PIIPM15P12D007 [INFINEON]
Programmable Isolated IPM; 可编程隔离IPM
| 型号： | PIIPM15P12D007 |
| 厂家： | 
Infineon |
| 描述： | Programmable Isolated IPM |
| 文件： | 总25页 (文件大小：1102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Bulletin I27179 22 - Sep
PIIPM15P12D007
Programmable Isolated IPM
Package:
PI-IPM Features:
ꢀ
Power Module:
•
•
NPT IGBTs 15A, 1200V
10us Short Circuit capability
ꢀ
ꢀ
ꢀ
Square RBSOA
Low Vce(on) (2.7Vtyp @ 15A, 25°C)
Positive Vce(on) temperature coefficient
•
•
Gen III HexFred Technology
ꢀ
Low diode VF (2.32Vtyp @ 15A, 25°C)
Soft reverse recovery
ꢀ
10mΩ sensing resistors on all phase outputs
PIIPM – BBI (EconoPack 2 outline compatible)
ꢀ
Thermal coefficient < 50ppm/°C
Power Module schematic:
DC+
OUT
DC+
IN
DC+ (signal)
ꢀ
Embedded driving board
•
•
•
Programmable 40 Mips DSP
Current sensing feedback from two phases
Full protection from ground and line
to line faults
IN1
IN2
IN3
Out 1
Out 2
Out 3
BRK
•
•
UVLO, OVLO on DCbus voltage
Embedded flyback smps for floating
stages (single 15Vdc @ 300mA input required)
Asynchronous isolated 2.5Mbps serial port for
DSP communication and/or programming
Synchronous isolated 10Mbps serial port for DSP
communication and/or programming
IEEE standard 1149.1 (JTAG port interface)
for program downloading and debugging
Separated turn on / turn off outputs for
IGBTs di/dt control
DC-
DC- (signal)
•
•
•
•
•
•
Input bridge, brake and three phases inverter (BBI) with current
sensing resistors on all output phases and thermistor
PIIPM15P12D007 System Block Schematic:
Hall effect sensors, sin/cos and quadrature encoder
interfaces
On board 64kbits I2C EEprom
Description
The PIIPM15P12D007 is a fully integrated Intelligent Power
Module for high performances Servo Motor Driver
applications.
The device core is
a
state of the art DSP, the
TMS320LF2406A at 40 Mips, interfaced with a full set of
peripherals designed to handle all analog feedback and
control signals needed to correctly manage the power
section of the device. A 64kbits EEPROM is also available to
store calibration data. The PIIPM has been designed and
tailored to implement internally all functions needed to close
the current, speed and position loops of a high performances
servo motor driver.
The device comes in the EMPTM package, fully compatible in
length, width and height with the popular EconoPack 2
outline.
The use of the flash memory version of the DSP and the
JTAG port connector allows the user to easily develop and
download his own proprietary algorithm.
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1
PIIPM15P12D007
I27179 22 - Sep
Embedded driving board block schematic
~ t l F a u
~ t l u a F e k a B r
~ n e - t o B o
P D
7 2 ; 3 n C i A D
1 U E M
0 U E M
- T S T R
7 7 ; 1 n C i A D
7 4 ; 2 n C i A D
9 5 ; B ~ n t
A ~ n t
P D P i
P D P i
k
T c
6
;
o
T D
6 9 ; 5 n C i A D
i
T D
S
T M
p o t s / t r a S t
N R C X A
X T N C A
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2
PIIPM15P12D007
I27179 22 - Sep
Signal pins on RS485 connector
Symbol
Lead Description
State
Connector pin number
Tx+
Tx-
Rx-
RS485 Trasmitter Non inverting Driver Output
RS485 Trasmitter Inverting Driver Output
RS485 Receiver Inverting Driver Input
RS485 Receiver Non inverting Driver Input
SPI clock output (GND iso referenced)
External 5V supply voltage for opto-couplers and line driver
supply
Output
Output
Input
Input
Output
1
2
3
4
5
Rx+
SpiCKout
Vin iso
Input
Input
6
7
Extenal 5V supply ground reference for opto-couplers and line
driver supply
GND iso
SpiTXout
SpiRXin
SinCos1 / QE1
SinCos2 / QE2
Contactor
Hall1
SPI transmitter output (GND iso referenced)
SPI receiver input (GND iso referenced)
SinCos encoder input 1 / Quadrature encoder input 1
SinCos encoder input 2 / Quadrature encoder input 2
General purpose I/O
Hall effect sensor input 1
Hall effect sensor input 2
Hall effect sensor input 3 / Resolver excitation
External 15V supply voltage. Internally referred to DC bus minus
pin (DC -)
External 15V supply ground reference. This pin is directly
connected to DC -
Output
Input
Input
Input
I/O
Input
Input
I/O
8
10
11
12
13
14
15
16
Hall2
Hall3 / Excitation
Vin
Input
Input
17-18
19-20
COM
Signal pins on IEEE1149.1 JTAG connector
CAUTION: DO NOT APPLY DC BUS VOLTAGE WHEN JTAG INTERFACE IS CONNECTED, SEVERE
DAMAGE MAY OCCUR ON POWER MODULE AND ON YOUR EQUIPMENT!
Connector
Symbol
Lead Description
State
Output
Input
pin number
Presence detect.
PD
Indicates that the emulation cable is connected and that the PIIPM logic is
powered up. PD is tied to the DSP 3.3V supply through a 1k resistor.
3
Homing / Direction
Homing signal / Counter direction
4
Start/Stop
CAN Tx
CAN Rx
Start/Stop signal
CAN transmitter signal
CAN receiver signal
Emulation pin 1
Input
Output
Input
I/O
5
6
7
EMU1/OFF~
8
Counter
EMU0
TRST~
Counter signal
Output
I/O
Input
9
Emulation pin 0
JTAG test reset
10
13
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3
PIIPM15P12D007
TMS
TDO
TDI
I27179 22 - Sep
JTAG test mode select
JTAG test data output
JTAG test data input
Input
Output
Input
14
15
16
JTAG test clock return. Test clock input to the emulator.
Internally short circuited to TCK.
JTAG test clock. TCK is a 10MHz clock source from the emulation pod. This
TCKRET
TCK
Output
Input
17
18
signal can be used to drive the system test clock.
Boot ROM enable. This pin is sampled during DSP reset, pulling it low
enables DSP boot ROM through SCI serial line at 40Mhz operation (Flash
versions only). 47k internal pull up.
Boot-En~
Input
19
ADCin
COM
Vin
General purpose analog input
External 15V supply ground reference. This pin is directly connected to DC -
External 15V supply voltage. Internally referred to DC bus minus pin (DC-)
Input
input
Input
20
1-11
2-12
Following pins are intended for signal communication between driving board and
power module only, though here described for completeness, they are on purpose
not available to the user.
Symbol
Lead Description
Pin number
DC +
DC -
Th +
DC Bus plus input signal
DC Bus minus input signal (internally connected to COM)
Thermal sensor positive input
Th -
G1/2/3
E1/2/3
R1/2/3 +
R1/2/3 -
G4/5/6
E4/5/6
Gb
Thermal sensor negative input (internally connected to COM)
Gate connections for high side IGBTs
Emitter connections for high side IGBTs (Kelvin points)
Output current sensing resistor positive input (IGBTs emitters 1/2/3 side, Kelvin points)
Output current sensing resistor negative input (Motor side, Kelvin points)
Gate connections for low side IGBTs
Lateral
connectors on
embedded
driving board
Emitter connections for low side IGBTs (Kelvin points)
Gate connections for brake IGBT
Eb
Brk
Emitter connection for brake IGBT (Kelvin point)
Collector connection for brake IGBT (Kelvin point)
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4
PIIPM15P12D007
I27179 22 - Sep
Power Module Frame Pins Mapping
JTAG conn. Pin1
IN1
IN2
OUT1
OUT2
OUT3
RS485 conn.
IN3
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5
PIIPM15P12D007
I27179 22 - Sep
Absolute Maximum Ratings (TC=25ºC)
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur.
All voltage parameters are absolute voltages referenced to VDC-, all currents are defined positive into any lead.
Thermal Resistance and Power Dissipation ratings are measured at still air conditions.
Symbol
VDC
Parameter Definition
Min.
Max.
1000
1200
15
Units
DC Bus Voltage
0
0
V
VCES
Collector Emitter Voltage
º
IC @ 100C
IC @ 25C
ICM
IGBTs continuous collector current (TC = 100 C, fig. 1)
º
30
IGBTs continuous collector current (TC = 25 C,fig 1)
Pulsed Collector Current (Fig. 3, Fig. CT.5)
60
A
Inverter and
Brake
º
IF @ 100C
IF @ 25C
IFM
15
Diode Continuous Forward Current (TC = 100 C)
º
30
Diode Continuous Forward Current (TC = 25 C)
Diode Maximum Forward Current
Gate to Emitter Voltage
60
VGE
-20
+20
140
55
V
PD @ 25°C
PD @ 100°C
VRRM
Power Dissipation (One transistor)
W
º
Power Dissipation (One transistor, TC = 100 C)
º
1400
1500
45
repetitive peak reverse voltage (Tj = 150 C)
º
Tj = 150 C
V
A
Irrm(max)=5mA
VRSM
non repetitive peak reverse voltage
º
º Rect conduction angle
Io
Diode Continuous Forward Current (TC = 100 C, 120
)
100% VRRM reapplied
225
270
253
365
3650
20
One-cycle forward. Non-repetitive on state
Bridge
IFSM
º
surge current (t=10ms, Initial Tj = 150 C)
No voltage reapplied
100% VRRM reapplied
No voltage reapplied
I2t
A2s
2
º
Current I t for fusing (t=10ms, Initial Tj = 150 C)
I2√t
A2√s
2
º
Current I √t for fusing (t=0.1 to 10ms, no voltage reapplied, Initial Tj = 150 C)
Non isolated supply voltage (DC- referenced)
Isolated supply voltage (GND iso referenced)
RS485 Receiver input voltage (GND iso referenced)
Operating Ambient Temperature Range
Vin
-20
-5
V
Vin-iso
Rx
5.5
-7
12
Embedded
Driving
Board
TA--EDB
-25
+70
ºC
V
TSTG-EDB
Board Storage Temperature Range
-40
AC
DC
+125
800
1000
VISO-CONT
R485
VISO-TEMP
RS485
Input-Output Continuous Withstand Voltage (RH ≤ 50%, -40°C ≤ TA ≤ 85°C )
Input-Output Momentary Withstand Voltage (RH ≤ 50%, t = 1 min, TA = 25°C)
RMS
2500
MT
Mounting Torque
3.5
Nm
ºC
V
T J
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage to Base Copper Plate
-40
-40
+150
+125
+2500
Power
Module
TSTG
Vc-iso
-2500
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6
PIIPM15P12D007
I27179 22 - Sep
Electrical Characteristics: Inverter and Brake
For proper operation the device should be used within the recommended conditions.
TJ = 25°C (unless otherwise specified)
Symbol
Parameter Definition
Collector To Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
Min.
Typ.
Max.
Units
Test Conditions
VGE = 0V, IC = 250µA
Fig.
V(BR)CES
1200
V
º
º
+1.2
2.70
3.74
3.14
4.89
-9.80
9
∆V(BR)CES /
V/ C
VGE = 0V, IC = 1mA (25 - 125 C)
IC = 15A, VGE = 15V
T
∆
3.00
4.24
3.61
5.30
5, 6
7, 9
VCE(on)
Collector To Emitter Saturation Voltage
V
V
IC = 30A, VGE = 15V
º
10, 11
IC = 15A, VGE = 15V, TJ = 125 C
VGE(th)
Gate Threshold Voltage
4.68
8
VCE = VGE, IC = 250µA
12
º
º
Temp. Coeff. of Threshold Voltage
Forward Trasconductance
∆VGE(th) /
mV/ C
VCE = VGE, IC = 1mA (25 - 125 C)
Tj
∆
gfe
10
S
VCE = 50V, IC = 15A, PW = 80µs
125
VGE = 0V, VCE = 1200V
ICES
Zero Gate Voltage Collector Current
µA
º
GE = 0V, VCE = 1200V, TJ = 125 C
376
1110
2000
2.52
2.64
±100
10.1
V
º
VGE = 0V, VCE = 1200V, TJ = 150 C
IC = 15A
2.32
2.47
VFM
Diode Forward Voltage Drop
V
8
º
IC = 15A, TJ = 125 C
±
=
IGES
Gate To Emitter Leakage Current
Sensing Resistors
nA
VGE
20V
R1/2/3
9.9
10
mΩ
Electrical Characteristics: Bridge
For proper operation the device should be used within the recommended conditions.
TJ = 25°C (unless otherwise specified)
Symbol
VFM
Parameter Definition
Forward Voltage Drop
Min.
Typ.
1.24
1.08
0.78
Max.
1.76
Units
Test Conditions
Fig.
tp = 400µs, Ipk = 30A
V
24
1.27
tp = 400µs, Ipk = 15A
º
VF(TO)
Irm
Threshold voltage
V
TJ = 125 C
º
Reverse Leakage Current
5
mA
VR = 1200V
TJ = 125 C
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7
PIIPM15P12D007
I27179 22 - Sep
Switching Characteristics: Inverter and Brake
For proper operation the device should be used within the recommended conditions.
TJ = 25°C (unless otherwise specified)
Symbol
Qg
Parameter Definition
Total Gate Charge (turn on)
Min
Typ
84
Max
127
Units
Test Conditions
Fig.
IC = 15A
23
nC
VCC = 600V
VGE = 15V
Qge
Qgc
Eon
Eoff
Etot
Gate – Emitter Charge (turn on)
Gate – Collector Charge (turn on)
Turn on Switching Loss
10
15
CT1
43
64
º
838
632
1470
1207
900
CT4
WF1
WF2
IC = 15A, VCC = 600V, TJ = 25 C
µJ
µJ
Turn off Switching Loss
V
GE = 15V, RG =10Ω, L = 500µH
Total Switching Loss
2107
Tail and Diode Rev. Recovery included
º
IC = 15A, VCC = 600V, TJ = 125 C
13,
15
CT4
WF1
WF2
Eon
Eoff
Etot
Turn on Switching Loss
Turn off Switching Loss
Total Switching Loss
1154
933
1512
1030
2542
VGE = 15V, RG =10Ω, L = 500µH
2087
Tail and Diode Rev. Recovery included
td (on)
Tr
Turn on delay time
Rise time
98
14
104
25
14,16
CT4
º
IC = 15A, VCC = 600V, TJ = 125 C
ns
td (off)
Tf
Turn off delay time
Fall time
132
226
142
247
WF1
WF2
VGE = 15V, RG =10Ω, L = 500µH
Cies
Coes
Cres
Input Capacitance
1323
255
37
VCC = 30V
VGE = 0V
f = 1MHz
pF
22
Output Capacitance
Reverse Transfer Capacitance
º
TJ = 150 C, I C =60A, VGE = 15V to 0V
4
RBSOA
SCSOA
Reverse Bias Safe Operating Area
Short Circuit Safe Operating Area
FULL SQUARE
CT2
VCC = 1000V, Vp = 1200V, RG = 5Ω
º
CT3
TJ = 150 C, VGE = 15V to 0V
10
µs
WF4
V
CC = 1000V, Vp= 1200V, RG = 5Ω
17,18
19,20
21
CT4
WF3
º
EREC
Trr
Diode reverse recovery energy
Diode reverse recovery time
Peak reverse recovery current
711
113
36
1263
300
41
µJ
ns
A
TJ = 125 C
IF= 15A, VCC = 600V,
VGE = 15V, RG =10Ω, L = 500µH
Irr
º
RthJ-C_T
RthJ-C_D
Each IGBT to copper plate thermal resistance
Each Diode to copper plate thermal resistance
0.9
C/W
º
º
1.54
25,26
C/W
See also fig. 25, 26
Module copper plate to heat sink thermal
resistance. Silicon grease applied = 0.1mm
RthC-H
0.03
C/W
W
º
29
42
81
40
IC = 2A, VDC = 530V, fsw = 8kHz, TC = 55 C
PD1
PD2
PD3
º
IC = 3A, VDC = 530V, fsw = 8kHz, TC = 55 C
Pdiss
Total Dissipated Power
º
IC = 3A, VDC = 530V, fsw = 16kHz TC = 55 C,
º
IC = 7A, VDC = 530V, fsw = 4kHz, TC = 55 C
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8
PIIPM15P12D007
I27179 22 - Sep
Electrical Characteristics: Embedded Driving Board (EDB) communication ports
For proper operation the device should be used within the recommended conditions.
Vin = 15V, Vin-iso = 5V, TA = 0 to 55°C, TC = 75°C (unless otherwise specified)
Symbol
Vin
Parameter Definition
EDB Input supply Voltage
Min.
Typ.
15
Max.
18
Units
V
Test Conditions
Type
Conn.
12
Non
isolated
Suppy
Isupp
EDB Input Supply Current
150
250
mA
VDC = 600V, fPWM = 16kHz
Vin iso
Iq. iso
EDB isolated supply voltage
EDB isolated quiescent supply current
4.5
10
5
9
5.5
15
V
Rx+ = +5V, Rx- = 0V
SPIRxIn open
mA
Isolated
supply
SPIRxIn low
15
55
22
62
mA
mA
Rx+ = 0V, Rx- = +5V
Tx+ and Tx- open
SPIRxIn low
Isupp. iso
EDB isolated supply current
Rx+ = 0V, Rx- = +5V
Tx+ and Tx- on 120Ω
50
2
VDO-TX
VCO-TX
VDI-RX
RIN-RX
fMAX
Differential Driver Output Voltage
Driver Common mode output voltage
Receiver Input Differential Threshold Voltage
Receiver Input Resistance
V
V
Rload = 120 Ω
3
RS485
port
RS485
- 0.2
3.8
0.2
V
≤
≤ +12V
VCM
- 7V
120
Ω
Mbps
V
RS485 maximum data rate
2.5
Logic High Input Voltage
SpiRxIn
Logic Low Input Voltage
1.0
-5
V
Logic Low Input Current
mA
V
SPI
port
0,8
1,2
Iout = -510µA
Iout = -1,2mA
Iout = 3mA
Logic Low Output Voltage
SpiTxOut
SpiCkOut
V
Logic High Output Voltage
2.4
V
CAUTION: DO NOT
APPLY DC BUS VOLTAGE WHEN JTAG
INTERFACE IS CONNECTED, SEVER
DAMAGE MAY OCCUR ON POWER
MODULE AND ON YOUR EQUIPMENT!)
TMS,TDI,TDO JTAG interface pins (
Please see
Directly connected from DSP
to connector pins.
EMU0 and EMU1 with 4.7k
internal pull up.
TCK,TRST-
EMU0
TMS320LF2406A
datasheet from
JTAG
EMU1/OFF~
PD
Texas Instruments
and VPD specifications
VPD
Presence detect voltage
3.2
3.3
3.4
V
V
JTAG
JTAG
IPD = -100µA
VBoot En~
IBoot-En~
Boot ROM enable input voltage
Boot ROM enable input current
Logic Low Output Voltage
Logic High Output Voltage
Logic Low Input Voltage
0.5
- 100
0.8
Active low
JTAG
µA
V
Iout = - 780µA
Iout = 860µA
CAN Tx
CAN Rx
2.4
2.4
V
CAN
port
0.8
V
Logic High Input Voltage
V
~ indicates active low signals
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9
PIIPM15P12D007
I27179 22 - Sep
AC Electrical Characteristics: Embedded Driving Board (EDB)
DSP pins mapping
For proper operation the device should be used within the recommended conditions.
Vin = 15V, Vin-iso = 5V, TA = 0 to 55°C, TC = 75°C (unless otherwise specified)
Test
Symbol
VDCgain
Parameter Definition
Min.
Typ.
Max.
Units
DSP name; pin N
Conditions
DC bus voltage feedback partition coefficient
DC bus voltage feedback second order filter
DC bus voltage over-voltage threshold
2.39
-
2.44
22
2.49
-
mV/V
kHz
V
ADCIN03 ; 72
PDPINTA~ ; 6
ADCIN04 ; 70
VDCpole
VDC-OVth
VTH25C
870
2.65
1.04
125
1600
78
920
2.75
1.09
128
1700
80
970
2.85
1.14
131
1800
82
º
V
Thermal sensor voltage feedback at 25 C (Fig. TF1)
º
VTH100C
Vin-gain
Vin-pole
Iph-GAIN
Iph-pole
Iph-LAT
Iph-Zero
V
Thermal sensor voltage feedback at 100 C (Fig. TF1)
Input voltage feedback partition coefficient
Input voltage feedback filter pole
Current feedback gain
mV/V
Hz
ADCIN05 ; 69
mV/A
kHz
µs
Current feedback filter pole
9.8
10.9
12
ADCIN01: 77
ADCIN02: 74
all two phases
all phases
Current feedback signal delay
Zero current input voltage level
5
1.62
1.65
1.68
V
Vce_sc
ISC-DEL
Vce Short Circuit Threshold detection
Short Circuit detection delay time
7.4
3
V
PDPINTA~ ; 6
6
µs
External watchdog timeout (see also RS~ signal),
please see WD internal signal for more details
WD
0.9
0
Sec
IOPC1 ; 85
ADCin
Generic purpose analog Input
3.3
3.3
V
kHz
V
ADCIN08 ; 80
Generic purpose analog input filter pole
Analog input 1 for sincos resolver
Analog input for sincos resolver filter pole
4.13
4.13
0
ADCIN06 ; 67
QEP1 ; 57
kHz
V
See also QEP1
internal signal
SinCos1/QE1
High level threshold
Low level threshold
2,4
0
QEP1: internal digital
signal of QE1
1
V
Analog input 2 for sincos resolver
3.3
V
ADCIN07;66
QEP2 ; 55
Analog input for sincos resolver filter pole
4.13
kHz
V
See also QEP2
internal signal
SinCos2/QE2
COM
High level threshold
Low level threshold
2,4
QEP2: internal digital
signal of QE2
1
V
3, 5, 13, 14, 19, 26, 27, 29, 32, 34, 46, 53,55, 58, 63,
65, 68, 71, 73, 75, 76, 78,79, 81, 84, 90, 97
DSP Ground
3.3V
DSP 3.3V supply
4, 10, 20, 30, 35, 47, 54, 59, 64, 91, 98
12, 23, 88, 25, 42, 44, 51
Floating
Not connected to anything
~ indicates active low signals
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10
PIIPM15P12D007
I27179 22 - Sep
Other DSP pins mapping to the connector
Symbol
Hall1
Signal Definition
Hall effect sensor input 1
DSP name ; pin N
Comments
Connector
CAP4/QEP3/IOPE7 ; 60
CAP5/QEP4/IOPF0 ; 56
Digital Input. See elec. characteristic of I/O pins
Digital Input. See elec. characteristic of I/O pins
Hall2
Hall effect sensor input 2
RS485
Hall3 /
Excitation
PWM7/IOPE1,
CAP6/IOPF1 ; 45, 48
Digital I/O, Output is type G3. See electrical
characteristics of I/O pins
Digital I/O, Output is type G3. See electrical
characteristics of I/O pins
Hall effect sensor input 3 / Resolver excitation
General purpose I/O
Contactor
IOPB6 ; 11
CANTX ; 50
CANRX ; 49
CAN Tx
CAN transmit data
Not isolated
CAN Rx
CAN receive data
Not isolated
TDIRB/IOPF4,
Homing/Direction
Start/Stop
Boot En~
Counter
Homing signal/ Counter direction
Start/Stop signal
Avoid electrical conflicts beetwen these two pins
Digital Input. See elec. Characteristic of I/O pins
See also EDB electrical characteristics
Digital Input. See elec. Characteristics of I/O pins
CAP3/IOPA5 ;2, 52
JTAG
IOPF6 ; 92
BOOT_EN~ ; 86
TCLKINB ; 89
Boot ROM enable signal
Counter signal
These signals are internal only
Symbol
PWM1
Signal Definition
Out 1 high side IGBT gate drive signal
Out 1 low side IGBT gate drive signal
Out 2 high side IGBT gate drive signal
Out 2 low side IGBT gate drive signal
Out 3 high side IGBT gate drive signal
Out 3 low side IGBT gate drive signal
DSP name ; pin N
PWM1; 39
Comments
DSP Event Manager A output
DSP Event Manager A output
DSP Event Manager A output
DSP Event Manager A output
DSP Event Manager A output
DSP Event Manager A output
DSP Event Manager B output
PWM2
PWM3
PWM4
PWM5
PWM6
Brake
PWM2 ; 37
PWM3 ; 36
PWM4 ; 33
PWM5 ; 31
PWM6 ; 28
T3PWM ; 7
Brake IGBT gate drive signal
SpiTx output
SPISIMO ; 21
SPISOMI ; 22
SPICLK ; 24
VREFHI, VCCA ; 82, 83
VCCP ; 40
SpiTXout
SpiRXout
These signal are optically isolated.
See also EDB electrical characteristics
SpiRx input
SpiCKout
Ref3.3V
SpiClk output
3.3V reference voltage
3.3V reference and supply voltage for ADC converter
Supplied by the embedded flyback regulator
5V supp.
Tx
Flash programming voltage pin
SCI transmit data
SCITXD ; 17
SCIRXD ; 18
IOPA2 ; 16
Drives Tx+ and Tx- through the opto-isolator and the line driver
Driven by Rx+ and Rx- through the opto-isolator and the line driver
Enable the SCI line driver through an opto-isolator
Rx
SCI receive data
SCI_Tx_en
Latch-reset~
FaultCLR
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SCI transmitter enable
LFAULT Reset signal, to be activated via software after a fault or
system boot, active low
Gate driver reset, to be activated via software after a short-circuit or
system boot
System general fault output reset signal
Gate driver fault output reset signal
IOPD0 ; 15
IOPE3 ; 41
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Forces a DSP reset if WD signal holds too long (see also EDB
electrical char.)
RS~
DSP reset input signal (see also WD signal)
PLL oscillator input pin
RS~ ; 93
XTAL1 ; 87
PFFL ; 9
Xtal1
A 10Mhz oscillator at 100ppm frequency stability feeds this pin.
PLLF1
PLLF2
FaultMem~
BrakeFault~
QEP1
PLL filter input 1
PLL filter for 40Mhz DSP clock frequency
PLL filter input 2
PLLF2 ; 8
PLL filter for 40Mhz DSP clock frequency
Activated by short circuits on output phases or brake IGBTand by DC
bus over-voltage comparator. Latched signal, see also Latch-reset
System general fault input
Brake Protection Interrupt signal
Square wave of SinCos1/QE1
Square wave of SinCos2/QE2
PDPINTA~ ; 6
PDPINTB~ ; 95
QEP1 ; 57
Activated by short circuits on brake
Internal Schmitt trigger, see also AC electrical characteristic
Internal Schmitt trigger, see also AC electrical characteristic
QEP2
QEP2 ; 55
WD = high impedance, external watchdog is disabled
WD
Output signal for external watchdog
IOPC1 ; 85
WD = high or WD = low, external watchdog is enabled and WD has to
be periodically triggered by positive or negative transition. When the
supervising system fails to retrigger the ext. watchdog within the time
shown on AC electrical Characteristics, RS~ signal becomes active.
~ indicates active low signals
64kbits I2C EEprom (please see Microchip 24LC4 for more specifications)
Symbol
Signal Definition
DSP name ; pin N
Comments
I2C - Clock
I2C - Data
I2C - Clock
I2C - Clock
IOPE2 ; 43
IOPE4 ; 38
Connected to the I2C EEPROM
Connected to the I2C EEPROM
Electrical characteristic of digital inputs and outputs.
Test
Units
Symbol
Input: VIH
Parameter Definition
Logic high,generic input voltage
Min.
Typ.
Max.
Conditions
2.4
V
V
Input: VIL
Logic low, generic input voltage
0.8
0.8
0.8
0.8
Output
VOH
VOL
VOH
VOL
VOH
VOL
2.4
2.4
2.4
V
V
V
V
V
V
Iout = 700µA
Iout = - 700µΑ
Iout = 850 µΑ
Iout = - 850 µΑ
Iout = 950 µA
Iout = -950 µΑ
Type G1(*)
Output
Type G2(*)
Output
Type G3(*)
(*) Please refer to TMS320LF2406A datasheet from Texas Instruments for more specifications.
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PIIPM15P12D007
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Fig. 1 – Maximum DC collector
Current vs. case temperature
Fig. 2 – Power Dissipation vs.
Case Temperature
TC = (ºC)
TC = (ºC)
Fig. 3 – Forward SOA
Fig. 4 – Reverse Bias SOA
Tj = 150ºC, VGE = 15V
TC = 25ºC; Tj ≤ 150ºC
VCE = (V)
VCE = (V)
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PIIPM15P12D007
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Fig. 5 – Typical IGBT Output Characteristics
Fig. 6 – Typical IGBT Output Characteristics
Tj = - 40ºC; tp = 300µs
Tj = 25ºC; tp = 300µs
VCE = (V)
VCE = (V)
Fig. 7 – Typical IGBT Output Characteristics
Fig. 8 – Typical Diode Forward
Tj = 125ºC; tp = 300µs
Characteristics tp = 300µs
VCE = (V)
VF = (V)
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Fig. 9 – Typical VCE vs. VGE
Tj = - 40ºC
Fig. 10 – Typical VCE vs. VGE
Tj = 25ºC
VGE = (V)
VGE = (V)
Fig. 11 – Typical VCE vs. VGE
Tj = 125ºC
Fig. 12 – Typical Transfer Characteristics
VCE = 20V; tp = 20µs
VGE = (V)
VGE = (V)
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PIIPM15P12D007
I27179 22 - Sep
Fig. 13 – Typical Energy Loss vs. IC
Tj = 125ºC; L = 500µH; VCE = 600V;
Rg = 10Ω; VGE = 15V
Fig. 14 – Typical Switching Time vs. IC
Tj = 125ºC; L = 500µH; VCE = 600V;
Rg = 10Ω; VGE = 15V
IC = (A)
IC = (A)
Fig. 15 – Typical Energy Loss vs. Rg
Tj = 125ºC; L = 500µH; VCE = 600V;
ICE = 15A; VGE = 15V
Fig. 16 – Typical Switching Time vs. Rg
Tj = 125ºC; L = 500µH; VCE = 600V;
ICE = 15A; VGE = 15V
Rg = (Ω)
Rg = (Ω)
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PIIPM15P12D007
I27179 22 - Sep
Fig. 17 – Typical Diode IRR vs. IF
Tj = 125ºC
Fig. 18 – Typical Diode IRR vs. Rg
IF = 15A; Tj = 125ºC
IF = (A)
Rg = (Ω)
Fig. 19 – Typical Diode IRR vs. dIF/dt
VDC = 600V; VGE = 15V; IF = 15A; Tj =
125ºC
Fig. 20 – Typical Diode QRR
VDC = 600V; VGE = 15V; Tj = 125ºC
dIF/dt (A/µs)
dIF/dt (A/µs)
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PIIPM15P12D007
I27179 22 - Sep
Fig. 21 – Typical Diode EREC vs. IF
Tj = 125ºC
Fig. 22 – Typical Capacitance vs. VCE
VGE = 0V; f = 1MHz
IF = (A)
VCE = (V)
Fig. 23 – Typical Gate Charge vs. VGE
IC = 15A; L = 600µH; VCC = 600V
Fig. 24 – On state Voltage Drop characteristic
VFM vs IF tp = 400µs
QG = (nC)
VFM = (V)
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PIIPM15P12D007
I27179 22 - Sep
Fig. 25 – Normalized Transient Thermal Impedance, Junction-to-copper plate (IGBTs)
t1, Rectangular Pulse Duration (sec)
Fig. 26 – Normalized Transient Impedance, Junction-to-copper plate (FRED diodes)
t1, Rectangular Pulse Duration (sec)
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PIIPM15P12D007
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PIIPM15P12D007
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PIIPM15P12D007
I27179 22 - Sep
Fig. PD1 – Total Dissipated Power vs. fSW
IoutRMS = 2A, VDC = 530V, TC = 55ºC
Fig. PD2 – Total Dissipated Power vs. fSW
IoutRMS = 3A, VDC = 530V, TC = 55ºC
120
90
60
30
0
120
90
60
30
0
0
4
8
12
16
20
0
4
8
12
16
20
fSW = (kHz)
fSW = (kHz)
Fig. PD3 – Total Dissipated Power vs. fSW
IoutRMS = 7A, VDC = 530V, TC = 55ºC
Fig. TF1 – Thermal Sensor Voltage
Feedback vs. Base-plate Temperature
TC (ºC)
fSW = (kHz)
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PIIPM15P12D007
I27179 22 - Sep
PIIPM family part number identification
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PIIPM15P12D007
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Top board suggested footprint
(top view)
RS485 and JTAG Connectors
Top view
These connectors do not have any orientation tag; please check their Pin 1 position on Power Module Frame
Pins Mapping before inserting mate part.
Molex 53916-0204
mates with 54167-0208 or 52991-0208
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PIIPM15P12D007
I27179 22 - Sep
PIIPM15P12D007 case outline and dimensions
Data and specifications subject to change without notice
This product has been designed and qualified for Industrial Level.
Qualification Standards can be found on IR’s Web Site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 3252 7105
TAC Fax: (310) 252 7309
Visit us at www.irf.com for sales contact information 22 - Sep
Data and specifications subject to change without notice.
Sales Offices, Agents and Distributors in Major Cities Throughout the World.
© 2003 International Rectifier - Printed in Italy 09 - 22 - Rev. 3.1
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相关型号：
PIIPM25P12B008
Programmable solated intelligent power module. a 25A. 1200V. three-phase inverter for 15kW industrial and servo motors with on-board programmable DSP. current sensing. isolation. gate drivers and power stage.
ETC
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