. (ER)
Coss eff. (TR)
V
GS = 0V, VDS = 0V to 60V ꢇ
GS = 0V, VDS = 0V to 60V ꢉ
V
Diode Characteristics
Symbol
Parameter
Continuous Source Current
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
S
IS
––– –––
A
170ꢁ
(Body Diode)
showing the
integral reverse
G
ISM
Pulsed Source Current
(Body Diode) ꢂꢊ
Diode Forward Voltage
Reverse Recovery Time
––– ––– 670
p-n junction diode.
TJ = 25°C, IS = 75A, VGS = 0V ꢅ
VSD
trr
––– –––
1.3
54
V
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
VR = 64V,
–––
–––
–––
–––
–––
36
41
50
67
2.4
ns
IF = 75A
62
di/dt = 100A/µs ꢅ
Qrr
Reverse Recovery Charge
75
nC
100
–––
IRRM
ton
Reverse Recovery Current
Forward Turn-On Time
A
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
ꢁCalculated continuous current based on maximum allowable junction
temperature. Bond wire current limit is 120A. Note that current
limitations arising from heating of the device leads may occur with
ꢃISD ≤ 75A, di/dt ≤ 1730A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
ꢅPulse width ≤ 400µs; duty cycle ≤ 2%.
ꢉCoss eff. (TR) is a fixed capacitance that gives the same charging time
some lead mounting arrangements.
ꢂRepetitive rating; pulse width limited by max. junction
temperature.
ꢄLimited by TJmax, starting TJ = 25°C, L = 0.033mH
RG = 25Ω, IAS = 102A, VGS =10V. Part not recommended for use
above this value.
as Coss while VDS is rising from 0 to 80% VDSS
ꢊCoss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS
ꢇWhen mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering techniques refer to application note #AN-994.
ꢆRθ is measured at TJ approximately 90°C.
.
.
2
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
1000
100
10
1000
VGS
15V
10V
8.0V
6.0V
5.5V
5.0V
4.8V
4.5V
VGS
15V
10V
8.0V
6.0V
5.5V
5.0V
4.8V
4.5V
TOP
TOP
BOTTOM
BOTTOM
4.5V
100
4.5V
60µs PULSE WIDTH
Tj = 175°C
60µs PULSE WIDTH
≤
≤
Tj = 25°C
10
0.1
1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
2.5
2.0
1.5
1.0
0.5
1000
100
10
I
= 75A
D
V
= 10V
GS
T
= 175°C
J
T
= 25°C
J
1
V
= 25V
DS
≤60µs PULSE WIDTH
0.1
2
3
4
5
6
7
-60 -40 -20 0 20 40 60 80 100120140160180
, Junction Temperature (°C)
T
J
V
, Gate-to-Source Voltage (V)
GS
Fig 4. Normalized On-Resistance vs. Temperature
Fig 3. Typical Transfer Characteristics
12.0
100000
10000
1000
V
= 0V,
= C
f = 1 MHZ
GS
I = 75A
D
C
C
C
+ C , C
SHORTED
iss
gs
gd
ds
= C
10.0
rss
oss
gd
V
V
V
= 60V
= 38V
= 15V
DS
DS
DS
= C + C
ds
gd
8.0
6.0
4.0
2.0
0.0
C
iss
C
oss
C
rss
100
0
20
40
60
80
100 120 140
1
10
, Drain-to-Source Voltage (V)
100
Q , Total Gate Charge (nC)
V
G
DS
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
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Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
1000
100
10
10000
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
T
= 175°C
1000
J
100µsec
100
T
= 25°C
J
1msec
10msec
10
DC
1
1
Tc = 25°C
Tj = 175°C
Single Pulse
V
= 0V
GS
0.1
0.1
0.0
0.5
1.0
1.5
2.0
2.5
1
10
, Drain-to-Source Voltage (V)
100
V
, Source-to-Drain Voltage (V)
V
SD
DS
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode Forward Voltage
180
100
95
90
85
80
75
70
Id = 5mA
Limited By Package
160
140
120
100
80
60
40
20
0
25
50
75
100
125
150
175
-60 -40 -20
0
20 40 60 80 100120140160180
, Temperature ( °C )
T
, Case Temperature (°C)
T
C
J
Fig 10. Drain-to-Source Breakdown Voltage
Fig 9. Maximum Drain Current vs. Case Temperature
2.5
700
I
D
600
500
400
300
200
100
0
TOP
17A
30A
2.0
1.5
1.0
0.5
0.0
BOTTOM 102A
-10
0
10 20 30 40 50 60 70 80
Drain-to-Source Voltage (V)
25
50
75
100
125
150
175
Starting T , Junction Temperature (°C)
J
V
DS,
Fig 12. Maximum Avalanche Energy vs. DrainCurrent
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Fig 11. Typical COSS Stored Energy
4
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
1
D = 0.50
0.1
0.20
0.10
0.05
R1
R1
R2
R2
R3
R3
Ri (°C/W) τi (sec)
0.1049 0.000099
τ
JτJ
τ
τ
Cτ
τ
1τ1
τ
2 τ2
0.02
0.01
3τ3
0.2469 0.001345
0.1484 0.008469
0.01
Ci= τi/Ri
Notes:
SINGLE PULSE
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t
, Rectangular Pulse Duration (sec)
1
Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case
1000
100
10
Duty Cycle =
Single Pulse
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming Tj = 150°C and
∆
0.01
Tstart =25°C (Single Pulse)
0.05
0.10
1
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming
Tstart = 150°C.
j = 25°C and
∆Τ
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14. Typical Avalanche Current vs.Pulsewidth
200
180
160
140
120
100
80
Notes on Repetitive Avalanche Curves , Figures 14, 15:
(For further info, see AN-1005 at www.irf.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 16a, 16b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
TOP
BOTTOM 1.0% Duty Cycle
= 102A
Single Pulse
I
D
6. Iav = Allowable avalanche current.
7. ∆T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 14, 15).
60
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
40
20
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
0
PD (ave) = 1/2 ( 1.3·BV·Iav) = ∆T/ ZthJC
25
50
75
100
125
150
175
Iav = 2∆T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
Starting T , Junction Temperature (°C)
J
Fig 15. Maximum Avalanche Energy vs. Temperature
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
20
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
I = 30A
F
V
= 64V
R
T = 25°C
J
15
10
5
T = 125°C
J
I
I
I
I
= 150µA
= 250µA
= 1.0mA
= 1.0A
D
D
D
D
0
0
200
400
600
800
1000
-75 -50 -25
0
25 50 75 100 125 150 175 200
, Temperature ( °C )
di /dt (A/µs)
T
F
J
Fig. 17 - Typical Recovery Current vs. dif/dt
Fig 16. Threshold Voltage vs. Temperature
340
260
180
100
20
20
I = 45A
I
= 30A
V = 64V
R
F
F
V
= 64V
R
T = 25°C
T = 25°C
J
J
15
10
5
T = 125°C
J
T = 125°C
J
0
0
200
400
600
800
1000
0
200
400
600
800
1000
di /dt (A/µs)
di /dt (A/µs)
F
F
Fig. 18 - Typical Recovery Current vs. dif/dt
Fig. 19 - Typical Stored Charge vs. dif/dt
340
I
= 45A
F
V
= 64V
R
T = 25°C
J
260
180
100
20
T = 125°C
J
0
200
400
600
800
1000
di /dt (A/µs)
F
Fig. 20 - Typical Stored Charge vs. dif/dt
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August 18, 2015
IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
Driver Gate Drive
P.W.
Period
D =
D.U.T
Period
P.W.
+
*
=10V
V
GS
ꢄ
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
-
D.U.T. I Waveform
SD
+
ꢂ
-
Reverse
Recovery
Current
Body Diode Forward
- ꢃ
Current
di/dt
+
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
ꢁ
V
DD
VDD
Re-Applied
Voltage
• dv/dt controlled by RG
RG
+
-
Body Diode
Forward Drop
• Driver same type as D.U.T.
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
Inductor Current
I
SD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 20. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs
V
(BR)DSS
15V
t
p
DRIVER
+
L
V
DS
D.U.T
AS
R
G
V
DD
-
I
A
V
2
GS
0.01Ω
t
p
I
AS
Fig 21b. Unclamped Inductive Waveforms
Fig 21a. Unclamped Inductive Test Circuit
LD
VDS
VDS
90%
+
-
VDD
10%
VGS
D.U.T
VGS
Pulse Width < 1µs
Duty Factor < 0.1%
td(on)
td(off)
tr
tf
Fig 22a. Switching Time Test Circuit
Fig 22b. Switching Time Waveforms
Id
Vds
Vgs
L
VCC
DUT
Vgs(th)
0
1K
Qgs1
Qgs2
Qgd
Qgodr
Fig 23a. Gate Charge Test Circuit
Fig 23b. Gate Charge Waveform
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
TO-220AB Package Outline (Dimensions are shown in millimeters (inches))
TO-220AB Part Marking Information
INTERNATIONAL
RECTIFIER LOGO
INTERNATIONAL
RECTIFIER LOGO
PART NUMBER
PART NUMBER
DATE CODE
P = LEAD-FREE
Y = LAST DIGIT OF YEAR
WW = WORK WEEK
? = ASSEMBLY SITE CODE
FB3207Z
FB3207Z
DATE CODE
OR
ASSEMBLY
LOT CODE
ASSEMBLY
LOT CODE
Y = LAST DIGIT OF YEAR
WW = WORK WEEK
P = LEAD-FREE
PYWW?
YWWP
LC
LC
LC
LC
TO-220AB packages are not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/
8
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
D2Pak (TO-263AB) Package Outline
Dimensions are shown in millimeters (inches)
D2Pak (TO-263AB) Part Marking Information
INTERNATIONAL
RECTIFIER LOGO
INTERNATIONAL
RECTIFIER LOGO
PART NUMBER
PART NUMBER
IRFS3207Z
IRFS3207Z
OR
PYWW?
YWWP
ASSEMBLY
ASSEMBLY
LOT CODE
DATE CODE
DATE CODE
LOT CODE
LC
LC
LC
LC
Y = LAST DIGIT OF YEAR
WW = WORK WEEK
P = LEAD-FREE
P = LEAD-FREE
Y = LAST DIGIT OF YEAR
WW = WORK WEEK
? = ASSEMBLY SITE CODE
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/
9
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
TO-262 Part Marking Information
PART NUMBER
PART NUMBER
INTERNATIONAL
RECTIFIER LOGO
INTERNATIONAL
RECTIFIER LOGO
FSL3207Z
FSL3207Z
OR
PYWW?
YWWP
ASSEMBLY
LOT CODE
ASSEMBLY
LOT CODE
DATE CODE
DATE CODE
P = LEAD-FREE
Y = LAST DIGIT OF YEAR
WW = WORK WEEK
Y = LAST DIGIT OF YEAR
WW = WORK WEEK
P = LEAD-FREE
LC LC
LC LC
? = ASSEMBLY SITE CODE
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/
10
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
D2Pak (TO-263AB) Tape & Reel Information
Dimensions are shown in millimeters (inches)
TRR
1.60 (.063)
1.50 (.059)
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
0.368 (.0145)
0.342 (.0135)
FEED DIRECTION
1.85 (.073)
11.60 (.457)
11.40 (.449)
1.65 (.065)
24.30 (.957)
23.90 (.941)
15.42 (.609)
15.22 (.601)
TRL
1.75 (.069)
1.25 (.049)
10.90 (.429)
10.70 (.421)
4.72 (.136)
4.52 (.178)
16.10 (.634)
15.90 (.626)
FEED DIRECTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
60.00 (2.362)
MIN.
30.40 (1.197)
MAX.
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
26.40 (1.039)
24.40 (.961)
4
3
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/
11
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IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF
Qualification information†
Industrial
Qualification level
(per JEDEC JESD47F†† guidelines)
TO-220
N/A
Moisture Sensitivity Level
RoHS compliant
D2Pak
TO-262
MSL1
Yes
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
†† Applicable version of JEDEC standard at the time of product release.
Revision History
Date
Comment
· Updated data sheet with new IR corporate template.
• Updated package outline & part marking on page 8, 9 & 10.
· Updated typo on the fig.19 and fig.20, unit of y-axis from "A" to "nC" on page 6.
4/24/2014
8/18/2015
• Added bullet point in the Benefits "RoHS Compliant, Halogen -Free" on page 1.
• Ordering Table - Base Part Number - IRFS3207ZPbF - Corrected Orderable Part Numbers
for Tape & Reel Left and Right to IRFS3207ZTRLPbF and IRFS3207ZTRRPbF resp - page 1
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
12
www.irf.com © 2015 International Rectifier
Submit Datasheet Feedback
August 18, 2015
IMPORTANT NOTICE
The information given in this document shall in no For further information on the product, technology,
event be regarded as a guarantee of conditions or delivery terms and conditions and prices please
characteristics (“Beschaffenheitsgarantie”) .
contact your nearest Infineon Technologies office
(www.infineon.com).
With respect to any examples, hints or any typical
values stated herein and/or any information
regarding the application of the product, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation warranties of non-infringement
of intellectual property rights of any third party.
WARNINGS
Due to technical requirements products may
contain dangerous substances. For information on
the types in question please contact your nearest
Infineon Technologies office.
In addition, any information given in this document
is subject to customer’s compliance with its
obligations stated in this document and any
applicable legal requirements, norms and
standards concerning customer’s products and any
use of the product of Infineon Technologies in
customer’s applications.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized
representatives
of
Infineon
Technologies, Infineon Technologies’ products may
not be used in any applications where a failure of
the product or any consequences of the use thereof
can reasonably be expected to result in personal
injury.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments
to evaluate the suitability of the product for the
intended application and the completeness of the
product information given in this document with
respect to such application.
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