IRU3039CHTR [INFINEON]

Switching Controller, Voltage-mode, 400kHz Switching Freq-Max, MOS, 5 X 5 MM, MLPQ-20;
IRU3039CHTR
型号: IRU3039CHTR
厂家: Infineon    Infineon
描述:

Switching Controller, Voltage-mode, 400kHz Switching Freq-Max, MOS, 5 X 5 MM, MLPQ-20

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Data Sheet No. PD94649  
IRU3039  
SYNCHRONOUS PWM CONTROLLER  
WITH OVER CURRENT PROTECTION  
FEATURES  
DESCRIPTION  
The IRU3039 controller IC is designed to provide a syn-  
chronous Buck regulator and is targeted for applications  
where the cost and size is critical. The IRU3039 oper-  
Current Limit using Lower MOSFET Sensing  
Using the 6V internal regulator for charge pump  
circuit allows single supply operation up to 18V  
Programmable Switching Frequency up to 400KHz ates with a single input supply up to 18V. The output  
Soft-Start Function  
voltage can be programmed as low as 0.8V for low volt-  
age applications. Selectable current limit is provided to  
tailor to external MOSFET’s on-resistance for optimum  
cost and performance. The IRU3039 features an uncom-  
mitted error amplifier for tracking output voltage and is  
capable of sourcing or sinking current for applications  
such as DDR bus termination.  
0.8V Precision Reference Voltage Available  
Uncommitted Error Amplifier Available for DDR  
Voltage Tracking Applications  
Stable with Ceramic Capacitor  
APPLICATIONS  
DDR Memory VDDQ/VTT Applications  
Graphic Card  
This device features a programmable switching frequency  
set from 200KHz to 400KHz, under-voltage lockout for  
both Vcc and Vc supplies, an external programmable  
soft-start function as well as output under-voltage detec-  
tion that latches off the device when an output short is  
detected.  
Hard Disk Drive  
Netcom on-board DC to DC regulator application  
Output voltage as low as 0.8V  
Low Cost On-Board DC to DC  
TYPICAL APPLICATION  
18V  
D1  
L1  
C3  
1uF  
C9  
1uF  
1uH  
C2  
3x 15uF  
25V  
C1  
15uF  
C4  
1uF  
C5  
0.1uF  
VOUT2  
Vcc  
Vc  
SS / SD  
Q1  
IRF7466  
C7  
0.1uF  
U1  
IRU3039  
HDrv  
D2  
L2  
4.7uH  
R2  
3.3V @ 8A  
OCSet  
VP  
5.76K  
V
REF  
C6  
2x 330uF  
40mΩ  
Q2  
IRF7458  
Rt  
Comp  
LDrv  
R3  
3.16K  
C8  
5600pF  
C11  
Optional  
Fb  
Gnd  
PGnd  
R4  
1K  
R1  
14K  
Figure 1 - Typical application of IRU3039.  
PACKAGE ORDER INFORMATION  
TA (°C)  
0 To 70  
DEVICE  
IRU3039CH  
PACKAGE  
20-Pin MLPQ 5x5 (H)  
Rev. 1.0  
06/06/03  
www.irf.com  
1
IRU3039  
ABSOLUTE MAXIMUM RATINGS  
Vcc Supply Voltage .................................................. -0.5V To 25V  
Vc Supply Voltage .................................................... -0.5V To 25V  
Storage Temperature Range ...................................... -65°C To 150°C  
Operating Junction Temperature Range .....................  
0°C To 125°C  
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device.  
PACKAGE INFORMATION  
20-Pin MLPQ 5x5 (H)  
*θJA=378C/W  
θJC=2.38C/W  
20 19  
18 17  
16  
V
REF  
1
15 VOUT2  
14 NC  
13 NC  
12 Rt  
NC 2  
*Exposed pad on  
underside is con-  
nected to a typical 1"  
square copper pad  
through vias for 4-  
layer PCB board  
design.  
Pad  
3
4
NC  
Vcc  
11  
NC 5  
NC  
6
7
8
10  
9
ELECTRICAL SPECIFICATIONS  
Unless otherwise specified, specifications apply over Vcc=5V, Vc=12V and TA=0-70°C. Typical values refer to 258C.  
Low duty cycle pulse testing is used which keeps junction and case temperatures equal to the ambient temp.  
PARAMETER  
SYM  
TEST CONDITION  
MIN  
TYP  
MAX UNITS  
Feedback Voltage  
Fb Voltage Initial Accuracy  
Fb Voltage Line Regulation  
Reference Voltage  
Ref Voltage Initial Accuracy  
Drive Current  
VFB  
0.784 0.800 0.816  
0.3  
V
%
LREG  
4.75V<Vcc<20V  
VREF  
IREF  
0.784  
0.8  
2
0.816  
V
µA  
Note 1  
UVLO  
UVLO Threshold - Vcc  
UVLO Hysteresis - Vcc  
UVLO Threshold - Vc  
UVLO Hysteresis - Vc  
UVLO Threshold - Fb  
Supply Current  
UVLO VCC Supply Ramping Up  
UVLO VC Supply Ramping Up  
UVLO Fb Fb Ramping Down  
4.4  
0.26  
3.47  
0.20  
0.4  
V
V
V
V
V
0.3  
0.5  
Vcc Dynamic Supply Current  
Vc Dynamic Supply Current  
Vcc Static Supply Current  
Vc Static Supply Current  
Dyn ICC  
Dyn IC  
ICCQ  
Freq=200KHz, CL=1500pF  
Freq=200KHz, CL=1500pF  
SS=0V  
7
7
5
3
15  
9
mA  
mA  
mA  
mA  
9
4
ICQ  
SS=0V  
Rev. 1.0  
06/06/03  
www.irf.com  
2
IRU3039  
PARAMETER  
SYM  
TEST CONDITION  
SS=3V  
MIN  
TYP  
MAX UNITS  
Error Amp  
Fb Voltage Input Bias Current  
Fb Voltage Input Bias Current  
Transconductance  
VP Voltage Range  
Soft-Start Section  
Charge Current  
Oscillator Section  
Frequency  
Ramp Amplitude  
Output Drivers  
IFB1  
IFB2  
-1  
+0.08  
55  
700  
+1  
70  
µA  
µA  
SS=0V  
30  
µmho  
V
VP  
Note 1  
0.8  
14  
1.5  
35  
SS IB  
Freq  
SS=0V  
Rt=Open  
Rt=Gnd  
Note 1  
22  
µA  
200  
400  
1.25  
KHz  
VRAMP  
VPP  
Tr(LO)  
Tr(HI)  
Tf(LO)  
Tf(HI)  
TDB  
Lo Drive Rise Time  
Hi Drive Rise Time  
Lo Drive Fall Time  
Hi Drive Fall Time  
Dead Band Time  
Max Duty Cycle  
CLOAD=1500pF, VCC=12V  
CLOAD=1500pF, VCC=12V  
CLOAD=1500pF  
40  
40  
40  
100  
100  
100  
100  
ns  
ns  
ns  
ns  
ns  
%
CLOAD=1500pF  
40  
100  
88  
HDrv going Hi or Low  
Fb=0.6V, Freq=200KHz  
Fb=1.0V  
DMAX  
DMIN  
Min Duty Cycle  
0
%
Internal Regulator  
Output Voltage  
VOUT2  
IOUT2  
Vcc=12V  
5.7  
40  
6
6.3  
V
Drive Current  
65  
mA  
Current Limit  
OC Threshold Set Current  
OC Comp Off-Set Voltage  
IOCSET  
21  
-2  
28  
35  
5
µA  
VOC(OFFSET)  
1.5  
mV  
Note 1: Guaranteed by design but not tested for production.  
PIN DESCRIPTIONS  
PIN#  
PIN SYMBOL  
PIN DESCRIPTION  
1
4
VREF  
Vcc  
Reference Voltage. This pin can source current about 2µA.  
This pin provides biasing for the internal blocks of the IC as well as power for the low side  
FET driver. A minimum of 1µF, high frequency capacitor must be connected from this pin  
to ground to provide peak drive current capability.  
6
7
LDrv  
PGnd  
Output driver for the synchronous power MOSFET.  
This pin serves as the separate ground for MOSFET's driver and should be connected to  
system's ground plane.  
8
9
Gnd  
This pin serves as analog ground for internal reference and control circuitry. A high fre-  
quency capacitor must be connected from Vcc pin to this pin for noise free operation.  
Output driver for the high side power MOSFET. This pin should not go negative (below  
ground), this may cause problem for the gate drive circuit. It can happen when the inductor  
current goes negative (Source/Sink), soft-start at no load and for the fast load transient  
from full load to no load. To prevent negative voltage at gate drive, a low forward voltage  
drop diode might be connected between this pin and ground.  
HDrv  
10  
12  
Vc  
Rt  
This pin is connected to a voltage that must be at least 4V higher than the bus voltage of  
the switcher (assuming 5V threshold MOSFET) and powers the high side output driver. A  
minimum of 1µF, high frequency capacitor must be connected from this pin to ground to  
provide peak drive current capability.  
The switching frequency can be Programmed between 200KHz and 400KHz by connect-  
ing a resistor between Rt and Gnd. By floating the pin, the switching frequency will be  
200KHz and by grounding the pin, the switching frequency will be 400KHz.  
Rev. 1.0  
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3
IRU3039  
PIN DESCRIPTIONS  
PIN#  
PIN SYMBOL  
PIN DESCRIPTION  
15  
VOUT2  
Output of internal regulator. The output is protected for short circuit. A high frequency  
capacitor is recommended to be connected from this pin to ground.  
This pin is connected to the Drain of the lower MOSFET via an external resister and it  
provides the positive sensing for the internal current sensing circuitry. The external resis-  
tor programs the current limit threshold depending on the RDS(ON) of the power MOSFET.  
An external capacitor can be placed in parallel with the programming resistor to provide  
high frequency noise filtering.  
16  
OCSet  
This pin provides soft-start for the switching regulator. An internal current source charges  
an external capacitor that is connected from this pin to ground which ramps up the output  
of the switching regulator, preventing it from overshooting as well as limiting the input  
current. The converter can be shutdown by pulling this pin down below 0.4V.  
Compensation pin of the error amplifier. An external resistor and capacitor network is  
typically connected from this pin to ground to provide loop compensation.  
This pin is connected directly to the output of the switching regulator via resistor divider to  
provide feedback to the Error amplifier.  
17  
SS / SD  
18  
19  
Comp  
Fb  
20  
VP  
Non-inverting input of error amplifier.  
2,3,5,  
11,13,14  
NC  
No connection.  
BLOCK DIAGRAM  
Vcc 4  
Regulator  
6V  
15 VOUT2  
0.8V  
VREF  
1
1.25V  
3V  
Bias  
Generator  
1.25V  
0.2V  
0.2V  
POR  
4V  
Vc  
3V  
12 Rt  
22uA  
3.5V  
10  
9
Vc  
SS / SD 17  
POR  
64uAMax  
Rt  
Ct  
Oscillator  
HDrv  
Enbl  
S
R
Q
Error Comp  
Vcc  
Error Amp  
25K  
25K  
VP 20  
Reset Dom  
Fb 19  
6 LDrv  
Comp 18  
FbLo Comp  
PGnd  
7
0.4V  
3V  
28uA  
OC Comp  
POR  
8 Gnd  
OCSet 16  
Figure 2 - Simplified block diagram of the IRU3039.  
www.irf.com  
Rev. 1.0  
06/06/03  
4
IRU3039  
THEORY OF OPERATION  
Introduction  
3V  
20uA  
The IRU3039 is a fixed frequency, voltage mode syn-  
chronous controller and consists of a precision refer-  
ence voltage, an uncommitted error amplifier, an internal  
oscillator, a PWM comparator, an internal regulator, a  
comparator for current limit, gate drivers, soft-start and  
shutdown circuits (see Block Diagram).  
SS/SD  
Comp  
64uA  
HDrv  
Max  
P O R  
Error Amp  
LDrv  
25K  
25K  
0.8V  
The output voltage of the synchronous converter is set  
and controlled by the output of the error amplifier; this is  
the amplified error signal from the sensed output voltage  
and the voltage on non-inverting input of error amplifier(VP).  
This voltage is compared to a fixed frequency linear  
sawtooth ramp and generates fixed frequency pulses of  
variable duty-cycle, which drives the two N-channel ex-  
ternal MOSFETs.  
Fb  
0.4V  
64uA×25K=1.6V  
P O R  
When SS=0  
Feeback  
UVLO Comp  
The timing of the IC is provided through an internal oscil-  
lator circuit which uses on-chip capacitor. The oscilla-  
tion frequency is programmable between 200KHz to  
Figure 3 - Soft-start circuit for IRU3039.  
400KHz by using an external resistor. Figure 14 shows The magnitude of this current is inversely proportional to  
switching frequency vs. external resistor (Rt).  
the voltage at soft-start pin.  
Soft-Start  
The 20µA current source starts to charge up the exter-  
The IRU3039 has a programmable soft-start to control nal capacitor. In the mean time, the soft-start voltage  
the output voltage rise and limit the current surge at the ramps up, the current flowing into Fb pin starts to de-  
start-up. To ensure correct start-up, the soft-start se- crease linearly and so does the voltage at the positive  
quence initiates when the Vc and Vcc rise above their pin of feedback UVLO comparator and the voltage nega-  
threshold (3.4V and 4.4V respectively) and generates tive input of E/A.  
the Power On Reset (POR) signal. Soft-start function  
operates by sourcing an internal current to charge an When the soft-start capacitor is around 1V, the current  
external capacitor to about 3V. Initially, the soft-start func- flowing into the Fb pin is approximately 32µA. The volt-  
tion clamps the E/A’s output of the PWM converter and age at the positive input of the E/A is approximately:  
disables the short circuit protection. During the power  
32µA×25K = 0.8V  
up, the output starts at zero and voltage at Fb is below  
0.4V. The feedback UVLO is disabled during this time The E/A will start to operate and the output voltage starts  
by injecting a current (64µA) into the Fb. This generates to increase. As the soft-start capacitor voltage contin-  
a voltage about 1.6V (64µA×25K) across the negative ues to go up, the current flowing into the Fb pin will keep  
input of E/A and positive input of the feedback UVLO decreasing. Because the voltage at pin of E/A is regu-  
comparator (see Figure 3).  
lated to reference voltage 0.8V, the voltage at the Fb is:  
VFB = 0.8-25K×(Injected Current)  
Rev. 1.0  
06/06/03  
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5
IRU3039  
The feedback voltage increases linearly as the injecting Shutdown  
current goes down. The injecting current drops to zero The converter can be shutdown by pulling the soft-start  
when soft-start voltage is around 2V and the output volt- pin below 0.4V. The control MOSFET turns off and the  
age goes into steady state.  
synchronous MOSFET turns on during shutdown.  
As shown in Figure 4, the positive pin of feedback UVLO Over-Current Protection  
comparator is always higher than 0.4V, therefore, feed- Over-current protection is achieved with a cycle by cycle  
back UVLO is not functional during soft-start.  
scheme and it is performed by sensing current through  
the RDS(ON) of low side MOSFET. As shown in Figure 5,  
an external resistor (RSET) is connected between OCSet  
pin and the drain of low side MOSFET (Q2) and sets the  
current limit set point. The internal current source devel-  
ops a voltage across RSET. When the low side switch is  
turned on, the inductor current flows through the Q2 and  
results a voltage which is given by:  
Output of UVLO  
POR  
3V  
@2V  
@1V  
Soft-Start  
Voltage  
0V  
64uA  
Current flowing  
into Fb pin  
VOCSET = IOCSET×RSET-RDS(ON)×iL  
---(1)  
0uA  
@1.6V  
Voltage at negative input  
of Error Amp and Feedback  
UVLO comparator  
IOCSET  
0.8V  
0.8V  
IRU3039  
Q1  
Q2  
L1  
VOUT  
RSET  
OCSet  
Osc  
0V  
Voltage at Fb pin  
Figure 4 - Theoretical operational waveforms  
during soft-start.  
Figure 5 - Diagram of the over current sensing.  
the output start-up time is the time period when soft- When voltage VOCSET is below zero, the current sensing  
start capacitor voltage increases from 1V to 2V. The start- comparator flips and disables the oscillator. The high  
up time will be dependent on the size of the external side MOSFET is turned off and the low side MOSFET is  
soft-start capacitor. The start-up time can be estimated turned on until the inductor current reduces to below  
by:  
current set value. The critical inductor current can be  
calculated by setting:  
20µA×TSTART/CSS = 2V-1V  
VOCSET = IOCSET×RSET - RDS(ON)×IL = 0  
For a given start up time, the soft-start capacitor can be  
estimated as:  
RSET×IOCSET  
ISET = IL(CRITICAL) =  
---(2)  
RDS(ON)  
CSS @ 20µA×TSTART/1V  
Internal Regulator  
If the over-current condition is temporary and goes away  
The regulator powers directly from Vcc and generates a quickly, the IRU3039 will resume its normal operation.  
regulated voltage (6V @ 40mA). The output is protected  
for short circuit. This voltage can be used for charge If output is shorted or over-current condition persists,  
pump circuitry as shown in Figure 1.  
the output voltage will keep going down until it is below  
0.4V. Then the output under-voltage lock out comparator  
goes high and turns off both MOSFETs. The operation  
Supply Voltage Under-Voltage Lockout  
The under-voltage lockout circuit assures that the waveforms are shown in Figure 6.  
MOSFET driver outputs remain in the off state whenever  
the supply voltage drops below set parameters. Lockout  
occurs if Vc or Vcc fall below 3.4V and 4.4V respec-  
tively. Normal operation resumes once Vc and Vcc rise  
above the set values.  
Rev. 1.0  
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IRU3039  
From Figure 7, the average inductor current during the  
current limit mode is:  
V
REF  
Feedback  
voltage  
0.4V  
IPK-PK(LIM)  
IO(LIM) = ISET +  
---(4)  
2
FS(NOM)  
IOUT  
Switching  
frequency  
The inductor's ripple current can be expressed as:  
(VIN - VOUT)×VOUT  
IPK-PK(LIM) =  
I
OUT  
VIN×L×fS  
D
MAX/FS(NOM)  
V
OUT  
High Side MOSFET  
turn on time (tON)  
Combination of above equation and (4) results in:  
F
S(NOM)×VIN  
(VIN-VOUT)×VOUT  
2×fS×L×VIN  
IOUT  
ISET = IO(LIM) -  
---(5)  
(
)
<IL>=IOUT  
Combination of equations (5) and (2) results in the rela-  
tionship between RSET and output current limit.  
Average Inductor  
Current  
IO(LIM)  
I
O(MAX)  
IOUT  
RSET = RDS(ON) × IO(LIM) -  
[ (  
---(6)  
(VIN-VOUT)×VOUT  
2×fS×L×VIN  
Normal  
operation  
Over Current  
Shutdown  
Limit Mode by UVLO  
)]  
IOCSET  
Figure 6 - Diagram of over-current operation.  
Where:  
IO(LIM) = The Output Current Limit. Typical is 50%  
higher than nominal output current  
VIN = Maximum Input Voltage  
VOUT = Output Voltage  
fS = Switching Frequency  
L = Output Inductor  
Operation in current limit is shown in Figure 7, the high  
side MOSFET is turned off and inductor current starts to  
decrease. Because the output inductor current is higher  
than the current limit setpoint (ISET), the over-current com-  
parator keeps high until the inductor current decreases  
to be below ISET. Then another cycle starts.  
RDS(ON) = RDS(ON) of Low Side MOSFET  
IOCSET = OC Threshold Set Current  
During over-current mode, the valley inductor current is:  
iL(VALLEY) = ISET  
From the above analysis, the current limit is not only  
dependent on the current setting resistor RSET and RDS(ON)  
of low side MOSFET but it is also dependent on the  
input voltage, output voltage, inductance and switching  
The peak inductor current is given as:  
IL(PEAK) = ISET+(VIN-VOUT)×tON/L  
---(3)  
To avoid undesirable trigger of over-current protection, frequency as well.  
this relationship must be satisfied:  
The cycle-by-cycle over-current limit will hold for a cer-  
IPK-PK(NOM)  
ISET / IO(NOM) -  
tain amount of time, until the output voltage drops below  
0.4V, the under-voltage lock out activates and latches  
off the output driver. The operation waveform is shown in  
Figure 7. Normal operation will resume after IRU3039 is  
powered up again.  
2
iL(PEAK)  
Inductor  
Current  
iL(AVG)  
ISET=iL(VALLEY)  
Current Limit  
Comparator Output  
HDrv  
tON  
tOFF  
Figure 7 - Operation waveforms during current limit.  
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06/06/03  
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7
IRU3039  
APPLICATION INFORMATION  
Design Example:  
The following example is a typical application for IRU3039,  
the schematic is Figure 17 on page 16.  
Css @ 20×tSTART (µF)  
---(8)  
Where tSTART is the desired start-up time (ms)  
VIN = 18V  
VOUT = 3.3V  
IOUT = 8A  
For a start-up time of 5ms, the soft-start capacitor will  
be 0.1µF. Choose a ceramic capacitor at 0.1µF.  
VOUT = 100mV (output voltage ripple @ 3% of VOUT)  
fS = 200KHz  
Boost Supply Vc  
To drive the high side switch, it is necessary to supply a  
gate voltage at least 4V grater than the bus voltage. This  
Output Voltage Programming  
Output voltage is programmed by reference voltage and is achieved by using a charge pump configuration as  
external voltage divider. The Fb pin is the inverting input shown in Figure 9. This method is simple and inexpen-  
of the error amplifier, which is referenced to the voltage sive. The operation of the circuit is as follows: when the  
on non-inverting pin of error amplifier. For this applica- lower MOSFET is turned on, the capacitor (C1) is pulled  
tion, this pin (VP) is connected to reference voltage (VREF). down to ground and charges, up to VOUT2 value, through  
The output voltage is defined by using the following equa- the diode (D1). The bus voltage will be added to this  
tion:  
voltage when upper MOSFET turns on in next cycle,  
and providing supply voltage (Vc) through diode (D2). Vc  
is approximately:  
R6  
R5  
VOUT = VP × 1 +  
---(7)  
( )  
VP = VREF = 0.8V  
Vc @ VOUT2 + VBUS - (VD1 + VD2)  
When an external resistor divider is connected to the Capacitors in the range of 0.1µF and 1µF are generally  
output as shown in Figure 8.  
adequate for most applications. The diode must be a  
fast recovery device to minimize the amount of charge  
fed back from the charge pump capacitor into VOUT2. The  
diodes need to be able to block the full power rail volt-  
age, which is seen when the high side MOSFET is  
switched on. For low voltage application, schottky di-  
odes can be used to minimize forward drop across the  
diodes at start up.  
V
OUT  
IRU3039  
R
6
VREF  
Fb  
R
5
VP  
D1  
C3  
Figure 8 - Typical application of the IRU3039 for  
programming the output voltage.  
VOUT2  
D2  
V
BUS  
Vc  
Equation (7) can be rewritten as:  
Regulator  
C2  
C1  
Q1  
VOUT  
L2  
R6 = R5 ×  
- 1  
( VP )  
HDrv  
Q2  
Choose R5 = 1K  
This will result toR6 = 3.16K  
IRU3039  
If the high value feedback resistors are used, the input  
bias current of the Fb pin could cause a slight increase  
Figure 9 - Charge pump circuit.  
in output voltage. The output voltage set point can be Input Capacitor Selection  
more accurate by using precision resistor.  
The input filter capacitor should be based on how much  
ripple the supply can tolerate on the DC input line. The  
ripple current generated during the on time of upper  
Soft-Start Programming  
The soft-start timing can be programmed by selecting MOSFET should be provided by input capacitor. The RMS  
the soft-start capacitance value. The start-up time of the value of this ripple is expressed by:  
converter can be calculated by using:  
Rev. 1.0  
06/06/03  
www.irf.com  
8
IRU3039  
requirements, yet have high enough ESR to satisfy sta-  
bility requirements. The ESR of the output capacitor is  
calculated by the following relationship:  
IRMS = IOUT  
D×(1-D)  
---(9)  
Where:  
D is the Duty Cycle, D=VOUT/VIN.  
IRMS is the RMS value of the input capacitor current.  
IOUT is the output current for each channel.  
VO  
IO  
ESR ≤  
---(10)  
Where:  
For VIN=20V, IOUT=8A and D=0.165, the IRMS=3A  
VO = Output Voltage Ripple  
i = Inductor Ripple Current  
VO = 100mV and I @ 40% of 8A = 3.2A  
This results to: ESR=31mΩ  
For higher efficiency, a low ESR capacitor is recom-  
mended. Choose three Poscap from Sanyo 25TQC15M  
(25V, 15µF, 90m) with a maximum allowable ripple  
current of 3A.  
The Sanyo TPC series, Poscap capacitor is a good choice.  
The 6TPC330M, 330µF, 6.3V has an ESR 40m. Se-  
lecting two of these capacitors in parallel, results to an  
Inductor Selection  
The inductor is selected based on operating frequency, ESR of @ 20mwhich achieves our low ESR goal.  
transient performance and allowable output voltage ripple.  
The capacitor value must be high enough to absorb the  
Low inductor value results to faster response to step inductor's ripple current. The larger the value of capaci-  
load (high i/t) and smaller size but will cause larger tor, the lower will be the output ripple voltage.  
output ripple due to increase of inductor ripple current.  
As a rule of thumb, select an inductor that produces a Power MOSFET Selection  
ripple current of 10-40% of full load DC.  
The IRU3039 uses two N-Channel MOSFETs. The se-  
lections criteria to meet power transfer requirements is  
For the buck converter, the inductor value for desired based on maximum drain-source voltage (VDSS), gate-  
operating ripple current can be determined using the fol- source drive voltage (VGS), maximum output current, On-  
lowing relation:  
resistance RDS(ON) and thermal management.  
i  
t  
1
fS  
VOUT  
VIN  
VIN - VOUT = L×  
; t = D×  
; D =  
The MOSFET must have a maximum operating voltage  
(VDSS) exceeding the maximum input voltage (VIN).  
VOUT  
L = (VIN - VOUT)×  
---(11)  
VIN×∆i×fS  
The gate drive requirement is almost the same for both  
MOSFETs. Logic-level transistor can be used and cau-  
tion should be taken with devices at very low VGS to pre-  
vent undesired turn-on of the complementary MOSFET,  
which results a shoot-through current.  
Where:  
VIN = Maximum Input Voltage  
VOUT = Output Voltage  
Di = Inductor Ripple Current  
fS = Switching Frequency  
Dt = Turn On Time  
The total power dissipation for MOSFETs includes con-  
duction and switching losses. For the Buck converter,  
the average inductor current is equal to the DC load cur-  
rent. The conduction loss is defined as:  
D = Duty Cycle  
If i = 37%(IO), then the output inductor will be:  
L = 4.65µH  
2
PCOND(Upper Switch) = ILOAD×RDS(ON)×D×ϑ  
The Coilcraft DO5022HC series provides a range of in-  
ductors in different values, low profile suitable for large  
currents, 4.7µH, 13A is a good choice for this applica-  
tion. This will result to a ripple approximately 37% of  
output current.  
2
PCOND(Lower Switch) = ILOAD×RDS(ON)×(1 - D)×ϑ  
ϑ = RDS(ON) Temperature Dependency  
The RDS(ON) temperature dependency should be consid-  
ered for the worst case operation. This is typically given  
Output Capacitor Selection  
The criteria to select the output capacitor is normally in the MOSFET data sheet. Ensure that the conduction  
based on the value of the Effective Series Resistance losses and switching losses do not exceed the package  
(ESR). In general, the output capacitor must have low ratings or violate the overall thermal budget.  
enough ESR to meet output ripple and load transient  
Rev. 1.0  
06/06/03  
www.irf.com  
9
IRU3039  
Choose IRF7466 for control MOSFET and IRF7458 for These values are taken under a certain condition test.  
synchronous MOSFET. These devices provide low on- For more details please refer to the IRF7466 and IRF7458  
resistance in a compact SOIC 8-Pin package.  
data sheets.  
The MOSFETs have the following data:  
By using equation (12), we can calculate the total switch-  
ing losses.  
IRF7466  
IRF7458  
VDSS = 30V  
ID = 11A  
RDS(ON) = 12.5mΩ  
VDSS = 30V  
ID = 14A  
RDS(ON) = 8mΩ  
PSW(TOTAL) = 92mW  
Programming the Over-Current Limit  
The over-current threshold can be set by connecting a  
resistor (RSET) from drain of low side MOSFET to the  
OCSet pin. The resistor can be calculated by using equa-  
tion (2).  
The total conduction losses will be:  
PCON(TOTAL) = PCON(UPPER) + PCON(LOWER)  
PCON(TOTAL) = 0.85W  
The switching loss is more difficult to calculate, even The RDS(ON) has a positive temperature coefficient and it  
though the switching transition is well understood. The should be considered for the worse case operation.  
reason is the effect of the parasitic components and  
switching times during the switching procedures such  
RDS(ON) = 8mΩ×1.5 = 12mΩ  
ISET @ IO(LIM) = 8A×1.5 = 12A  
as turn-on / turnoff delays and rise and fall times. The  
(50% over nominal output current)  
control MOSFET contributes to the majority of the switch-  
This results to:  
RSET = 5.76KΩ  
ing losses in synchronous Buck converter. The synchro-  
nous MOSFET turns on under zero voltage conditions,  
therefore, the turn on losses for synchronous MOSFET Feedback Compensation  
can be neglected. With a linear approximation, the total The IRU3039 is a voltage mode controller; the control  
switching loss can be expressed as:  
loop is a single voltage feedback path including error  
amplifier and error comparator. To achieve fast transient  
response and accurate output regulation, a compensa-  
tion circuit is necessary. The goal of the compensation  
network is to provide a closed loop transfer function with  
the highest 0dB crossing frequency and adequate phase  
margin (greater than 458).  
VDS(OFF)  
tr + tf  
T
PSW =  
×
×ILOAD  
---(12)  
2
Where:  
VDS(OFF) = Drain to Source Voltage at off time  
tr = Rise Time  
tf = Fall Time  
T = Switching Period  
ILOAD = Load Current  
The output LC filter introduces a double pole, –40dB/  
decade gain slope above its corner resonant frequency,  
and a total phase lag of 1808 (see Figure 11). The Reso-  
nant frequency of the LC filter is expressed as follows:  
The switching time waveform is shown in Figure 10.  
VDS  
1
90%  
FLC =  
---(13)  
2π× LO×CO  
Figure 11 shows gain and phase of the LC filter. Since  
we already have 1808 phase shift just from the output  
filter, the system risks being unstable.  
10%  
Gain  
Phase  
VGS  
08  
0dB  
td  
(ON)  
td(OFF)  
tr  
tf  
-40dB/decade  
Figure 10 - Switching time waveforms.  
From IRF7466 data sheet we obtain:  
-180  
8
IRF7466  
tr = 2.8ns  
tf = 3.6ns  
F
LC Frequency  
F
LC Frequency  
Figure 11 - Gain and phase of LC filter.  
Rev. 1.0  
06/06/03  
www.irf.com  
10  
IRU3039  
The IRU3039’s error amplifier is a differential-input First select the desired zero-crossover frequency (Fo):  
transconductance amplifier. The output is available for  
DC gain control or AC phase compensation.  
Use the following equation to calculate R4:  
Fo > FESR and FO (1/5 ~ 1/10)×fS  
The E/A can be compensated with or without the use of  
1
gm  
VOSC  
VIN  
Fo×FESR  
R5 + R6  
R5  
R4 =  
×
×
×
---(18)  
local feedback. When operated without local feedback,  
the transconductance properties of the E/A become evi-  
dent and can be used to cancel one of the output filter  
poles. This will be accomplished with a series RC circuit  
from Comp pin to ground as shown in Figure 12.  
2
FLC  
Where:  
VIN = Maximum Input Voltage  
VOSC = Oscillator Ramp Voltage  
Fo = Crossover Frequency  
Note that this method requires that the output capacitor  
should have enough ESR to satisfy stability requirements.  
In general, the output capacitor’s ESR generates a zero  
typically at 5KHz to 50KHz which is essential for an  
acceptable phase margin.  
FESR = Zero Frequency of the Output Capacitor  
FLC = Resonant Frequency of the Output Filter  
R5 and R6 = Resistor Dividers for Output Voltage  
Programming  
gm = Error Amplifier Transconductance  
For:  
VIN = 18V  
VOSC = 3.3V  
Fo = 20KHz  
FESR = 12KHz  
The ESR zero of the output capacitor expressed as fol-  
FLC = 2.8KHz  
R5 = 1K  
R6 = 3.16K  
gm = 700µmho  
lows:  
1
2π×ESR×Co  
FESR =  
---(14)  
VOUT  
This results to R4=12.08K  
Choose R4=14K  
R6  
Fb  
Comp  
To cancel one of the LC filter poles, place the zero be-  
fore the LC filter resonant frequency pole:  
Ve  
E/A  
R5  
C9  
Vp=VREF  
FZ @ 75%FLC  
R4  
1
FZ @ 0.75×  
---(19)  
Gain(dB)  
2π LO × CO  
For:  
H(s) dB  
Lo = 4.7µH  
Co = 660µF  
FZ = 2.1KHz  
R4 = 14K  
Frequency  
FZ  
Using equations (17) and (19) to calculate C9, we get:  
Figure 12 - Compensation network without local  
feedback and its asymptotic gain plot.  
C9 @ 5300pF; Choose C9=5600pF  
One more capacitor is sometimes added in parallel with  
C9 and R4. This introduces one more pole which is mainly  
used to suppress the switching noise. The additional  
pole is given by:  
The transfer function (Ve / VOUT) is given by:  
R5  
1 + sR4C9  
sC9  
H(s) = gm×  
×
---(15)  
( )  
R6 + R5  
1
FP =  
The (s) indicates that the transfer function varies as a  
function of frequency. This configuration introduces a gain  
and zero, expressed by:  
C9×CPOLE  
C9 + CPOLE  
2π×R4×  
The pole sets to one half of switching frequency which  
results in the capacitor CPOLE:  
R5  
R6×R5  
|H(s=j×2π×FO)| = gm×  
×R4  
---(16)  
1
1
1
FZ =  
---(17)  
CPOLE =  
@
π×R4×fS  
2π×R4×C9  
1
C9  
π×R4×fS -  
|H(s)| is the gain at zero cross frequency.  
fS  
2
for FP <<  
Rev. 1.0  
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11  
IRU3039  
For a general solution for unconditionally stability for  
ceramic capacitor with very low ESR and any type of  
output capacitors, in a wide range of ESR values we  
should implement local feedback with a compensation  
network. The typically used compensation network for  
voltage-mode controller is shown in Figure 13.  
FP1 = 0  
FP2 =  
1
2π×R8×C10  
1
1
FP3 =  
@
2π×R7×C12  
C12×C11  
(C12+C11 )  
2π×R7×  
VOUT  
1
ZIN  
C12  
FZ1 =  
FZ2 =  
2π×R7×C11  
C10  
R7  
1
1
C11  
@
2π×C10×(R6 + R8)  
2π×C10×R6  
R8  
R6  
Zf  
Cross Over Frequency:  
Fb  
VIN  
FO = R7×C10×  
VOSC  
Where:  
1
Ve  
E/A  
---(21)  
×
Comp  
R5  
2π×Lo×Co  
Vp=VREF  
VIN = Maximum Input Voltage  
VOSC = Oscillator Ramp Voltage  
Lo = Output Inductor  
Gain(dB)  
H(s) dB  
Co = Total Output Capacitors  
The stability requirement will be satisfied by placing the  
poles and zeros of the compensation network according  
to following design rules. The consideration has been  
taken to satisfy condition (20) regarding transconduc-  
tance error amplifier.  
Frequency  
F
Z
1
F
Z
2
F
P
2
FP3  
Figure 13 - Compensation network with local  
feedback and its asymptotic gain plot.  
In such configuration, the transfer function is given by:  
These design rules will give a crossover frequency ap-  
proximately one-tenth of the switching frequency. The  
higher the band width, the potentially faster the load tran-  
sient speed. The gain margin will be large enough to  
Ve  
1 - gmZf  
=
VOUT  
1 + gmZIN  
The error amplifier gain is independent of the transcon- provide high DC-regulation accuracy (typically -5dB to -  
ductance under the following condition:  
12dB). The phase margin should be greater than 458 for  
overall stability.  
gmZf >> 1  
and  
gmZIN >>1  
---(20)  
By replacing ZIN and Zf according to Figure 9, the trans- Based on the frequency of the zero generated by ESR  
former function can be expressed as:  
versus crossover frequency, the compensation type can  
be different. The table below shows the compensation  
type and location of crossover frequency.  
(1+sR7C11)×[1+sC10(R6+R8)]  
1
×
H(s) =  
sR6(C12+C11)  
C12C11  
1+sR7  
×(1+sR8C10)  
Compensator  
Type  
Location of Zero  
Crossover Frequency  
(FO)  
Typical  
Output  
[ (C12+C11)]  
Capacitor  
Electrolytic,  
Tantalum  
Tantalum,  
Ceramic  
As known, transconductance amplifier has high imped-  
ance (current source) output, therefore, consider should  
be taken when loading the E/A output. It may exceed its  
source/sink output current capability, so that the ampli-  
fier will not be able to swing its output voltage over the  
necessary range.  
Type II (PI)  
FPO < FZO < FO < fS/2  
Type III (PID)  
Method A  
FPO < FO < FZO < fS/2  
FPO < FO < fS/2 < FZO  
Type III (PID)  
Method B  
Ceramic  
Table - The compensation type and location of zero  
crossover frequency.  
The compensation network has three poles and two ze-  
ros and they are expressed as follows:  
Detail information is dicussed in application Note AN-  
1043 which can be downloaded from the IR Web-Site.  
Rev. 1.0  
06/06/03  
www.irf.com  
12  
IRU3039  
Layout Consideration  
The layout is very important when designing high fre- the ESR, replace the single input capacitor with two par-  
quency switching converters. Layout will affect noise allel units. The feedback part of the system should be  
pickup and can cause a good design to perform with kept away from the inductor and other noise sources  
less than expected results.  
and be placed close to the IC. In multilayer PCB, use  
one layer as power ground plane and have a separate  
Start to place the power components. Make all the con- control circuit ground (analog ground), to which all sig-  
nections in the top layer with wide, copper filled areas. nals are referenced. The goal is to localize the high cur-  
The inductor, output capacitor and the MOSFET should rent path to a separate loop that does not interfere with  
be close to each other as possible. This helps to reduce the more sensitive analog control function. These two  
the EMI radiated by the power traces due to the high grounds must be connected together on the PC board  
switching currents through them. Place input capacitor layout at a single point.  
directly to the drain of the high-side MOSFET. To reduce  
450  
400  
350  
300  
250  
200  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
Ω  
Rt (K  
)
Figure 14 - Switching Frequency versus Resistor.  
Rev. 1.0  
06/06/03  
www.irf.com  
13  
IRU3039  
TYPICAL APPLICATION  
5V  
+12V  
L1  
1uH  
C4  
1uF  
C3  
1uF  
C2  
C1  
47uF  
2x 150uF  
Vcc  
Vc  
HDrv  
Q1  
IRF7457  
SS / SD U1  
D1  
C7  
L2  
0.1uF  
IRU3039  
R2  
7.12K  
OCSet  
VOUT  
3.3uH  
V
V
P
2.5V @ 10A  
Q2  
IRF7457  
REF  
LDrv  
C6  
2x 330uF, 40m  
Rt  
V
OUT2  
Fb  
Comp  
C8  
2200pF  
R3  
2.15K  
Gnd  
PGnd  
R1  
28K  
R4  
1K  
Figure 15 - Typical application of the IRU3039 with two input supplies.  
Rev. 1.0  
06/06/03  
www.irf.com  
14  
IRU3039  
TYPICAL APPLICATION  
5V  
12V  
L1  
5V  
1uH  
C1  
1uF  
C2  
1uF  
C3  
2x 100uF, 55m  
10TPB100M  
C4  
47uF  
Vcc Vc  
V
V
REF  
P
V
OUT2  
Q1  
1/2 of IRF7313  
HDrv  
U1  
IRU3039  
D1  
L2  
R7  
8K  
SS / SD  
OCSet  
LDrv  
V
DDQ  
C6  
0.1uF  
4.7uH  
Q1  
1/2 of IRF7313  
1.8V @ 5A  
C7  
2x 330uF, 40m  
6TPC330M  
PGnd  
Rt  
R1  
Comp  
C8  
4.7nF  
Fb  
1.25K  
Gnd  
R3  
1K  
R2  
27K  
5V  
12V  
C9  
1uF  
C10  
1uF  
C11  
100uF, 55m  
10TPB100M  
V
V
REF Vcc Vc  
R4  
1K  
Q2  
1/2 of IRF7313  
U2  
P
HDrv  
R5  
1K  
IRU3038  
D2  
L3  
VTT (0.9V @ 3A)  
SS / SD  
4.7uH  
Q2  
1/2 of IRF7313  
C12  
0.15uF  
LDrv  
C13  
2x 330uF, 40m  
6TPC330M  
PGnd  
Rt  
Comp  
C14  
5.6nF  
Fb  
Gnd  
R6  
13K  
Figure 16 - Typical application of IRU3039 for DDR memory when IRU3039  
generates VCORE and IRU3038 generates the termination voltage.  
Rev. 1.0  
06/06/03  
www.irf.com  
15  
IRU3039  
DEMO-BOARD APPLICATION  
18V to 3.3V @ 8A  
18V  
D1  
L1  
C11  
1uF  
C3  
1uF  
1uH  
C2A,B,C  
C13  
1uF  
C1  
15uF  
3x 15uF  
25V  
C5  
0.1uF  
V
OUT2  
Vc  
HDrv  
Vcc  
SS / SD  
Q1  
U1  
IRU3039  
C6  
0.1uF  
IRF7466  
L2  
R4  
D2  
3.3V  
@ 8A  
OCSet  
4.7uH  
V
V
P
5.76K  
C8  
C10  
0.1uF  
470pF  
R8  
4.7  
C9A,B  
2x 330uF  
40m  
REF  
LDrv  
C12  
1uF  
Q2  
IRF7458  
Rt  
Comp  
C7  
5600pF  
R9  
3.16K  
Gnd  
PGnd Fb  
R7  
14K  
R10  
1K  
Figure 17 - Demo-board application of the IRU3039.  
PARTS LIST  
Ref Desig Description  
Value  
Qty  
1
Part#  
IRF7466  
Manuf  
Web site (www.)  
irf.com  
Q1  
Q2  
U1  
D1  
D2  
L1  
MOSFET  
MOSFET  
Controller  
Schottky Diode Fast Switching  
Schottky Diode Fast Switching  
30V, 12.5m, 11A  
30V, 8m, 14A  
Synchronous PWM  
IR  
IR  
IR  
IR  
IR  
1
1
1
IRF7458  
IRU3039  
BAT54S  
1
1
1
BAT54  
Inductor  
Inductor  
1µH, 3A  
DS1608C-102  
DO5022P-472HC  
25TQC15M  
ECJ-2VF1E104Z  
Coilcraft  
Coilcraft  
Sanyo  
coilcraft.com  
sanyo.com  
L2  
4.7µH, 13A  
15µF, 25V  
0.1µF, Y5V, 25V  
5600pF, X7R, 50V  
470pF, X7R, 50V  
330uF, 40mΩ  
1µF, Y5V, 16V  
1µF, X7R, 25V  
5.76K  
C1,C2A,B,C Cap, Poscap  
4
3
1
C5,6,10  
C7  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Resistor  
Resistor  
Resistor  
Resistor  
Resistor  
Panasonic maco.panasonic.co.jp  
ECU-V1H562KBG Panasonic  
C8  
1
2
3
ECJ-2VC1H471J  
6TPB-330M  
ECJ-2VF1C105Z  
ECJ-3YB1E105K  
Panasonic  
Sanyo sanyo.com  
Panasonic maco.panasonic.co.jp  
Panasonic  
C9A,B  
C3,11,12  
C13  
R4  
1
1
1
R7  
14K  
R8  
R9  
R10  
4.7Ω  
3.16K  
1K  
1
1
1
Rev. 1.0  
06/06/03  
www.irf.com  
16  
IRU3039  
TYPICAL OPERATING CHARACTERISTICS  
Test Conditions:  
VIN=20V, VOUT=3.3V, IOUT=0-8A, Fs=200KHz  
Figure 18 - Normal condition at No Load.  
Figure 20 - Soft-Start.  
Ch1: HDrv, Ch2: LDrv, Ch4: Inductor Current  
Ch1: VIN, Ch2: VOUT, Ch3: VOUT2, Ch4: Vss  
Figure 19 - Soft-Start pin grounded.  
Ch1: HDrv, Ch2: LDrv  
Figure 21 - Output Ripple.  
Ch1: Output Ripple, Ch2: HDrv, Ch3: LDrv,  
Ch4: Inductor Current  
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17  
IRU3039  
TYPICAL OPERATING CHARACTERISTICS  
Test Conditions:  
VIN=20V, VOUT=3.3V, IOUT=0-8A, Fs=200KHz  
8A  
0A  
Figure 22 - Output shorted at start up.  
Ch1: VOUT, Ch3: Vss, Ch4: Inductor Current  
Figure 23 - Load Transient Response  
Ch1: VOUT, Ch3: Output Current  
90  
88  
86  
84  
82  
80  
78  
76  
74  
72  
70  
0
1
2
3
4
5
6
7
8
9
10  
11  
Output Current (A)  
Figure 24 - Efficiency Measurement.  
VIN=20V, VOUT=3.3V  
Rev. 1.0  
06/06/03  
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18  
IRU3039  
TYPICAL PERFORMANCE CHARACTERISTICS  
For all charts: VC=VCC=12V, 20V, 24V  
Note:Data are taken with few samples to indicate the variation of these parameters over the wide temperature range.  
0.802  
6.2  
0.801  
6.15  
0.8  
6.1  
0.799  
6.05  
0.798  
12 Volt  
20 Volt  
6
0.797  
24 Volt  
12 Volt  
20 Volt  
24 Volt  
5.95  
5.9  
0.796  
0.795  
5.85  
0.794  
0.793  
5.8  
-45  
-10  
25  
60  
95  
130  
-45  
-10  
25  
60  
95  
130  
Temperature (C)  
Temperature (C)  
Figure 28 - VOUT2 vs.Temperature  
Figure 25 - VREF vs.Temperature  
410  
215  
214  
213  
212  
211  
210  
209  
405  
400  
12 Volt  
20 Volt  
12 Volt  
24 Volt  
20 Volt  
24 Volt  
395  
390  
208  
207  
206  
205  
204  
385  
-45  
-45  
-10  
25  
60  
95  
130  
-10  
25  
60  
95  
130  
Temperature(C)  
Temperature (C)  
Figure 26 - Frequency vs.Temperature  
FS=200KHz  
Figure 29 - Frequency vs.Temperature  
FS=400KHz  
200  
150  
100  
50  
200  
150  
100  
50  
12 Volts  
20 Volts  
24 Volts  
12 Volts  
20 Volts  
24 Volts  
0
0
-45  
-10  
25  
60  
95  
130  
-45  
-10  
25  
60  
95  
130  
Temperature (C)  
Temperature (C)  
Figure 27 - Deadtime, Control FET Drive  
Rising Time vs.Temperature  
Figure 30 - Deadtime, Sync FET Drive  
Rising Time vs.Temperature  
FS=400KHz, CLOAD=3300pF  
FS=400KHz, CLOAD=3300pF  
Rev. 1.0  
06/06/03  
www.irf.com  
19  
IRU3039  
TYPICAL PERFORMANCE CHARACTERISTICS  
For all charts: VC=VCC=12V, 20V, 24V  
Note:Data are taken with few samples to indicate the variation of these parameters over the wide temperature range.  
200  
180  
160  
140  
120  
100  
80  
200  
180  
160  
140  
120  
100  
80  
12 Volts  
20 Volts  
24 Volts  
12 Volts  
20 Volts  
24 Volts  
60  
60  
40  
40  
20  
20  
0
0
-45  
-10  
25  
60  
95  
130  
-45  
5
55  
105  
155  
Temperature (C)  
Temperature (C)  
Figure 31 - Control FET Drive Rise Time vs.Temp.  
FS=400KHz, CLOAD=3300pF  
Figure 33 - Control FET Drive Fall Time vs.Temp.  
FS=400KHz, CLOAD=3300pF  
200  
180  
160  
140  
20  
18  
16  
14  
12 Volts  
120  
12  
12 Volts  
20 Volts  
20 Volts  
24 Volts  
10  
8
100  
80  
60  
40  
20  
0
24 Volts  
6
4
2
0
-45  
-10  
25  
60  
95  
130  
-45  
-10  
25  
60  
95  
130  
Temperature (C)  
Temperature (C)  
Figure 32 - Sync FET Drive Rise Time vs.Temp.  
FS=400KHz, CLOAD=3300pF  
Figure 34 - Sync FET Drive Fall Time vs.Temp.  
FS=400KHz, CLOAD=3300pF  
IR WORLD HEADQUARTERS:233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information  
Data and specifications subject to change without notice. 02/01  
Rev. 1.0  
06/06/03  
www.irf.com  
20  
IRU3039  
(H) MLPQ 5x5 Package  
20-Pin  
D
D/2  
D2  
EXPOSED PAD  
PIN NUMBER 1  
PIN 1 MARK AREA  
(See Note1)  
E/2  
E2  
E
R
L
e
TOP VIEW  
B
BOTTOMVIEW  
Note 1: Details of pin #1 are optional, but  
must be located within the zone indicated.  
The identifier may be molded, or marked  
features.  
A
A3  
A1  
SIDE VIEW  
20-PIN 5x5  
SYMBOL  
DESIG  
A
MIN  
NOM  
MAX  
1.00  
0.05  
0.80  
0.00  
0.90  
0.02  
0.20 REF  
A1  
A3  
B
0.23  
3.00  
3.00  
0.30  
5.00 BSC  
0.38  
3.25  
3.25  
D
D2  
E
3.15  
5.00 BSC  
E2  
e
3.15  
0.65 BSC  
L
0.45  
0.55  
---  
0.65  
---  
R
0.115  
NOTE: ALL MEASUREMENTS  
ARE IN MILLIMETERS.  
Rev. 1.0  
06/06/03  
www.irf.com  
21  
IRU3039  
PACKAGE SHIPMENT METHOD  
PKG  
PACKAGE  
PIN  
PARTS  
PARTS  
T & R  
DESIG  
DESCRIPTION  
COUNT  
PER TUBE  
PER REEL  
Orientation  
H
MLPQ 5x5  
20  
---  
3000  
Fig A  
1
1
1
Feed Direction  
Figure A - Live Bug  
IR WORLD HEADQUARTERS:233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information  
Data and specifications subject to change without notice. 02/01  
Rev. 1.0  
06/06/03  
www.irf.com  
22  

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