PTFA211801EV5R0 [INFINEON]

RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, GREEN, H-36260-2, 2 PIN;
PTFA211801EV5R0
型号: PTFA211801EV5R0
厂家: Infineon    Infineon
描述:

RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, GREEN, H-36260-2, 2 PIN

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PTFA211801E  
Confidential, Limited Internal Distribution  
Thermally-Enhanced High Power RF LDMOS FET  
180 W, 2110 – 2170 MHz  
Description  
The PTFA211801E is a thermally-enhanced, 180-watt, internally  
matched LDMOS FET intended for WCDMA applications. It is  
characaterized for single- and two-carrier WCDMA operation from  
2110 to 2170 MHz. Manufactured with Infineon's advanced LDMOS  
process, this device provides excellent thermal performance and  
superior reliability.  
PTFA211801E  
Package H-36260-2  
Features  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 1.2 A, ƒ = 2140 MHz,  
3GPP WCDMA signal, PAR = 8 dB,  
10 MHz carrier spacing  
Broadband internal matching  
Typictwo-carrier WCDMA performance at 2140  
MHz, 28 V  
- Average output power = 45.5 dBm  
- Linear Gain = 15.5 dB  
- Efficiency = 27.5%  
- Intermodulation distortion = –36 dBc  
- Adjacent channel power = –41 dBc  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
30  
25  
20  
15  
10  
5
Efficiency  
IM3  
Typical CW performance, 2170 MHz, 30 V  
- Output power at P  
= 180 W  
1dB  
- Efficiency = 52%  
Integrated ESD protection  
Excellent thermal stability, low HCI drift  
ACPR  
Capable of handling 10:1 VSWR @ 28 V,  
150 W (CW) output power  
0
34  
36  
38  
40  
42  
4  
46  
48  
Pb-free and RoHS-compliant  
Average Output Power (dBm)  
RF Characteristic
WCDMA Measurements (tested in Infineon test fixture)  
= 28 V, I = 1.2 A, P = 35 W average, ƒ = 2135 MHz, ƒ = 2145 MHz, 3GPP signal, channel bandwidth = 3.84 MHz,  
V
DD  
DQ  
OUT  
1
2
peak/average = 8 dB @ 0.01% CCDF  
Characteristic  
Gain  
Symbol  
Min  
14.5  
26  
Typ  
15.5  
27.5  
–36  
Max  
Unit  
dB  
G
ps  
Drain Efficiency  
Intermodulation Distortion  
hD  
%
IMD  
–34  
dBc  
All published data at T  
= 25°C unless otherwise indicated  
CASE  
ESD: Electrostatic discharge sensitive device—observe handling precautions!  
Data Sheet 1 of 9  
Rev. 07, 2015-03-03  
PTFA211801E  
Confidential, Limited Internal Distribution  
RF Characteristics (cont.)  
CW Measurements (tested in Infineon test fixture)  
V
= 28 V, I  
= 1.2 A, P  
= 150 W average, ƒ = 2170 MHz  
DD  
DQ  
OUT  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Gain Compression  
G
comp  
0.5  
1.0  
dB  
Two-tone Measurements (not subject to production test—verified by design/characterization in Infineon test fixture)  
V
= 28 V, I  
= 1.2 A, P = 140 W PEP, ƒ = 2140 MHz, tone spacing = 1 MHz  
OUT  
DD  
DQ  
Characteristic  
Gain  
Symbol  
Min  
Typ  
155  
38.5  
–28  
Max  
Unit  
dB  
G
ps  
Drain Efficiency  
hD  
%
Intermodulation Distortion  
IMD  
dBc  
DC Characteristics  
Characteristic  
Conditions  
Symbol  
Min  
65  
Typ  
Max  
Unit  
V
Drain-Source Breakdown Voltage  
Drain Leakage Current  
Drain Leakage Current  
On-State Resistance  
V
GS  
V
DS  
V
DS  
V
GS  
V
DS  
V
GS  
= 0 V, I = 10 mA  
V
(BR)DSS  
DS  
= 28 V, V  
= 63 V, V  
= 0 V  
= V  
I
I
1.0  
10.0  
µA  
µA  
W
GS  
GS  
DSS  
DSS  
= 10 V, V = 0.1 V  
R
0.05  
2.5  
DS  
DS(on)  
Operating Gate Voltage  
Gate Leakage Current  
= 28 V, I  
= 1.2 A  
V
2.0  
3.0  
1.0  
V
DQ  
GS  
= 10 V, V = 0 V  
I
µA  
DS  
GSS  
Maximum Ratings  
Parameter  
Symbol  
Value  
65  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Junction Temperature  
Storage Temperature Range  
V
DSS  
V
–0.5 to +12  
200  
V
GS  
T
°C  
J
T
–40 to +150  
0.31  
°C  
STG  
Thermal Resistance (T  
= 70°C, 150 W CW)  
R
qJC  
°C/W  
CASE  
Data Sheet  
2 of 9  
Rev. 07, 2015-03-03  
PTFA211801E  
Confidential, Limited Internal Distribution  
Ordering Information  
Type and Version  
PTFA211801E V5  
Package Outline  
H-36260-2  
Package Description  
Shipping  
Thermally-enhanced slotted flange, single-ended Tray  
PTFA211801E V5 R250  
H-36260-2  
Thermally-enhanced slotted flange, single-ended Tape & Reel  
Typical Performance (data taken in a production test fixture)  
Two-carrier WCDMA at Various Biases  
Broadbad Performance  
VDD = 28 V, IDQ .2 A, POUT = 45.0 dBm CW  
VDD = 28 V, ƒ = 2140 MHz, 3GPP WCDMA signal,  
PAR = 8 dB, 10 MHz carrier spacing, series show IDQ  
-30  
-35  
30  
25  
20  
15  
10  
5
-5  
Efficiency  
-10  
-15  
-20  
-25  
-30  
1.4 A  
1.3 A  
Return Loss  
-40  
-45  
1.2 A  
Gain  
1.1 A  
-50  
-55  
2070 2090 2110 2130 2150 2170 2190 2210  
Frequency (MHz)  
34  
36  
38  
40  
42  
44  
46  
48  
Output Power, Avg. (dBm)  
Data Sheet  
3 of 9  
Rev. 07, 2015-03-03  
PTFA211801E  
Confidential, Limited Internal Distribution  
Typical Performance (cont.)  
Power Sweep, CW Conditions  
VDD = 28 V, IDQ = 1.2 A, ƒ = 2170 MHz  
Power Sweep, CW Conditions  
VDD = 30 V, IDQ = 1.2 A, ƒ = 2170 MHz  
18  
17  
16  
15  
14  
13  
12  
60  
50  
40  
30  
20  
10  
0
17  
60  
47  
34  
21  
8
Efficiency  
Efficiency  
TCASE = 25°C  
TCASE = 90°C  
16  
Gain  
Gain  
15  
14  
13  
0
20 40 60 80 100 120 140 160 180  
Output Power (W)  
0
20 40 60 80 100 120 140 160 180  
Output Power (W)  
Two-tone Drive-up  
Intermodulation Distortion Products  
vs. Tone Spacing  
VDD = 28 V, IDQ = 1.2 A,  
ƒ
= 2140 MHz, tone spacing = 1 MHz  
VDD = 28 V IDQ = 1.2 A,  
ƒ = 2140 MHz,  
POUT = 51 dBm PEP  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
45  
40  
35  
30  
25  
20  
15  
10  
5
Efficiency  
3rd Order  
IM3  
IM5  
IM7  
5th  
7th  
25  
0
38  
42  
46  
50  
54  
0
5
10  
15  
20  
30  
35  
40  
Tone Spacing (MHz)  
Output Power, PEP (dBm)  
Data Sheet  
4 of 9  
Rev. 07, 2015-03-03  
PTFA211801E  
Confidential, Limited Internal Distribution  
Reference Circuit  
C1  
0.001µF  
R2  
R1  
1.3K  
1.2K   
QQ1  
LM7805  
VDD  
Q1  
BCP56  
C2  
0.001µF C3  
0.001µF  
R3  
R4  
2K   
2K   
R5  
R6  
R8  
10  
5.1K   
5.1K   
VDD  
C12  
9.1pF  
C13  
0.02µF  
C14  
1µF  
C15  
22µF  
C4  
C5  
R7  
C6  
0.1µF  
C7  
C8  
10µF  
35V  
0.1µF 5.1K  
.01µF  
9.1pF  
l7  
50V  
R9  
10  
l8  
C10  
8.2pF  
C21  
8.2pF  
DUT  
l1  
l2  
l3  
l4  
l5  
l6  
l10  
l11  
l12  
l13  
l14  
RF_OUT  
RF_IN  
C9  
0.5pF  
C11  
1.5pF  
C20  
0.3pF  
l9  
A211801ef _sch  
C17  
0.02µF  
C16  
9.1pF  
C18  
1µF  
C19  
22µF  
50V  
Reference circuit schematic for ƒ = 2140 MHz  
Electrical Characteristics at 2140 MHz  
Transmission  
Electrical  
Dimensions: L x W (mm)  
Dimensions: L x W (in.)  
Line  
l1  
Characteristics  
0.097 l, 50.0 W  
0.267 l, 50.0 W  
0.l, 42.0 W  
0.087 l, 42.0 W  
0.018 l, 11.4 W  
0.077 l, 6.9 W  
7.37 x 1.40  
0.290 x 0.055  
0.782 x 0.055  
0.403 x 0.073  
0.256 x 0.073  
0.049 x 0.403  
0.206 x 0.700  
0.618 x 0.059  
0.760 x 0.065  
0.230 x 1.000  
0.220 x 1.000 / 0.078  
0.057 x 0.078  
0.262 x 0.055  
1.210 x 0.055  
l2  
19.86 x 1.40  
10.24 x 1.85  
6.50 x 1.85  
l3  
l4  
l5  
1.24 x 10.24  
5.23 x 17.78  
15.70 x 1.50  
19.30 x 1.65  
5.84 x 25.40  
5.59 x 25.40 / 1.98  
1.45 x 1.98  
l6  
l7  
0.207 l, 48.0 W  
0.256 l, 45.0 W  
0.087 l, 5.0 W  
l8, l9  
l10  
l11 (taper)  
l12  
l13  
l14  
0.073 l, 5.0 W / 40.0 W  
0.019 l, 40.0 W  
0.087 l, 50.0 W  
0.403 l, 50.0 W  
6.65 x 1.40  
30.73 x 1.40  
Data Sheet  
6 of 9  
Rev. 07, 2015-03-03  
PTFA211801E  
Confidential, Limited Internal Distribution  
Reference Circuit (cont.)  
LM  
10  
+
35V  
RF_IN  
RF_OUT  
A211801ef _assy  
Reference circuit assembly diagram (not to scale)*  
Circuit Assembly Information  
DUT  
PTFA211801E  
LDMOS Transistor  
Rogers TMM4  
PCB  
0.76 mm [.030"] thick, er = 4.5  
2 oz. copper  
Component  
C1, C2, C3  
C4  
Description  
Capacitor, 0.001 µF  
Suggested Manufacturer  
P/N  
Digi-Key  
Digi-Key  
Digi-Key  
ATC  
PCC1772CT-ND  
PCS6106TR-ND  
PCC104BCT  
200B103  
Tantalum capacitor, 10 µF, 35 V  
Capacitor, 0.F  
C5, C6  
C7  
Capacitor, 001 µF  
C8, C12, C16  
C9  
Ceramc capacitor, 9.1 pF  
Ceramic capacitor, 0.5 pF  
Ceramic capacitor, 8.2 pF  
Ceramic capacitor, 1.5 pF  
Ceramic capacitor, 0.02 µF  
Ceramic capacitor, 1 µF  
Electrolytic capacitor, 22 µF, 50 V  
Ceramic capacitor, 0.3 pF  
Transistor  
ATC  
100B 9R1  
ATC  
100B 0R5  
C10, C21  
C11  
ATC  
100B 8R2  
ATC  
100B 1R5  
C13, C17  
C14, C18  
C15, C19  
C20  
ATC  
200B 203  
ATC  
920C105  
Digi-Key  
ATC  
PCE3374CT-ND  
100B 0R3  
Q1  
Infineon Technologies  
National Semiconductor  
Digi-Key  
Digi-Key  
Digi-Key  
Digi-Key  
Digi-Key  
Digi-Key  
BCP56  
QQ1  
Voltage regulator  
LM7805  
R1  
Chip resistor, 1.2 k W  
Chip resistor, 1.3 k W  
Chip resistor, 2 k W  
P1.2KGCT-ND  
P1.3KGCT-ND  
P2KECT-ND  
3224W-202ETR-ND  
P10ECT-ND  
P5.1KECT-ND  
R2  
R3  
R4  
Potentiometer, 2 k W  
Chip resistor, 10 W  
R5, R9  
R6, R7, R8  
Chip resistor, 5.1 k W  
* Gerber Files for this circuit available on request  
Data Sheet  
7 of 9  
Rev. 07, 2015-03-03  
PTFA211801E  
Confidential, Limited Internal Distribution  
Package Outline Specifications  
Package H-36260-2  
2X 12.70  
[.500]  
4.83±0.50  
[.190±.020]  
45° X 2.031  
45° X [.080]  
C
L
D
4X R1.52  
[R.060]  
S
23.37
[.90±.0]  
+0.10  
LID13.21  
–0.15  
.520+.004  
[
]
–.006  
C
L
13
[.0]  
2X R1.63  
[R.064]  
G
H
3- 6260 - 2_ po _02 -18 - 2010  
27.94  
[1.100]  
LID 22.35±0.23  
[.880±.009]  
1.02  
[.040]  
4.11±0.38  
[.162±.015]  
C
L
34.04  
[1.340]  
SPH 1.57  
[.062]  
Diagram Notes—unless otherwise specified:  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. All tolerances ± 0.127 [.005] unless specified otherwise.  
4. Pins: D = drain, S = source, G = gate.  
5. Lead thickness: 0.10 +0.051/–0.025 [.004 +.002/–.001].  
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch]  
Find the latest and most complete information about products and packaging at the Infineon Internet page  
http://www.infineon.com/rfpower  
Data Sheet  
8 of 9  
Rev. 07, 2015-03-03  
PTFA211801 E V5  
Confidential, Limited Internal Distribution  
Revision History:  
2015-03-03  
Data Sheet  
Previous Version:  
2011-01-11, Data Sheet  
Page  
Subjects (major changes since last revision)  
All  
Not recommended for new design  
All  
Data Sheet reflects released product specifications  
We Listen to Your Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
highpowerRF@infineon.com  
To request other information, contact us at:  
+1 877 465 3667 (1-877-GO-LDMOS) USA  
or +1 408 776 0600 International  
Edition 2015-03-03  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2005 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in s document shall in no event be regarded as a guarantee of conditions or characteristics.  
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com/rfpower).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of  
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended  
to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  
Data Sheet  
9 of 9  
Rev. 07, 2015-03-03  

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