T458B_PA [INFINEON]
Wide Band Medium Power Amplifier, 17000MHz Min, 24000MHz Max,;型号: | T458B_PA |
厂家: | Infineon |
描述: | Wide Band Medium Power Amplifier, 17000MHz Min, 24000MHz Max, 射频 微波 |
文件: | 总4页 (文件大小:70K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
T458B_PA
17 – 24 GHz GaAs Power Amplifier/Driver MMIC
• 4 Stage Monolithic Microwave Integrated Circuit
(MMIC) Amplifier
• Input/Output matched (incl. bond wires)
• Frequency range: 17 GHz to 24 GHz
• High Isolation > 50 dB
chip size: 4.2 mm x 1.8 mm
• Gain > 22 dB
• P-1dB > 23 dBm, Psat > 24 dBm
ESD: Electrical discharge sensitive device, observe handling precautions!
Description:
This 4 stage GaAs MMIC power amplifier is intended for use in radio link applications. It
provides an output power of 23 dBm at 1 dB gain compression. The device is fabricated with
a 0.18 micron Pseudomorphic InGaAs/AlGaAs/GaAs High Electron Mobility Transistor
processing technology.
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Chip T458B
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Chip
Electrical Specifications: (VD = 5 – 6 V, ID = 300 mA)
Parameter
Min
Typ
Max
Unit
GHz
dBm
dB
Frequency Range
17
24
P-1dB
23
22
24
15
- 6
- 3
Gain
Psat
dBm
%
PAE
Input Return Loss (incl. bond wire)
Output Return Loss (incl. bond wire)
dB
dB
Infineon Technologies AG i. Gr.
pg. 1/4
Preliminary data sheet 07.05.99
This is information on a product that is under development. Data and specificatios are subject to change without notice.
T458B_PA
0HDVXUHGꢀGDWDꢁꢀ(on chip measurements)
CCH250PW.SPW
30
28
26
24
22
20
18
12
14
16
18
20
22
24
26
28
30
Frequency f (GHz)
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Infineon Technologies AG i. Gr.
pg. 2/4
Preliminary data sheet 07.05.99
This is information on a product that is under development. Data and specificatios are subject to change without notice.
T458B_PA
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Chip thickness
Chip size
Bond pads
Bond pad material
Chip passivation
95µm
4,2 mm * 1,8 mm
100 µm * 100 µm
Au (plated gold)
SiN (silicon nitride)
Suggested measurement setup:
Operating Point:
C > 100 pF,
R = 18 Ohms
C
C
R
R
R
Vd
5V <Vd < 6V
0V < Vg < 0.35V
300mA < Id < 350mA
C
C
C
Vd1
Vd2
Vd3
Vd4
RF Input
RF Output
Vg2
Vg3
Vg1
C
C
Vg
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250°C
180°C
100 Hz
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250°C
150°C
1: 2,5 g
2: 3,1 g
3: 3,2 g
4: 3,0 g
5: 2,8 g
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50 g
25 µm
25 g
17 µm
Infineon Technologies AG i. Gr.
pg. 3/4
Preliminary data sheet 07.05.99
This is information on a product that is under development. Data and specificatios are subject to change without notice.
T458B_PA
Published by Infineon Technologies AG i. Gr., Wireless Products Division, GaAs & Sensor Subdivision,
WS GS PM P, Balanstraße 73, 81541 Munich, Germany; Postal Address: P.O. Box 800949, 81609
Munich, Germany.
copyright Infineon Technologies 1999. All Rights Reserved.
As fas as patents or other rights of third parties are concerned, liability is only assumed for
components per se, not for applications, processes and cirucits implemented within components
or assemblies.
The information describes the type of component and shall not be considered as assured
characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery, and prices please contact the Offices of Infineon in
Germany or the Infineon Companies and Representatives worldwide.
Due to technical requirements components may contain dangerous substances. For information
on the type in question please contact your nearest Infineon Office.
Infineon Technologies AG i. Gr. is an approved QS9000 and ISO9001 manufacturer.
Infineon Technologies AG i. Gr.
pg. 4/4
Preliminary data sheet 07.05.99
This is information on a product that is under development. Data and specificatios are subject to change without notice.
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