SP001194252 [INFINEON]

Rectifier Diode,;
SP001194252
型号: SP001194252
厂家: Infineon    Infineon
描述:

Rectifier Diode,

二极管
文件: 总10页 (文件大小:874K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Diode  
Silicon Carbide Schottky Diode  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Final Datasheet  
Rev. 2.0 2015-07-22  
Industrial Power Control  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
thinQ!TM SiC Schottky Diode  
Features:  
Revolutionary semiconductor material - Silicon Carbide  
No reverse recovery current / No forward recovery  
Temperature independent switching behavior  
Low forward voltage even at high operating temperature  
Tight forward voltage distribution  
Excellent thermal performance  
Extended surge current capability  
Specified dv/dt ruggedness  
Qualified according to JEDEC1) for target applications  
Pb-free lead plating; RoHS compliant  
Benefits  
System efficiency improvement over Si diodes  
Enabling higher frequency / increased power density solutions  
System size / cost savings due to reduced heatsink requirements and smaller magnetics  
Reduced EMI  
Highest efficiency across the entire load range  
Robust diode operation during surge events  
High reliability  
RelatedLinks: www.infineon.com/sic  
Applications  
Solar inverters  
Uninterruptable power supplies  
Motor drives  
Power Factor Correction  
Package pin definitions  
Pin 1 and backside cathode  
Pin 2 anode  
Key Performance and Package Parameters  
Type  
VDC  
IF  
QC  
Tj,max  
Marking  
Package  
IDH08G120C5  
1200V  
8A  
28nC  
175°C D0812C5  
PG-TO220-2-1  
1) J-STD20 and JESD22  
Final Data Sheet  
2
Rev. 2.0, 2015-07-22  
 
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Table of Contents  
Description ..................................................................................................................................................2  
Table of Contents........................................................................................................................................3  
Maximum Ratings .......................................................................................................................................4  
Thermal Resistances ..................................................................................................................................4  
Electrical Characteristics.............................................................................................................................5  
Electrical Characteristics Diagram..............................................................................................................6  
Package Drawings......................................................................................................................................9  
Revision History........................................................................................................................................10  
Disclaimer .................................................................................................................................................10  
Final Data Sheet  
3
Rev. 2.0, 2015-07-22  
 
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Maximum ratings  
Parameter  
Symbol  
Value  
Unit  
V
Repetitive peak reverse voltage  
VRRM  
1200  
Continues forward current for Rth(j-c,max)  
TC = 151°C, D=1  
TC = 135°C, D=1  
8.0  
11.0  
22.8  
IF  
A
A
TC = 25°C, D=1  
Surge non-repetitive forward current,  
sine halfwave  
TC=25°C, tp=10ms  
IF,SM  
IF,max  
i²dt  
70  
60  
TC=150°C, tp=10ms  
Non-repetitive peak forward current  
TC = 25°C, tp=10 µs  
i²t value  
TC = 25°C, tp=10 ms  
TC = 150°C, tp=10 ms  
Diode dv/dt ruggedness  
VR=0…960V  
530  
A
25  
18  
A²s  
V/ns  
dv/dt  
80  
Power dissipation  
TC = 25°C  
Ptot  
126  
W
°C  
°C  
Operating temperature  
Storage temperature  
Tj  
-55…175  
-55…150  
Tstg  
Soldering temperature,  
wavesoldering only allowed at leads,  
1.6mm (0.063 in.) from case for 10 s  
Mounting torque  
Tsold  
260  
0.7  
°C  
M
Nm  
M3 and M4 screws  
Thermal Resistances  
Value  
Parameter  
Symbol Conditions  
Unit  
min.  
typ.  
max.  
Characteristic  
Diode thermal resistance,  
junction case  
Rth(j-c)  
Rth(j-a)  
-
-
0.92  
-
1.19  
62  
K/W  
K/W  
Thermal resistance,  
junction ambient  
leaded  
Final Data Sheet  
4
Rev. 2.0, 2015-07-22  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Electrical Characteristics  
Static Characteristics, at Tj=25°C, unless otherwise specified  
Value  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Static Characteristic  
DC blocking voltage  
VDC  
VF  
Tj = 25°C  
1200  
-
-
V
V
IF= 8A, Tj=25°C  
IF= 8A, Tj=150°C  
VR=1200V, Tj=25°C  
VR=1200V, Tj=150°C  
-
-
1.65  
2.25  
3
1.95  
2.85  
40  
Diode forward voltage  
Reverse current  
IR  
µA  
14  
210  
Dynamic Characteristics, at Tj=25°C, unless otherwise specified  
Value  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Dynamic Characteristics  
Total capacitive charge  
VR=800V, Tj=150°C  
VR  
QC  
C
-
28  
-
nC  
pF  
Q C(V)dV  
C
0
VR=1 V, f=1 MHz  
VR=400 V, f=1 MHz  
VR=800 V, f=1 MHz  
-
-
-
365  
26  
20  
-
-
-
Total Capacitance  
Final Data Sheet  
5
Rev. 2.0, 2015-07-22  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Electrical Characteristics Diagram  
Figure 1. Power dissipation as a function  
of case temperature, Ptot=f(TC),  
Figure 2. Diode forward current as function  
of temperature, Tj175°C,  
Rth(j-c),max, parameter D=duty cycle,  
Rth(j-c),max  
Vth, Rdiff @ Tj=175°C  
Figure 3. Typical forward characteristics,  
IF=f(VF), tp= 10 µs, parameter: Tj  
Figure 4. Typical forward characteristics in surge  
current, IF=f(VF), tp= 10 µs,  
parameter: Tj  
Final Data Sheet  
6
Rev. 2.0, 2015-07-22  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Figure 5. Typical capacitive charge as function  
of current slope1, QC=f(dIF/dt), Tj=150°C  
1) Only capacitive charge, guaranteed by design.  
Figure 6. Typical reverse current as function  
of reverse voltage, IR=f(VR), parameter: Tj  
Figure 7. Max. transient thermal impedance,  
Zth,jc=f(tP), parameter: D=tP/T  
Figure 8. Typical capacitance as function of  
reverse voltage, C=f(VR); Tj=25°C; f=1 MHz  
Final Data Sheet  
7
Rev. 2.0, 2015-07-22  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Figure 9. Typical capacitively stored energy as  
function of reverse voltage,  
VR  
E C(V )VdV  
C
0
Final Data Sheet  
8
Rev. 2.0, 2015-07-22  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Package Drawings  
Final Data Sheet  
9
Rev. 2.0, 2015-07-22  
IDH08G120C5  
5th Generation thinQ!™ 1200 V SiC Schottky Diode  
Revision History  
IIDH08G120C5  
Revision: 2015-07-22, Rev. 2.0  
Previous Revision:  
Revision  
2.0  
Date Subjects (major changes since last version)  
Final data sheet  
-
Disclaimer  
We Listen to Your Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to: erratum@infineon.com  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2015 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any  
information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office.  
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or  
systems and/or automotive, aviation and aerospace applications or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the  
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the  
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to  
assume that the health of the user or other persons may be endangered.  
Final Data Sheet  
10  
Rev. 2.0, 2015-07-22  

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