IRFHM8326PBF [INFINEON]
Compatible with Existing Surface Mount Techniques;型号: | IRFHM8326PBF |
厂家: | Infineon |
描述: | Compatible with Existing Surface Mount Techniques |
文件: | 总9页 (文件大小:663K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IRFHM8326PbF
HEXFET® Power MOSFET
VDSS
30
V
V
VGS max
±20
RDS(on) max
(@ VGS = 10V)
4.7
G
m
S
S
S
(@ VGS = 4.5V)
6.7
D
Qg (typical)
20
nC
A
D
D
D
D
ID
70
(@TC (Bottom) = 25°C)
Applications
Charge and Discharge Switch for Notebook PC Battery Application
System/Load Switch
Synchronous MOSFET for Buck Converters
Features
Benefits
Low Thermal Resistance to PCB (<3.4°C/W)
Low Profile (<1.05 mm)
Enable better thermal dissipation
Increased Power Density
Multi-Vendor Compatibility
Easier Manufacturing
Industry-Standard Pinout
results in
Compatible with Existing Surface Mount Techniques
RoHS Compliant Containing no Lead, no Bromide and no Halogen
MSL1, Consumer Qualification
Environmentally Friendlier
Increased Reliability
Base part number
Package Type
Standard Pack
Orderable Part Number
Form
Tape and Reel
Quantity
4000
IRFHM8326PbF
PQFN 3.3 mm x 3.3 mm
IRFHM8326TRPbF
Absolute Maximum Ratings
Parameter
Gate-to-Source Voltage
Max.
± 20
19
Units
VGS
V
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC(Bottom) = 25°C
ID @ TC(Bottom) = 100°C
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
15
70
44
25
A
Continuous Drain Current, VGS @ 10V (Source Bonding
Technology Limited)
IDM
Pulsed Drain Current
Power Dissipation
278
2.8
PD @TA = 25°C
PD @TC(Bottom) = 25°C
W
Power Dissipation
37
Linear Derating Factor
Operating Junction and
Storage Temperature Range
0.023
W/°C
TJ
-55 to + 150
°C
TSTG
Notes through are on page 9
1
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June 30, 2014
IRFHM8326PbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min.
30
–––
–––
–––
1.2
Typ.
–––
22
3.8
5.2
1.7
-10
–––
Max. Units
–––
––– mV/°C Reference to 25°C, ID = 1mA
Conditions
VGS = 0V, ID = 250µA
BVDSS
BVDSS/TJ
RDS(on)
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
V
4.7
6.7
2.2
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 20A
VDS = VGS, ID = 50µA
m
VGS(th)
VGS(th)
IDSS
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
V
–––
–––
––– mV/°C
1.0
150
100
-100
–––
–––
30
µA VDS = 24V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 125°C
nA VGS = 20V
–––
–––
–––
70
–––
–––
–––
–––
39
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
V
GS = -20V
VDS = 10V, ID = 20A
nC VGS = 10V, VDS = 15V, ID = 20A
gfs
Qg
S
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Qg
Total Gate Charge
20
V
V
DS = 15V
GS = 4.5V
Qgs1
Qgs2
Qgd
Qgodr
Qsw
Qoss
RG
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Qgs2 + Qgd)
Output Charge
4.8
2.6
6.5
6.1
9.1
11
1.9
12
35
18
12
2496
524
273
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
nC
ID = 20A
nC VDS = 16V, VGS = 0V
VDD = 15V, VGS = 4.5V
ns ID = 20A
RG=1.8
Gate Resistance
td(on)
tr
td(off)
tf
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VGS = 0V
pF
VDS = 10V
ƒ = 1.0MHz
Avalanche Characteristics
Parameter
Single Pulse Avalanche Energy
Avalanche Current
Typ.
–––
–––
Max.
58
20
EAS
IAR
Diode Characteristics
Parameter
Min.
–––
Typ.
–––
Max. Units
25
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
D
IS
Continuous Source Current
(Body Diode)
G
A
ISM
Pulsed Source Current
(Body Diode)
–––
–––
278
S
VSD
trr
Qrr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
–––
–––
–––
–––
15
14
1.0
23
21
V
TJ = 25°C, IS = 20A, VGS = 0V
ns TJ = 25°C, IF = 20A, VDD = 15V
nC
di/dt = 300A/µs
Thermal Resistance
Parameter
Typ.
Max.
3.4
Units
Junction-to-Case
–––
–––
–––
–––
RJC (Bottom)
RJC (Top)
°C/W
Junction-to-Case
41
Junction-to-Ambient
Junction-to-Ambient
44
31
RJA
RJA (<10s)
2
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June 30, 2014
IRFHM8326PbF
1000
100
10
1000
100
10
VGS
10V
VGS
10V
TOP
TOP
7.0V
4.5V
4.0V
3.5V
3.0V
2.75V
2.5V
7.0V
4.5V
4.0V
3.5V
3.0V
2.75V
2.5V
BOTTOM
BOTTOM
2.5V
2.5V
1
60µs PULSE WIDTH
Tj = 25°C
60µs PULSE WIDTH
Tj = 150°C
0.1
1
0.1
1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
1000
1.8
1.6
1.4
1.2
1.0
0.8
0.6
I
= 20A
D
V
= 10V
GS
100
T = 150°C
J
10
T = 25°C
J
1
V
= 10V
DS
60µs PULSE WIDTH
0.1
1.0
2.0
3.0
4.0
5.0
6.0
-60 -40 -20
0
20 40 60 80 100 120 140 160
V
, Gate-to-Source Voltage (V)
T , Junction Temperature (°C)
GS
J
Fig 4. Normalized On-Resistance vs. Temperature
Fig 3. Typical Transfer Characteristics
14.0
100000
10000
1000
V
= 0V,
f = 1 MHZ
GS
I = 20A
D
C
C
C
= C + C , C
SHORTED
iss
gs
gd
ds
12.0
= C
V
V
V
= 24V
DS
= 15V
DS
= 6.0V
DS
rss
oss
gd
= C + C
ds
gd
10.0
8.0
6.0
4.0
2.0
0.0
C
iss
C
oss
C
rss
100
0
5
10 15 20 25 30 35 40 45 50
1
10
100
Q , Total Gate Charge (nC)
G
V
, Drain-to-Source Voltage (V)
DS
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
Submit Datasheet Feedback June 30, 2014
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
3
www.irf.com © 2014 International Rectifier
IRFHM8326PbF
1000
100
10
1000
100
10
OPERATION IN THIS AREA
LIMITED BY R
(on)
DS
100µsec
1msec
T = 150°C
J
Limited by Source
Bonding Tecnology
T = 25°C
J
1
1
10msec
DC
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0V
GS
0.1
0.1
0.0
0.4
0.8
1.2
1.6
2.0
0.1
1
10
100
V
, Source-to-Drain Voltage (V)
SD
V
, Drain-to-Source Voltage (V)
DS
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode Forward Voltage
2.6
80
Limited by package
2.2
1.8
60
40
20
0
I
= 50µA
= 250µA
= 1.0mA
= 1.0A
D
I
1.4
1.0
0.6
D
I
D
I
D
-75 -50 -25
0
25 50 75 100 125 150
25
50
75
100
125
150
T , Temperature ( °C )
T
, Case Temperature (°C)
J
C
Fig 10. Drain-to–Source Breakdown Voltage
Fig 9. Maximum Drain Current vs. Case Temperature
10
D = 0.50
1
0.20
0.10
0.05
0.1
0.02
0.01
0.01
SINGLE PULSE
Notes:
( THERMAL RESPONSE )
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
t
, Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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4
June 30, 2014
IRFHM8326PbF
9.0
8.0
7.0
6.0
5.0
4.0
3.0
250
200
150
100
50
I
= 20A
I
D
D
TOP
4.7A
9.8A
BOTTOM 20A
T = 125°C
J
T = 25°C
J
0
2
4
6
8
10 12 14 16 18 20
25
50
75
100
125
150
Starting T , Junction Temperature (°C)
J
V
Gate -to -Source Voltage (V)
GS,
Fig 13. Maximum Avalanche Energy vs. Drain Current
Fig 12. On– Resistance vs. Gate Voltage
100
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming Tj = 125°C and
Tstart =25°C (Single Pulse)
10
1
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming
Tstart = 125°C.
j = 25°C and
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14. Typical Avalanche Current vs. Pulsewidth
5
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IRFHM8326PbF
Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
V
(BR)DSS
t
p
15V
DRIVER
+
L
V
DS
D.U.T
AS
R
G
V
DD
-
I
A
20V
I
0.01
t
p
AS
Fig 16a. Unclamped Inductive Test Circuit
Fig 16b. Unclamped Inductive Waveforms
Fig 17a. Switching Time Test Circuit
Fig 17b. Switching Time Waveforms
Id
Vds
Vgs
Vgs(th)
Qgs1
Qgs2
Qgd
Qgodr
Fig 18a. Gate Charge Test Circuit
Fig 18b. Gate Charge Waveform
Submit Datasheet Feedback June 30, 2014
6
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IRFHM8326PbF
PQFN 3.3mm x 3.3mm Outline Package Details
For more information on board mounting, including footprint and stencil recommendation, please refer to application note
AN-1136: http://www.irf.com/technical-info/appnotes/an-1136.pdf
For more information on package inspection techniques, please refer to application note AN-1154:
http://www.irf.com/technical-info/appnotes/an-1154.pdf
PQFN 3.3mm x 3.3mm Outline Part Marking
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
7
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IRFHM8326PbF
PQFN 3.3mm x 3.3mm Outline Tape and Reel
REEL DIMENSIONS
TAPE DIMENSIONS
DIMENSION (MM)
DIMENSION (INCH)
CODE
Ao
MIN
3.50
3.50
1.10
7.90
11.80
12.30
MAX
3.70
MIN
.138
.138
.043
.311
.465
.484
MAX
.146
.146
.051
.319
.480
.492
3.70
Bo
1.30
Ko
8.10
P
1
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
12.20
12.50
W
W
1
Qty
4000
13 Inches
Reel Diameter
CODE
DESCRIPTION
Ao
Bo
Ko
W
Dimension design to accommodate the component width
Dimension design to accommodate the component lenght
Dimension design to accommodate the component thickness
Overall width of the carrier tape
P
1
Pitch between successive cavity centers
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
8
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June 30, 2014
IRFHM8326PbF
Qualification Information†
Qualification Level
Consumer††
(per JEDEC JESD47F††† guidelines)
MSL1
PQFN 3.3mm x 3.3mm
Moisture Sensitivity Level
RoHS Compliant
(per JEDEC J-STD-020D†††
)
Yes
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability
†† Higher qualification ratings may be available should the user have such requirements. Please contact your
International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/
††† Applicable version of JEDEC standard at the time of product release.
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.29mH, RG = 50, IAS = 20A.
Pulse width 400µs; duty cycle 2%.
R is measured at TJ of approximately 90°C.
When mounted on 1 inch square 2 oz copper pad on 1.5x1.5 in. board of FR-4 material.
Calculated continuous current based on maximum allowable junction temperature.
Current is limited to 25A by source bonding technology.
Revision History
Date
Comments
Updated schematic on page 1
Updated package outline and part marking on page 7
Updated tape and reel on page 8
6/6/14
6/30/14
Remove “SAWN” package outline on page 7.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
9
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June 30, 2014
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