LHT774-M2P1-1 [INFINEON]
Visible LED, Clear;
| 型号： | LHT774-M2P1-1 |
| 厂家： | 
Infineon |
| 描述： | Visible LED, Clear |
| 文件： | 总14页 (文件大小：246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TOPLED® RG
Super-Bright, Hyper-Red GaAlAs-LED
LH T774
Besondere Merkmale
Features
• Gehäusetyp: weißes SMT Gehäuse
• Besonderheit des Bauteils: extrem breite
Abstrahlcharakteristik; ideal für
• package: white SMT package
• feature of the device: extremely wide viewing
angle; ideal for backlighting and coupling in
light guides; LED is mounted top down and
emits through the PCB
Hinterleuchtungen und Einkopplungen in
Lichtleiter; Bauteil wird top-down montiert und
strahlt durch das PCB
• wavelength: 645 nm
• Wellenlänge: 645 nm
• Abstrahlwinkel: Lambertscher Strahler (120°)
• Technologie: GaAlAs
• viewing angle: Lambertian Emitter (120°)
• technology: GaAlAs
• optical efficiency: 3 lm/W
• optischer Wirkungsgrad: 3 lm/W
• Gruppierungsparameter: Lichtstärke
• Verarbeitungsmethode: für alle
SMT-Bestücktechniken geeignet
• Lötmethode: IR Reflow Löten und
Wellenlöten (TTW)
• Vorbehandlung: nach JEDEC Level 2
• Gurtung: 12 mm Gurt mit 2000/Rolle,
ø180 mm oder 8000/Rolle, ø330 mm
• grouping parameter: luminous intensity
• assembly methods: suitable for all
SMT assembly methods
• soldering methods: IR reflow soldering and
TTW soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 12 mm tape with 2000/reel, ø180 mm
or 8000/reel, ø330 mm
Anwendungen
Applications
• Hinterleuchtung (LCD, Schalter, Tasten,
Displays, Werbebeleuchtung,
• backlighting (LCD, switches, keys, displays,
illuminated advertising, general lighting)
• coupling into light guide
Allgemeinbeleuchtung)
• Einkopplung in Lichtleiter
• interior automotive lighting.
• Innenbeleuchtung im Automobilbereich
(z.B. Instrumentenbeleuchtung, u.ä.)
(e.g. dashboard backlighting, etc.)
2001-12-14
1
LH T774
Typ
Emissions-
farbe
Farbe der
Lichtaustritts-
fläche
Lichtstärke
Lichtstrom Bestellnummer
Type
Color of
Emission
Color of the
LightEmitting Intensity
Luminous
Luminous
Flux
Ordering Code
Area
IF = 10 mA
IV (mcd)
IF = 10 mA
ΦV (mlm)
LH T774-L2M2-1 hyper-red
LH T774-M2P1-1
colorless clear 14.0 ... 28.0
22.4 ... 56.0
62 (typ.) Q62703-Q5028
110 (typ.) Q62703-Q5029
Anm.: -1 gesamter Farbbereich (siehe Seite 4)
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhältlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range (see page 4)
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
2001-12-14
2
LH T774
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
Top
Tstg
Tj
– 40 … + 100
– 40 … + 100
+ 100
°C
Lagertemperatur
Storage temperature range
°C
°C
mA
A
Sperrschichttemperatur
Junction temperature
Durchlassstrom
Forward current
IF
30
Stoßstrom
IFM
0.5
Surge current
t ≤ 10 µs, D = 0.005
Sperrspannung
Reverse voltage
VR
3
V
Leistungsaufnahme
Power consumption
TA ≤ 25 °C
Ptot
90
mW
Wärmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/ambient
Sperrschicht/Lötpad
Rth JA
Rth JS
400
180
K/W
K/W
Junction/solder point
Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm2)
mounted on PC board FR 4 (pad size ≥ 16 mm 2)
2001-12-14
3
LH T774
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge des emittierten Lichtes
Wavelength at peak emission
IF = 10 mA
Dominantwellenlänge 1)
Dominant wavelength
IF = 10 mA
(typ.) λpeak
660
645
22
nm
(typ.) λdom
(typ.) ∆λ
(typ.) 2ϕ
nm
nm
Spektrale Bandbreite bei 50 % Irel max
Spectral bandwidth at 50 % Irel max
IF = 10 mA
Abstrahlwinkel bei 50 % IV (Vollwinkel)
Viewing angle at 50 % IV
120
Grad
deg.
Durchlassspannung 2)
Forward voltage
IF = 10 mA
(typ.) VF
(max.) VF
1.75
2.5
V
V
Sperrstrom
Reverse current
VR = 3 V
(typ.) IR
(max.) IR
0.01
10
µA
µA
Temperaturkoeffizient von λpeak
Temperature coefficient of λpeak
IF = 10 mA; –10°C ≤ T ≤ 100°C
(typ.) TCλpeak
(typ.) TCλdom
(typ.) TCV
0.28
0.05
– 2.5
3
nm/K
nm/K
mV/K
lm/W
Temperaturkoeffizient von λdom
Temperature coefficient of λdom
IF = 10 mA; –10°C ≤ T ≤ 100°C
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 10 mA; –10°C ≤ T ≤ 100°C
Optischer Wirkungsgrad
Optical efficiency
IF = 10 mA
(typ.) ηopt
1)
Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
2001-12-14
4
LH T774
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstärke
Luminous Intensity
IV (mcd)
Lichtstrom
Luminous Flux
ΦV (mlm)
L2
14.0 … 18.0
18.0 … 22.4
22.4 … 28.0
28.0 … 35.5
35.5 … 45.0
45.0 … 56.0
50 (typ.)
60 (typ.)
75 (typ.)
95 (typ.)
120 (typ.)
150 (typ.)
M1
M2
N1
N2
P1
Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von 11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11%.
2001-12-14
5
LH T774
Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 10 mA
Relative Spectral Emission
V(λ) = spektrale Augenempfindlichkeit
Standard eye response curve
OHL01727
100
%
Irel
80
Vλ
60
40
20
0
400
450
500
550
600
650
700
nm
λ
Abstrahlcharakteristik Irel = f (ϕ)
Radiation Characteristic
OHL01660
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
2001-12-14
6
LH T774
Durchlassstrom IF = f (VF)
Forward Current
TA = 25 °C
Relative Lichtstärke IV/IV(10 mA) = f (IF)
Relative Luminous Intensity
TA = 25 °C
OHL01737
OHL01736
10 1
103
mA
IV
IV(10 mA)
IF
102
101
10 0
5
hyper-red
10 -1
5
100
10 -1
10 -2
10-3
10 -2
5
10 -3
10 -1
5
10 0
5
10 1
10 2
1.2
1.6
2
2.4
V 2.8
mA
IF
VF
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
Relative Lichtstärke IV/IV(25 °C) = f (TA)
Relative Luminous Intensity
IF = 10 mA
OHL01099
OHL01749
2
40
IV
IV (25 ˚C)
IF
1.6
1.2
30
T
T
S
A
20
10
0
hyper-red
0.8
0.4
0
T
temp. ambient
temp. solder point
A
T
S
0
20
40
60
80 ˚C 100
0
20
40
60
80 ˚C 100
TA
T
2001-12-14
7
LH T774
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA = 25 °C
OHL01686
10 3
tP
IF
= tP
IF
D
T
mA
T
D
=
0.005
0.01
0.02
0.05
0.1
10 2
5
0.2
0.5
DC
10 1
10-5
10-4 10-3 10-2 10-1
100 s 101
tp
2001-12-14
8
LH T774
Maßzeichnung
Package Outlines
2.1 (0.083)
1.7 (0.067)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
1.0 (0.039)
0.9 (0.035)
2.1 (0.083)
0...0.1 (0.004)
0.6 (0.024)
0.4 (0.016)
Cathode marking
GPLY6899
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Kathodenkennung:
Cathode mark:
abgeschrägte Ecke
bevelled edge
Gewicht / Approx. weight: 40 mg
2001-12-14
9
LH T774
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil
(nach IPC 9501)
IR Reflow Soldering Profile (acc. to IPC 9501)
OHLY0597
300
˚C
250
200
150
100
50
T
240-245 ˚C
10-40 s
183 ˚C
120 to 180 s
Ramp-down rate up to 6 K/s
Defined for Preconditioning: up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
0
0
50
100
150
200
s
250
t
2001-12-14
10
LH T774
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
300
C
10 s
Normalkurve
standard curve
250
200
150
100
50
T
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
1. Welle
1. wave
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
Zwangskühlung
2 K/s
forced cooling
0
0
50
100
150
200
s
250
t
2001-12-14
11
LH T774
Empfohlenes Lötpaddesign IR Reflow Löten / Wellenlöten (TTW)
Recommended Solder Pad
IR Reflow Soldering / TTW soldering
6 (0.236)
1.5 (0.059)
6 (0.236)
1.5 (0.059)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm2
2.8 (0.110)
2.4 (0.094)
Cu-area > 16 mm 2
Hole on PCB
Lötstopplack
Solder resist
OHLPY977
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-12-14
12
LH T774
Gurtung / Polarität und Lage
Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
or 8000/reel, ø330 mm
4 (0.157)
1.5 (0.059)
2 (0.079)
Cathode identification
C
A
3 (0.118)
4 (0.157)
OHAY2272
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-12-14
13
LH T774
Revision History: 2001-12-14
Previous Version: 2001-03-12
Page
Subjects (major changes since last revision)
new values for luminous flux
2
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2001-12-14
14
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