T458B_PA [INFINEON]

Wide Band Medium Power Amplifier, 17000MHz Min, 24000MHz Max,;
T458B_PA
型号: T458B_PA
厂家: Infineon    Infineon
描述:

Wide Band Medium Power Amplifier, 17000MHz Min, 24000MHz Max,

射频 微波
文件: 总4页 (文件大小:70K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
T458B_PA  
17 – 24 GHz GaAs Power Amplifier/Driver MMIC  
4 Stage Monolithic Microwave Integrated Circuit  
(MMIC) Amplifier  
Input/Output matched (incl. bond wires)  
Frequency range: 17 GHz to 24 GHz  
High Isolation > 50 dB  
chip size: 4.2 mm x 1.8 mm  
Gain > 22 dB  
P-1dB > 23 dBm, Psat > 24 dBm  
ESD: Electrical discharge sensitive device, observe handling precautions!  
Description:  
This 4 stage GaAs MMIC power amplifier is intended for use in radio link applications. It  
provides an output power of 23 dBm at 1 dB gain compression. The device is fabricated with  
a 0.18 micron Pseudomorphic InGaAs/AlGaAs/GaAs High Electron Mobility Transistor  
processing technology.  
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Chip T458B  
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Chip  
Electrical Specifications: (VD = 5 – 6 V, ID = 300 mA)  
Parameter  
Min  
Typ  
Max  
Unit  
GHz  
dBm  
dB  
Frequency Range  
17  
24  
P-1dB  
23  
22  
24  
15  
- 6  
- 3  
Gain  
Psat  
dBm  
%
PAE  
Input Return Loss (incl. bond wire)  
Output Return Loss (incl. bond wire)  
dB  
dB  
Infineon Technologies AG i. Gr.  
pg. 1/4  
Preliminary data sheet 07.05.99  
This is information on a product that is under development. Data and specificatios are subject to change without notice.  
T458B_PA  
0HDVXUHGꢀGDWDꢁꢀ(on chip measurements)  
CCH250PW.SPW  
30  
28  
26  
24  
22  
20  
18  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
Frequency f (GHz)  
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tbd.  
Infineon Technologies AG i. Gr.  
pg. 2/4  
Preliminary data sheet 07.05.99  
This is information on a product that is under development. Data and specificatios are subject to change without notice.  
T458B_PA  
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Chip thickness  
Chip size  
Bond pads  
Bond pad material  
Chip passivation  
95µm  
4,2 mm * 1,8 mm  
100 µm * 100 µm  
Au (plated gold)  
SiN (silicon nitride)  
Suggested measurement setup:  
Operating Point:  
C > 100 pF,  
R = 18 Ohms  
C
C
R
R
R
Vd  
5V <Vd < 6V  
0V < Vg < 0.35V  
300mA < Id < 350mA  
C
C
C
Vd1  
Vd2  
Vd3  
Vd4  
RF Input  
RF Output  
Vg2  
Vg3  
Vg1  
C
C
Vg  
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7KHUPRFRPSUHVVLRQ  
1DLOKHDGꢂꢀZLWKRXW  
XOWUDVRQLF  
250°C  
180°C  
100 Hz  
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250°C  
150°C  
1: 2,5 g  
2: 3,1 g  
3: 3,2 g  
4: 3,0 g  
5: 2,8 g  
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50 g  
25 µm  
25 g  
17 µm  
Infineon Technologies AG i. Gr.  
pg. 3/4  
Preliminary data sheet 07.05.99  
This is information on a product that is under development. Data and specificatios are subject to change without notice.  
T458B_PA  
Published by Infineon Technologies AG i. Gr., Wireless Products Division, GaAs & Sensor Subdivision,  
WS GS PM P, Balanstraße 73, 81541 Munich, Germany; Postal Address: P.O. Box 800949, 81609  
Munich, Germany.  
copyright Infineon Technologies 1999. All Rights Reserved.  
As fas as patents or other rights of third parties are concerned, liability is only assumed for  
components per se, not for applications, processes and cirucits implemented within components  
or assemblies.  
The information describes the type of component and shall not be considered as assured  
characteristics.  
Terms of delivery and rights to change design reserved.  
For questions on technology, delivery, and prices please contact the Offices of Infineon in  
Germany or the Infineon Companies and Representatives worldwide.  
Due to technical requirements components may contain dangerous substances. For information  
on the type in question please contact your nearest Infineon Office.  
Infineon Technologies AG i. Gr. is an approved QS9000 and ISO9001 manufacturer.  
Infineon Technologies AG i. Gr.  
pg. 4/4  
Preliminary data sheet 07.05.99  
This is information on a product that is under development. Data and specificatios are subject to change without notice.  

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