SGU06N60 [INFINEON]

Fast IGBT in NPT-technology; 在NPT技术的快速IGBT
SGU06N60
型号: SGU06N60
厂家: Infineon    Infineon
描述:

Fast IGBT in NPT-technology
在NPT技术的快速IGBT

晶体 晶体管 电动机控制 瞄准线 双极性晶体管 栅
文件: 总12页 (文件大小:390K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
Fast IGBT in NPT-technology  
75% lower Eoff compared to previous generation  
combined with low conduction losses  
Short circuit withstand time – 10 µs  
Designed for:  
C
- Motor controls  
- Inverter  
G
P-TO-251-3-1 (I-PAK)  
(TO-251AA)  
E
NPT-Technology for 600V applications offers:  
- very tight parameter distribution  
- high ruggedness, temperature stable behaviour  
- parallel switching capability  
P-TO-252-3-1 (D-PAK) P-TO-220-3-1  
P-TO-263-3-2 (D²-PAK)  
(TO-263AB)  
(TO-252AA)  
(TO-220AB)  
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  
Type  
VCE  
IC  
VCE(sat)  
Tj  
Package  
Ordering Code  
SGP06N60  
SGB06N60  
SGD06N60  
SGU06N60  
600V  
6A  
2.3V  
TO-220AB  
Q67040-S4450  
Q67040-S4448  
Q67041-A4709  
Q67040-S4449  
150°C  
TO-263AB  
TO-252AA(DPAK)  
TO-251AA(IPAK)  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
DC collector current  
TC = 25°C  
VCE  
IC  
600  
V
A
12  
6.9  
TC = 100°C  
Pulsed collector current, tp limited by Tjmax  
ICpul s  
-
24  
24  
Turn off safe operating area  
VCE 600V, Tj 150°C  
Gate-emitter voltage  
VG E  
EAS  
V
±20  
Avalanche energy, single pulse  
IC = 6 A, VCC = 50 V, RGE = 25 ,  
start at Tj = 25°C  
34  
mJ  
Short circuit withstand time1)  
VGE = 15V, VCC 600V, Tj 150°C  
Power dissipation  
tSC  
10  
68  
µs  
Pt ot  
W
TC = 25°C  
Operating junction and storage temperature  
Tj , Tstg  
-55...+150  
°C  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
Rt hJC  
Rt hJA  
Rt hJA  
1.85  
K/W  
Thermal resistance,  
junction – ambient  
SMD version, device on PCB1)  
TO-251AA  
TO-220AB  
TO-252AA  
TO-263AB  
75  
62  
50  
40  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage V( BR)CES  
600  
-
-
V
VG E=0V, IC =500µA  
Collector-emitter saturation voltage  
VC E( sat ) VG E = 15V, IC =6A  
Tj =25°C  
1.7  
-
2.0  
2.3  
2.4  
2.8  
Tj =150°C  
Gate-emitter threshold voltage  
VG E(t h)  
ICES  
3
4
5
IC =250µA,VCE=VGE  
VCE=600V,VGE=0V  
Tj =25°C  
Zero gate voltage collector current  
µA  
-
-
-
-
20  
700  
Tj =150°C  
Gate-emitter leakage current  
Transconductance  
IGES  
gfs  
VCE=0V,VG E=20V  
VCE=20V, IC =6A  
-
-
-
100  
-
nA  
S
4.2  
Dynamic Characteristic  
Input capacitance  
Ciss  
VCE=25V,  
VG E=0V,  
-
-
-
-
350  
38  
420  
46  
pF  
Output capacitance  
Coss  
Crss  
f=1MHz  
Reverse transfer capacitance  
Gate charge  
23  
28  
QGate  
VCC =480V, IC =6A  
VG E=15V  
32  
42  
nC  
nH  
A
Internal emitter inductance  
LE  
TO-220AB  
-
-
7
-
-
measured 5mm (0.197 in.) from case  
Short circuit collector current2)  
IC( SC)  
60  
VG E=15V,tSC10µs  
VCC 600V,  
Tj 150°C  
1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for  
collector connection. PCB is vertical without blown air.  
2) Allowed number of short circuits: <1000; time between short circuits: >1s.  
2
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
Switching Characteristic, Inductive Load, at Tj=25 °C  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Tj =25°C,  
CC =400V,IC =6A,  
VG E=0/15V,  
td(on)  
tr  
td( off)  
tf  
-
-
-
-
-
-
-
25  
18  
30  
22  
ns  
V
Turn-off delay time  
Fall time  
220  
264  
65  
RG=50,  
1)  
Lσ =180nH,  
54  
1)  
Cσ =250pF  
Turn-on energy  
Turn-off energy  
Total switching energy  
Eon  
Eoff  
Et s  
0.110  
0.105  
0.215  
0.127 mJ  
0.137  
Energy losses include  
“tail” and diode  
reverse recovery.  
0.263  
Switching Characteristic, Inductive Load, at Tj=150 °C  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Tj =150°C  
td(on)  
tr  
td( off)  
tf  
-
-
-
-
-
-
-
24  
17  
29  
20  
ns  
V
V
CC =400V, IC =6A,  
G E=0/15V,  
Turn-off delay time  
Fall time  
248  
298  
84  
RG=50,  
1)  
Lσ =180nH,  
70  
1)  
Cσ =250pF  
Turn-on energy  
Turn-off energy  
Total switching energy  
Eon  
Eoff  
Et s  
0.167  
0.153  
0.320  
0.192 mJ  
0.199  
Energy losses include  
“tail” and diode  
reverse recovery.  
0.391  
1) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
3
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
Ic  
tp=2µs  
30A  
20A  
10A  
0A  
10A  
15µs  
TC=80°C  
50µs  
1A  
TC=110°C  
200µs  
1ms  
Ic  
DC  
0.1A  
1V  
10V  
100V  
1000V  
10Hz  
100Hz  
1kHz  
10kHz 100kHz  
f, SWITCHING FREQUENCY  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 1. Collector current as a function of  
switching frequency  
Figure 2. Safe operating area  
(D = 0, TC = 25°C, Tj 150°C)  
(Tj 150°C, D = 0.5, VCE = 400V,  
VGE = 0/+15V, RG = 50)  
15A  
10A  
5A  
80W  
60W  
40W  
20W  
0W  
0A  
25°C  
50°C  
75°C 100°C 125°C  
25°C  
50°C  
75°C 100°C 125°C  
TC, CASE TEMPERATURE  
TC, CASE TEMPERATURE  
Figure 3. Power dissipation as a function  
of case temperature  
Figure 4. Collector current as a function of  
case temperature  
(Tj 150°C)  
(VGE 15V, Tj 150°C)  
4
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
20A  
15A  
10A  
5A  
20A  
15A  
VGE=20V  
15V  
13V  
VGE=20V  
15V  
13V  
11V  
9V  
7V  
5V  
10A  
11V  
9V  
7V  
5V  
5A  
0A  
0V  
0A  
0V  
1V  
2V  
3V  
4V  
5V  
1V  
2V  
3V  
4V  
5V  
VCE, COLLECTOR-EMITTER VOLTAGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 5. Typical output characteristics  
Figure 6. Typical output characteristics  
(Tj = 25°C)  
(Tj = 150°C)  
20A  
4.0V  
18A  
16A  
14A  
12A  
10A  
8A  
Tj=+25°C  
IC = 12A  
3.5V  
-55°C  
+150°C  
3.0V  
IC = 6A  
2.5V  
2.0V  
1.5V  
1.0V  
6A  
4A  
2A  
0A  
0V  
2V  
4V  
6V  
8V  
10V  
-50°C  
0°C  
50°C 100°C 150°C  
VGE, GATE-EMITTER VOLTAGE  
Tj, JUNCTION TEMPERATURE  
Figure 7. Typical transfer characteristics  
Figure 8. Typical collector-emitter  
(VCE = 10V)  
saturation voltage as a function of junction  
temperature  
(VGE = 15V)  
5
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
td(off)  
td(off)  
100ns  
tf  
tf  
100ns  
td(on)  
td(on)  
tr  
tr  
10ns  
0A  
10ns  
3A  
6A  
9A  
12A  
15A  
0  
50Ω  
100Ω  
150Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 9. Typical switching times as a  
function of collector current  
Figure 10. Typical switching times as a  
function of gate resistor  
(inductive load, Tj = 150°C, VCE = 400V,  
(inductive load, Tj = 150°C, VCE = 400V,  
VGE = 0/+15V, IC = 6A,  
VGE = 0/+15V, RG = 50,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
5.5V  
5.0V  
4.5V  
4.0V  
3.5V  
3.0V  
2.5V  
2.0V  
td(off)  
100ns  
tf  
max.  
td(on)  
typ.  
tr  
min.  
10ns  
0°C  
50°C  
100°C  
150°C  
-50°C  
0°C  
50°C 100°C 150°C  
Tj, JUNCTION TEMPERATURE  
Tj, JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
function of junction temperature  
(inductive load, VCE = 400V, VGE = 0/+15V,  
IC = 6A, RG = 50,  
Figure 12. Gate-emitter threshold voltage  
as a function of junction temperature  
(IC = 0.25mA)  
Dynamic test circuit in Figure E)  
6
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
0.8mJ  
0.6mJ  
0.4mJ  
0.2mJ  
0.0mJ  
0.6mJ  
*) Eon and Ets include losses  
due to diode recovery.  
*) Eon and Ets include losses  
Ets*  
due to diode recovery.  
Ets*  
0.4mJ  
Eoff  
Eon*  
Eon*  
0.2mJ  
Eoff  
0.0mJ  
0A  
3A  
6A  
9A  
12A  
15A  
0Ω  
50Ω  
100Ω  
150Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 13. Typical switching energy losses  
as a function of collector current  
Figure 14. Typical switching energy losses  
as a function of gate resistor  
(inductive load, Tj = 150°C, VCE = 400V,  
(inductive load, Tj = 150°C, VCE = 400V,  
VGE = 0/+15V, IC = 6A,  
VGE = 0/+15V, RG = 50,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
0.4mJ  
*) Eon and Ets include losses  
due to diode recovery.  
D=0.5  
100K/W  
Ets*  
0.2  
0.1  
0.3mJ  
0.2mJ  
0.1mJ  
0.0mJ  
0.05  
10-1K/W  
0.02  
Eon*  
R , ( K / W )  
0.705  
0.561  
τ , ( s )  
0.0341  
3.74E-3  
3.25E-4  
0.01  
Eoff  
0.583  
10-2K/W  
R1  
R2  
single pulse  
C1=τ1/R1 C2=τ2/R2  
10-3K/W  
1µs  
0°C  
50°C  
100°C  
150°C  
10µs 100µs 1ms 10ms 100ms 1s  
tp, PULSE WIDTH  
Tj, JUNCTION TEMPERATURE  
Figure 15. Typical switching energy losses  
as a function of junction temperature  
(inductive load, VCE = 400V, VGE = 0/+15V,  
IC = 6A, RG = 50,  
Figure 16. IGBT transient thermal  
impedance as a function of pulse width  
(D = tp / T)  
Dynamic test circuit in Figure E)  
7
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
25V  
20V  
15V  
10V  
5V  
1nF  
Ciss  
120V  
480V  
100pF  
Coss  
Crss  
0V  
0nC  
10pF  
15nC  
30nC  
45nC  
0V  
10V  
20V  
30V  
QGE, GATE CHARGE  
Figure 17. Typical gate charge  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 18. Typical capacitance as a  
function of collector-emitter voltage  
(VGE = 0V, f = 1MHz)  
(IC = 6A)  
25µs  
100A  
20µs  
15µs  
10µs  
5µs  
80A  
60A  
40A  
20A  
0A  
0µs  
10V  
11V  
12V  
13V  
14V  
15V  
10V  
12V  
14V  
16V  
18V  
20V  
VGE, GATE-EMITTER VOLTAGE  
VGE, GATE-EMITTER VOLTAGE  
Figure 19. Short circuit withstand time as a  
function of gate-emitter voltage  
(VCE = 600V, start at Tj = 25°C)  
Figure 20. Typical short circuit collector  
current as a function of gate-emitter voltage  
(VCE 600V, Tj = 150°C)  
8
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
dimensions  
TO-220AB  
symbol  
[mm]  
[inch]  
min  
9.70  
14.88  
0.65  
3.55  
2.60  
6.00  
13.00  
4.35  
0.38  
0.95  
max  
10.30  
15.95  
0.86  
3.89  
3.00  
6.80  
14.00  
4.75  
0.65  
1.32  
min  
max  
A
B
C
D
E
F
0.3819  
0.5858  
0.0256  
0.1398  
0.1024  
0.2362  
0.5118  
0.1713  
0.0150  
0.0374  
0.4055  
0.6280  
0.0339  
0.1531  
0.1181  
0.2677  
0.5512  
0.1870  
0.0256  
0.0520  
G
H
K
L
M
N
P
T
2.54 typ.  
0.1 typ.  
4.30  
4.50  
1.40  
2.72  
0.1693  
0.0461  
0.0906  
0.1772  
0.0551  
0.1071  
1.17  
2.30  
TO-263AB (D2Pak)  
dimensions  
symbol  
[mm]  
[inch]  
min  
9.80  
0.70  
1.00  
1.03  
max  
10.20  
1.30  
1.60  
1.07  
min  
max  
A
B
C
D
E
F
0.3858  
0.0276  
0.0394  
0.0406  
0.4016  
0.0512  
0.0630  
0.0421  
2.54 typ.  
0.65 0.85  
5.08 typ.  
0.1 typ.  
0.0256  
0.0335  
G
H
K
L
0.2 typ.  
4.30  
4.50  
1.37  
9.45  
2.50  
0.1693  
0.0461  
0.3563  
0.0906  
0.1772  
0.0539  
0.3720  
0.0984  
1.17  
9.05  
2.30  
M
N
P
Q
R
S
T
15 typ.  
0.5906 typ.  
0.00  
4.20  
0.20  
5.20  
0.0000  
0.1654  
0.0079  
0.2047  
8° max  
8° max  
2.40  
0.40  
3.00  
0.60  
0.0945  
0.0157  
0.1181  
0.0236  
U
V
W
X
Y
Z
10.80  
1.15  
6.23  
4.60  
9.40  
16.15  
0.4252  
0.0453  
0.2453  
0.1811  
0.3701  
0.6358  
9
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
dimensions  
P-TO252 (D-Pak)  
symbol  
[mm]  
inch]  
min  
6.40  
5.25  
max  
6.73  
5.50  
min  
max  
A
B
C
D
E
F
0.2520  
0.2067  
0.2650  
0.2165  
(0.65)  
0.63  
(1.15) (0.0256) (0.0453)  
0.89  
0.0248  
0.0350  
2.28  
0.2520  
2.19  
0.76  
0.90  
5.97  
9.40  
0.46  
0.87  
0.51  
5.00  
4.17  
0.26  
-
2.39  
0.98  
1.21  
6.23  
10.40  
0.58  
1.15  
-
0.0862  
0.0299  
0.0354  
0.2350  
0.3701  
0.0181  
0.0343  
0.0201  
0.1969  
0.1642  
0.0102  
-
0.0941  
0.0386  
0.0476  
0.2453  
0.4094  
0.0228  
0.0453  
-
G
H
K
L
M
N
P
R
S
T
-
-
-
-
1.02  
-
0.0402  
-
U
dimensions  
P-TO251 (I-Pak)  
symbol  
[mm]  
[inch]  
min  
6.47  
5.25  
4.19  
0.63  
max  
6.73  
5.41  
4.43  
0.89  
min  
max  
A
B
C
D
E
F
0.2547  
0.2067  
0.1650  
0.0248  
0.2650  
0.2130  
0.1744  
0.0350  
2.29 typ.  
2.18  
0.0902 typ.  
2.39  
0.86  
1.11  
6.23  
9.65  
0.56  
1.15  
0.0858  
0.0299  
0.0398  
0.2350  
0.3598  
0.0181  
0.0386  
0.0941  
0.0339  
0.0437  
0.2453  
0.3799  
0.0220  
0.0453  
G
H
K
L
0.76  
1.01  
5.97  
9.14  
0.46  
0.98  
M
N
10  
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
τ1  
r1  
τ2  
r 2  
τn  
r n  
T (t)  
j
p(t)  
r 2  
r1  
rn  
T
C
Figure D. Thermal equivalent  
circuit  
Figure A. Definition of switching times  
Figure B. Definition of switching losses  
Figure E. Dynamic test circuit  
Leakage inductance Lσ =180nH  
and Stray capacity Cσ =250pF.  
11  
Jul-02  
SGP06N60, SGB06N60  
SGD06N60, SGU06N60  
Published by  
Infineon Technologies AG,  
Bereich Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 2000  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,  
descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or  
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect  
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
12  
Jul-02  

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Insulated Gate Bipolar Transistor, 1A I(C), 600V V(BR)CES, N-Channel, IPAK-3
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SGU20N40

High input impedance
FAIRCHILD

SGU20N40L

High input impedance
FAIRCHILD

SGU20N40LTU

Insulated Gate Bipolar Transistor, 400V V(BR)CES, N-Channel, TO-251, IPAK-3
FAIRCHILD

SGU20N40LTU_NL

Insulated Gate Bipolar Transistor, 400V V(BR)CES, N-Channel, TO-251, LEAD FREE, IPAK-3
FAIRCHILD

SGU2N60UF

Ultra-Fast IGBT
FAIRCHILD

SGU2N60UFD

Ultra-Fast IGBT
FAIRCHILD

SGU2N60UFDTU

暂无描述
FAIRCHILD

SGU2N60UFTU

Insulated Gate Bipolar Transistor, 2.4A I(C), 600V V(BR)CES, N-Channel, TO-251, IPAK-3
FAIRCHILD