IRS2552D [INFINEON]
CCFL/EEFL BALLAST CONTROLLER IC; CCFL / EEFL镇流器控制器IC型号: | IRS2552D |
厂家: | Infineon |
描述: | CCFL/EEFL BALLAST CONTROLLER IC |
文件: | 总32页 (文件大小:770K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
July 7, 2009
IRS2552D
CCFL/EEFL BALLAST CONTROLLER IC
Features
Product Summary
•
•
Drives up to two IGBT/MOSFET power devices
Topology
Half-Bridge
600 V
Integrated programmable oscillator
•
Soft start function
VOFFSET
15.6 V voltage clamp on
Micro-power startup
0 V to 5 V input analog dimming
Programmable ignition frequency
Programmable ignition time
VCC
•
•
•
•
•
•
•
•
•
•
•
•
•
VOUT
VCC
IO+ & IO- (typical)
300 mA & 450 mA
500ns ~ 2µs
Deadtime
(programmable)
Lamp current control
Programmable deadtime
Supports multi-lamp operation
Burst dimming with soft start at every burst
Latched open circuit protection
Integrated bootstrap functionality
Excellent latch immunity on all inputs & outputs
Integrated ESD protection on all pins
Package Options
Typical Application
•
CCFL/EEFL inverter
16-Lead PDIP
16-Lead SOIC (Narrow Body)
Typical Application Diagram
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IRS2552D
Table of Contents
Page
Typical Application Diagram
1
Qualification Information
Absolute Maximum Ratings
Recommended Operating Conditions
Electrical Characteristics
Functional Block Diagram
Lead Definitions
4
5
6
7
10
12
13
14
15
29
30
32
Lead Assignments
State Diagram
Application Information and Additional Details
Package Details
Part Marking Information
Ordering Information
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IRS2552D
Description
The IRS2552D incorporates a high voltage half-bridge gate driver with a front end that incorporates full control
functionality for CCFL/EEFL ballasts. Includes a programmable ignition and supports dimming via analog or PWM
control voltage. HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The
output driver features a high pulse current buffer stage designed for minimum driver cross-conduction. Noise
immunity is achieved with low di/dt peak of the gate drivers, and with an undervoltage lockout hysteresis of
approximately 1 V. The IRS2552D also includes protection features for over-current and over-voltage of the lamps.
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IRS2552D
Qualification Information†
Industrial††
(per JEDEC JESD 47E)
Qualification Level
Comments: This family of ICs has passed JEDEC’s
Industrial qualification. IR’s Consumer qualification level is
granted by extension of the higher Industrial level.
MSL3†††
SOIC16
(per IPC/JEDEC J-STD-020C)
Moisture Sensitivity Level
Not applicable
(non-surface mount package style)
PDIP16
Class C
Machine Model
Human Body Model
(per JEDEC standard EIA/JESD22-A115-A)
ESD
Class 3A
(per EIA/JEDEC standard JESD22-A114-B)
Class I, Level A
IC Latch-Up Test
RoHS Compliant
(per JESD78A)
Yes
†
Qualification standards can be found at International Rectifier’s web site http://www.irf.com/
†† Higher qualification ratings may be available should the user have such requirements. Please contact your
International Rectifier sales representative for further information.
††† Higher MSL ratings may be available for the specific package types listed here. Please contact your
International Rectifier sales representative for further information.
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© 2009 International Rectifier
4
IRS2552D
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol
VB
Definition
High-side floating supply voltage
High-side floating supply offset voltage
High-side floating output voltage
Low-side output voltage
Min.
-0.3
VB - 25
VS – 0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
---
Max.
625
Units
VS
VB + 0.3
VB + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
VH
VL
VCO
VCT
VDT
MIN
DIM
CR
CD
SD
VCO pin voltage
C pin voltage
T
V
DT pin voltage
MIN pin voltage
DIM pin voltage
CR pin voltage
CD pin voltage
SD pin voltage
CS pin voltage
V
CC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
CS
ICC
Supply current†
Allowable offset voltage slew rate
25
50
mA
V/ns
dVS/dt
-50
16L-PDIP
16L-SOIC
16L-PDIP
16L-SOIC
---
---
---
---
1.3
1.4
70
Package power dissipation @ TA ≤ +25
PD
W
ºC
RΘJA
Thermal resistance, junction to ambient
ºC/W
82
TJ
TS
TL
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
-55
-55
---
150
150
300
ºC
†
This IC contains a voltage clamp structure between the chip VCC and COM which has a nominal breakdown
voltage of 15.6 V. Please note that this supply pin should not be driven by a DC, low impedance power source
greater than the VCLAMP specified in the Electrical Characteristics section.
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IRS2552D
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol
Definition
High-side floating supply voltage
Steady-state high-side floating supply offset voltage
Supply voltage
Supply current
Junction temperature
Min.
VCC – 0.7
Max.
VCLAMP
Units
VBS
-3.0†
VCCUV+ +0.1V
††
VS
VCC
ICC
TJ
V
600
VCLAMP
10
mA
ºC
-40
125
†
Care should be taken to avoid output switching conditions where the V node flies inductively below ground
S
by more than 5 V.
†† Enough current should be supplied to the
pin of the IC to keep the internal 15.6 V zener diode clamping
VCC
the voltage at this pin.
Recommended Component Values
Symbol
RMIN
RMAX
RDT
CT
CDT
Component
Min.
5
5
22
330
47
1
Max.
Units
MIN pin resistor value
MAX pin resistor value
DT pin resistor value
CT pin capacitor value
DT pin capacitor value
CR pin capacitor value
CD pin capacitor value
---
kΩ
---
---
pF
nF
CR
CD
1
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IRS2552D
Electrical Characteristics
VBIAS (VCC, VBS) = 14 V, CT = 1 nF and TA = 25 °C unless otherwise specified. The input parameters are referenced to
COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or
LO.
Symbol
Low Voltage Supply Characteristics
VCCUV Rising VCC undervoltage lockout threshold
Falling VCC undervoltage lockout threshold
VCCUVHYS VCC undervoltage lockout hysteresis
Definition
Min
Typ
Max Units
Test Conditions
9.5
8.5
0.5
10.5
9.5
1
11.5
+
VCCUV
V
N/A
10.5
1.5
-
VCC = VCCUV+
-100 mV rising
IQCCUV
Micropower startup VCC supply current
Quiescent supply current
---
300
350
µA
RMIN
MODE CT = 0 V
=
RUN
12 kΩ,
IQCC
VCC
VCC supply current
current @ fosc = fMIN
---
---
4.0
0.9
4.5
1.3
IQCCFLT
ICC,FMIN
VCLAMP
mA
V
Fault mode
RMIN = 12 kΩ, RUN
VCC
VCC clamp voltage
---
4.7
5.3
MODE
ICC = 19 mA
14.6
15.6
16.6
Floating Supply Characteristics
VCC ≤ VCCUV-
CC = VBS
,
IQBSUV
Micropower startup VBS supply current
---
6
20
µA
V
IBS
VBS supply current
BS supply undervoltage positive going
---
1000 1200
HO oscillating
V
VBSUV+
6.5
7.5
8.5
threshold
V
N/A
VBS supply undervoltage negative going
threshold
VBSUV-
ILK
6.0
---
7.0
---
8.0
50
Offset supply leakage current
VB = VS = 600 V
μA
Oscillator I/O Characteristics
RMIN = 12 kΩ, RUN
fMIN
Minimum oscillator frequency
Maximum oscillator frequency
36.5
67
39
69
42.5
71
MODE
kHz
RMAX = 6.8 kΩ,
IGNITION MODE
fMAX
VCT+
VCT-
Upper CT ramp voltage threshold
Lower CT ramp voltage threshold
4.8
---
5.0
0
5.2
---
V
N/A
R
MIN =12 kΩ, RUN
ICT
CT pin source current
350
410
470
μA
MODE
VMIN
VMAX
VMIN pin voltage
4.8
4.8
---
5.0
5.0
0
5.2
5.2
---
VMAX pin voltage
V
N/A
VMIN,FLT
VMAX,FLT
VMIN voltage in fault mode
VMAX voltage in fault mode
---
0
---
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IRS2552D
Electrical Characteristics
VBIAS (VCC, VBS) = 14 V, CT = 1 nF and TA = 25 °C unless otherwise specified. The input parameters are referenced to
COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or
LO.
Symbol
Ignition
Definition
Min
Typ
Max
Units
Test Conditions
R
MIN = 12 kΩ,
ICR,IGN
Source current at CR pin in IGN mode
Ignition detection threshold
3.7
4.5
0.6
5.3
μA
IGNITION MODE
VCS,IGN
0.57
0.63
V
N/A
Gate Driver Output Characteristics
VOH
VOL
High-level output voltage, VBIAS – VO
---
---
VCC
---
---
V
I
O = 0 A
Low-level output voltage, V
COM
O
mV
I
O = 0 A,
VOL,UV
UV-mode output voltage, V
---
COM
---
O
VCC ≤ VCCUV-
tR
tF
Output rise time
Output fall time
---
---
80
45
150
100
ns
N/A
RDT = 2.2 kΩ,
CDT = 1 nF
tD
Output deadtime (HO or LO)
1.0
1.1
1.2
μs
IO+
IO-
Output source current
Output sink current
---
---
300
450
---
---
mA
N/A
Bootstrap FET Characteristics
VB,ON VB when the bootstrap FET is on
IB,CAP
13.2
40
9
13.5
55
---
---
---
V
N/A
VB source current when FET is on
VB source current when FET is on
mA
mA
CBS = 0.1 μF
VB = 10 V
IB,10V
12
Shutdown
VSD,TH
Shutdown threshold at SD pin
CD pin source current
1.9
3.7
4.8
2.0
4.5
5.0
2.1
5.3
5.2
V
μA
V
N/A
VSD>VSD,TH
,
ICD,source
VCD,TH
RMIN = 12 kΩ
Threshold at which CD triggers shutdown
VCC = 14 V
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8
IRS2552D
Electrical Characteristics
VBIAS (VCC, VBS) = 14 V, CT = 1 nF and TA = 25 °C unless otherwise specified. The input parameters are
referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the respective
output leads: HO or LO.
Symbol
Definition
Min
Typ
Max
Units
Test Conditions
Over-Current Compensation
VCS,TH
Current compensation threshold at CS pin
1.15
3.7
1.21
4.5
1.27
5.3
V
N/A
VCS>VCS,TH
,
Source current at CD pin when the IC is in
current compensation mode
ICD,OC
μA
RMIN = 12 kΩ
Voltage on CD where duty cycle reaches
minimum
VCD,oc
DCMIN
4.8
---
5.0
5.2
---
V
N/A
V
CD = 4.7 V,
Minimum HO duty cycle
10%
---
RUN MODE
Dimming
VCR+
CR pin upper threshold voltage
CR pin lower threshold voltage
Source current at CR pin in RUN mode
4.8
---
5.0
0.2
5.2
---
V
N/A
VCR-
ICR,RUN
125
150
175
μA
RMIN = 12 kΩ
CR = 100 nF,
RUN MODE,
RMIN = 12 kΩ
fCR
Frequency at CR pin
240
310
370
Hz
Soft Start
V
CR = 0 V,
DCMIN
Minimum HO duty cycle
---
10%
---
---
V
V
DIM < VDIM,SS
VCR,SS
VDIM,SS
End of soft start voltage
0.88
---
0.96
4.8
1.04
---
VDIM < VDIM,SS
N/A
Soft start disable threshold
Enable
VENATH
Enable threshold
Enable hysteresis
1.9
---
2.2
2.5
---
V
N/A
VENAHYS
200
mV
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9
IRS2552D
Functional Block Diagram
12
CS
IMIN
ICD
ICR_IGN
ICR_RUN
0.6V
5V
1.21V
5
MIN
IGNITION
LOGIC
OVER
CURRENT
CONTROL
BAND
GAP
REF
IMAX
5V
5V
6
MAX
SOFT
START
CONTROL
3
VBG
CT
S
Q
Q
5V
0V
DUTY
CYCLE
CONTROL
R1
R2
DEAD TIME
CONTROL
EN
DT
4
16
15
14
VB
HO
VS
10
11
CD
SD
PULSE
FILTER &
LATCH
LEVEL
SHIFT
5V
2V
9
7
CR
BOOT
STRAP
DRIVE
Q
Q
S
R
UV
DIM
1
VCC
LO
OUTPUT
LOGIC
13
5V
UV
UVLO
EN
15.6V
2
8
COM
ENA
0.2V
2.2V
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10
IRS2552D
Input/Output Pin Equivalent Circuit Diagrams: IRS2552D
VB
ESD
Diode
25V
HO
VCC
CT
ESD
Diode
ESD
Diode
VS
600V
RESD
RESD
ESD
Diode
VCC
ESD
Diode
COM
LO
25V
ESD
Diode
COM
VCC
ESD
Diode
MIN,
MAX
RESD
ESD
Diode
COM
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11
IRS2552D
Lead Definitions
Symbol
Description
Logic and internal gate drive supply voltage
VCC
COM
CT
IC power and signal ground
Oscillator timing capacitor
DT
Independent dead time R and C
RFMIN sets running frequency
RFMAX sets ignition mode frequency
MIN
MAX
DIM
ENA
CR
0 to 5 V DC burst mode dimming control input
Chip Enable (2 V logic threshold)
Burst dimming ramp
CD
Shutdown delay timing
SD
Open load detection
CS
Ignition detection (0.6 V threshold), over-current (1.2 V threshold)
Low side output
LO
VS
Half bridge
HO
VB
High side output
High side floating supply
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IRS2552D
Lead Assignments
VCC
COM
CT
VB
HO
VS
LO
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
DT
MIN
MAX
CS
SD
CD
DIM
ENA
CR
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13
IRS2552D
State Diagram†
†
All values are typical. Applies to application circuit on page 1.
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IRS2552D
Application Information and Additional Details
Information regarding the following topics is included as subsections within this section of the datasheet.
•
•
•
•
•
•
•
•
•
•
•
•
IGBT/MOSFET Gate Drive
Undervoltage Lockout Protection
Oscillator
Deadtime
Ignition
Run Mode
Lamp Current Control
Frequency, Current and Deadtime Calculation
Dimming Function
Soft Start
PCB Layout Tips
Additional Documentation
IGBT/MOSFET Gate Drive
The IRS2552D HVICs are designed to drive up to two MOSFET or IGBT power devices. Figures 1 and 2 illustrate
several parameters associated with the gate drive functionality of the HVIC. The output current of the HVIC, used to
drive the gate of the power switch, is defined as IO. The voltage that drives the gate of the external power switch is
defined as VHO for the high-side power switch and VLO for the low-side power switch; this parameter is sometimes
generically called VOUT and in this case does not differentiate between the high-side or low-side output voltage.
VB
(or VCC
)
IO+
HO
(or LO)
+
VHO (or VLO)
-
VS
(or COM)
Figure 1: HVIC sourcing current
Figure 2: HVIC sinking current
Undervoltage Lock-Out
The IRS2552D includes an under voltage lockout circuit such that it remains in micro-power mode until the
voltage at VCC pin exceeds the VCCUV+ threshold. When VCC exceeds the VCCUV+ threshold the IRS2552D
oscillator starts up and gate drive signals appear at the LO and HO outputs, provided the ENABLE pin is
connected to a voltage source above VENATH. The LO output will always go high first in order to pre-charge the
bootstrap capacitor before the IRS2552D begins normal operation.
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IRS2552D
Oscillator
During UVLO and shutdown and the voltage at the MIN and MAX pins remain at 0 V. When VCC is raised above
VCCUV+ the oscillator will start and LO and HO will produce output drive waveforms at frequency FMAX. The MAX
pin sources 5 V and the resistance connected from this point to COM determines the CT charging current and
consequently the frequency. RMIN is always connected from the MIN pin to COM, which sets the RUN mode
frequency. In IGNITION mode the MAX pin supplies 5 V to RMAX, which is connected to COM setting a higher CT
charging current and consequently a higher ignition frequency, as RMAX is smaller than RMIN. In RUN mode the
MAX pin is no longer active and the voltage will drop to 0V. CT charges until the voltage reaches the 5 V
threshold and then it is discharged rapidly to VCT-. It then begins to charge again, repeating this sequence and
producing a saw tooth waveform. The MIN pin sources 5 V during IGNITION and RUN modes. The current
flowing through FMIN to COM determines the charging current of CT during RUN mode and also serves as a
current reference for the currents supplied from the CD and CR pins.
VCC
VCCUV+
CT
VCT+
VCT-
DT
1/3*VCC
LO
HO
Figure 3: Oscillator waveforms
Deadtime
In the IRS2552D the dead time is determined by an independent external timing circuit comprising of RDT and
CDT and is not affected by the values of CT, RMIN or RMAX. The DT pin voltage is held at COM when LO or HO is
high. CDT is charged through RDT, which is connected to VCC, when DT is internally disconnected from COM at
the start of the dead time. The dead time ends when CDT has charged to 1/3 VCC. This allows the dead time to
remain consistent over the working range of VCC, i.e. from UVLO+ to the clamp voltage of 15.6 V.
Ignition
During the IGNITION phase the CR capacitor is charged through an internal current source ICR_IGN. When CR
reaches VCR+ then if the voltage at CS is greater than VCSIGN, the IRS2552D will enter RUN mode. If the voltage
at the CS pin is less than VCSIGN the IRS2552D will enter FAULT mode whereby LO and HO will both go low and
the IRS2552D will shut down until VCC is reduced below VCCUV- and then increased above VCCU+. The ignition
function is achieved by applying a frequency somewhat above resonance to the output step up transformer and
resonant load. This should develop sufficient voltage across the lamps to allow partial ignition and some arc
current to flow. The combined lamp current is fed back to the CS pin through a suitable isolating network to
determine whether the lamps have ignited successfully. If a successful ignition is detected after the voltage at CR
has reached VCR+ then RMAX is disconnected inside the IRS2552D and the frequency will switch immediately to
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16
IRS2552D
to FMIN, therefore applying maximum power to the lamps. At this point the burst mode dimming function will be
enabled.
Run Mode
In RUN mode an additional current source ICR_RUN is also switched into the circuit. This causes CR to ramp up
to VCR+ much more rapidly than before. The CR pin is used to provide ignition timing as well as the burst mode
dimming low frequency ramp.
If the output is open circuit a very large voltage develops at the output. This is fed back to the SD pin through
some suitable isolated sensing network such that the voltage at the SD pin will exceed VSDTH during an over-
voltage condition. At this stage the capacitor CD begins to charge through a current source. When VSD >
VSDTH the burst mode dimming function is disabled and the output will be continuous.
If the voltage at SD drops below VSDTH the capacitor CD will be discharged to 0V again. If SD remains above
VSDTH long enough for the CD capacitor voltage to reach VCDMAX or about 5 V then the IRS2552D will shut
down and go into fault mode.
Lamp Current Control
Additionally the half bridge current is monitored at the CS pin so that during running if too much power is
supplied to the lamps the IRS2552D is able to compensate by reducing the oscillator duty cycle while
maintaining the same run frequency. This prevents the lamps from being over driven preventing premature end
of life. When VCS > VCSTH the CD capacitor will begin to charge and the CD pin voltage will rise. As this occurs
the duty cycle will begin to adjust, i.e. the HO on time will become gradually shorter and the LO on time will
become gradually longer. The dead time will remain constant at all times. In this way the power to the output will
be reduced while the frequency remains at fMIN. As the CD voltage rises, the duty cycle will be further reduced. If
VCS then drops below VCSTH then the duty cycle will be regulated at that point and thus the current will be
maintained at this limit. If VCS remains above VCSTH then the voltage will continue to rise on CD until it reaches
VCDMAX, at which point the duty cycle reaches its minimum limit DCMIN and the IRS2552D will enter FAULT
mode, requiring VCC to fall below UVLO- and then rise above UVLO+ in order to re-start.
Frequency, Current, and Dead Time Calculation
The running frequency of the IRS2552D is given by the following formula:
1
fMIN
=
2.09⋅CT ⋅ RMIN
where VMIN = 5 V, i.e. When the ignition ramp is complete and RMAX has no further effect on the oscillator.
The ignition frequency given by:
1
fMAX
=
2.09⋅CT ⋅ RMAX
and the dead time is calculated by:
tDT = RDT ⋅CDT ⋅ln(1.5)
tDT = 0.405⋅ RDT ⋅CDT
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17
IRS2552D
Maximum duty cycle
DCMAX = 0.5− (tDT * f )
The ICR charging current during ignition mode and the ICD charging current are given by:
0.06
ICRIGN
=
RMIN
0.06
ICD =
RMIN
The ICR charging current and frequency during run mode are given by:
1.8
ICRRUN
=
RMIN
0.36
RMIN ⋅CCR
fCR
=
Dimming Function
The IRS2552D supports burst mode dimming, meaning that the output drive to the lamps is pulsed on and off at
a low frequency and the burst duty cycle is adjusted to control the average current and therefore the light output
of the lamps. The IRS2552D contains a low frequency oscillator that generates a ramp waveform at the CR pin
from 0 V to 5 V. The ramp frequency is dependent on the value of the external CR capacitor. A DC dimming
control voltage is fed into the DIM pin which is compared with the dimming ramp by means of an internal
comparator, which generates the PWM signal that is used internally to switch the outputs on and off. Thus when
the DIM voltage is at 5 V the outputs will be on all of the time and when it is at 0 V the outputs will be off all of the
time. Alternatively a PWM dimming control signal from 0 V to 5 V can be fed directly into the DIM pin to allow
external PWM control independent of the dimming ramp. During the off period the LO and HO outputs are both
low.
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18
IRS2552D
5V
DIM
CR
1V
0.2V
Soft Start
Soft Start
Soft Start
LO
HO
Duty cycle
increases from 10%
to 50%
Figure 4: Dimming waveform
RUN MODE
ICCRUN charges CR up to VCR+. CR oscillates at fCR (sawtooth)
Half-bridge oscillates at FMIN. VDC reset to 0V
SOFT START
ON
OFF
DC increases from DC
min to DC max
DC=DCmax
DC=0
VDIM <VCRSS
VCR<VCRSS
VCR<VCRSS
VCR>VDIM
VCR>VDIM
VCR>VDIM
VCRSS <VDIM<VDIMSS
VDIM>VDIMSS
VCR<VDIM
VCR<VDIM
Soft start
In addition the IRS2552D includes a soft start function that operates at the start of each burst, during dimming
operation when VDIM < VDIMSS. The soft start will operate during the portion of the dimming ramp CR at the
start of each burst from CR = 0 V to CR = VCRSS. When VCR = 0 the duty cycle will be at minimum (DCMIN) and
will linearly increase to 50% (minus the dead time) when VCR reaches VCRSS. This function is enabled only in
RUN mode and allows inrush currents to be eliminated during burst mode dimming, while always maintaining the
frequency at FMIN
.
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19
IRS2552D
PCB Layout Tips
Distance between high and low voltage components: It’s strongly recommended to place the components tied to the
floating voltage pins (VB and VS) near the respective high voltage portions of the device.
Ground Plane: In order to minimize noise coupling, the ground plane should not be placed under or near the high
voltage floating side.
Gate Drive Loops: Current loops behave like antennas and are able to receive and transmit EM noise (see Figure 5).
In order to reduce the EM coupling and improve the power switch turn on/off performance, the gate drive loops must
be reduced as much as possible. Moreover, current can be injected inside the gate drive loop via the IGBT collector-
to-gate parasitic capacitance. The parasitic auto-inductance of the gate loop contributes to developing a voltage
across the gate-emitter, thus increasing the possibility of a self turn-on effect.
Figure 5: Antenna Loops
Supply Capacitor: It is recommended to place a bypass capacitor (CIN) between the VCC and VSS pins. A ceramic
1 μF ceramic capacitor is suitable for most applications. This component should be placed as close as possible to
the pins in order to reduce parasitic elements.
Routing and Placement: Power stage PCB parasitic elements can contribute to large negative voltage transients as
the switch node; it is recommended to limit the phase voltage negative transients. In order to avoid such conditions,
it is recommended to 1) minimize the high-side emitter to low-side collector distance, and 2) minimize the low-side
emitter to negative bus rail stray inductance. However, where negative VS spikes remain excessive, further steps
may be taken to reduce the spike. This includes placing a resistor (5 Ω or less) between the VS pin and the switch
node (see Figure 6), and in some cases using a clamping diode between VSS and VS (see Figure 7). See DT04-4 at
www.irf.com for more detailed information.
www.irf.com
© 2009 International Rectifier
20
IRS2552D
Figure 6: VS resistor
Figure 7: VS clamping diode
Additional Documentation
Several technical documents related to the use of HVICs are available at www.irf.com; use the Site Search
function and the document number to quickly locate them. Below is a short list of some of these documents.
DT97-3: Managing Transients in Control IC Driven Power Stages
AN-1123: Bootstrap Network Analysis: Focusing on the Integrated Bootstrap Functionality
DT04-4: Using Monolithic High Voltage Gate Drivers
AN-978: HV Floating MOS-Gate Driver ICs
www.irf.com
© 2009 International Rectifier
21
IRS2552D
Programmable parameter characteristics
Figure 7 to 12 provide the characteristics of the programmable parameters as a function of the value of the
programming components.
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
0
5
10 15 20 25 30 35 40 45 50
RMIN(k
0
300
600
900
1200
1500
)
Ω
CT(pF)
RMIN, RMAX=12.1K
Figure 7: FMIN, FMAX vs. CT
Figure 8: FMIN vs. RMIN
2000
100
90
80
70
60
50
40
30
20
10
0
1600
1200
800
400
0
0
5
10 15 20 25 30 35 40 45 50
RMAX(k
0
400
800
1200
1600
2000
)
Ω
CDT(pF)
RDT=2.21K
Figure 9: FMAX vs. RMAX
Figure 10: DT vs. CDT
100
90
80
70
60
50
40
30
20
10
0
3000
2500
2000
1500
1000
500
0
0
1
2
3
4
5
6
7
0
500 1000 1500 2000 2500 3000 3500
CR(pF)
RDT(K
)
Ω
Figure 11: DT vs. RDT
Figure 12: FCR vs. CR
www.irf.com
© 2009 International Rectifier
22
Parameter characteristics
Figure 13 to 18 provide the characteristics of the main parameters as a function of VCC or the oscillator
6
5
4
3
2
1
0
20
16
12
8
4
0
0
2
4
6
8
10 12 14 16
9
9.2
9.4
9.6
9.8
10
10.2
VCC(V)
VCC(V)
Figure 13: ICC vs. VCC
Figure 14: IQCC vs. VCC (VCC raising and falling
2
1.75
1.5
80
70
60
50
40
30
20
10
0
FMAX
FMIN
1.25
1
0.75
0.5
0.25
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
VCC(V)
VCC(V)
RMIN=12.1K, RNAX=6.81K
Figure15: FMIN, FMAX vs. VCC
Figure 16: td vs. VCC
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
30
34
38
42
46
50
30
34
38
42
46
50
FMIN(kHz)
FMAX(kHz)
Figure 17: ICC RUN vs. FMIN
Figure 18: ICC FMAX vs. FMAX
www.irf.com
© 2009 International Rectifier
23
IRS2552D
Parameter Temperature Trends
Figures 38-58 provide the characteristics of the main parameters over temperature based on three temperatures (-
40 ºC, 25 ºC, and 125 ºC) average testing.
350
300
250
200
150
100
50
11.5
11
10.5
10
VCCUV+
9.5
9
VCCUV-
8.5
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (C)
Temperature (C)
Figure 19: VCCUV vs. temperature
Figure 20: IQCCUV vs. temperature
5.5
5
4
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3
4.5
4
3.5
3
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (C)
Temperature (C)
Figure 21: IQCC vs. temperature
Figure 22: ICC,FMIN vs. temperature
www.irf.com
© 2009 International Rectifier
24
IRS2552D
8.5
8
16.6
16.1
15.6
15.1
14.6
VBSUV+
VBSUV-
7.5
7
6.5
6
-50
-50
-50
-25
0
25
50
75
100
125
125
125
-50
-25
0
25
50
75
100
125
125
125
Temperature (C)
Temperature (C)
Figure 23: VCLAMP vs. temperature
Figure 24: VBSUV vs. temperature
71
42.5
41.5
40.5
39.5
38.5
37.5
36.5
70.5
70
69.5
69
68.5
68
67.5
67
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (C)
Temperature (C)
Figure 25: fMIN vs. temperature
Figure 26: fMAX vs. temperature
5.2
5.15
5.1
5.2
5.15
5.1
5.05
5
5.05
5
4.95
4.9
4.95
4.9
4.85
4.8
4.85
4.8
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (C)
Temperature (C)
Figure 27: VMINvs. temperature
Figure 28: VMAX vs. temperature
www.irf.com
© 2009 International Rectifier
25
IRS2552D
630
620
610
600
590
580
570
5.3
5.1
4.9
4.7
4.5
4.3
4.1
3.9
3.7
-50
-25
0
25
50
75
100
100
100
125
125
125
-50
-25
0
25
50
75
100
100
100
125
125
125
Temperature (C)
Temperature (C)
Figure 29: ICR,IGN vs. temperature
Figure 30: Vcs,ign vs. temperature
14
13.9
13.8
13.7
13.6
13.5
13.4
13.3
13.2
13.1
13
1.2
1.18
1.16
1.14
1.12
1.1
1.08
1.06
1.04
1.02
1
-50
-25
0
25
50
75
-50
-25
0
25
50
75
Temperature (C)
Temperature (C)
Figure 31: tD vs. temperature
Figure 32: VB,ON vs. temperature
20
18
16
14
12
10
8
90
80
70
60
50
40
30
20
10
0
6
4
2
0
-50
-25
0
25
50
75
-50
-25
0
25
50
75
Temperature (C)
Temperature (C)
Figure 33: IB,CAP vs. temperature
Figure 34: IB,10V vs. temperature
www.irf.com
© 2009 International Rectifier
26
IRS2552D
2.1
2.05
2
5.3
5.1
4.9
4.7
4.5
4.3
4.1
3.9
3.7
1.95
1.9
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (C)
Temperature (C)
Figure 35: VSD,TH vs. temperature
Figure 36: VCD,SOURCEvs. temperature
1.27
1.25
1.23
1.21
1.19
1.17
1.15
5.2
5.15
5.1
5.05
5
4.95
4.9
4.85
4.8
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (C)
Temperature (C)
Figure 37: VCD,TH vs. temperature
Figure 38: VCDSTH vs. temperature
5.2
5.15
5.1
5.3
5.1
4.9
4.7
4.5
4.3
4.1
3.9
3.7
5.05
5
4.95
4.9
4.85
4.8
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (C)
Temperature (C)
Figure 39: ICD,OC vs. temperature
Figure 40: VCD,OC vs. temperature
www.irf.com
© 2009 International Rectifier
27
IRS2552D
14
12
10
8
360
340
320
300
280
260
240
6
4
2
0
-50
-25
0
25
50
75
100
100
100
125
125
125
-50
-25
0
25
50
75
100
100
100
125
125
125
Temperature (C)
Temperature (C)
Figure 41: DCMIN vs. temperature
Figure 42: fCR vs. temperature
5
1040
1020
1000
980
4.95
4.9
4.85
4.8
960
4.75
4.7
940
4.65
4.6
920
900
4.55
4.5
880
-50
-25
0
25
50
75
-50
-25
0
25
50
75
Temperature (C)
Temperature (C)
Figure 43: VCR,SS vs. temperature
Figure 44: VDIM,SS vs. temperature
1.2
1.1
1
2.5
2.4
2.3
2.2
2.1
2
ENATH+
ENATH-
0.9
0.8
0.7
0.6
0.5
1.9
1.8
1.7
-50
-25
0
25
50
75
-50
-25
0
25
50
75
Temperature (C)
Temperature (C)
Figure 45: VENA vs. temperature
Figure 46: IBS vs. temperature
www.irf.com
© 2009 International Rectifier
28
IRS2552D
Package Details: PDIP16 and S016N
www.irf.com
© 2009 International Rectifier
29
IRS2552D
Package Details: SOIC16N, Tape and Reel
LOADED TAPE FEED DIRECTION
A
B
H
D
F
C
NOTE : CONTROLLING
DIMENSION IN MM
E
G
CARRIER TAPE DIMENSION FOR 16SOICN
Metric
Imperial
Min
Code
A
B
C
D
E
F
G
H
Min
7.90
3.90
15.70
7.40
6.40
10.20
1.50
1.50
Max
8.10
4.10
16.30
7.60
6.60
10.40
n/a
Max
0.318
0.161
0.641
0.299
0.260
0.409
n/a
0.311
0.153
0.618
0.291
0.252
0.402
0.059
0.059
1.60
0.062
F
D
B
C
A
E
G
H
REEL DIMENSIONS FOR 16SOICN
Metric
Imperial
Code
A
B
C
D
E
F
G
H
Min
329.60
20.95
12.80
1.95
98.00
n/a
18.50
16.40
Max
330.25
21.45
13.20
2.45
102.00
22.40
21.10
18.40
Min
12.976
0.824
0.503
0.767
3.858
n/a
Max
13.001
0.844
0.519
0.096
4.015
0.881
0.830
0.724
0.728
0.645
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© 2009 International Rectifier
30
IRS2552D
Part Marking Information
www.irf.com
© 2009 International Rectifier
31
IRS2552D
Ordering Information
Base Part Number
IRS2552D
Standard Pack
Package Type
Complete Part Number
Form
Quantity
PDIP16
Tube/Bulk
25
45
IRS2552DPBF
IRS2552DSPBF
IRS2552DSTRPBF
Tube/Bulk
SOIC16N
Tape and Reel
2500
The information provided in this document is believed to be accurate and reliable. However, International Rectifier assumes no responsibility for
the consequences of the use of this information. International Rectifier assumes no responsibility for any infringement of patents or of other
rights of third parties which may result from the use of this information. No license is granted by implication or otherwise under any patent or
patent rights of International Rectifier. The specifications mentioned in this document are subject to change without notice. This document
supersedes and replaces all information previously supplied.
For technical support, please contact IR’s Technical Assistance Center
http://www.irf.com/technical-info/
WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245
Tel: (310) 252-7105
www.irf.com
© 2009 International Rectifier
32
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