ITS4060S-SJ-N [INFINEON]

高边功率开关,集成了垂直功率 FET,提供嵌入式保护和诊断功能。;
ITS4060S-SJ-N
型号: ITS4060S-SJ-N
厂家: Infineon    Infineon
描述:

高边功率开关,集成了垂直功率 FET,提供嵌入式保护和诊断功能。

开关
文件: 总21页 (文件大小:736K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Features  
CMOS compatible input  
Switching all types of resistive, inductive and capacitive loads  
Fast demagnetization of inductive loads  
Very low standby current  
Optimized Electromagnetic Compatibility (EMC)  
Overload protection  
Current limitation  
Short circuit protection  
Thermal shutdown with restart  
Overvoltage protection (including load dump)  
Reverse battery protection with external resistor  
Loss of GND and loss of Vbb protection  
Electrostatic Discharge Protection (ESD)  
Green Product (RoHS compliant)  
Applications  
All types of resistive, inductive and capacitive loads  
Power switch for 12V and 24V DC applications with CMOS compatible control interface  
Driver for electromagnetic relays  
Power management for high-side-switching with low current consumption in OFF-mode  
Product validation  
Qualified for industrial applications according to the relevant tests of JEDEC.  
Description  
The ITS4060S-SJ-N is a protected single channel smart high-side NMOS power switch in a PG-DSO-8 package  
with charge pump and CMOS compatible input. The device is monolithically integrated in Smart technology.  
Data Sheet  
Rev 1.1  
2019-07-25  
www.infineon.com/industrial-profets  
1
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Table 1  
Product summary  
Parameter  
Symbol  
VSAZmin  
VS  
Values  
Overvoltage protection  
Operating voltage range  
On-state resistance  
41 V  
5 < VS < 34V  
typ. 50 m  
2.6 A  
RDSON  
IL(nom)  
Tj  
Nominal load current  
Operating temperature range  
Stand-by current  
-40°C to 125°C  
15 µA  
ISSTB  
Type  
Package  
Marking  
ITS4060S-SJ-N  
PG-DSO-8  
I060SN  
Data Sheet  
2
Rev1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Table of Contents  
1
Block diagram and terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2
2.1  
2.2  
Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3
General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Functional range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.1  
3.2  
3.3  
4
5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Typical performance graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
6
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Special feature description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Typical application waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Protection behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
6.1  
6.2  
6.3  
7
8
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Data Sheet  
3
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Block diagram and terms  
1
Block diagram and terms  
ITS4060S-SJ-N  
VS  
5
6
7
8
Bias  
Supervision  
Overvoltage  
Protection  
Current  
Limiter  
Gate  
Control  
Circuit  
IN  
Logic  
2
4
ESD  
Protection  
NC  
Temperature  
Sensor  
OUT  
3
1
GND  
Figure 1  
Block diagram  
Voltage- and Current-Definitions:  
Switching Times and Slew Rate Definitions:  
VIN  
H
ITS4060S-SJ-N  
L
VS  
5
6
7
8
t
IS  
VOUT  
+VS  
Bias  
Supervision  
Overvoltage  
Protection  
Current  
Limiter  
VDS  
90%  
70%  
SROFF  
40%  
30%  
Gate  
Control  
Circuit  
IN  
Logic  
2
4
IIN  
ESD  
Protection  
SRON  
10%  
NC  
Temperature  
Sensor  
0
OUT  
tON  
tOFF  
t
t
3
IOUT  
IL  
IL  
1
0
GND  
OFF  
ON  
OFF  
GND  
Figure 2  
Terms - parameter definition  
Data Sheet  
4
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Pin configuration  
2
Pin configuration  
2.1  
Pin assignment  
GND  
IN  
1
2
3
4
8
7
6
5
VS  
VS  
OUT  
NC  
VS  
VS  
P-DSO-8  
Figure 3  
Pin configuration top view, PG-DSO-8  
2.2  
Pin definitions and functions  
Pin  
Symbol Function  
1
GND  
IN  
Logic ground  
2
Input, controls the power switch; the powerswitch is ON when high  
3
OUT  
NC  
Output to the load  
4
Not connected  
5, 6, 7, 8  
VS  
Supply voltage (design the wiring for the maximum short circuit current  
and also for low thermal resistance)  
Data Sheet  
5
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
General product characteristics  
3
General product characteristics  
3.1  
Absolute maximum ratings  
Table 2  
Absolute maximum ratings 1) at Tj = 25°C unless otherwise specified. Currents flowing into  
the device unless otherwise specified in chapter “Block Diagram and Terms”  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Supply voltage VS  
Voltage  
VS  
40  
36  
V
V
4.1.1  
Voltage for short circuit protection  
Output stage OUT  
VSSC  
-40°C < Tj < 150°C 4.1.2  
Output current; (short circuit current IOUT  
self  
A
4.1.3  
see electrical characteristics)  
limited  
Input IN  
Voltage  
VIN  
IIN  
-10  
-5  
16  
5
V
4.1.4  
4.1.5  
Current  
mA  
Temperatures  
Junction temperature  
Storage temperature  
Power dissipation  
Ta = 25 °C2)  
Tj  
-40  
-55  
125  
125  
°C  
°C  
4.1.6  
4.1.7  
Tstg  
P tot  
1.5  
W
4.1.8  
4.1.9  
Inductive load switch-off energy dissipation  
Tj = 125 °C; VS=13.5V; IL= 1.5A3)  
EAS  
900  
mJ single pulse  
ESD Susceptibility  
ESD susceptibility (input pin IN)  
ESD susceptibility (output pin OUT)  
ESD susceptibility (all other pins)  
VESD  
VESD  
VESD  
-1  
-6  
-4  
1
6
4
kV  
kV  
kV  
HBM4)  
HBM4)  
HBM4)  
4.1.10  
4.1.12  
4.1.11  
1) Not subject to production test, specified by design  
2) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70mm thick) copper area for Vbb connection.  
PCB is vertical without blown air  
3) Not subject to production test, specified by design  
4) ESD susceptibility HBM according to ANSI/ESDA/JEDEC JS001 (1.5 k, 100 pF)  
Note:  
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Integrated protection functions are designed to prevent IC destruction under fault conditions  
described in the data sheet. Fault conditions are considered as “outside” the normal operating  
range. Protection functions are neither designed for continuous nor repetitive operation.  
Data Sheet  
6
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
General product characteristics  
3.2  
Functional range  
Table 3  
Functional range  
Parameter  
Symbol  
Values  
Typ.  
Unit Note or  
Test Condition  
Number  
Min.  
Max.  
Nominal operating voltage  
VS  
5
34  
V
VS increasing  
4.2.1  
Note:  
Within the functional range the IC operates as described in the circuit description. The electrical  
characteristics are specified within the conditions given in the related electrical characteristics  
table.  
3.3  
Thermal resistance  
Note:  
This thermal data was generated in accordance with JEDEC JESD51 standards. For more  
information, go to www.jedec.org.  
Table 4  
Thermal resistance1)  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Thermal resistance - unction to Rthj-pin5  
pin5  
26.7  
K/W  
4.3.1  
4.3.2  
2)  
Thermal resistance - junction to RthJA_1s0p  
ambient - 1s0p, minimal  
footprint  
140.1 –  
K/W  
3)  
4)  
5)  
6)  
Thermal resistance - junction to RthJA_1s0p_300mm  
85.8  
74.7  
78.2  
76.6  
K/W  
K/W  
K/W  
K/W  
4.3.3  
4.3.4  
4.3.5  
4.3.6  
ambient - 1s0p, 300mm2  
Thermal resistance - junction to RthJA_1s0p_600mm  
ambient - 1s0p, 600mm2  
Thermal resistance - junction to RthJA_2s2p  
ambient - 2s2p  
Thermal resistance - junction to RthJA_2s2p  
ambient with thermal vias - 2s2p  
1) Not subject to production test, specified by design  
2) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, footprint; the product  
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.  
3) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, Cu, 300mm2; the  
product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.  
4) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, 600mm2; the product  
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.  
5) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; the product  
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).  
6)Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board with two  
thermal vias; the product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper  
layers (2 x 70µm Cu, 2 x 35µm Cu. The diameter of the two vias are equal 0.3mm and have a plating of 25um  
with a copper heatsink area of 3mm x 2mm). JEDEC51-7: The two plated-through hole vias should have a  
solder land of no less than 1.25 mm diameter with a drill hole of no less than 0.85 mm diameter.  
Data Sheet  
7
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Electrical characteristics  
4
Electrical characteristics  
Table 5  
VS=13.5V; Tj = -40°C to 125°C; all voltages with respect to ground. Currents flowing into the  
device unless otherwise specified in chapter “Block diagram and terms”. Typical values at  
Vs = 13.5V, Tj = 25°C  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Powerstage  
NMOS ON resistance  
RDSON  
RDSON  
ILNOM  
50  
95  
3.1  
60  
120  
mIOUT= 2A;Tj = 25°C;  
9V < VS < 34V;  
5.0.1  
5.0.2  
5.0.3  
VIN= 5V  
NMOS ON resistance  
mIOUT= 2A;Tj = 125°C;  
9V < VS < 34V;  
VIN= 5V  
Nominal load current;  
device on PCB 1)  
2.6  
A
Tpin5 = 85°C  
Timings of power stages2)  
Turn ON time (to 90% of Vout);  
L to H transition of VIN  
tON  
90  
180  
230  
1.5  
µs  
µs  
VS=13.5V; RL = 47Ω  
VS=13.5V; RL = 47Ω  
5.0.4  
5.0.5  
5.0.6  
Turn OFF time (to 10% of Vout);  
H to L transition of VIN  
tOFF  
SRON  
110  
0.7  
ON-slew rate; VOUT / t  
(10 to 30% of Vout);  
L to H transition of VIN  
V / µs VS=13.5V; RL = 47Ω  
V / µs VS=13.5V; RL = 47Ω  
OFF-slew rate; VOUT / t  
(70 to 40% of Vout);  
SROFF  
0.7  
1.5  
5.0.7  
H to L transition of VIN  
Under voltage lockout (charge pump start-stop-restart)  
Supply undervoltage;  
charge pump stop voltage  
VSUV  
5.5  
5.5  
V
V
VS decreasing  
VS increasing  
5.0.8  
5.0.9  
Supply startup voltage;  
VSSU  
4.0  
Charge pump restart voltage  
Current consumption  
Operating current  
Standby current  
IGND  
0.8  
1.5  
10  
mA VIN= 5V  
5.0.10  
5.0.11  
ISSTB  
µA  
µA  
µA  
VIN= 0V; VOUT= 0V  
-40°C < Tj < 85°C  
Standby current  
ISSTB  
15  
5
VIN= 0V; VOUT= 0V  
Tj = 125°C  
5.0.12  
5.0.13  
Output leakage current  
IOUTLK  
VIN= 0V; VOUT= 0V  
Protection functions 3)  
Initial peak short circuit current  
limit  
ILSCP  
28  
A
Tj = -40°C; VS = 20V  
5.0.14  
VIN = 5.0V; tm =150µs  
Data Sheet  
8
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Electrical characteristics  
Table 5  
VS=13.5V; Tj = -40°C to 125°C; all voltages with respect to ground. Currents flowing into the  
device unless otherwise specified in chapter “Block diagram and terms”. Typical values at  
Vs = 13.5V, Tj = 25°C  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Initial peak short circuit current  
limit  
ILSCP  
ILSCP  
ILSCR  
VDSCL  
VSAZ  
TjTrip  
THYS  
17  
A
A
A
V
Tj = 25°C; VS = 20V  
IN = 5.0V; tm =150µs  
Tj =125°C; VS = 20V  
IN = 5.0V; tm =150µs  
5.0.15  
5.0.16  
5.0.17  
5.0.18  
5.0.19  
5.0.20  
5.0.21  
V
Initial peak short circuit current  
limit  
9
V
Repetitive short circuit current  
limit Tj = TjTrip ; see timing diagrams  
12  
47  
VIN = 5.0V  
IS = 4mA  
IS = 4mA  
Output clamp at VOUT = VS - VDSCL  
(inductive load switch off)  
41  
41  
150  
Overvoltage protection  
VOUT = VS - VONCL  
V
Thermal overload  
trip temperature  
°C  
K
Thermal hysteresis  
10  
Reverse battery4)  
Continuous reverse battery  
voltage  
VSREV  
VFDS  
- 32  
V
5.0.22  
5.0.23  
Forward voltage of the drain-  
source reverse diode  
600  
mV IFDS = 200mA;  
VIN= 0V; Tj = 125°C  
Input interface; pin IN  
Input turn-ON voltage  
(logic input high-level)  
VINON  
2.2  
V
V
5.0.24  
5.0.25  
Input turn-OFF voltage  
(logic input low-level)  
VINOFF  
0.8  
Input threshold hysteresis  
Off state input current  
On state input current  
Input resistance  
VINHYS  
IINOFF  
IINON  
RIN  
0.3  
V
5.0.26  
5.0.27  
5.0.28  
5.0.29  
1
30  
30  
5.0  
µA  
µA  
kΩ  
VIN = 0.7V  
VIN = 5.0V  
1
1.5  
3.5  
1) Device on 50mm x 50mm x 1,5mm epoxy FR4 PCB with 6cm2 (one layer copper 70um thick) copper area for supply  
voltage connection. PCB in vertical position without blown air.  
2) Timing values only with high slewrate input signal; otherwise slower.  
3) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data  
sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed  
for continuous repetitive operation.  
4) Requires a 150 resistor in GND connection. The reverse load current trough the intrinsic drain-source diode of the  
power-MOS has to be limited by the connected load. Power dissipation is higher compared to normal operation due  
to the voltage drop across the drain-source diode. The temperature protection is not functional during reverse  
current operation! Input current has to be limited (see max ratings).  
Data Sheet  
9
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Typical performance graphs  
5
Typical performance graphs  
Typical characteristics  
Transient thermal impedance ZthJA versus  
Transient thermal impedance ZthJA versus  
pulse time tp @ 6cm2 heatsink area  
pulse time tp @ min. footprint  
D = tp / T  
D = tp / T  
On-resistance RDSONversus  
junction temperature Tj  
On-resistance RDSONversus  
supply voltage VS  
120  
100  
80  
70  
60  
50  
40  
30  
20  
10  
60  
40  
Tj=−40°C;IL=0.5A  
Tj=25°C;IL=0.5A  
Tj=125°C;IL=0.5A  
20  
0
Vs=13.5V  
0
−40 −25  
0
25  
50  
Tj [°C]  
75  
100  
125  
10  
15  
20  
25  
Vs[V]  
30  
35  
40  
Data Sheet  
10  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Typical performance graphs  
Typical characteristics  
Switch ON time tON versus  
junction temperature Tj  
Switch OFF time tOFF versus  
junction temperature Tj  
140  
120  
100  
80  
180  
160  
140  
120  
100  
80  
60  
60  
40  
40  
Vs=9V;RL=47Ω  
20  
20  
Vs=9V;RL=47Ω  
Vs=32V;RL=47Ω  
Vs=13.5V;RL=47Ω  
Vs=32V;RL=47Ω  
0
0
−40 −25  
0
25  
50  
T[°C]  
75  
100  
125  
−40 −25  
0
25  
50  
T[°C]  
75  
100  
125  
j
j
ON slewrate SRON versus  
junction temperature Tj  
OFF slewrate SROFF versus  
junction temperature Tj  
2
1.8  
1.6  
1.4  
1.2  
1
2
1.8  
1.6  
1.4  
1.2  
1
Vs=9V;RL=47Ω  
Vs=13.5V;RL=47Ω  
Vs=32V;RL=47Ω  
Vs=9V;RL=47Ω  
Vs=13.5V;RL=47Ω  
Vs=32V;RL=47Ω  
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
0.4  
0.2  
0
−40 −25  
0
25  
50  
Tj[°C]  
75  
100  
125  
−40 −25  
0
25  
50  
Tj[°C]  
75  
100  
125  
Data Sheet  
11  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Typical performance graphs  
Typical characteristics  
Standby current ISSTB versus  
junction temperature Tj  
Output leakage current IOUTLK versus  
junction temperature Tj  
6
5
4
3
2
1
2.5  
VIN=0V;Vs=32V  
2
1.5  
1
0.5  
VIN=0V;Vs=32V  
75 100  
0
−40 −25  
0
0
25  
50  
Tj [°C]  
125  
−40 −25  
0
25  
50  
Tj [°C]  
75  
100  
125  
Initial peak short circuit current limit ILSCP versus Initial short circuit shutdown time tSCOFF versus  
junction temperature Tj  
junction temperature Tj  
25  
3
2.5  
2
20  
15  
10  
5
1.5  
1
0.5  
Vs=20V  
100  
Vs=20V  
0
0
−40 −25  
−40 −25  
0
25  
50  
Tj [°C]  
75  
125  
0
25  
50  
T[°C]  
75  
100  
125  
j
Data Sheet  
12  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Typical performance graphs  
Typical characteristics  
Input current consumption IIN versus  
junction temperature Tj  
Input current consumption IIN versus  
input voltage VIN  
12  
10  
8
200  
Tj=−40..25°C;Vs=13.5V  
180  
Tj=125°C;Vs=13.5V  
160  
140  
120  
100  
80  
6
4
60  
40  
2
V
IN0.7V;Vs=13.5V  
VIN=5V;Vs=13.5V  
75 100  
20  
0
0
−40 −25  
0
25  
50  
Tj [°C]  
125  
0
2
4
6
8
VIN[V]  
Input threshold voltage VINH,L versus  
junction temperature Tj  
Input threshold voltage VINH,L versus  
supply voltage VS  
2
1.8  
1.6  
1.4  
1.2  
1
2
1.8  
1.6  
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.8  
0.6  
0.4  
OFF;Tj=25°C  
OFF;Vs=13.5V  
ON;Vs=13.5V  
75 100  
0.2  
0
0.2  
0
ON;Tj=25°C  
−40 −25  
0
25  
50  
Tj [°C]  
125  
10  
15  
20  
25  
30  
35  
Vs[V]  
Data Sheet  
13  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Typical performance graphs  
Typical characteristics  
Max. allowable load inductance L versus  
load current IL  
Max. allowable inductive single pulse switch-off  
energy EAS versus load current IL  
2000  
1400  
Tjstart=125°C;Vs=13.5V;RL=0Ω  
Tjstart=125°C;Vs=13.5V  
1800  
1200  
1000  
800  
600  
400  
200  
0
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
1
1.5  
2
2.5  
3
1
1.5  
2
2.5  
3
IL [A]  
IL [A]  
Data Sheet  
14  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Application information  
6
Application information  
Note:  
The following information is given as a hint for the implementation of the device only and shall not  
be regarded as a description or warranty of a certain functionality, condition or quality of the device.  
Wire  
Harness  
ITS4060S-SJ-N  
VS  
5
6
Bias  
Supervision  
Overvoltage  
Protection  
Current  
Limiter  
7
8
CS  
GND3  
220nF  
Gate  
Control  
Circuit  
IN  
Logic  
2
4
ESD  
Protection  
Wire  
Harness  
NC  
Temperature  
Sensor  
OUT  
3
COUT  
1nF  
Complex  
LOAD  
1
GND  
GND1  
GND2  
Electronic Control Unit  
Figure 4  
Application diagram  
The ITS4060S-SJ-N can be connected directly to a supply network. It is recommended to place a ceramic  
capacitor (e.g. CS = 220nF) between supply and GND of the ECU to avoid line disturbances. Wire harness  
inductors/resistors are sketched in the application circuit above.  
The complex load (resistive, capacitive or inductive) must be connected to the output pin OUT.  
A built-in current limit protects the device against destruction.  
The ITS4060S-SJ-N can be switched on and off with standard logic ground related logic signal at pin IN.  
In standby mode (IN=L) the ITS4060S-SJ-N is deactivated with very low current consumption.  
The output voltage slope is controlled during on and off transition to minimize emissions. Only a small  
ceramic capacitor COUT=1nF is recommended to attenuate RF noise.  
In the following chapters the main features, some typical waverforms and the protection behavior  
of the ITS4060S-SJ-N is shown. For further details please refer to application notes on the Infineon homepage.  
Note:  
This is a very simplified example of an application circuit. The function must be verified in the real  
application.  
Data Sheet  
15  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Application information  
6.1  
Special feature description  
Supply over voltage:  
Supply reverse voltage:  
ITS4060S-SJ-N  
ITS4060S-SJ-N  
VS  
VS  
5-8  
5-8  
RIN  
RIN  
IN  
IN  
IRev  
2
4
2
ZDIN  
IIN  
ZDIN  
IIN  
ZDSAZ  
ZDSAZ  
NC  
NC  
4
OUT  
OUT  
ROUTPD  
ROUTPD  
3
3
IRev1  
1
1
GND  
GND  
ZL  
ZL  
RGND  
RGND  
IRev2  
If over-voltage is applied to the VS-Pin:  
Voltage is limited to VZDSAZ; current can be calculated:  
IZDSAZ = (VS – VZDSAZ) / RGND  
If reverse voltage is applied to the device:  
1.) Current via load resistance RL:  
IRev1 = (VRev – VFDS) / RL  
2.) Current via Input pin IN and dignostic pin ST :  
IRev2 = IST+IIN ~ (VRev–VCC)/RIN +(VRev–VCC)/RST1,2  
Current IST must be limited with the extrernal series  
resistor RSTS. Both currents will sum up to:  
IRev = IRev1+ IRev2  
A typical value for RGND is 150Ω.  
In case of ESD pulse on the input pin there is in both  
polarities a peak current IINpeak ~ VESD / RIN  
Drain-Source power stage clamper VDSCL  
:
Energy calculation:  
ITS4060S-SJ-N  
ITS4060S-SJ-N  
VS  
VS  
5-8  
5-8  
RIN  
RIN  
IN  
IN  
EBatt  
2
4
2
4
ZDIN  
IIN  
ZDIN  
IIN  
ZDSAZ  
ZDSAZ  
NC  
NC  
ELoad  
OUT  
OUT  
ROUTPD  
ROUTPD  
3
3
1
1
IL  
EL  
ER  
LL  
RL  
GND  
GND  
LL  
RGND  
When an inductive load is switched off a current path must be  
established until the current is sloped down to zero (all energy  
removed from the inductive load). For that purpose the series  
combination ZDSCL is connected between Gate and Drain of the  
power DMOS acting as an active clamp.  
When the device is switched off, the voltage at OUT turns  
negative until VDSCL is reached.  
Energy stored in the load inductance is given by :  
EL= IL²*L/2  
While demagnetizing the load inductance the energy  
dissipated by the Power-DMOS is:  
EAS = ES + EL – ER  
With an approximate solution for RL =0Ω:  
The voltage on the inductive load is the difference between  
VDSCL and VS.  
EAS = ½ * L * IL² * {(1- VS / (VS - VDSCL)  
Figure 5  
Special feature description  
Data Sheet  
16  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Application information  
6.2  
Typical application waveforms  
General Input Output waveforms:  
Waveforms switching a resistive load:  
VIN  
VIN  
H
H
L
L
t
t
t
VS  
VOUT  
+VS  
VDS  
90%  
70%  
SROFF = dV/dt  
VOUT  
40%  
30%  
SRON = dV/dt  
10%  
0
0
tON  
tOFF  
t
t
t
t
IL  
IL  
0
0
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
Waveforms switching a capacitive load:  
Waveforms switching an inducitive load :  
VIN  
VIN  
H
H
L
L
t
t
VOUT  
VOUT  
~ VS  
~ VS  
0
0
t
t
IL  
ILSC  
IL  
0
0
t
t
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
Figure 6  
Typical application waveforms of the ITS4060S-SJ-N  
Data Sheet  
17  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Application information  
6.3  
Protection behavior  
Overtemperature concept:  
Overtemperature behavior:  
VIN  
H
L
TjRestart  
TjTrip  
t
VOUT  
ON  
heating  
up  
0
t
TJ  
TjTrip  
OFF  
cooling  
down  
TJ  
THYS  
Device  
Status  
THYS  
Normal  
Toggling  
Overtemperature  
t
OFF  
ON  
OFF  
ON  
OFF  
Waveforms turn on into a short circuit :  
Waveforms short circuit during on state :  
VIN  
H
VIN  
H
L
L
t
t
VOUT  
VOUT  
0
0
t
t
Ipeak  
Ipeak  
IL  
IL  
ILSCP  
Controlled  
Controlled  
by the  
current limit  
by the  
current limit  
ILSCR  
ILSCR  
circuit  
circuit  
tm  
tSCOFF  
0
0
t
t
Normal  
operation  
OFF  
OFF  
OFF  
OUT shorted to GND  
Overloaded  
Shut down by overtemperature and  
restart by cooling (toggling)  
Shut down by overtemperature and  
restart by cooling (toggling)  
Figure 7  
Protective behavior of the ITS4060S-SJ-N  
Data Sheet  
18  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Package information  
7
Package information  
0.35 x 45°  
1)  
4-0.2  
C
1.27  
B
0.1  
SEATING PLANE  
±0.25  
0.64  
+0.1 2)  
-0.06  
0.41  
±0.2  
6
M
M
0.2  
A
A B 8x  
0.2  
C 8x  
8
5
1
4
1)  
5-0.2  
Index Marking  
1) Does not include plastic or metal protrusion of 0.15 max. per side  
2) Lead width can be 0.61 max. in dambar area  
Figure 8  
PG-DSO-81)  
Green Product (RoHS compliant)  
To meet the world-wide customer requirements for environmentally friendly products and to be compliant  
with government regulations the device is available as a green product. Green products are RoHS-Compliant  
(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).  
Further information on packages  
https://www.infineon.com/packages  
1) Dimensions in mm  
Data Sheet  
19  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4060S-SJ-N  
Revision history  
8
Revision history  
Revision Date  
Changes  
2019-07-25 Datasheet updated:  
- ESD ratings for HBM updated according ANSI/ESDA/JEDEC JS-001  
1.10  
1.0  
- Editorial changes  
12-09-01  
Datasheet release  
Data Sheet  
20  
Rev 1.1  
2019-07-25  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
IMPORTANT NOTICE  
The information given in this document shall in no For further information on technology, delivery terms  
Edition 2019-07-25  
Published by  
event be regarded as a guarantee of conditions or and conditions and prices, please contact the nearest  
characteristics ("Beschaffenheitsgarantie").  
Infineon Technologies Office (www.infineon.com).  
With respect to any examples, hints or any typical  
values stated herein and/or any information regarding  
the application of the product, Infineon Technologies  
hereby disclaims any and all warranties and liabilities  
of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any  
third party.  
In addition, any information given in this document is  
subject to customer's compliance with its obligations  
stated in this document and any applicable legal  
requirements, norms and standards concerning  
customer's products and any use of the product of  
Infineon Technologies in customer's applications.  
The data contained in this document is exclusively  
intended for technically trained staff. It is the  
responsibility of customer's technical departments to  
evaluate the suitability of the product for the intended  
application and the completeness of the product  
information given in this document with respect to  
such application.  
Infineon Technologies AG  
81726 Munich, Germany  
Please note that this product is not qualified  
according to the AEC Q100 or AEC Q101 documents of  
the Automotive Electronics Council.  
© 2019 Infineon Technologies AG.  
All Rights Reserved.  
WARNINGS  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon  
Technologies office.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Z8F51106907  
Except as otherwise explicitly approved by Infineon  
Technologies in a written document signed by  
authorized representatives of Infineon Technologies,  
Infineon Technologies’ products may not be used in  
any applications where a failure of the product or any  
consequences of the use thereof can reasonably be  
expected to result in personal injury.  

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