LSGT677-J+L [INFINEON]

Visible LED, Clear;


型号：	LSGT677-J+L
厂家：	Infineon
描述：	Visible LED, Clear 光电
文件：	总12页 (文件大小：136K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Multi TOPLED

Cathodes On One Side

LSG T677

Besondere Merkmale

Features

• Gehäusetyp: weißes P-LCC-4 Gehäuse

• Besonderheit des Bauteils:

2 Leuchtdiodenchips getrennt ansteuerbar

• Wellenlänge: 628 nm (super-rot),

570 nm (grün)

• package: white P-LCC-4 package

• feature of the device: 2 chips can be

controlled separately

• wavelength: 628 nm (super-red),

570 nm (green)

• Abstrahlwinkel: Lambertscher Strahler (120°)

• Technologie: GaAlP

• viewing angle: Lambertian Emitter (120°)

• technology: GaAlP

• optischer Wirkungsgrad: 1,5 lm/W (super-rot),

2,5 lm/W (grün)

• optical efficiency: 1.5 lm/W (super-red),

2.5 lm/W (green)

• Gruppierungsparameter: Lichtstärke

• Verarbeitungsmethode: für alle

SMT-Bestücktechniken geeignet

• Lötmethode: IR Reflow Löten und

Wellenlöten TTW)

• grouping parameter: luminous intensity

• assembly methods: suitable for all

SMT assembly methods

• soldering methods: IR reflow soldering and

TTW soldering

• Vorbehandlung: nach JEDEC Level 2

• Gurtung: 8 mm Gurt mit 2000/Rolle, ø180 mm

oder 8000/Rolle, ø330 mm

• preconditioning: acc. to JEDEC Level 2

• taping: 8 mm tape with 2000/reel, ø180 mm or

8000/reel, ø330 mm

Anwendungen

Applications

• optischer Indikator

• optical indicators

• Einkopplung in Lichtleiter

• coupling into light guides

• Hinterleuchtung (LCD, Schalter, Tasten,

Displays, Werbebeleuchtung,

Allgemeinbeleuchtung)

• Innenbeleuchtung im Automobilbereich

(z.B. Instrumentenbeleuchtung, u.ä.)

• backlighting (LCD, switches, keys, displays,

illuminated advertising, general lighting)

• interior automotive lighting (e.g. dashboard

backlighting, etc.)

2001-03-14

LSG T677

Bestellnummer

Ordering Code

Typ

Emissions-

farbe

Farbe der

Lichtaustritts-

fläche

Color of the

Light Emitting

Area

Lichtstärke

Type

Color of

Emission

Luminous Intensity

I_F= 10 mA

I_V(mcd)

super-red

green

LSG T677

J+J

J+K

super-red / green colorless clear

4.5 ... 18.0

4.5 ... 7.1

4.5 ... 18.0 Q62703-Q4327

4.5 ... 7.1

7.1 ... 11.2

J+L

4.5 ... 7.1 11.2 ... 18.0

K+J

K+K

K+L

7.1 ... 11.2

7.1 ... 11.2 11.2 ... 18.0

4.5 ... 7.1

7.1 ... 11.2

L+J

L+K

11.2 ... 18.0

4.5 ... 7.1

7.1 ... 11.2

L+L

11.2 ... 18.0 11.2 ... 18.0

Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±11 % ermittelt.

Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ±11 %.

Anm.: Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Gruppen sind

nicht erhältlich.

In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe pro Farbe enthalten.

Note: The standard shipping format for serial types includes a family group. Individual groups are not

available.

No packing unit / tape ever contains more than one luminous intensity group per color.

2001-03-14

LSG T677

Grenzwerte

Maximum Ratings

Bezeichnung

Parameter

Symbol

Wert

Value

Einheit

Unit

Betriebstemperatur

Operating temperature range

T_op

T_stg

T_j

– 40 … + 100

+ 100

°C

Lagertemperatur

Storage temperature range

°C

Sperrschichttemperatur

Junction temperature

Durchlassstrom

Forward current

I_F

Stoßstrom

I_FM

0.5

Surge current

t ≤ 10 µs, D = 0.005

Sperrspannung

Reverse voltage

V_R

Leistungsaufnahme

Power consumption

P_tot

Wärmewiderstand

Thermal resistance

Sperrschicht/Umgebung

Junction/ambient

Sperrschicht/Lötpad

Junction/solder point

1 chip on R_{th JA}

480

650

260

360

K/W

2 chips on R_{th JA}

1 chip on R_{th JS}

2 chips on R_{th JS}

Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm²)

mounted on PC board FR 4 (pad size ≥ 16 mm ²)

2001-03-14

LSG T677

Kennwerte (T_A= 25 °C)

Characteristics

Bezeichnung

Parameter

Symbol

Werte

Values

Einheit

Unit

Wellenlänge des emittierten Lichtes

Wavelength at peak emission

I_F= 10 mA

Dominantwellenlänge ¹⁾

Dominant wavelength

I_F= 10 mA

(typ.) λ_peak

635

572

(typ.) λ_dom

(typ.) ∆λ

(typ.) 2ϕ

628

± 6

570

± 6

Spektrale Bandbreite bei 50 % I_{rel max}

Spectral bandwidth at 50 % I_{rel max}

I_F= 10 mA

Abstrahlwinkel bei 50 % I_V(Vollwinkel)

Viewing angle at 50 % I_V

120

Grad

deg.

Durchlassspannung ²⁾

Forward voltage

I_F= 10 mA

(typ.) V_F

(max.) V_F

2.0

2.5

2.0

2.5

Sperrstrom

Reverse current

V_R= 5 V

(typ.) I_R

(max.) I_R

0.01

µA

Temperaturkoeffizient von λ_peak

Temperature coefficient of λ_peak

I_F= 10 mA; –10°C ≤ T ≤ 100°C

(typ.) TC_λpeak

(typ.) TC_λdom

(typ.) TC_V

0.11

0.07

– 1.9

1.5

0.11

0.07

– 1.4

2.5

nm/K

mV/K

lm/W

Temperaturkoeffizient von λ_dom

Temperature coefficient of λ_dom

I_F= 10 mA; –10°C ≤ T ≤ 100°C

Temperaturkoeffizient von V_F

Temperature coefficient of V_F

I_F= 10 mA; –10°C ≤ T ≤ 100°C

Optischer Wirkungsgrad

Optical efficiency

I_F= 10 mA

(typ.) η_opt

Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt.

Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.

Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt.

Voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V.

2001-03-14

LSG T677

Relative spektrale Emission I_rel= f (λ), T_A= 25 °C, I_F= 10 mA

Relative Spectral Emission

V(λ) = spektrale Augenempfindlichkeit

Standard eye response curve

OHL01702

100

I_rel

V_λ

400

450

500

550

600

650

700

Abstrahlcharakteristik I_rel= f (ϕ)

Radiation Characteristic

OHL01660

40˚

30˚

20˚

10˚

0˚

1.0

50˚

0.8

0.6

0.4

0.2

60˚

70˚

80˚

90˚

100˚

1.0

0.8

0.6

0.4

0˚

20˚

40˚

60˚

80˚

100˚

120˚

2001-03-14

LSG T677

Durchlassstrom I_F= f (V_F)

Forward Current

T_A= 25 °C

Relative Lichtstärke I_V/I_{V(10 mA)}= f (I_F)

Relative Luminous Intensity

T_A= 25 °C

OHL01263

OHL01703

10 ²

10 ¹

I_V

I_F

I_{V (10 mA)}

10 ⁰

10 ¹

green

super-red

10 ^-1

10 ⁰

10 ^-2

10 ^-1

10 ^-3

10 ^-1

10 ⁰

10 ¹

10 ²

1.4

1.8

2.2

2.6

3.4

V_F

Maximal zulässiger Durchlassstrom I_F= f (T)

Max. Permissible Forward Current

OHL00241

OHL00956

I_F

1 chip on

2 chips on

1 chip on

temp. ambient

T_Stemp. solder point

80 ˚C 100

2001-03-14

LSG T677

Relative Lichtstärke I_V/I_{V(25 °C)}= f (T_A)

Relative Luminous Intensity

I_F= 10 mA

Zulässige Impulsbelastbarkeit I_F= f (t_p)

Permissible Pulse Handling Capability

Duty cycle D = parameter, T_A= 25 °C

OHL01686

10 ³

OHL01708

1.6

1.2

0.8

0.4

t_P

I_F

₌t_P

I_V

I_{V(25 ˚C)}

I_F

0.005

0.01

0.02

0.05

0.1

10 ²

0.2

green

super-red

0.5

10 ¹

10^-5

10^-410^-310^-210^-1

10⁰s 10¹

80 ˚C 100

t_p

2001-03-14

LSG T677

Maßzeichnung

Package Outlines

3.0 (0.118)

2.6 (0.102)

2.3 (0.091)

2.1 (0.083)

1.7 (0.067)

2.1 (0.083)

0.8 (0.031)

0.9 (0.035)

0.7 (0.028)

0.6 (0.024)

0.1 (0.004) typ

0.6 (0.024)

0.4 (0.016)

Package

marking

0.18 (0.007)

0.12 (0.005)

GPLY6925

T677

LED

Emission color 1 Emission color 2 Package

Cathode: pin 1 Cathode: pin 4

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).

Gewicht / Approx. weight: 34 mg

2001-03-14

LSG T677

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions Preconditioning acc. to JEDEC Level 2

IR-Reflow Lötprofil

(nach IPC 9501)

IR Reflow Soldering Profile (acc. to IPC 9501)

OHLY0597

300

˚C

250

200

150

100

240-245 ˚C

10-40 s

183 ˚C

120 to 180 s

Ramp-down rate up to 6 K/s

Defined for Preconditioning: up to 6 K/s

Ramp-up rate up to 6 K/s

Defined for Preconditioning: 2-3 K/s

100

150

200

250

2001-03-14

LSG T677

Wellenlöten (TTW) (nach CECC 00802)

TTW Soldering

(acc. to CECC 00802)

OHLY0598

300

10 s

Normalkurve

standard curve

250

200

150

100

235 C ... 260 C

Grenzkurven

limit curves

2. Welle

2. wave

1. Welle

1. wave

ca 200 K/s

2 K/s

5 K/s

100 C ... 130 C

Zwangskühlung

2 K/s

forced cooling

100

150

200

250

2001-03-14

LSG T677

Empfohlenes Lötpaddesign IR Reflow Löten / Wellenlöten (TTW)

Recommended Solder Pad IR Reflow Soldering / TTW Soldering

3.3 (0.130)

0.4 (0.016)

2.6 (0.102)

1.1 (0.043)

Padgeometrie für

verbesserte Wärmeableitung

Kathoden Markierung /

Cathode marking

Cu Fläche / 12 mm²per pad

Cu-area

Paddesign for

improved heat dissipation

Lötstoplack

Solder resist

OHLPY439

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).

Gurtung / Polarität und Lage

Verpackungseinheit 2000/Rolle, ø180 mm

oder 8000/Rolle, ø330 mm

Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm

or 8000/reel, ø330 mm

1.5 (0.059)

4 (0.157)

2 (0.079)

4 (0.157)

2.9 (0.114)

OHAY0094

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).

2001-03-14 11

LSG T677

Revision History: 2001-03-14

Previous Version: 2001-03-14

Page

Subjects (major changes since last revision)

TTW soldering

Published by OSRAM Opto Semiconductors GmbH & Co. OHG

Wernerwerkstrasse 2, D-93049 Regensburg

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components ¹may only be used in life-support devices or systems ²with the express written approval of OSRAM OS.

¹A critical component is a component used in a life-support device or system whose failure can reasonably be expected

to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or

system.

²Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

2001-03-14

LSGT677-J+L [INFINEON]

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