RDHB710SE20A2SX_15 [INFINEON]
Hermetically Sealed Package;型号: | RDHB710SE20A2SX_15 |
厂家: | Infineon |
描述: | Hermetically Sealed Package |
文件: | 总7页 (文件大小:136K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PD-97808
Radiation Hardended,
Solid-State Relay
with Buffered Inputs
RDHB710SE20A2SX
Dual, 200V, 10A
Product Summary 5
Part
Breakdown Current
tr / tf
Logic Drive
Number
Voltage
Voltage
RDHB710SE20A2SX
200V
10A
Controlled
3.3V
8-PIN SURFACE MOUNT
Description
The RDHB710SE20A2SX is a radiation hardened
dual solid-state relay in a hermetic package. It is
configured as a dual, single-pole-single-throw
(SPST) normally open relay with common input
supply. This device is characterized for 100 Krad(Si)
total ionizing dose, and neutron fluence level of
1.8E12 n/cm2. The input and output MOSFETs utilize
International Rectifier’s R6 technology. The
RDHB710SE20A2SX is optically coupled and
actuated by standard logic inputs.
Features:
n
n
n
n
n
n
n
n
Total Dose Capability to 100 Krad (Si)
Neutron Fluence Level of 1.8E12 n/cm2
Optically Coupled
1000VDC Input to Output Isolation
Buffered Input Stage
3.3V Compatible Logic Level Input
Controlled Switching Times
Hermetically Sealed Package
Absolute Maximum Ratings per Channel @ TJ = 25°C (unless otherwise specified)
Parameter
Symbol
Value
200
Units
V
Output Voltage 5, 8
V
S
4, 5
Output Current
A
I
10
O
Input Buffer Voltage - (Pins 4 & 6)
Input Buffer Current
3
V
V
±7.0
±10
IN
mA
V
I
IN
Input Supply Voltage (Pin 5)
7
V
DD
DD
10
7
Input Supply Current
I
mA
W
25
73
Power Dissipation 4, 5
P
DISS
T
J
Operating Temperature Range
Storage Temperature Range
Lead Temperature
-55 to +150
-65 to +150
300
T
S
°C
T
L
For Notes, please refer to page 3
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1
04/22/13
RDHB710SE20A2SX
Dual, 200V, 10A
General Characteristics per Channel @ -55°C £ TC £ +125°C (unless otherwise specified)
Parameter
Group A
Test Conditions
Symbol Min. Typ. Max. Units
Subgroups
Input Buffer Threshold Voltage 1, 3
Input-to-Output Leakage Current
3.0
V
V
V
= 5.0V, I = 10A
O
V
IN(TH)
DD
= 1.0KVdc, dwell = 5.0s
I-O
1
I
1.0
µA
I-O
T
C
= 25°C
V
V
V
= 0.1V, f = 1.0MHz,
IN
S
Output Capacitance
Thermal Resistance
1
1
210
pF
C
OSS
= 25V, T = 25°C
C
1, 4
1.4 °C/W
MHrs
= 3.3V, V = 5.0V
R
THJC
IN
DD
MTBF (Per Channel)
Weight
MIL-HDBK-217F, SF@Tc= 25°C
6.0
W
25
gms
Pre-Irradiation
Electrical Characteristics per Channel @ -55°C £ TC £ +125°C (unless otherwise specified)
Parameter
Group A
Test Conditions
Symbol Min. Typ. Max. Units
Subgroups
V
V
V
V
V
V
= 3.3V
1
2
1
2
0.15
IN
Output On-Resistance
Output Leakage Current
Input Supply Current
Input Buffer Current
R
Ω
DS(ON)
= 5.0V, I = 10A
0.29
25
DD
O
= 0.1V, V = 200V
IN
S
I
O
µ
A
250
15
= 0.1V, V = 150V
IN
S
10
= 5.0V, I = 10A
DD
DD
O
1, 2, 3
mA
I
DD
25
= 10V, I = 10A 1, 7
O
1
1.0
3.0
V
IN
= 3.3V
I
µ
A
IN
on
off
2, 3
V
IN
= 3.3V, V = 5.0V, V = 50V
DD
S
Turn-On Delay
Turn-Off Delay
Rise Time 2, 6
Fall Time 2, 6
6
6
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1.5
10
t
R = 5Ω, PW = 50ms
L
V
IN
= 0.1V, V = 5.0V, V = 50V
DD S
t
R = 5Ω, PW = 50ms
L
ms
V
IN
= 3.3V, V = 5.0V, V = 50V
DD S
0.5
2.5
t
r
R = 5Ω, PW = 50ms
L
V
IN
= 0.1V, V = 5.0V, V = 50V
DD S
t
f
R = 5Ω, PW = 50ms
L
For Notes, please refer to page 3
2
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RDHB710SE20A2SX
Dual, 200V, 10A
Post Total Dose Irradiation 9, 10, 11
Electrical Characteristics per Channel @ 25°C (unless otherwise specified)
Parameter
Group A
Test Conditions
Symbol Min. Typ. Max. Units
Subgroups
Output On-Resistance
Input Supply Current
Output Leakage Current
Input Buffer Current
R
Ω
V
V
V
V
V
= 3.3V, V = 5.0V, I = 10A
1
1
0.15
15
DS(ON)
IN
IN
IN
IN
IN
DD
O
I
= 3.3V, V = 5.0V, I = 10A
10
mA
DD
DD
O
1
1
25
I
O
= 0.1V, V = 200V
S
µ
A
1.0
= 3.3V
I
IN
= 3.3V, V = 5.0V, V = 50V
DD
S
Turn-On Delay
Turn-Off Delay
Rise Time 2, 6
Fall Time 2, 6
6
1
1
1
1
1.5
10
t
on
Ω
RL = 5 , PW = 50ms
= 0.1V, V = 5.0V, V = 50V
V
IN
DD
S
6
t
off
Ω
RL = 5 , PW = 50ms
= 3.3V, V = 5.0V, V = 50V
ms
V
IN
DD
S
0.5
2.5
t
r
Ω
RL = 5 , PW = 50ms
= 0.1V, V = 5.0V, V = 50V
V
IN
DD
S
t
f
Ω
RL = 5 , PW = 50ms
Notes for Maximum Ratings and Electrical Characteristic Tables
1. Specification is guaranteed by design.
2. Rise and fall times are controlled internally.
3. Inputs protected for VIN < 1.0V and VIN > 7.0V.
4. Optically coupled Solid State Relays (SSRs) have relatively slow turn on and turn off times. Care must be taken to
insure that transient currents do not cause violation of SOA. If transient conditions are present, IR recommends a
complete simulation to be performed by the end user to insure compliance with SOA requirements as specified in the
IRHNJ67230 data sheet.
5. While the SSR design meets the design requirements specified in MIL-PRF-38534, the end user is responsible for
product derating, as required for the application.
6. Reference Figures 3 & 4 for Switching Test Circuits and Wave Form; Output Voltage (VO) of Figure 4, Switching
Test Wave Form is representative of the Output MOSFET and Drain-to-Source.
7. Input Supply voltage shall not exceed 5.25V@Tc ≥ 70°C.
8. Breakdown voltage (BVDSS) of Output MOSFET, @ -55°C, shall be derated to 80% of Maximum Rated Voltage.
9. Total Dose Irradiation with Input Bias. 10mA IDD applied and VDS = 0 during Irradiation.
10. Total Dose Irradiation with Output Bias. 160Volts VDS applied and IDD = 0 during Irradiation.
11. International Rectifier does not currently have a DLA certified Radiation Hardness.
Radiation Performance
International Rectifier Radiation Hardened Solid State Relays are tested to verify their hardness capability.
The hardness assurance program at IR uses a Cobalt-60 (60Co) Source and heavy ion irradiation. Both
pre- and post-irradiation performance are tested and specified using the same drive circuitry and test
conditions to provide a direct comparision.
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3
RDHB710SE20A2SX
Dual, 200V, 10A
TC, Case Temperature (°C)
Figure 1: Maximum Drain Current Vs Case Temperature per Channel
Pin 1 - OUT 1+
Pin 4 - INPUT 1
Opto
Isolation
Pin 2 - OUT 1-
Pin 8 - OUT 2+
Pin 3 - GND
Pin 5 - VDD
Pin 6 - INPUT 2
Opto
Isolation
Pin 7 - OUT 2-
Figure 2: Typical Application
4
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RDHB710SE20A2SX
Dual, 200V, 10A
VDD=+5V
VS=+50V
5
1
2
RL
4
3
5 Ohm
8
7
6
Figure 3: Switching Test Circuit (Only one channel shown)
50%
50%
V_IN
90%
50%
10%
90%
50%
10%
V_OUT
tr
tf
toff
ton
Figure 4: Switching Test Waveform
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5
RDHB710SE20A2SX
Dual, 200V, 10A
Case Outline and Dimensions — 8-Pin Surface Mount Package
.040
1.375
.545
1
8
0.255±.010
0.135±.020
+_
.002
.145
.040
8 PLS.
.150
TYP
.1625
1.050
.270
MAX.
.005
NOTES:
1. Dimensioning and Tolerancing per ASME Y14.53M-1994
2. Controlling Dimension: Inch
3. Dimensions are shown in inches
4. Tolerances are ±0.005 UOS
5. Lead Dimensions are prior to Hot Solder Dip
6. Lead Finish per MIL-PRF-38534, Finish A, Hot Solder Dip (Sn63Pb37)
Pin Designation
Pin #
Pin Description
OUT 1 +
1
2
3
4
5
6
7
8
OUT 1 -
INPUT GND
INPUT 1
V
DD
INPUT 2
OUT 2 -
OUT 2 +
6
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RDHB710SE20A2SX
Dual, 200V, 10A
Part Numbering Nomenclature
RD H B 7 10 SE 20 A 2 S X
Screening Level
P = Unscreened, 25°C
Electrical Test (Not for Qualification)
X = Class K per MIL-PRF-38534
(Fully compliant Class K is presently
pending DLA Approval)
Device Type
RD = DC Solid
State Relay
Radiation
Characteriization
H = RAD Hard
Features
N = Non Buffered Fast
S = Buffer Controlled Input
Generation
A = Current Design
Number of Poles
1 = Single Pole
2 = Dual Poles
B = R6 Generation
Radiation Level
7= 100 Krad (Si)
Throw Configuration
A = Single Throw, Normally Open
Current
10 = 10A
Voltage
10 =100 Volts
20 = 200 Volts
Package
SE = 8-Pin Surface Mount
IRWORLDHEADQUARTERS:101N.SepulvedaBlvd., ElSegundo,California90245,USATel:(310)252-7105
IRLEOMINSTER:205CrawfordSt., Leominster,Massachusetts01453,USATel:(978)534-5776
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 04/2013
www.irf.com
7
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