PTFA211001F [INFINEON]

RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, 31248, 2 PIN;
PTFA211001F
型号: PTFA211001F
厂家: Infineon    Infineon
描述:

RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, 31248, 2 PIN

放大器 CD 晶体管
文件: 总6页 (文件大小:225K)
中文:  中文翻译
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Preliminary PTFA211001E  
PTFA211001F  
Thermally Enhanced High Power RF LDMOS FETs  
100 W, 2110–2170 MHz  
Features  
Description  
Thermally enhanced packaging  
The PTFA211001E and PTFA211001F are thermally enhanced an  
internally matched 100-watt GOLDMOS FETs intended for WCDMA  
applications from 2110 to 2170 MHz. Thermally enhanced packaging  
provides the coolest operation possible. Full gold metallization  
ensures excellent device lifetime and reliability.  
Internal matching for wideband performance  
Typical two–carrier 3GPP WCDMA  
performance  
- Average output power = 22 W at –37 dBc  
- Efficiency = 28.5%  
Intermodulation Distortion vs. Output Power  
for selected currents  
Typical CW performance  
- Output power at P–1dB = 110 W  
- Gain = 16.4 dB  
-32  
- Efficiency = 57%  
Freq = 2.14 GHz, Vdd = 28V  
-34  
2Carrier 3GPP WCDMA , 10MHz Spacing  
Integrated ESD protection: Human Body Model,  
Class 1 (minimum)  
8dB PAR  
-36  
Excellent thermal stability, low HCI drift  
-38  
Capable of handling 10:1 VSWR at 28 V,  
100 W (CW) output power  
1200 mA  
-40  
1000 mA  
-42  
-44  
-46  
-48  
900 mA  
800 mA  
PTFA211001E*  
Package 30248  
34  
36  
38  
40  
42  
44  
46  
ESD: Electrostatic discharge sensitive device — observe handling  
precautions!  
PTFA211001F*  
Package 31248  
RF Characteristics at T  
= 25°C unless otherwise indicated  
CASE  
WCDMA Measurements (not subject to production test—verified by design/characterization in Infineon test fixture)  
= 28 V, I = 1050 mA, P = 22 W AVG  
V
DD  
DQ  
OUT  
f = 2140 MHz, f = 2150 MHz, 3GPP signal, channel bandwidth 3.84 MHz, 8.0 dB peak/average @ 0.01% CCDF  
1
2
Characteristic  
Intermodulation Distortion  
Gain  
Symbol  
Min  
Typ  
–37  
Max  
Units  
dBc  
dB  
IMD  
G
ps  
16.4  
28.5  
Drain Efficiency  
ηD  
%
*See Infineon distributor for future availability.  
Preliminary Data Sheet  
1
2004-06-04  
Preliminary PTFA211001E  
PTFA211001F  
Two–Tone Measurements (tested in Infineon test fixture)  
= 28 V, I = 950 mA, P = 100 W PEP, f = 2170 MHz, tone spacing = 1 MHz  
V
DD  
DQ  
OUT  
Characteristic  
Gain  
Symbol  
Min  
Typ  
16.4  
42  
Max  
Units  
dB  
G
ps  
Drain Efficiency  
ηD  
IMD  
%
Intermodulation Distortion  
–30  
–28  
dBc  
DC Characteristics at T  
= 25°C unless otherwise indicated  
CASE  
Characteristic  
Conditions  
Symbol  
Min  
65  
Typ  
Max  
Units  
V
Drain–Source Breakdown Voltage  
Drain Leakage Current  
On–State Resistance  
V
GS  
V
DS  
V
GS  
V
DS  
= 0 V, I = 10 µA  
V
(BR)DSS  
D
= 28 V, V  
= 0 V  
I
1.0  
µA  
GS  
DSS  
= 10 V, V = 0.1 V  
R
DS(on)  
0.1  
2.2  
0.01  
DS  
Operating Gate Voltage  
Gate Leakage Current  
= 28 V, I  
= 1050 mA  
V
GS  
1.8  
3.0  
1.0  
V
DQ  
V
GS  
= 10 V, V = 0 V  
I
GSS  
µA  
DS  
Maximum Ratings  
Parameter  
Symbol  
Value  
65  
Unit  
V
Drain–Source Voltage  
Gate–Source Voltage  
Junction Temperature  
Storage Temperature Range  
V
DSS  
V
GS  
–0.5 to +12  
200  
V
T
J
°C  
T
STG  
–40 to +150  
0.38  
°C  
Thermal Resistance (T  
= 70°C, 100 W CW)  
R
θJC  
°C/W  
CASE  
Ordering Information  
Type  
Package Outline  
Package Description  
Marking  
PTFA211001E*  
PTFA211001F*  
30248  
31248  
Thermally enhanced slotted flange, single-ended  
Thermally enhanced earless flange, single-ended  
PTFA211001E  
PTFA211001F  
*See Infineon distributor for future availability.  
Preliminary Data Sheet  
2
2004-06-04  
Preliminary PTFA211001E  
PTFA211001F  
Typical Performance in broadband test fixture  
Broadband 2-tone Performance  
Power Sweep, Pulsed Conditions  
60  
55  
50  
45  
40  
18  
35  
30  
25  
20  
15  
10  
0
Freq = 2.14 GHz, Vdd = 28V, Idq = 900 mA  
Pulse Width = 8 µs, Pulse Period = 40 µS  
17  
16  
15  
14  
13  
12  
11  
10  
EFFICIENCY  
IRL  
-10  
-20  
-30  
-40  
-50  
P -1 dB  
50.86 dBm  
51.68 dBm  
Vdd = 28V, Idq = 900 mA  
GAIN  
P -3 dB  
IMD  
20  
25  
30  
35  
40  
45  
2100  
2150  
FREQUENCY (MHz)  
2200  
Input Power (dBm), CW Pulsed  
Intermodulation Distortion Products  
vs. Frequency Spacing  
Intermodulation Distortion vs. Output Power  
for selected currents  
-20  
-20  
Freq = 2.14GHz, Vdd = 28V, Idq = 900mA  
Pout = 50W Avg  
Freq = 2.14 GHz, Vdd = 28V  
Tone Spacing = 1 MHz  
-25  
-25  
IM3  
-30  
-30  
1.2 A  
1.0 A  
-35  
-40  
-45  
-50  
-55  
-35  
1.1 A  
-40  
-45  
-50  
-55  
IM5  
IM7  
0.9 A  
0.8 A  
36  
38  
40  
42  
44  
46  
48  
50  
52  
1
10  
OUTPUT POWER (dBm) , PEP  
Frequency Spacing (MHz)  
Data Sheet  
3
2004-01-16  
Preliminary PTFA211001E  
PTFA211001F  
Package Outline Specifications  
Package 30248  
(45° X 2.72  
[.107])  
C
L
2X 4.83± 0.51  
[.190± .020]  
D
S
9.78  
[.385]  
+ 0.10  
-0.15  
LID 9.40  
C
L
+ .004  
[.370  
]
-.006  
19.43 ± 0.51  
[.765± .020]  
2X R1.63  
[.064]  
G
4X R1.52  
[.060]  
2X 12.70  
[.500]  
27.94  
[1.100]  
1.02  
[.040]  
19.81± 0.20  
[.780± .008]  
SPH 1.57  
[.062]  
3.76± 0.38  
[.142± .015]  
0.0381 [.0015]  
-A-  
34.04  
[1.340]  
0.51  
[.020]  
ERA-H-30248-2-1-230  
Notes: Unless otherwise specified  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. Pins: D = drain, S = source, G = gate  
4. Lead thickness: 0.10± +0.051/–0.025 [.004 +.002/–.001 ]  
Find the latest and most complete information about products and packaging at the Infineon Internet page  
http://www.infineon.com/products  
Preliminary Data Sheet  
4
2004-06-04  
Preliminary PTFA211001E  
PTFA211001F  
Package Outline Specifications (cont.)  
Package 31248  
(4 5 ° X 2 .7 2  
[.107])  
4 .8 3 ± 0 .5 1  
[.1 9 0 ± .0 2 0 ]  
D
1 9 .4 3 ± 0 .5 1  
[.7 6 5 ± .0 2 0 ]  
LID 9 .4 0  
[.3 7 0 ]  
9.78  
[.385]  
G
2X 12.70  
[.5 0 0 ]  
0 .5 1  
[.0 2 0 ]  
1 9 .8 1 ± 0.20  
[.7 8 0 ± .0 0 8 ]  
S P H 1.58  
[.062]  
1 .0 2  
[.040]  
0 .0 2 5 [.0 0 1 ]  
-A-  
S
ERA-H-21248-2-1-23  
2 0 .5 7  
[.810]  
3 .6 1 ± 0.38  
[.1 4 2 ± .015]  
Notes: Unless otherwise specified  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. Pins: D = drain, S = source, G = gate  
4. Lead thickness: 0.10± +0.051/–0.025 [.004 +.002/–.001 ]  
Find the latest and most complete information about products and packaging at the Infineon Internet page  
http://www.infineon.com/products  
Preliminary Data Sheet  
5
2004-06-04  
PTFA211001E/F  
Confidential, Limited Internal  
Revision History:  
2004-06-04  
none  
Subjects (major changes since last revision)  
Preliminary Data Sheet  
Previous version:  
Page  
We Listen toYour Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
highpowerRF@infineon.com  
To request other information, contact us at:  
+1 877 465 3667 (1-877-GOLDMOS) USA  
or +1 408 776 0600 International  
GOLDMOS® is a registered trademark of Infineon Technologies AG.  
Edition 2004-06-04  
Published by InfineonTechnologies AG,  
St.-Martin-Strasse 53,  
81669 München, Germany  
© InfineonTechnologies AG 2003.  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as a guarantee of  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,  
descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office (www.infineon.com/rfpower).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of  
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support  
device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are  
intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it  
is reasonable to assume that the health of the user or other persons may be endangered.  
Preliminary Data Sheet  
6
2004-06-04  

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