SC170R015A5P [INFINEON]

Rectifier Diode, Schottky, 1 Phase, 1 Element, 15V V(RRM), Silicon, WAFER;


型号：	SC170R015A5P
厂家：	Infineon
描述：	Rectifier Diode, Schottky, 1 Phase, 1 Element, 15V V(RRM), Silicon, WAFER 二极管
文件：	总5页 (文件大小：152K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Bulletin I0506J rev. B 10/00

SC170.....5. Series

SCHOTTKY DIE 115 x 170 mils

0.35 ± 0.01

(0.14 ± 0.0004)

NOTES:

1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES).

2. CONTROLLING DIMENSION: (INCH).

3. DIMENSIONS AND TOLERANCES:

a = 4.32 + 0, - 0.05

(0.170 + 0, - 0.002)

b = 2.92 + 0, - 0.05

(0.115 + 0, - 0.002)

c = 4.17 + 0, - 0.003

(0.164 + 0, - 0.0001)

d = 2.77 + 0, - 0.003

(0.109 + 0, - 0.0001)

Ø = 0.7 ± 0.1

(0.03 ± 0.004)

4. LETTER DESIGNATION:

A = Anode (Top Metal)

40 (1.57)

C = Cathode (Back Metal)

D = Reject Ink Dot (only on non-conforming dies)

5. SAWING:

Wafer flat alligned with

side b of the die

Recommended Blade

SEMITEC S1025 QS00 Blade

Ø 125 (4.92)

NOT TO SCALE

NOTE: 10 mils die thickness is available on specific request only.

Contact factory for information.

www.irf.com

SC170.....5.

Bulletin I506J rev. B 10/00

Electrical Characteristics

Device

Max.

(V)

Typ. I @ 25°C Typ. I @ 125°C

Max. V @ I

F F

Package

Style

(°C)

(µA)

(mA)

(V)

SC170R015x5x

SC170S020x5x

SC170S030x5x

SC170S045x5x

SC170S060x5x

SC170H045x5x

SC170H100x5x

SC170H150x5x

125

150

175

5000

600

0.41 @ 19A

TO-220

n.a. contact factory

350

250

140

100

0.48 @ 20A

0.57 @ 20A

0.61 @ 20A

0.60 @ 18A

0.80 @ 20A

TO-220

100

150

n.a. contact factory

Mechanical Data

Device

MetalThickness

FrontMetal

MetalThickness

BackMetal

SC170xxxxA5x

SC170xxxxS5x

WireBondable

Solderable

Al 30 kÅ

Ag 35 kÅ

Cr 1 kÅ

Ni 2 kÅ

Ag 3 kÅ

Ti 2 kÅ

Ni 1 kÅ

Ni 2 kÅ

Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.

Shelf life for parts stored in above condition is 2 years.

If the storage is done in normal atmosphere shelf life is reduced to six months.

Packaging

Device

Description

Minimum Order Quantity

Die in Sale Package

SC170xxxxx5B

SC170xxxxx5R

Inked Probed Unsawn Wafer (Wafer in Box)

Probed Die in Tape & Reel

800

n.a.

SC170xxxxx5P

SC170xxxxx5F

Probed Die in Waffle Pack

800

Inked Probed Sawn Wafer on Film

www.irf.com

SC170.....5.

Bulletin I506J rev. B 10/00

Ordering Information Table

Device Code

SC 170

100

Schottky Die

Chip Dimension in Mils

H = 830 Process

R = OR'ing Process

S = Standard Process

Process (see Electrical Characteristics Table)

Voltage code: Code = V_RRM

Chip surface metallization (see Mechanical Data Table)

Wafer Diameter in inches

Packaging(seePackagingTable)

Wafer on Film

www.irf.com

SC170.....5.

Bulletin I506J rev. B 10/00

Wafer in Box

ROUNDCONTAINER

TYVEK DISK

FOAM DISK

Die in Waffle Pack

CHIPTRAYPOCKET

www.irf.com

SC170.....5.

Bulletin I506J rev. B 10/00

Tape and Reel

REEL FRAME

BARE DIE CARRIER TAPE

WORLDHEADQUARTERS: 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332.

EUROPEANHEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.

IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801.

IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.

IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.

IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086.

IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.

IR TAIWAN: 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936.

http://www.irf.com

Fax-On-Demand: +44 1883 733420

Data and specifications subject to change without notice.

www.irf.com

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