PTFA211801EV5R0 [INFINEON]
RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, GREEN, H-36260-2, 2 PIN;型号: | PTFA211801EV5R0 |
厂家: | Infineon |
描述: | RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, GREEN, H-36260-2, 2 PIN 局域网 CD 晶体管 |
文件: | 总9页 (文件大小:557K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PTFA211801E
Confidential, Limited Internal Distribution
Thermally-Enhanced High Power RF LDMOS FET
180 W, 2110 – 2170 MHz
Description
The PTFA211801E is a thermally-enhanced, 180-watt, internally
matched LDMOS FET intended for WCDMA applications. It is
characaterized for single- and two-carrier WCDMA operation from
2110 to 2170 MHz. Manufactured with Infineon's advanced LDMOS
process, this device provides excellent thermal performance and
superior reliability.
PTFA211801E
Package H-36260-2
Features
Two-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 1.2 A, ƒ = 2140 MHz,
3GPP WCDMA signal, PAR = 8 dB,
10 MHz carrier spacing
•
•
Broadband internal matching
Typictwo-carrier WCDMA performance at 2140
MHz, 28 V
- Average output power = 45.5 dBm
- Linear Gain = 15.5 dB
- Efficiency = 27.5%
- Intermodulation distortion = –36 dBc
- Adjacent channel power = –41 dBc
-25
-30
-35
-40
-45
-50
-55
30
25
20
15
10
5
Efficiency
IM3
•
Typical CW performance, 2170 MHz, 30 V
- Output power at P
= 180 W
1dB
- Efficiency = 52%
•
•
•
Integrated ESD protection
Excellent thermal stability, low HCI drift
ACPR
Capable of handling 10:1 VSWR @ 28 V,
150 W (CW) output power
0
34
36
38
40
42
4
46
48
•
Pb-free and RoHS-compliant
Average Output Power (dBm)
RF Characteristic
WCDMA Measurements (tested in Infineon test fixture)
= 28 V, I = 1.2 A, P = 35 W average, ƒ = 2135 MHz, ƒ = 2145 MHz, 3GPP signal, channel bandwidth = 3.84 MHz,
V
DD
DQ
OUT
1
2
peak/average = 8 dB @ 0.01% CCDF
Characteristic
Gain
Symbol
Min
14.5
26
Typ
15.5
27.5
–36
Max
—
Unit
dB
G
ps
Drain Efficiency
Intermodulation Distortion
hD
—
%
IMD
—
–34
dBc
All published data at T
= 25°C unless otherwise indicated
CASE
ESD: Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet 1 of 9
Rev. 07, 2015-03-03
PTFA211801E
Confidential, Limited Internal Distribution
RF Characteristics (cont.)
CW Measurements (tested in Infineon test fixture)
V
= 28 V, I
= 1.2 A, P
= 150 W average, ƒ = 2170 MHz
DD
DQ
OUT
Characteristic
Symbol
Min
Typ
Max
Unit
Gain Compression
G
comp
—
0.5
1.0
dB
Two-tone Measurements (not subject to production test—verified by design/characterization in Infineon test fixture)
V
= 28 V, I
= 1.2 A, P = 140 W PEP, ƒ = 2140 MHz, tone spacing = 1 MHz
OUT
DD
DQ
Characteristic
Gain
Symbol
Min
—
Typ
155
38.5
–28
Max
—
Unit
dB
G
ps
Drain Efficiency
hD
—
—
%
Intermodulation Distortion
IMD
—
—
dBc
DC Characteristics
Characteristic
Conditions
Symbol
Min
65
—
Typ
—
Max
—
Unit
V
Drain-Source Breakdown Voltage
Drain Leakage Current
Drain Leakage Current
On-State Resistance
V
GS
V
DS
V
DS
V
GS
V
DS
V
GS
= 0 V, I = 10 mA
V
(BR)DSS
DS
= 28 V, V
= 63 V, V
= 0 V
= V
I
I
—
1.0
10.0
—
µA
µA
W
GS
GS
DSS
DSS
—
—
= 10 V, V = 0.1 V
R
—
0.05
2.5
—
DS
DS(on)
Operating Gate Voltage
Gate Leakage Current
= 28 V, I
= 1.2 A
V
2.0
—
3.0
1.0
V
DQ
GS
= 10 V, V = 0 V
I
µA
DS
GSS
Maximum Ratings
Parameter
Symbol
Value
65
Unit
V
Drain-Source Voltage
Gate-Source Voltage
Junction Temperature
Storage Temperature Range
V
DSS
V
–0.5 to +12
200
V
GS
T
°C
J
T
–40 to +150
0.31
°C
STG
Thermal Resistance (T
= 70°C, 150 W CW)
R
qJC
°C/W
CASE
Data Sheet
2 of 9
Rev. 07, 2015-03-03
PTFA211801E
Confidential, Limited Internal Distribution
Ordering Information
Type and Version
PTFA211801E V5
Package Outline
H-36260-2
Package Description
Shipping
Thermally-enhanced slotted flange, single-ended Tray
PTFA211801E V5 R250
H-36260-2
Thermally-enhanced slotted flange, single-ended Tape & Reel
Typical Performance (data taken in a production test fixture)
Two-carrier WCDMA at Various Biases
Broadbad Performance
VDD = 28 V, IDQ .2 A, POUT = 45.0 dBm CW
VDD = 28 V, ƒ = 2140 MHz, 3GPP WCDMA signal,
PAR = 8 dB, 10 MHz carrier spacing, series show IDQ
-30
-35
30
25
20
15
10
5
-5
Efficiency
-10
-15
-20
-25
-30
1.4 A
1.3 A
Return Loss
-40
-45
1.2 A
Gain
1.1 A
-50
-55
2070 2090 2110 2130 2150 2170 2190 2210
Frequency (MHz)
34
36
38
40
42
44
46
48
Output Power, Avg. (dBm)
Data Sheet
3 of 9
Rev. 07, 2015-03-03
PTFA211801E
Confidential, Limited Internal Distribution
Typical Performance (cont.)
Power Sweep, CW Conditions
VDD = 28 V, IDQ = 1.2 A, ƒ = 2170 MHz
Power Sweep, CW Conditions
VDD = 30 V, IDQ = 1.2 A, ƒ = 2170 MHz
18
17
16
15
14
13
12
60
50
40
30
20
10
0
17
60
47
34
21
8
Efficiency
Efficiency
TCASE = 25°C
TCASE = 90°C
16
Gain
Gain
15
14
13
0
20 40 60 80 100 120 140 160 180
Output Power (W)
0
20 40 60 80 100 120 140 160 180
Output Power (W)
Two-tone Drive-up
Intermodulation Distortion Products
vs. Tone Spacing
VDD = 28 V, IDQ = 1.2 A,
ƒ
= 2140 MHz, tone spacing = 1 MHz
VDD = 28 V IDQ = 1.2 A,
ƒ = 2140 MHz,
POUT = 51 dBm PEP
-20
-25
-30
-35
-40
-45
-50
-55
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
45
40
35
30
25
20
15
10
5
Efficiency
3rd Order
IM3
IM5
IM7
5th
7th
25
0
38
42
46
50
54
0
5
10
15
20
30
35
40
Tone Spacing (MHz)
Output Power, PEP (dBm)
Data Sheet
4 of 9
Rev. 07, 2015-03-03
PTFA211801E
Confidential, Limited Internal Distribution
Reference Circuit
C1
0.001µF
R2
R1
1.3K
1.2K
QQ1
LM7805
VDD
Q1
BCP56
C2
0.001µF C3
0.001µF
R3
R4
2K
2K
R5
R6
R8
10
5.1K
5.1K
VDD
C12
9.1pF
C13
0.02µF
C14
1µF
C15
22µF
C4
C5
R7
C6
0.1µF
C7
C8
10µF
35V
0.1µF 5.1K
.01µF
9.1pF
l7
50V
R9
10
l8
C10
8.2pF
C21
8.2pF
DUT
l1
l2
l3
l4
l5
l6
l10
l11
l12
l13
l14
RF_OUT
RF_IN
C9
0.5pF
C11
1.5pF
C20
0.3pF
l9
A211801ef _sch
C17
0.02µF
C16
9.1pF
C18
1µF
C19
22µF
50V
Reference circuit schematic for ƒ = 2140 MHz
Electrical Characteristics at 2140 MHz
Transmission
Electrical
Dimensions: L x W (mm)
Dimensions: L x W (in.)
Line
l1
Characteristics
0.097 l, 50.0 W
0.267 l, 50.0 W
0.l, 42.0 W
0.087 l, 42.0 W
0.018 l, 11.4 W
0.077 l, 6.9 W
7.37 x 1.40
0.290 x 0.055
0.782 x 0.055
0.403 x 0.073
0.256 x 0.073
0.049 x 0.403
0.206 x 0.700
0.618 x 0.059
0.760 x 0.065
0.230 x 1.000
0.220 x 1.000 / 0.078
0.057 x 0.078
0.262 x 0.055
1.210 x 0.055
l2
19.86 x 1.40
10.24 x 1.85
6.50 x 1.85
l3
l4
l5
1.24 x 10.24
5.23 x 17.78
15.70 x 1.50
19.30 x 1.65
5.84 x 25.40
5.59 x 25.40 / 1.98
1.45 x 1.98
l6
l7
0.207 l, 48.0 W
0.256 l, 45.0 W
0.087 l, 5.0 W
l8, l9
l10
l11 (taper)
l12
l13
l14
0.073 l, 5.0 W / 40.0 W
0.019 l, 40.0 W
0.087 l, 50.0 W
0.403 l, 50.0 W
6.65 x 1.40
30.73 x 1.40
Data Sheet
6 of 9
Rev. 07, 2015-03-03
PTFA211801E
Confidential, Limited Internal Distribution
Reference Circuit (cont.)
LM
10
+
35V
RF_IN
RF_OUT
A211801ef _assy
Reference circuit assembly diagram (not to scale)*
Circuit Assembly Information
DUT
PTFA211801E
LDMOS Transistor
Rogers TMM4
PCB
0.76 mm [.030"] thick, er = 4.5
2 oz. copper
Component
C1, C2, C3
C4
Description
Capacitor, 0.001 µF
Suggested Manufacturer
P/N
Digi-Key
Digi-Key
Digi-Key
ATC
PCC1772CT-ND
PCS6106TR-ND
PCC104BCT
200B103
Tantalum capacitor, 10 µF, 35 V
Capacitor, 0.F
C5, C6
C7
Capacitor, 001 µF
C8, C12, C16
C9
Ceramc capacitor, 9.1 pF
Ceramic capacitor, 0.5 pF
Ceramic capacitor, 8.2 pF
Ceramic capacitor, 1.5 pF
Ceramic capacitor, 0.02 µF
Ceramic capacitor, 1 µF
Electrolytic capacitor, 22 µF, 50 V
Ceramic capacitor, 0.3 pF
Transistor
ATC
100B 9R1
ATC
100B 0R5
C10, C21
C11
ATC
100B 8R2
ATC
100B 1R5
C13, C17
C14, C18
C15, C19
C20
ATC
200B 203
ATC
920C105
Digi-Key
ATC
PCE3374CT-ND
100B 0R3
Q1
Infineon Technologies
National Semiconductor
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
BCP56
QQ1
Voltage regulator
LM7805
R1
Chip resistor, 1.2 k W
Chip resistor, 1.3 k W
Chip resistor, 2 k W
P1.2KGCT-ND
P1.3KGCT-ND
P2KECT-ND
3224W-202ETR-ND
P10ECT-ND
P5.1KECT-ND
R2
R3
R4
Potentiometer, 2 k W
Chip resistor, 10 W
R5, R9
R6, R7, R8
Chip resistor, 5.1 k W
* Gerber Files for this circuit available on request
Data Sheet
7 of 9
Rev. 07, 2015-03-03
PTFA211801E
Confidential, Limited Internal Distribution
Package Outline Specifications
Package H-36260-2
2X 12.70
[.500]
4.83±0.50
[.190±.020]
45° X 2.031
45° X [.080]
C
L
D
4X R1.52
[R.060]
S
23.37
[.90±.0]
+0.10
LID13.21
–0.15
.520+.004
[
]
–.006
C
L
13
[.0]
2X R1.63
[R.064]
G
H
3- 6260 - 2_ po _02 -18 - 2010
27.94
[1.100]
LID 22.35±0.23
[.880±.009]
1.02
[.040]
4.11±0.38
[.162±.015]
C
L
34.04
[1.340]
SPH 1.57
[.062]
Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ± 0.127 [.005] unless specified otherwise.
4. Pins: D = drain, S = source, G = gate.
5. Lead thickness: 0.10 +0.051/–0.025 [.004 +.002/–.001].
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch]
Find the latest and most complete information about products and packaging at the Infineon Internet page
http://www.infineon.com/rfpower
Data Sheet
8 of 9
Rev. 07, 2015-03-03
PTFA211801 E V5
Confidential, Limited Internal Distribution
Revision History:
2015-03-03
Data Sheet
Previous Version:
2011-01-11, Data Sheet
Page
Subjects (major changes since last revision)
All
Not recommended for new design
All
Data Sheet reflects released product specifications
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
highpowerRF@infineon.com
To request other information, contact us at:
+1 877 465 3667 (1-877-GO-LDMOS) USA
or +1 408 776 0600 International
Edition 2015-03-03
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2005 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in s document shall in no event be regarded as a guarantee of conditions or characteristics.
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com/rfpower).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question,
please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended
to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet
9 of 9
Rev. 07, 2015-03-03
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