IRISG5624A [INFINEON]

INTEGRATED SWITCHER; 集成开关调节器
IRISG5624A
型号: IRISG5624A
厂家: Infineon    Infineon
描述:

INTEGRATED SWITCHER
集成开关调节器

调节器 开关
文件: 总7页 (文件大小:273K)
中文:  中文翻译
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IRIS-G5624A  
INTEGRATED SWITCHER  
Features  
Oscillator is provided on the monolithic control with adopting On-Chip-  
Trimming technology.  
Small temperature characteristics variation by adopting a comparator to  
compensate for temperature on the control part.  
Package Outline  
Low start-up circuit current (100uA max)  
Built-in Active Low-Pass Filter for stabilizing the operation in case of light  
load  
Avalanche energy guaranteed MOSFET with high VDSS  
The built-in power MOSFET simplifies the surge absorption circuit since the  
MOSFET guarantees the avalanche energy.  
No VDSS de-rating is required.  
Built-in constant voltage drive circuit  
Built-in step drive circuit  
Built-in low frequency PRC mode (20kHz)  
Various kinds of protection functions  
TO-220 Fullpack (5 Lead)  
Key Specifications  
Pulse-by-pulse Overcurrent Protection (OCP)  
MOSFET  
VDSS(V)  
RDS(ON)  
MAX  
Pout(W)  
Note 1  
Type  
AC input(V)  
Overvoltage Protection with latch mode (OVP)  
Thermal Shutdown with latch mode (TSD)  
Descriptions  
100±15%  
90  
120 15%  
±
120  
1.0Ω  
IRIS-G5624A  
450  
IRIS-G5624A is a hybrid IC consists from power MOSFET and a controller IC, designed for Indirect feed-back Quasi-  
Resonant (including low frequency PRC) fly-back converter type SMPS (Switching Mode Power Supply) applications.  
This IC realizes high efficiency, low noise, downsizing and standardizing of a power supply system reducing external  
components count and simplifying the circuit designs.  
(Note). PRC is abbreviation of Pulse Ratio Control(On-width control with fixed OFF-time).  
Typical Connection Diagram  
IRIS-G5600  
OCP/FB  
Vin  
GND  
S
D
www.irf.com  
IRIS-G5624A  
Absolute Maximum Ratings  
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are  
absolute voltages referenced to terminals stated, all currents are defined positive into any lead. The thermal resistance and power  
dissipation ratings are measured under board mounted and still air conditions.  
Symbol  
Definition  
Drain Current *1  
Terminals Max. Ratings Units  
Note  
Dpeak  
I
1-2  
14.4  
A
Single Pulse  
2-3  
V =0.78V  
DMAX  
I
Maximum switching current *5  
1-2  
14.4  
A
Ta=-20~+125  
Single Pulse  
DD=99V, L=20mH  
V
I
AS  
E
L peak  
Single pulse avalanche energy *2  
Input voltage for control part  
O.C.P/F.B Pin voltage  
1-2  
4-3  
5-3  
248  
35  
6
mJ  
V
=4.4A  
Vin  
Vth  
V
26  
1.5  
W
W
With infintite heatsink  
Without heatsink  
Specified by  
×
Vin Iin  
Refer to recommended  
operating temperature  
D1  
P
Power dissipation for MOSFET *3  
Power dissipation for control part  
(Control IC) *4  
Internal frame temperature  
in operation  
Operating ambient temperature  
Storage temperature  
Channel temperature  
1-2  
4-3  
D2  
P
0.8  
W
F
T
-
-
-
-
-20 ~ +125  
-20 ~ +125  
-40 ~ +125  
150  
Top  
Tstg  
Tch  
*1 Refer to MOS FET A.S.O curve  
*2 MOS FET Tch-EAS curve  
Fig.1  
V2-3  
*3 Refer to MOS FET Ta-PD1 curve  
*4 Refer to TF-PD2 curve for Control IC (See page 5)  
*5 Maximum switching current.  
The maximum switching current is the Drain current determined by the drive voltage of the IC and  
threshold voltage (Vth) of MOS FET. Therefore, in the event that voltage drop occurs between Pin 2 and  
Pin 3 due to patterning, the maximum switching current decreases as shown by V2-3 in Fig.1  
Accordingly please use this device within the decrease value, referring to the derating  
curve of the maximum switching current.  
www.irf.com  
IRIS-G5624A  
Electrical Characteristics (for Control IC)  
Electrical characteristics for control part (Ta=25, Vin=18V,unless otherwise specified)  
Ratings  
Test  
Symbol  
Definition  
MIN  
TYP  
MAX  
17.6  
11  
Units  
V
Conditions  
Vin=0 17.6V  
in(ON)  
V
Operation start voltage  
14.4  
16  
10  
-
-
-
Vin=17.6 9V  
in(OFF)  
V
Operation stop voltage  
9
-
-
V
in(ON)  
I
Circuit current in operation  
Circuit current in non-operation  
Maximum OFF time  
20  
mA  
µA  
µsec  
-
Vin=14V  
in(OFF)  
I
100  
55  
OFF(MAX)  
T
45  
-
Minimum time for input of quasi  
Tth(2) resonant signals  
*6  
*7  
-
-
-
-
1
2
µsec  
µsec  
V
-
-
-
OFF(MIN)  
T
Minimum OFF time  
Vth(1) O.C.P/F.B Pin threshold voltage 1  
Vth(2) O.C.P/F.B Pin threshold voltage 2  
OCP/FB  
0.68  
1.3  
1.2  
34  
-
6.6  
140  
31.7  
-
0.73  
1.45  
1.35  
36.5  
-
-
-
32  
2.5  
0.78  
1.6  
1.5  
39  
400  
8.4  
-
V
I
O.C.P/F.B Pin extraction current  
O.V.P operation voltage  
mA  
V
-
Vin=0  
V
8.5V  
6.6V  
39.0  
in(OVP)  
in(H)  
I
V
Vin=39.0  
Vin=39.0  
Latch circuit sustaining current *8  
Latch circuit release voltage *8  
Thermal shutdown operating temperature  
Detected Voltage  
µA  
V
in(La.OFF)  
V
(TSD)  
V
Tj  
-
Vin=31.7  
32.3V  
in(SENSE)  
V
32.3  
-
Vin=31.7  
32.3V  
mV/  
-
Temperature coefficient of detected voltage  
*6 Recommended operating conditions  
Time for iunput of quasi resonant signals  
Tth(2)1.0μsec  
O.C.P/F.B  
For the quasi resonant signal inputted to OCP/FB Pin  
at the time of quasi resonant operation, the signal shall  
be wider thant Tth(2).  
Vth(2)  
0V  
*7 The minimum OFF time means TOFF width at the time when the minimum quasi resonant signal is inputted.  
*8 The latch circuit means a circuit operated O.V.P and T.S.D.  
Electrical Characteristics (for MOSFET)  
(Ta=25) unless otherwise specified  
Ratings  
Symbol  
Definition  
Drain-to-Source breakdown voltage  
Drain leakage current  
MIN  
450  
-
TYP  
MAX  
-
Units  
V
Test Conditions  
ID=300µA  
- 2  
V3 =0V(short)  
DSS  
V
-
-
DS  
V
=450V  
V3-2=0V(s hort)  
V3-2=10V  
DSS  
I
300  
µA  
D
Ω
I =1.8A  
DS(ON)  
R
On-resistance  
Switching time  
-
-
-
-
1
tf  
250  
nsec  
-
Between channel and  
internal frame  
θ
ch-F  
Thermal resistance  
-
-
2
/W  
www.irf.com  
IRIS-G5624A  
IRIS-G5624A  
MOSFETA.S.O. Curve  
IRIS-G5624A  
A.S.O. temperature derating coefficient curve  
100  
10  
100  
80  
60  
40  
20  
0
Drain current  
0.1ms  
limit by ON  
resistance  
1ms  
1
ASO temperature derating  
shall be made by obtaining  
ASO Coefficient from the left  
curve in your use.  
0.1  
0.01  
0
20  
40  
60  
80  
100  
120  
1
10  
100  
1000  
Internal frame temperature TF []  
Drain-to-SourceVoltage VDS[V ]  
IRIS-G5624A  
Maximum Switching current derating curve  
IRIS-G5624A  
Avalanche energy derating curve  
Ta= 20 +125  
‐ ~  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
16.0  
100  
80  
60  
40  
20  
0
14.0  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
0.70  
0.80  
0.90  
1.00  
1.10  
1.20  
25  
50  
75  
100  
125  
150  
V2-3 [V]  
Channel temperature Tch []  
www.irf.com  
IRIS-G5624A  
IRIS-G5624A  
MOSFET Ta-PD1 Curve  
IRIS-G5624A  
MIC TF-PD2 Curve  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
30  
25  
20  
15  
10  
5
PD1=26[W]  
PD2=0.8[W]  
With infinite  
heatsink  
Without  
heatsink  
PD1=1.5[W]  
0
0
20  
40  
60  
80 100 120 140 160  
0
20  
40  
60  
80 100 120 140 160  
Internal frame temperature TF[]  
Ambient temperature Ta[]  
IRIS-G5624A  
Transient thermal resistance curve  
10  
1
0.1  
0.01  
0.001  
1µ  
10µ  
100µ  
1m  
10m  
100m  
timet [sec]  
www.irf.com  
IRIS-G5624A  
Block Diagram  
4 Vin  
3
D
LATCH  
START  
REG.  
O.V.P.  
DRIVE  
2
S
T.S.D  
Vth(1)  
1
OCP/FB  
-
+
O.S.C  
Vth(2)  
-
+
5
GND  
Lead Assignments  
Pin No.  
Symbol  
D
Description  
Drain Pin  
Function  
MOSFET drain  
MOSFET source  
Ground  
1
2
3
4
S
Source Pin  
Ground Pin  
GND  
Vin  
Power supply Pin  
Input of power supply for control circuit  
Input of overcurrent detection  
5
OCP/FB Overcurrent / Feedback Pin  
signal / constant voltage control signal  
Other Functions  
O.V.P. – Overvoltage Protection Circuit  
T.S.D. – Thermal Shutdown Circuit  
SD – Step drive circuit  
D
S
GND  
Vin  
OCP/FB  
www.irf.com  
            
             
              
               
IRIS-G5624A  
Case Outline  
44..22±00..22  
44..22 00..22  
φ
33..22±00..22  
33..22 00..22  
22..88±00..22  
22..88 00..22  
IRIS  
22..66±00..11  
22..66 00..11  
22--((RR11))  
22--((RR11))  
00..9944±00..1155  
00..9944 00..1155  
RR--eenndd  
RR--eenndd  
++00..22  
++00..22  
--00..11  
--00..11  
00..8855  
00..8855  
++00..22  
++00..22  
--00..11  
--00..11  
00..4455  
00..4455  
55..0088±00..66  
55..0088 00..66  
44xxpp11..77±00..11==((66..88))  
44xxpp11..77 00..11==((66..88))  
aType Number G5624A  
bLot Number  
1100±00..22  
1100 00..22  
1st letterThe last digit of year  
2nd letterMonth  
00..77  
00..77  
00..77  
00..77  
1 to 9 for Jan. to Sept.,  
O for Oct. N for Nov. D for Dec.  
3rd & 4th letterDay  
Arabic Numerals  
11 22 33 44 55  
11 22 33 44 55  
Weight : Approx. 2.3g  
Dimensions in mm  
Material of Pin : Cu  
Treatment of Pin : Ni plating + solder dip  
DWG.No.TG3A-1128  
Data and specifications subject to change without notice.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC FAX: (310) 252-7903  
Visit us at www.irf.com for sales contact information.  
www.irf.com  

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