PTAC260302FCV1R250XTMA1 [INFINEON]
Thermally-Enhanced High Power RF LDMOS FET;型号: | PTAC260302FCV1R250XTMA1 |
厂家: | Infineon |
描述: | Thermally-Enhanced High Power RF LDMOS FET |
文件: | 总9页 (文件大小:1255K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PTAC260302FC
Thermally-Enhanced High Power RF LDMOS FET
30 W, 28 V, 2620 – 2690 MHz
Description
The PTAC260302FC is a 30-watt LDMOS FET intended for use in
multi-standard cellular power amplifier applications in the 2620 to
2690 MHz frequency band. This device integrates a 10-W (main)
and a 20-W (peak) transistor, making it ideal for asymmetric Doherty
amplifier designs. Features include input matching, high gain and
thermally-enhanced package with earless flange. Manufactured with
Infineon's advanced LDMOS process, this device provides excellent
thermal performance and superior reliability.
PTAC260302FC
Package H-37248H-4
Features
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA,
•ꢀ Asymmetric design
ƒ = 2620, 2655, 2690 MHz,
3GPP WCDMA signal, 10 dB PAR,
3.84 MHz bandwidth
•ꢀ Broadband internal matching
•ꢀ Typical CW performance, 2690 MHz, 28 V
-10
-20
-30
-40
-50
-60
60
50
40
30
20
10
(Doherty configuration, combined output)
- Output power @ P
- Efficiency = 54%
- Gain = 13 dB
= 30 W
3dB
2620 MHz
2655 MHz
2690 MHz
•ꢀ Typical single-carrier WCDMA performance,
2690 MHz, 28 V, 10 dB PAR
- Output power = 37.5 dBm avg
- Gain = 15.5 dB
- Efficiency = 45%
Efficiency
ACP Up
ACP Low
•ꢀ Capable of handling 10:1 VSWR @ 32 V, 30 W
(CW) output power
•ꢀ Integrated ESD protection
c260302fc_gr1
•ꢀ Human Body Model Class 1B (per ANSI/ESDA/
28
30
32 34 36
38
40
42
44
JEDEC JS-001)
Average Output Power (dBm)
•ꢀ Pb-free and RoHS compliant
RF Characteristics
Single-carrier WCDMA Specifications (tested in Infineon Doherty test fixture)
= 28 V, I = 85 mA, V = 1.1 V, P = 5.6 W avg, ƒ = 2690 MHz,
V
DD
DQ
GS1
OUT
3GPP WCDMA signal, 3.84 MHz channel bandwidth, 10 dB peak/average @ 0.01% CCDF
Characteristic
Symbol
Min
14.5
42
Typ
15.5
45
Max
—
Unit
dB
Linear Gain
G
ps
Drain Efficiency
hD
—
%
Adjacent Channel Power Ratio
ACPR
—
–27
–25
dBc
All published data at T
= 25°C unless otherwise indicated
CASE
ESD: Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet 1 of 9
Rev. 04, 2016-06-21
PTAC260302FC
DC Characteristics (each side)
Characteristic
Conditions
Symbol
Min
65
—
Typ
—
Max
—
Unit
V
Drain-Source Breakdown Voltage
Drain Leakage Current
V
GS
= 0 V, I = 10 mA
V(
BR)DSS
DS
V
= 28 V, V = 0 V
I
I
—
1
µA
µA
µA
W
DS
DS
GS
DSS
DSS
V
= 63 V, V = 0 V
—
—
10
1
GS
Gate Leakage Current
V
GS
= 10 V, V = 0 V
I
—
—
DS
GSS
On-State Resistance
(main)
(peak)
V
GS
= 10 V, V = 0.1 V
R
R
—
0.8
0.6
2.7
1.1
—
DS
DS(on)
DS(on)
V
GS
= 10 V, V = 0.1 V
—
—
W
DS
Operating Gate Voltage (main)
(peak)
V
= 28 V, I
= 28 V, I
= 0.085 A
= 0 A
V
GS
2
3.5
1.8
V
DS
DS
DQ
DQ
V
V
GS
0.4
V
Maximum Ratings
Parameter
Symbol
Value
65
Unit
V
Drain-Source Voltage
Gate-Source Voltage
Junction Temperature
Storage Temperature Range
V
DSS
V
GS
–6 to +10
225
V
T
°C
J
T
STG
–65 to +150
1.5
°C
Thermal Resistance
(main)
(peak)
(T
(T
70°C, 30 W CW)
70°C, 30 W CW)
R
qJC
R
qJC
°C/W
°C/W
CASE
CASE
1.7
Ordering Information
Type and Version
Order Code
Package and Description
Shipping
PTAC260302FC V1 R0
PTAC260302FCV1R0XTMA1
H-37248H-4, Ceramic open-cavity, earless
Tape & Reel, 50 pcs
PTAC260302FC V1 R250
PTAC260302FCV1R250XTMA1 H-37248H-4, Ceramic open-cavity, earless
Tape & Reel, 250 pcs
Data Sheet
2 of 9
Rev. 04, 2016-06-21
PTAC260302FC
Pinout Diagram (top view)
S
Peak
D1
Main
Pin
D1
D2
G1
G2
S (flange)
Description
D2
Drain device 1 (peak)
Drain device 2 (main)
Gate device 1 (peak)
Gate device 2 (main)
Source
G1
G2
Lead connections for PTAC260302FC
Typical Performance (data taken in a production test fixture)
Single-carrier WCDMA Broadband
VDD = 28 V, IDQ = 85 mA, POUT = 37.5 dBm,
3GPP WCDMA signal, 10 dB PAR
Single-carrier WCDMA Broadband
VDD = 28 V, IDQ = 85 mA, POUT = 37.5 dBm,
3GPP WCDMA signal, 10 dB PAR
19
18
17
16
15
14
13
12
47
46
45
44
43
42
41
40
-5
-10
-15
-20
-25
-30
-35
-40
-5
-10
-15
-20
-25
-30
-35
-40
Efficiency
Return Loss
Gain
ACP Up
c260302fc_gr5
c260302fc_gr6
2580
2620
2660
2700
2740
2580
2620
2660
2700
2740
Frequency (MHz)
Frequency (MHz)
Data Sheet
3 of 9
Rev. 04, 2016-06-21
PTAC260302FC
Typical Performance (cont.)
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA, ƒ = 2620 MHz,
3GPP WCDMA signal,
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA, ƒ = 2655 MHz,
3GPP WCDMA signal,
10 dB PAR, 3.84 MHz bandwidth
10 dB PAR, 3.84 MHz bandwidth
24
20
16
12
8
60
40
20
0
24
20
16
12
8
60
40
20
0
Efficiency
Efficiency
Gain
Gain
-20
-40
-60
-20
-40
-60
PAR @ 0.01% CCDF
PAR @ 0.01% CCDF
4
4
c260302fc_gr3
c260302fc_gr2
0
0
28
32
36
40
44
28
32
36
40
44
Average Output Power (dBm)
Average Output Power (dBm)
CW Performance
VDD = 28 V, IDQ = 85 mA,
ƒ = 2620, 2655, 2690 MHz
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA, ƒ = 2690 MHz,
3GPP WCDMA signal,
10 dB PAR, 3.84 MHz bandwidth
24
20
16
12
8
60
40
20
0
19
18
17
16
15
14
13
12
11
10
60
55
50
45
40
35
30
25
20
15
Efficiency
Efficiency
Gain
Gain
-20
-40
-60
2620 MHz
2655 MHz
2690 MHz
PAR @ 0.01% CCDF
4
c260302fc_gr4
c260302fc_gr7
0
28
32
36
40
44
30 32
34 36 38 40 42 44 46
Output Power (dBm)
Average Output Power (dBm)
Data Sheet
4 of 9
Rev. 04, 2016-06-21
PTAC260302FC
Typical Performance (cont.)
CW Performance
CW Performance
at selected VDD
IDQ = 85 mA, ƒ = 2620 MHz
at selected VDD
IDQ = 85 mA, ƒ = 2655 MHz
19
18
17
16
15
14
13
12
11
10
65
60
55
50
45
40
35
30
25
20
19
18
17
16
15
14
13
12
11
10
65
60
55
50
45
40
35
30
25
20
Efficiency
Efficiency
Gain
Gain
VDD = 24 V
DD = 28 V
VDD = 32 V
VDD = 24 V
DD = 28 V
VDD = 32 V
V
V
c260302fc_gr8
c260302fc_gr9
30 32 34 36 38 40 42 44 46
Output Power (dBm)
30 32 34 36 38 40 42 44 46
Output Power (dBm)
CW Performance
at selected VDD
IDQ = 85 mA, ƒ = 2690 MHz
Small Signal CW
Gain & Input Return Loss
VDD = 28 V, IDQ = 85 mA
19
18
17
16
15
14
13
12
11
10
65
60
55
50
45
40
35
30
25
20
17.5
15.0
12.5
10.0
7.5
0
Efficiency
-2
-4
Gain
Gain
-6
-8
-10
-12
-14
-16
5.0
VDD = 24 V
VDD = 28 V
2.5
VDD = 32 V
IRL
c260302fc_gr10
c260302fc_gr11
0.0
30 32 34 36 38 40 42 44 46
Output Power (dBm)
1950 2150 2350 2550 2750 2950 3150
Frequency (MHz)
Data Sheet
5 of 9
Rev. 04, 2016-06-21
PTAC260302FC
Load Pull Performance
Z Source
Z Load
D
S
G
G
D
Main Side – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 85 mA
P
1dB
Class AB
Max Output Power
Max PAE
Freq
[MHz]
Zs W
Zl W
Gain
[dB]
P
dBm
P
[W] PAE %
Zl W
Gain [dB]
P
[dBm]
P [W]
OUT
PAE %
66.4
OUT
OUT
OUT
2620
2655
2690
26 – j22
33 – j32
55 – j34
10.9 – j9.7
12.7 – j9.6
19.7
20.0
42.36
17.2
17.6
19.3
61.0
59.8
55.1
5.9 – j7.0
7.1 – j8.1
6.8 – j9.0
21.6
21.4
21.2
40.70
11.7
13.7
13.6
42.45
42.86
41.36
41.33
65.9
64.4
15.2 – j11.4 19.3
Peak Side – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 115 mA
P
1dB
Class AB
Max Output Power
Max PAE
Freq
[MHz]
Zs W
Zl W
Gain
[dB]
P
dBm
P
[W] PAE %
Zl W
Gain [dB]
P
P
[W]
OUT
PAE %
OUT
OUT
OUT
[dBm]
41.92
42.07
42.16
2620
2655
2690
36 - j41
42 - j31
55 - j33
11.5 - j14.9 19.6
11.9 - j12.7 20
12.9 - j15.0 19.5
43.11
20.5
20.4
19.4
58.8
61.1
57.2
6.4 - j13.4 20.9
7.0 - j13.9 20.8
7.8 - j15.1 20.5
15.6
16.1
16.4
63.9
63.2
61.8
43.09
42.87
Reference Circuit
DUT
PTAC2603022FC
Test Fixture Part No.
PCB
LTA/PTAC260302FC
Rogers 4350, 0.762 mm [.030"] thick, 2 oz. copper, εr = 3.66
Find Gerber files for this test fixture on the Infineon Web site at (http://www.infineon.com/rfpower)
Data Sheet
6 of 9
Rev. 04, 2016-06-21
PTAC260302FC
Reference Circuit (cont.)
R04350, 030
R04350 030
(105)
(61)
VGSpeak
VDD
C105
C101
C201
C203
C208
R104
C104
R101
C205
C202
C102
RF_OUT
RF_IN
R103
C106
C206
S1
C103
R102
VDD
VGSmain
C204
C207
PTAC260302F_OUT_03_D
PTAC260302F_IN_03_D
c
2 6 0 3 0 2 f c _ c d _ 3 - 7 - 1 3
Reference circuit assembly diagram (not to scale)
Component Information
Component
Description
Suggested Manufacturer
P/N
Input
C101, C103
C102, C104, C105, C106
R101
Capacitor, 10 µF, 50 V
Chip capacitor, 18 pF
Resistor, 50 Ohm
Resistor, 20 Ohm
Resistor, 10 Ohm
Hybrid coupler
Panasonic Electronic Components
EEV-HD1H100P
ATC100A180JW150XB
C16A50Z4
ATC
Anaren
R102
Panasonic Electronic Components
Panasonic Electronic Components
Anaren
ERJ-8GEYJ200V
ERJ-3GEYJ100V
X3C25P1_05S
R103, R104
S1
Output
C201, C202
C203, C207
C204, C205
C206, C208
Chip capacitor, 18 pF
Capacitor, 10 µF
ATC
ATC100A180JW150XB
UMK325C7106MM-T
ATC100A180JW150XB
EEE-FP1V221AP
Taiyo Yuden
Chip capacitor, 18 pF
Capacitor, 220 µF, 35 V
ATC
Panasonic Electronic Components
Data Sheet
7 of 9
Rev. 04, 2016-06-21
PTAC260302FC
Package Outline Specifications
Package H-37248H-4
(8.89
[.350])
D
2X 45° x .64
[.025]
(5.08
[.200])
4X 3.49±0.51
[.138±.020]
D1
G1
D2
(16.76
[.660])
9.78
[.385]
C
L
G2
+0.38
4X R0.51
-0.13
+.015
-.005
R.020
[
]
C
L
4X 3.81
[.150]
2X 12.70
[.500]
3.76±0.25
[.148±.010]
19.81±0.20
[.780±.008]
1.57
[.062] SPH
(1.02
[.040])
H-37248H-4_sl_01_12-03-2012
20.57
[.810]
S
Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances 0.127 [.005] unless specified otherwise.
4. Pins: D1, D2 – drains; G1, G2 – gates; S – source.
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].
6. Gold plating thickness: 1.14 0.38 micron [45 15 microinch].
(Find the latest and most complete information about products and packaging at the Infineon Internet page
(http://www.infineon.com/rfpower)
Data Sheet
8 of 9
Rev. 04, 2016-06-21
PTAC260302FC V1
Revision History
Revision Date
Data Sheet
Page
Subjects (major changes since last revision)
01
02
2012-03-05 Advance
2012-11-28 Advance
all
New product, proposed only.
1,3
2
Updated package and Package Outline.
Updated Pinout Diagram.
03
04
2014-02-12 Production
2016-06-21 Production
all
3 – 7
Product released to production. All information updated.
Performance graphs, load pull and circuit information added.
1
2
Updated ESD rating
Maximum junction temperature raised to 225°C, updated ordering info.
We Listen toYour Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
(highpowerRF@infineon.com)
To request other information, contact us at:
+1 877 465 3667 (1-877-GO-LDMOS) USA
or +1 408 776 0600 International
Edition 2016-06-21
Published by
Infineon Technologies AG
85579 Neubiberg, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com/rfpower).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question,
please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of In-
fineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device
or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be
implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet
9 of 9
Rev. 04, 2016-06-21
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