IRLR8103TRPBF [INFINEON]

Power Field-Effect Transistor, 89A I(D), 30V, 0.0085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK-3;
IRLR8103TRPBF
型号: IRLR8103TRPBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 89A I(D), 30V, 0.0085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK-3

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总8页 (文件大小:151K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD-94021C  
IRLR8103V  
• N-Channel Application-Specific MOSFETs  
• Ideal for CPU Core DC-DC Converters  
• Low Conduction Losses  
D
• Low Switching Losses  
• Minimizes Parallel MOSFETs for high current  
applications  
100% RG Tested  
G
Description  
This new device employs advanced HEXFET Power  
MOSFET technology to achieve an unprecedented  
balance of on-resistance and gate charge. The reduced  
conduction and switching losses make it ideal for high  
efficiency DC-DC converters that power the latest  
generation of microprocessors.  
S
D-Pak  
DEVICE CHARACTERISTICSꢀ  
The IRLR8103V has been optimized for all parameters  
that are critical in synchronous buck converters including  
IRLR8103V  
RDS(on), gate charge and Cdv/dt-induced turn-on immunity.  
7.9 mΩ  
27 nC  
12 nC  
RDS(on)  
QG  
The IRLR8103V offers an extremely low combination of  
Qsw & RDS(on) for reduced losses in both control and  
synchronous FET applications.  
QSW  
The package is designed for vapor phase, infra-red,  
convection, or wave soldering techniques. Power  
dissipation of greater than 2W is possible in a typical  
PCB mount application.  
QOSS  
29nC  
Absolute Maximum Ratings  
Parameter  
Symbol  
IRLR8103V  
Units  
VDS  
30  
Drain-Source Voltage  
V
VGS  
±20  
Gate-Source Voltage  
Continuous Drain or Source Current  
(VGS > 10V)  
TC = 25°C  
TC= 90°C  
91  
I
D
A
63  
I
363  
Pulsed Drain Current  
DM  
TC = 25°C  
TC = 90°C  
115  
Power Dissipation  
P
W
°C  
A
D
60  
TJ , T  
IS  
-55 to 150  
Junction & Storage Temperature Range  
Continuous Source Current (Body Diode)  
Pulsed Source Current  
STG  
91  
ISM  
363  
Thermal Resistance  
Parameter  
Symbol  
RθJA  
Typ.  
Max.  
50  
Units  
–––  
–––  
Maximum Junction-to-Ambient  
Maximum Junction-to-Case  
www.irf.com  
°C/W  
RθJC  
1.09  
1
10/22/04  
IRLR8103V  
Electrical Characteristics  
Parameter  
Symbol Min Typ Max Units  
Conditions  
VGS = 0V, ID = 250µA  
VGS = 10V, ID = 15A  
BVDSS  
RDS(on)  
Drain-to-Source Breakdown Voltage  
Static Drain-Source  
30  
––– –––  
V
––– 6.9 9.0  
m
V
V
GS = 4.5V, ID = 15A  
DS = VGS, ID = 250µA  
On-Resistance  
––– 7.9 10.5  
1.0 ––– 3.0  
VGS(th)  
IDSS  
Gate Threshold Voltage  
V
VDS = 30V, VGS = 0V  
VDS = 24V, VGS = 0  
Drain-to-Source Leakage Current  
––– ––– 50  
µA  
––– ––– 20  
––– ––– 100  
µA  
V
V
DS = 24V, VGS = 0, TJ = 100°C  
GS = ± 20V  
IGSS  
QG  
Gate-Source Leakage Current  
Total Gate Charge, Control FET  
Total Gate Charge, Synch FET  
Pre-Vth Gate-Source Charge  
Post-Vth Gate-Source Charge  
Gate to Drain Charge  
Switch Charge (Qgs2 + Qgd)  
Output Charge  
––– ––– ±100 nA  
VGS = 5V, ID = 15A, VDS = 16V  
GS = 5V, VDS < 100mV  
–––  
–––  
27 –––  
23 –––  
V
QG  
QGS1  
QGS2  
QGD  
QSW  
QOSS  
RG  
––– 4.7 –––  
––– 2.0 –––  
––– 9.7 –––  
nC  
V
DS = 16V, ID = 15A  
–––  
–––  
12 –––  
29 –––  
VDS = 16V, VGS = 0  
Gate Resistance  
0.8 ––– 3.1  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
–––  
–––  
–––  
–––  
10 –––  
–––  
VDD = 16V  
Rise Time  
9
ID = 15A  
ns  
Turn-Off Delay Time  
24 –––  
18 –––  
VGS = 5.0V  
Fall Time  
Clamped Inductive Load  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 2672 –––  
––– 1064 –––  
––– 109 –––  
VGS = 16V, VGS=0  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Source-Drain Rating & Characteristics  
Parameter  
Diode Forward Voltage  
Symbol Min Typ Max Units  
Conditions  
IS = 15A , VGS = 0V  
VSD  
––– 0.9 1.3  
––– 103 –––  
V
Reverse Recovery Charge  
Qrr  
nC di/dt ~ 700A/µs  
VDS = 16V, VGS = 0V, IF = 15A  
Qrr(s)  
Reverse Recovery Charge  
(with Parallel Schottky)  
–––  
96 –––  
nC di/dt = 700A/µs , (with 10BQ040)  
VDS= 16V, VGS = 0V, IF = 15A  
Notes:  

‚
ƒ
„
Repetitive rating; pulse width limited by max. junction temperature.  
Pulse width 400 µs; duty cycle 2%.  
When mounted on 1 inch square copper board, t < 10 sec.  
Typ = measured - Qoss  
Typical values of RDS(on) measured at VGS = 4.5V, QG, QSW and QOSS measured at VGS = 5.0V, IF = 15A.  
† Rθ is measured at TJ approximately 90°C  
2
www.irf.com  
IRLR8103V  
1000  
100  
10  
1000  
100  
10  
VGS  
15V  
VGS  
15V  
TOP  
TOP  
10V  
10V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
BOTTOM2.7V  
BOTTOM2.7V  
2.7V  
2.7V  
20µs PULSE WIDTH  
20µs PULSE WIDTH  
°
T = 25 C  
J
°
T = 150 C  
J
1
0.1  
1
0.1  
1
10  
100  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
2.0  
1000  
15A  
I =  
D
1.5  
1.0  
0.5  
0.0  
°
T = 25 C  
J
°
T = 150 C  
J
100  
V
= 15V  
DS  
20µs PULSE WIDTH  
V
=10V  
GS  
10  
2.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
3.0  
4.0  
5.0 6.0  
7.0  
T , Junction Temperature ( C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRLR8103V  
5000  
6
5
4
3
2
1
0
V
= 0V,  
f = 1MHz  
C
GS  
C
I =  
D
15A  
V
V
= 24V  
= 15V  
= C + C  
gs  
SHORTED  
ds  
DS  
DS  
iss  
gd ,  
C
= C  
gd  
= C + C  
rss  
C
4000  
3000  
2000  
1000  
0
oss ds  
gd  
C
iss  
C
oss  
C
rss  
1
10  
100  
0
5
10  
15  
20  
25  
30  
V
, Drain-to-Source Voltage (V)  
DS  
Q , Total Gate Charge (nC)  
G
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
1000  
10000  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
100  
10  
1
1000  
100  
10  
°
T = 150 C  
J
10us  
100us  
°
T = 25 C  
J
1ms  
10ms  
°
T = 25 C  
J
C
°
T = 150 C  
Single Pulse  
V
= 0 V  
GS  
2.0  
1
0.1  
0.0  
1
10  
100  
0.4  
0.8  
1.2  
1.6  
2.4  
V
, Drain-to-Source Voltage (V)  
V
,Source-to-Drain Voltage (V)  
DS  
SD  
FFiigg 77.. TTyyppiiccaall SSoouurrccee--DDrraaiinn DDiiooddee  
FFoorrwwaarrdd VVoolltaaggee  
Fig 8. Maximum Safe Operating Area  
4
www.irf.com  
IRLR8103V  
RD  
VDS  
100  
80  
60  
40  
20  
0
LIMITED BY PACKAGE  
VGS  
10V  
D.U.T.  
RG  
+
-
VDD  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fiigg 1100aa.. SSwwiittcchhiinngg TTiimmee TTeesstt CCiirrccuuiitt  
V
DS  
90%  
25  
50  
75  
100  
125  
150  
°
10%  
T , Case Temperature( C)  
C
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 9. Maximum Drain Current Vs.  
Fig 10b. Switching Time Waveforms  
Case Temperature  
10  
1
D = 0.50  
0.20  
0.10  
P
2
DM  
0.1  
0.05  
t
1
SINGLE PULSE  
0.02  
0.01  
t
2
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D = t / t  
1
2. Peak T =P  
x Z  
+ T  
thJC C  
J
DM  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.irf.com  
5
IRLR8103V  
0.016  
0.014  
0.012  
0.014  
0.012  
0.010  
0.008  
0.006  
I
= 15A  
VGS = 4.5V  
0.010  
D
VGS = 10V  
0.008  
0.006  
0.0  
2.0  
4.0  
6.0  
8.0  
0
50  
100 150 200 250 300 350  
, Drain Current ( A )  
V
Gate -to -Source Voltage (V)  
GS,  
I
D
Fig 13. On-Resistance Vs. Gate Voltage  
Fig 12. On-Resistance Vs. Drain Current  
Current Regulator  
Same Type as D.U.T.  
Q
G
VGS  
50KΩ  
.2µF  
12V  
.3µF  
Q
Q
GD  
GS  
+
V
DS  
D.U.T.  
-
V
G
V
GS  
3mA  
Charge  
I
I
D
G
Current Sampling Resistors  
Fig 14a&b. Basic Gate Charge Test Circuit and Waveform  
6
www.irf.com  
IRLR8103V  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
2.38 (.094)  
2.19 (.086)  
6.73 (.265)  
6.35 (.250)  
1.14 (.045)  
0.89 (.035)  
- A -  
1.27 (.050)  
0.88 (.035)  
5.46 (.215)  
5.21 (.205)  
0.58 (.023)  
0.46 (.018)  
4
6.45 (.245)  
5.68 (.224)  
6.22 (.245)  
5.97 (.235)  
10.42 (.410)  
9.40 (.370)  
1.02 (.040)  
1.64 (.025)  
LEAD ASSIGNMENTS  
1
2
3
1 - GATE  
0.51 (.020)  
MIN.  
2 - DRAIN  
3 - SOURCE  
4 - DRAIN  
- B -  
1.52 (.060)  
1.15 (.045)  
0.89 (.035)  
0.64 (.025)  
3X  
0.58 (.023)  
0.46 (.018)  
1.14 (.045)  
0.76 (.030)  
2X  
0.25 (.010)  
M A M B  
NOTES:  
2.28 (.090)  
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.  
2 CONTROLLING DIMENSION : INCH.  
4.57 (.180)  
3 CONFORMS TO JEDEC OUTLINE TO-252AA.  
4 DIMENSIONS SHOWN ARE BEFORE SOLDER DIP,  
SOLDER DIP MAX. +0.16 (.006).  
D-Pak (TO-252AA) Part Marking Information  
EXAMPLE: THIS IS AN IRFR120  
PART NUMBER  
WIT H AS S E MB L Y  
LOT CODE 1234  
RECTIFIER  
ASSEMBLED ON WW 16, 1999  
INTERNATIONAL  
DATE CODE  
YEAR 9 = 1999  
WE E K 16  
IRFR120  
916A  
34  
LOGO  
IN THE ASSEMBLY LINE "A"  
12  
LINE A  
No te : "P" in assembly line  
pos ition indicates "Lead-Free"  
AS S E MB L Y  
LOT CODE  
OR  
PART NUMBER  
DAT E CODE  
INTERNATIONAL  
RECTIFIER  
LOGO  
IRFR120  
P916A  
34  
P = DE S IGNAT E S L E AD-F R E E  
PRODUCT (OPTIONAL)  
YEAR 9 = 1999  
12  
AS S E MB L Y  
LOT CODE  
WE E K 16  
A = AS S E MB L Y S I T E CODE  
www.irf.com  
7
IRLR8103V  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Industrial market.  
Qualification Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information. 10/04  
8
www.irf.com  

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