PTAC260302FCV1R250XTMA1 [INFINEON]

Thermally-Enhanced High Power RF LDMOS FET;
PTAC260302FCV1R250XTMA1
型号: PTAC260302FCV1R250XTMA1
厂家: Infineon    Infineon
描述:

Thermally-Enhanced High Power RF LDMOS FET

文件: 总9页 (文件大小:1255K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PTAC260302FC  
Thermally-Enhanced High Power RF LDMOS FET  
30 W, 28 V, 2620 – 2690 MHz  
Description  
The PTAC260302FC is a 30-watt LDMOS FET intended for use in  
multi-standard cellular power amplifier applications in the 2620 to  
2690 MHz frequency band. This device integrates a 10-W (main)  
and a 20-W (peak) transistor, making it ideal for asymmetric Doherty  
amplifier designs. Features include input matching, high gain and  
thermally-enhanced package with earless flange. Manufactured with  
Infineon's advanced LDMOS process, this device provides excellent  
thermal performance and superior reliability.  
PTAC260302FC  
Package H-37248H-4  
Features  
Single-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 85 mA,  
•ꢀ Asymmetric design  
ƒ = 2620, 2655, 2690 MHz,  
3GPP WCDMA signal, 10 dB PAR,  
3.84 MHz bandwidth  
•ꢀ Broadband internal matching  
•ꢀ Typical CW performance, 2690 MHz, 28 V  
-10  
-20  
-30  
-40  
-50  
-60  
60  
50  
40  
30  
20  
10  
(Doherty configuration, combined output)  
- Output power @ P  
- Efficiency = 54%  
- Gain = 13 dB  
= 30 W  
3dB  
2620 MHz  
2655 MHz  
2690 MHz  
•ꢀ Typical single-carrier WCDMA performance,  
2690 MHz, 28 V, 10 dB PAR  
- Output power = 37.5 dBm avg  
- Gain = 15.5 dB  
- Efficiency = 45%  
Efficiency  
ACP Up  
ACP Low  
•ꢀ Capable of handling 10:1 VSWR @ 32 V, 30 W  
(CW) output power  
•ꢀ Integrated ESD protection  
c260302fc_gr1  
•ꢀ Human Body Model Class 1B (per ANSI/ESDA/  
28  
30  
32 34 36  
38  
40  
42  
44  
JEDEC JS-001)  
Average Output Power (dBm)  
•ꢀ Pb-free and RoHS compliant  
RF Characteristics  
Single-carrier WCDMA Specifications (tested in Infineon Doherty test fixture)  
= 28 V, I = 85 mA, V = 1.1 V, P = 5.6 W avg, ƒ = 2690 MHz,  
V
DD  
DQ  
GS1  
OUT  
3GPP WCDMA signal, 3.84 MHz channel bandwidth, 10 dB peak/average @ 0.01% CCDF  
Characteristic  
Symbol  
Min  
14.5  
42  
Typ  
15.5  
45  
Max  
Unit  
dB  
Linear Gain  
G
ps  
Drain Efficiency  
hD  
%
Adjacent Channel Power Ratio  
ACPR  
–27  
–25  
dBc  
All published data at T  
= 25°C unless otherwise indicated  
CASE  
ESD: Electrostatic discharge sensitive device—observe handling precautions!  
Data Sheet 1 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
DC Characteristics (each side)  
Characteristic  
Conditions  
Symbol  
Min  
65  
Typ  
Max  
Unit  
V
Drain-Source Breakdown Voltage  
Drain Leakage Current  
V
GS  
= 0 V, I = 10 mA  
V(  
BR)DSS  
DS  
V
= 28 V, V = 0 V  
I
I
1
µA  
µA  
µA  
W
DS  
DS  
GS  
DSS  
DSS  
V
= 63 V, V = 0 V  
10  
1
GS  
Gate Leakage Current  
V
GS  
= 10 V, V = 0 V  
I
DS  
GSS  
On-State Resistance  
(main)  
(peak)  
V
GS  
= 10 V, V = 0.1 V  
R
R
0.8  
0.6  
2.7  
1.1  
DS  
DS(on)  
DS(on)  
V
GS  
= 10 V, V = 0.1 V  
W
DS  
Operating Gate Voltage (main)  
(peak)  
V
= 28 V, I  
= 28 V, I  
= 0.085 A  
= 0 A  
V
GS  
2
3.5  
1.8  
V
DS  
DS  
DQ  
DQ  
V
V
GS  
0.4  
V
Maximum Ratings  
Parameter  
Symbol  
Value  
65  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Junction Temperature  
Storage Temperature Range  
V
DSS  
V
GS  
–6 to +10  
225  
V
T
°C  
J
T
STG  
–65 to +150  
1.5  
°C  
Thermal Resistance  
(main)  
(peak)  
(T  
(T  
70°C, 30 W CW)  
70°C, 30 W CW)  
R
qJC  
R
qJC  
°C/W  
°C/W  
CASE  
CASE  
1.7  
Ordering Information  
Type and Version  
Order Code  
Package and Description  
Shipping  
PTAC260302FC V1 R0  
PTAC260302FCV1R0XTMA1  
H-37248H-4, Ceramic open-cavity, earless  
Tape & Reel, 50 pcs  
PTAC260302FC V1 R250  
PTAC260302FCV1R250XTMA1 H-37248H-4, Ceramic open-cavity, earless  
Tape & Reel, 250 pcs  
Data Sheet  
2 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
Pinout Diagram (top view)  
S
Peak  
D1  
Main  
Pin  
D1  
D2  
G1  
G2  
S (flange)  
Description  
D2  
Drain device 1 (peak)  
Drain device 2 (main)  
Gate device 1 (peak)  
Gate device 2 (main)  
Source  
G1  
G2  
Lead connections for PTAC260302FC  
Typical Performance (data taken in a production test fixture)  
Single-carrier WCDMA Broadband  
VDD = 28 V, IDQ = 85 mA, POUT = 37.5 dBm,  
3GPP WCDMA signal, 10 dB PAR  
Single-carrier WCDMA Broadband  
VDD = 28 V, IDQ = 85 mA, POUT = 37.5 dBm,  
3GPP WCDMA signal, 10 dB PAR  
19  
18  
17  
16  
15  
14  
13  
12  
47  
46  
45  
44  
43  
42  
41  
40  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
Efficiency  
Return Loss  
Gain  
ACP Up  
c260302fc_gr5  
c260302fc_gr6  
2580  
2620  
2660  
2700  
2740  
2580  
2620  
2660  
2700  
2740  
Frequency (MHz)  
Frequency (MHz)  
Data Sheet  
3 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
Typical Performance (cont.)  
Single-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 85 mA, ƒ = 2620 MHz,  
3GPP WCDMA signal,  
Single-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 85 mA, ƒ = 2655 MHz,  
3GPP WCDMA signal,  
10 dB PAR, 3.84 MHz bandwidth  
10 dB PAR, 3.84 MHz bandwidth  
24  
20  
16  
12  
8
60  
40  
20  
0
24  
20  
16  
12  
8
60  
40  
20  
0
Efficiency  
Efficiency  
Gain  
Gain  
-20  
-40  
-60  
-20  
-40  
-60  
PAR @ 0.01% CCDF  
PAR @ 0.01% CCDF  
4
4
c260302fc_gr3  
c260302fc_gr2  
0
0
28  
32  
36  
40  
44  
28  
32  
36  
40  
44  
Average Output Power (dBm)  
Average Output Power (dBm)  
CW Performance  
VDD = 28 V, IDQ = 85 mA,  
ƒ = 2620, 2655, 2690 MHz  
Single-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 85 mA, ƒ = 2690 MHz,  
3GPP WCDMA signal,  
10 dB PAR, 3.84 MHz bandwidth  
24  
20  
16  
12  
8
60  
40  
20  
0
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
Efficiency  
Efficiency  
Gain  
Gain  
-20  
-40  
-60  
2620 MHz  
2655 MHz  
2690 MHz  
PAR @ 0.01% CCDF  
4
c260302fc_gr4  
c260302fc_gr7  
0
28  
32  
36  
40  
44  
30 32  
34 36 38 40 42 44 46  
Output Power (dBm)  
Average Output Power (dBm)  
Data Sheet  
4 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
Typical Performance (cont.)  
CW Performance  
CW Performance  
at selected VDD  
IDQ = 85 mA, ƒ = 2620 MHz  
at selected VDD  
IDQ = 85 mA, ƒ = 2655 MHz  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
Efficiency  
Efficiency  
Gain  
Gain  
VDD = 24 V  
DD = 28 V  
VDD = 32 V  
VDD = 24 V  
DD = 28 V  
VDD = 32 V  
V
V
c260302fc_gr8  
c260302fc_gr9  
30 32 34 36 38 40 42 44 46  
Output Power (dBm)  
30 32 34 36 38 40 42 44 46  
Output Power (dBm)  
CW Performance  
at selected VDD  
IDQ = 85 mA, ƒ = 2690 MHz  
Small Signal CW  
Gain & Input Return Loss  
VDD = 28 V, IDQ = 85 mA  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
17.5  
15.0  
12.5  
10.0  
7.5  
0
Efficiency  
-2  
-4  
Gain  
Gain  
-6  
-8  
-10  
-12  
-14  
-16  
5.0  
VDD = 24 V  
VDD = 28 V  
2.5  
VDD = 32 V  
IRL  
c260302fc_gr10  
c260302fc_gr11  
0.0  
30 32 34 36 38 40 42 44 46  
Output Power (dBm)  
1950 2150 2350 2550 2750 2950 3150  
Frequency (MHz)  
Data Sheet  
5 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
Load Pull Performance  
Z Source  
Z Load  
D
S
G
G
D
Main Side – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 85 mA  
P
1dB  
Class AB  
Max Output Power  
Max PAE  
Freq  
[MHz]  
Zs W  
Zl W  
Gain  
[dB]  
P
dBm  
P
[W] PAE %  
Zl W  
Gain [dB]  
P
[dBm]  
P [W]  
OUT  
PAE %  
66.4  
OUT  
OUT  
OUT  
2620  
2655  
2690  
26 – j22  
33 – j32  
55 – j34  
10.9 – j9.7  
12.7 – j9.6  
19.7  
20.0  
42.36  
17.2  
17.6  
19.3  
61.0  
59.8  
55.1  
5.9 – j7.0  
7.1 – j8.1  
6.8 – j9.0  
21.6  
21.4  
21.2  
40.70  
11.7  
13.7  
13.6  
42.45  
42.86  
41.36  
41.33  
65.9  
64.4  
15.2 – j11.4 19.3  
Peak Side – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 115 mA  
P
1dB  
Class AB  
Max Output Power  
Max PAE  
Freq  
[MHz]  
Zs W  
Zl W  
Gain  
[dB]  
P
dBm  
P
[W] PAE %  
Zl W  
Gain [dB]  
P
P
[W]  
OUT  
PAE %  
OUT  
OUT  
OUT  
[dBm]  
41.92  
42.07  
42.16  
2620  
2655  
2690  
36 - j41  
42 - j31  
55 - j33  
11.5 - j14.9 19.6  
11.9 - j12.7 20  
12.9 - j15.0 19.5  
43.11  
20.5  
20.4  
19.4  
58.8  
61.1  
57.2  
6.4 - j13.4 20.9  
7.0 - j13.9 20.8  
7.8 - j15.1 20.5  
15.6  
16.1  
16.4  
63.9  
63.2  
61.8  
43.09  
42.87  
Reference Circuit  
DUT  
PTAC2603022FC  
Test Fixture Part No.  
PCB  
LTA/PTAC260302FC  
Rogers 4350, 0.762 mm [.030"] thick, 2 oz. copper, εr = 3.66  
Find Gerber files for this test fixture on the Infineon Web site at (http://www.infineon.com/rfpower)  
Data Sheet  
6 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
Reference Circuit (cont.)  
R04350, 030  
R04350 030  
(105)  
(61)  
VGSpeak  
VDD  
C105  
C101  
C201  
C203  
C208  
R104  
C104  
R101  
C205  
C202  
C102  
RF_OUT  
RF_IN  
R103  
C106  
C206  
S1  
C103  
R102  
VDD  
VGSmain  
C204  
C207  
PTAC260302F_OUT_03_D  
PTAC260302F_IN_03_D  
c
2 6 0 3 0 2 f c _ c d _ 3 - 7 - 1 3  
Reference circuit assembly diagram (not to scale)  
Component Information  
Component  
Description  
Suggested Manufacturer  
P/N  
Input  
C101, C103  
C102, C104, C105, C106  
R101  
Capacitor, 10 µF, 50 V  
Chip capacitor, 18 pF  
Resistor, 50 Ohm  
Resistor, 20 Ohm  
Resistor, 10 Ohm  
Hybrid coupler  
Panasonic Electronic Components  
EEV-HD1H100P  
ATC100A180JW150XB  
C16A50Z4  
ATC  
Anaren  
R102  
Panasonic Electronic Components  
Panasonic Electronic Components  
Anaren  
ERJ-8GEYJ200V  
ERJ-3GEYJ100V  
X3C25P1_05S  
R103, R104  
S1  
Output  
C201, C202  
C203, C207  
C204, C205  
C206, C208  
Chip capacitor, 18 pF  
Capacitor, 10 µF  
ATC  
ATC100A180JW150XB  
UMK325C7106MM-T  
ATC100A180JW150XB  
EEE-FP1V221AP  
Taiyo Yuden  
Chip capacitor, 18 pF  
Capacitor, 220 µF, 35 V  
ATC  
Panasonic Electronic Components  
Data Sheet  
7 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC  
Package Outline Specifications  
Package H-37248H-4  
(8.89  
[.350])  
D
2X 45° x .64  
[.025]  
(5.08  
[.200])  
4X 3.49±0.51  
[.138±.020]  
D1  
G1  
D2  
(16.76  
[.660])  
9.78  
[.385]  
C
L
G2  
+0.38  
4X R0.51  
-0.13  
+.015  
-.005  
R.020  
[
]
C
L
4X 3.81  
[.150]  
2X 12.70  
[.500]  
3.76±0.25  
[.148±.010]  
19.81±0.20  
[.780±.008]  
1.57  
[.062] SPH  
(1.02  
[.040])  
H-37248H-4_sl_01_12-03-2012  
20.57  
[.810]  
S
Diagram Notes—unless otherwise specified:  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. All tolerances 0.127 [.005] unless specified otherwise.  
4. Pins: D1, D2 – drains; G1, G2 – gates; S – source.  
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].  
6. Gold plating thickness: 1.14 0.38 micron [45 15 microinch].  
(Find the latest and most complete information about products and packaging at the Infineon Internet page  
(http://www.infineon.com/rfpower)  
Data Sheet  
8 of 9  
Rev. 04, 2016-06-21  
PTAC260302FC V1  
Revision History  
Revision Date  
Data Sheet  
Page  
Subjects (major changes since last revision)  
01  
02  
2012-03-05 Advance  
2012-11-28 Advance  
all  
New product, proposed only.  
1,3  
2
Updated package and Package Outline.  
Updated Pinout Diagram.  
03  
04  
2014-02-12 Production  
2016-06-21 Production  
all  
3 – 7  
Product released to production. All information updated.  
Performance graphs, load pull and circuit information added.  
1
2
Updated ESD rating  
Maximum junction temperature raised to 225°C, updated ordering info.  
We Listen toYour Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
(highpowerRF@infineon.com)  
To request other information, contact us at:  
+1 877 465 3667 (1-877-GO-LDMOS) USA  
or +1 408 776 0600 International  
Edition 2016-06-21  
Published by  
Infineon Technologies AG  
85579 Neubiberg, Germany  
© 2012 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.  
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com/rfpower).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of In-  
fineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device  
or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be  
implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  
Data Sheet  
9 of 9  
Rev. 04, 2016-06-21  

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