IRLML0100PBF-1_15 [INFINEON]

Compatible with Existing Surface Mount Techniques;
IRLML0100PBF-1_15
型号: IRLML0100PBF-1_15
厂家: Infineon    Infineon
描述:

Compatible with Existing Surface Mount Techniques

文件: 总9页 (文件大小:209K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IRLML0100PbF-1  
HEXFET® Power MOSFET  
VDS  
100  
220  
2.5  
1.6  
V
RDS(on) max  
(@VGS = 10V)  
Qg (typical)  
G
S
1
2
m
Ω
nC  
A
3
D
ID  
(@TA = 25°C)  
TM  
Micro3 (SOT-23)  
Features  
Benefits  
Industry-standard pinout SOT-23 Package  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant, Halogen-Free  
Multi-Vendor Compatibility  
Easier Manufacturing  
Environmentally Friendlier  
Increased Reliability  
MSL1, Industrial qualification  
Standard Pack  
Base Part Number  
Package Type  
Micro3 (SOT-23)  
Orderable Part Number  
Form  
Quantity  
IRLML0100TRPbF-1  
Tape and Reel  
3000  
IRLML0100TRPbF-1  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
100  
Units  
V
Drain-Source Voltage  
VDS  
1.6  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
1.3  
7.0  
A
1.3  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
PD @TA = 25°C  
PD @TA = 70°C  
W
0.8  
0.01  
± 16  
W/°C  
V
Gate-to-Source Voltage  
VGS  
-55 to + 150  
Junction and Storage Temperature Range  
°C  
TJ, TSTG  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
Max.  
Units  
Junction-to-Ambient  
RθJA  
RθJA  
–––  
–––  
100  
99  
°C/W  
Junction-to-Ambient (t<10s)  
1
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October 27, 2014  
IRLML0100PbF-1  
Electric Characteristics @ TJ = 25°C (unless otherwise specified)  
Symbol  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
100  
–––  
–––  
–––  
1.0  
–––  
0.10  
190  
178  
–––  
–––  
–––  
–––  
–––  
1.3  
–––  
2.5  
0.5  
1.2  
2.2  
2.1  
9.0  
3.6  
290  
27  
–––  
–––  
235  
220  
2.5  
V
VGS = 0V, ID = 250μA  
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient  
V/°C Reference to 25°C, ID = 1mA  
VGS = 4.5V, ID = 1.3A  
RDS(on)  
Static Drain-to-Source On-Resistance  
Ω
m
VGS = 10V, ID = 1.6A  
VDS = VGS, ID = 25μA  
VGS(th)  
IDSS  
Gate Threshold Voltage  
V
–––  
–––  
–––  
–––  
–––  
5.7  
20  
VDS =100V, VGS = 0V  
VDS = 100V, VGS = 0V, TJ = 125°C  
VGS = 16V  
Drain-to-Source Leakage Current  
μA  
250  
100  
-100  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Internal Gate Resistance  
Forward Transconductance  
Total Gate Charge  
nA  
VGS = -16V  
RG  
Ω
gfs  
Qg  
S
VDS = 50V, ID = 1.6A  
ID = 1.6A  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
nC  
ns  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
VDS =50V  
VGS = 4.5V  
VDD =50V  
Rise Time  
ID = 1.0A  
td(off)  
tf  
Turn-Off Delay Time  
RG = 6.8Ω  
VGS = 4.5V  
VGS = 0V  
Fall Time  
Ciss  
Coss  
Crss  
Input Capacitance  
pF  
Output Capacitance  
VDS = 25V  
ƒ = 1.0MHz  
Reverse Transfer Capacitance  
13  
Source - Drain Ratings and Characteristics  
Symbol  
Parameter  
Min. Typ. Max. Units  
Conditions  
IS  
Continuous Source Current  
MOSFET symbol  
–––  
–––  
–––  
1.1  
(Body Diode)  
showing the  
A
ISM  
Pulsed Source Current  
(Body Diode)  
integral reverse  
–––  
7.0  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
–––  
–––  
–––  
–––  
20  
1.3  
30  
20  
V
TJ = 25°C, IS = 1.1A, VGS = 0V  
ns TJ = 25°C, VR = 50V, IF=1.1A  
Qrr  
13  
nC di/dt = 100A/μs  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature.  
‚ Pulse width 400μs; duty cycle 2%.  
ƒ Surface mounted on 1 in square Cu board  
„ Refer to application note #AN-994.  
2
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October 27, 2014  
IRLML0100PbF-1  
100  
10  
100  
10  
1
VGS  
VGS  
60μs PULSE WIDTH  
Tj = 25°C  
60μs PULSE WIDTH  
Tj = 150°C  
TOP  
10.0V  
4.50V  
3.50V  
3.30V  
3.25V  
2.50V  
2.35V  
2.25V  
TOP  
10.0V  
4.50V  
3.50V  
3.30V  
3.25V  
2.50V  
2.35V  
2.25V  
BOTTOM  
BOTTOM  
1
0.1  
0.01  
2.25V  
2.25V  
1
0.1  
0.1  
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 2. Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
10  
2.5  
2.0  
1.5  
1.0  
0.5  
I
= 1.6A  
D
V
= 10V  
GS  
T
= 150°C  
J
1
0.1  
T
= 25°C  
J
V
= 50V  
DS  
60μs PULSE WIDTH  
0.01  
1.5  
2.0  
2.5  
3.0  
3.5  
-60 -40 -20  
T
0
20 40 60 80 100120 140 160  
, Junction Temperature (°C)  
V
, Gate-to-Source Voltage (V)  
J
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
3
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October 27, 2014  
IRLML0100PbF-1  
10000  
1000  
100  
10  
16  
12  
8
V
C
= 0V,  
f = 1 MHZ  
GS  
I = 1.6A  
= C + C , C SHORTED  
D
iss  
gs  
gd ds  
V
V
V
= 80V  
= 50V  
= 20V  
DS  
DS  
DS  
C
= C  
rss  
gd  
C
= C + C  
oss  
ds  
gd  
C
iss  
C
oss  
C
rss  
4
0
1
0
1
2
3
4
5
6
7
1
10  
100  
Q
Total Gate Charge (nC)  
G
V
, Drain-to-Source Voltage (V)  
DS  
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
100μsec  
T
= 150°C  
J
1
1
1msec  
0.1  
0.01  
0.1  
0.01  
T
= 25°C  
T
= 25°C  
A
J
10msec  
Tj = 150°C  
Single Pulse  
V
= 0V  
GS  
0.1  
1
10  
100  
0.4  
0.6  
0.8  
1.0  
V
, Drain-to-Source Voltage (V)  
V
, Source-to-Drain Voltage (V)  
DS  
SD  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
4
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October 27, 2014  
IRLML0100PbF-1  
2.0  
1.5  
1.0  
0.5  
0.0  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
VGS  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
25  
50  
T
75  
100  
125  
150  
, Ambient Temperature (°C)  
A
10%  
Fig 9. Maximum Drain Current Vs.  
V
GS  
Ambient Temperature  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 10b. Switching Time Waveforms  
1000  
100  
10  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
1
0.1  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
SINGLE PULSE  
( THERMAL RESPONSE )  
0.01  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
10  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient  
5
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October 27, 2014  
IRLML0100PbF-1  
600  
550  
500  
450  
400  
350  
300  
250  
200  
150  
270  
250  
230  
210  
190  
170  
I
= 1.6A  
D
Vgs = 4.5V  
T
= 125°C  
= 25°C  
J
Vgs = 10V  
T
8
J
2
4
6
10  
0
2
4
6
8
I
, Drain Current (A)  
D
V
Gate -to -Source Voltage (V)  
GS,  
Fig 13. Typical On-Resistance Vs. Drain  
Fig 12. Typical On-Resistance Vs. Gate  
Current  
Voltage  
Id  
Vds  
Vgs  
L
VCC  
DUT  
0
Vgs(th)  
20K  
Qgs1  
Qgs2  
Qgodr  
Qgd  
Fig 14a. Basic Gate Charge Waveform  
Fig 14b. Gate Charge Test Circuit  
6
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October 27, 2014  
IRLML0100PbF-1  
100  
80  
60  
40  
20  
0
2.5  
2.0  
1.5  
1.0  
0.5  
I
I
= 25uA  
D
D
= 250uA  
1E-005 0.0001 0.001  
0.01  
0.1  
1
10  
-75 -50 -25  
0
25 50 75 100 125 150  
Time (sec)  
T
, Temperature ( °C )  
J
Fig 16. Typical Power Vs. Time  
Fig 15. Typical Threshold Voltage Vs.  
Junction Temperature  
7
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October 27, 2014  
IRLML0100PbF-1  
Micro3 (SOT-23) (Lead-Free) Package Outline  
Dimensions are shown in millimeters (inches)  
S
DIMENSIONS  
Y
S
DIME NS IONS  
Y
M
M
B
O
L
B
O
L
MILLIMETERS  
INCHES  
6
MIN  
0.89  
0.01  
0.88  
0.30  
0.08  
2.80  
2.10  
1.20  
MAX  
1.12  
0.10  
1.02  
0.50  
0.20  
3.04  
2.64  
1.40  
MI N  
MAX  
.044  
.0039  
.040  
.0196  
.0078  
.119  
MILL IMET E RS  
INCHES  
D
5
E
A
A1  
.036  
.0004  
.035  
.0119  
.0032  
.111  
MIN  
0.89  
0.01  
0.88  
0.30  
0.08  
2.80  
2.10  
1.20  
MAX  
1.12  
0.10  
1.02  
0.50  
0.20  
3.04  
2.64  
1.40  
MIN  
MAX  
.044  
A2  
b
c
6
5
3
.036  
.0004  
.035  
A
A1  
A2  
b
E1  
B
ccc  
C
B
A
D
E
E1  
e
.083  
.048  
.103  
.055  
1
2
.0039  
.040  
0.95 BSC  
1.90 BSC  
0.40 0.60  
.0375 BSC  
.075 BSC  
.0158 .0236  
e1  
L
e
L1  
L2  
0
0.25 BSC  
0.54 REF  
.0118 BSC  
.021 REF  
e1  
.0119  
.0032  
.111  
.0196  
.0078  
.119  
0°  
8°  
0°  
8°  
aaa  
0.10  
0.20  
0.15  
.004  
.008  
.006  
bbb  
ccc  
c
L2  
4
H
D
E
A2  
A
L1  
.083  
.103  
3X  
b
bbb  
A1  
aaa  
C
3 SURF  
C
B A  
E1  
e
.048  
.055  
0
7
3X  
L
0.95 BSC  
1.90 BSC  
0.40 0.60  
.0375 BSC  
.075 BSC  
.0158 .0236  
e1  
L
RE COMME NDED F OOT P RINT  
0.972  
L EAD ASS IGNMENT  
1. GATE  
2. SOURCE  
3. DRAIN  
3X  
L1  
L2  
0
0.25 BSC  
0.54 REF  
.0118 BSC  
.021 REF  
[.038]  
2.742  
[.1079]  
0°  
8°  
0°  
8°  
NOTES  
1. DIMENSIONING AND TOLERANCING PER AS ME Y14.5M-1994.  
2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES ]  
3. CONT ROLLING DIMENSION: MILLIMETER.  
aaa  
0.802  
[.031]  
0.10  
0.20  
0.15  
.004  
.008  
.006  
3X  
0.95  
[.0375]  
bbb  
ccc  
1.90  
[.075]  
4
5
6
DAT UM PLANE H IS LOCAT ED AT THE MOLD PARTING LINE.  
DAT UM A AND B TO BE DET ERMINED AT DAT UM PLANE H.  
DIMENSIONS D AND E1 ARE MEASURED AT DAT UM PLANE H.  
DIMENS IONS DOES NOT INCLUDE MOLD PROTRUS IONS OR  
INT E RLE AD F L AS H. MOLD PROT RUS ION OR INT ER LEAD F LAS H  
S HALL NOT EXCEED 0.25 MM [.010 INCH] PER SIDE.  
7
DIMENSION L IS THE LEAD LENGT H FOR SOLDERING TO A SUBSTRATE.  
8. OUT LINE CONFORMS TO JEDEC OUTLINE TO-236AB.  
Micro3 (SOT-23 / TO-236AB) Part Marking Information  
W= (1-26) IF PRECEDED BY LAST DIGIT OF CALENDAR YEAR  
WORK  
DATE CODE  
PART NUMBER  
LEAD FREE  
YEAR  
Y
WEE K  
W
2011  
2001  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
1
2
3
4
5
6
7
8
9
0
01  
02  
03  
04  
A
B
C
D
2012  
2013  
2014  
2015  
2016  
2017  
2018  
2019  
2020  
INDUSTRIAL VERSION  
Cu WIR E  
HALOGEN FREE  
LOT CODE  
X = PART NUMBER CODE REFERENCE:  
A= IRLML2402  
B = IRLML2803  
C= IRLML6302  
D = IRLML5103  
E = IRLML6402  
F = IRLML6401  
G= IRLML2502  
H = IRLML5203  
S = IRLML6244  
T = IRLML6246  
U = IRLML6344  
V= IRLML6346  
W = IRFML8244  
X = IRLML2244  
Y = IRLML2246  
Z = IRFML9244  
24  
25  
26  
X
Y
Z
W = (27-52) IF PRECEDED BY A LETTER  
WORK  
YEAR  
Y
WEE K  
W
I
= IRLML0030  
2011  
2001  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
A
B
C
D
E
27  
28  
29  
30  
A
B
C
D
2012  
2013  
2014  
2015  
2016  
2017  
2018  
2019  
2020  
J = IRLML2030  
K = IRLML0100  
L = IRLML0060  
M= IRLML0040  
N = IRLML2060  
P = IRLML9301  
R = IRLML9303  
F
G
H
J
K
50  
51  
52  
X
Y
Z
Note: A line above the work week  
(as shown here) indicates Lead- Free.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
8
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October 27, 2014  
IRLML0100PbF-1  
Micro3Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
2.05 ( .080 )  
1.95 ( .077 )  
1.6 ( .062 )  
1.5 ( .060 )  
1.32 ( .051 )  
1.12 ( .045 )  
1.85 ( .072 )  
1.65 ( .065 )  
4.1 ( .161 )  
3.9 ( .154 )  
TR  
3.55 ( .139 )  
3.45 ( .136 )  
8.3 ( .326 )  
7.9 ( .312 )  
FEED DIRECTION  
4.1 ( .161 )  
3.9 ( .154 )  
0.35 ( .013 )  
0.25 ( .010 )  
1.1 ( .043 )  
0.9 ( .036 )  
178.00  
( 7.008 )  
MAX.  
9.90 ( .390 )  
8.40 ( .331 )  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package  
Qualification information†  
Industrial  
(per JEDEC JESD47F†† guidelines)  
Qualification level  
MS L 1  
Micro3 (SOT-23)  
Moisture Sensitivity Level  
RoHS compliant  
(per JEDEC J-S TD-020D††  
Yes  
)
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability  
†† Applicable version of JEDEC standard at the time of product release  
Revision History  
Date  
Comment  
10/27/2014  
Updated partmarking to reflect Industrial partmarking on page 8.  
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visit http://www.irf.com/whoto-call/  
9
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October 27, 2014  

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