TC1164128F80HLABFXQMA1 [INFINEON]
Microcontroller, CMOS,;
| 型号： | TC1164128F80HLABFXQMA1 |
| 厂家： | 
Infineon |
| 描述： | Microcontroller, CMOS, 时钟 微控制器 外围集成电路 |
| 文件： | 总134页 (文件大小：945K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet, V1.0, Apr. 2008
TC1163/TC1164
32-Bit Single-Chip Microcontroller
TriCore
Microcontrollers
Edition 2008-04
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2008.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-
infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Data Sheet, V1.0, Apr. 2008
TC1163/TC1164
32-Bit Single-Chip Microcontroller
TriCore
Microcontrollers
TC1163/TC1164
Preliminary
TC1163/TC1164 Data Sheet
Revision History: V1.0, 2008-04
Previous Version: V0.3 2007-03
Page
7
Subjects (major changes since last revision)
VSSOSC3 is deleted from the TC1163/TC1164 Logic Symbol.
8, 10
TDATA0 of Pin 17, TCLK0 of Pin 20, TCLK0 of Pin 74 and TDATA0 of Pin
77 are updated in the Pinning Diagram and Pin Definition and Functions
Table.
53
Transmit DMA request in Block Diagram of ASC Interfaces is updated.
Alternate output functions in block diagram of SSC interfaces are updated.
Programmable baud rate of the MLI is updated.
55
61
62
TDATA0 and TCLK0 of the block diagram of MLI interfaces are updated.
The description for WDT double reset detection is updated.
The power sequencing details is updated.
74
111
122
126
MLI timing, maximum operating frequency limit is extended, t31 is added.
Thermal resistance junction leads is updated.
Trademarks
TriCore® is a trademark of Infineon Technologies AG.
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
Data Sheet
V1.0, 2008-04
TC1163/TC1164
Table of Contents
Preliminary
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pad Driver and Input Classes Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
2.2
2.3
2.4
2.5
3
3.1
3.2
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.4.1
3.3.4.2
3.3.5
3.4
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . . 24
On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
How to Read the Address Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Contents of the Segments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Address Map of the FPI Bus System . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Segments 0 to 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Segment 15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Address Map of the Local Memory Bus (LMB) . . . . . . . . . . . . . . . . . . . 42
Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Peripheral Control Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . . 53
High-Speed Synchronous Serial Interfaces (SSC0 and SSC1) . . . . . . . . . 55
Micro Second Bus Interface (MSC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
MultiCAN Controller (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Micro Link Serial Bus Interface (MLI0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
General Purpose Timer Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Functionality of GPTA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Analog-to-Digital Converter (ADC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . . 69
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.13.1
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
Data Sheet
1
V1.0, 2008-04
TC1163/TC1164
Table of Contents
Preliminary
4
4.1
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 87
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Analog to Digital Converter (ADC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . 102
Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Debug Trace Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Timing for JTAG Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 124
Synchronous Serial Channel (SSC) Master Mode Timing . . . . . . . . 125
4.1.1
4.1.2
4.1.3
4.1.4
4.2
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
4.3.7
4.3.8
4.3.8.1
4.3.8.2
4.3.8.3
5
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Package Parameters (PG-LQFP-176-2) . . . . . . . . . . . . . . . . . . . . . . . . . 126
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
5.1
5.2
5.3
5.4
Data Sheet
2
V1.0, 2008-04
TC1163/TC1164
Preliminary
Summary of Features
1
Summary of Features
The TC1163/TC1164 has the following features:
• High-performance 32-bit super-scaler TriCore v1.3 CPU with 4-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Single precision Floating Point Unit (FPU)
– 80 MHz operation at full temperature range
• Peripheral Control Processor with single cycle instruction (PCP2)
– 8 Kbyte Parameter Memory (PRAM)
– 12 Kbyte Code Memory (CMEM)
• Multiple on-chip memories
– 40 Kbyte Local Data Memory (SRAM)
– 8 Kbyte Overlay Memory
– 8 Kbyte Scratch-Pad RAM (SPRAM)
– 8 Kbyte Instruction Cache (ICACHE)
– 1024 Kbyte Program Flash (for instruction code and constant data)
– 16 Kbyte Data Flash (e.g. 2 Kbyte EEPROM emulation)
– 16 Kbyte Boot ROM
• 8-channel DMA Controller
• Fast-response interrupt system with 2 x 255 hardware priority arbitration levels
serviced by CPU or PCP2
• High-performance on-chip bus structure
– 64-bit Local Memory Bus (LMB) to Flash memory
– System Peripheral Bus (SPB) for interconnections of functional units
• Versatile on-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASCs) with baudrate
generator, parity, framing and overrun error detection
– Two High Speed Synchronous Serial Channels (SSCs) with programmable data
length and shift direction
– One Micro Second Bus (MSC) interface for serial port expansion to external power
devices
– One high-speed Micro Link Interface (MLI) for serial inter-processor
communication
– One MultiCAN Module with two CAN nodes and 64 free assignable message
objects for high efficiency data handling via FIFO buffering and gateway data
transfer1)
1) Not applicable to TC1163
Data Sheet
3
V1.0, 2008-04
TC1163/TC1164
Preliminary
Summary of Features
– One General Purpose Timer Array Module (GPTA) with a powerful set of digital
signal filtering and timer functionality to realize autonomous and complex
Input/Output management
– One 16-channel Analog-to-Digital Converter unit (ADC) with selectable 8-bit, 10-
bit, or 12-bit, supporting 32 input channels
– One 2-channel Fast Analog-to-Digital Converter unit (FADC) with concatenated
comb filters for hardware data reduction: supporting 10-bit resolution, with
minimum conversion time of 262.5ns
• 32 analog input lines for ADC and FADC
• 81 digital general purpose I/O lines
• Digital I/O ports with 3.3 V capability
• On-chip debug support for OCDS Level 1 and 2 (CPU, PCP, DMA)
• Power Management System
• Clock Generation Unit with PLL
• Core supply voltage of 1.5 V
• I/O voltage of 3.3 V
• Full Industrial and Multi-Market temperature range: -40° to +85°C
• PG-LQFP-176-2 package
Data Sheet
4
V1.0, 2008-04
TC1163/TC1164
Preliminary
Summary of Features
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
• The derivative itself, i.e. its function set, the temperature range, and the supply
voltage
• The package and the type of delivery
For the available ordering codes for the TC1163/TC1164, please refer to the “Product
Catalog Microcontrollers” that summarizes all available microcontroller variants.
This document describes the derivatives of the device.The Table 1-1 enumerates these
derivatives and summarizes the differences.
Table 1-1
TC1163/TC1164 Derivative Synopsis
Derivative
Ambient Temperature Range
TA = -40oC to +85oC
TA = -40oC to +85oC
SAF-TC1163-128F80HL
SAF-TC1164-128F80HL
Data Sheet
5
V1.0, 2008-04
TC1163/TC1164
Preliminary
General Device Information
2
General Device Information
Chapter 2 provides the general information for the TC1163/TC1164.
2.1
Block Diagram
Figure 2-1 shows the TC1163/TC1164 block diagram.
FPU
PMI
DMI
8 KB SPRAM
8 KB ICACHE
TriCore
(TC1.3M)
40 KB LDRAM
Abbreviations:
ICACHE:
SPRAM:
CPS
Instruction Cache
Scratch-Pad RAM
LDRAM:
OVRAM:
BROM:
PFlash:
DFlash:
Local Data RAM
Local Memory Bus (LMB)
LBCU
Overlay RAM
PMU
Boot ROM
Program Flash
Data Flash
Parameter Memory in PCP
Code Memory in PCP
16 KB BROM
1024 KB Pflash
16 KB DFlash
PRAM:
CMEM:
LFI Bridge
8 KB OVRAM
8 KB PRAM
OCDS Debug
Interface/JTAG
PCP2
Core
STM
ASC0
ASC1
SBCU
12 KB CMEM
PLL
SSC0
Ports
fFP I
SSC1
SCU
fCPU
GPTA
DMA
ADC0
32 ch.
8 ch.
FADC
2 ch.
SMIF
Ext.
Request
Unit
Multi CAN 1)
(2 Nodes,
64 Buffer)
MSC0
Mem
Check
MLI0
1) Not applicable to TC1163
TC1163/TC1164 Block Diagram
Figure 2-1
TC1163/TC1164 Block Diagram
Data Sheet
6
V1.0, 2008-04
TC1163/TC1164
Preliminary
General Device Information
2.2
Logic Symbol
Figure 2-2 shows the TC1163/TC1164 logic symbol.
Alternate Functions
GPTA, SCU
PORST
Port 0 16-bit
HDRST
General Control
NMI
BYPASS
GPTA, SSC1, ADC
Port 1 15-bit
Port 2 14-bit
Port 3 16-bit
Port 4 4-bit
Port 5 16-bit
TESTMODE
SSC0/1, MLI0, GPTA, MSC0
ASC0/1, SSC0/1, SCU, CAN1)
GPTA, SCU
FCLP 0A
FCLN0
MSC0 Control
SOP0A
SON0
GPTA, OCDS L 2, MLI0
AN[35:0]
ADC Analog Inputs
VDDM
VSSM
TRST
TCK
TC1163/
TC1164
VDDMF
TDI
VSSMF
VDDAF
TDO
OCDS / JTAG Control
TMS
ADC/FADC Analog
Power Supply
VSSAF
VAREF0
VAGND0
VFAREF
VFAGND
VDDFL3
BRKIN
BRKOUT
TRCLK
XTAL1
XTAL2
VDDOSC3
7
8
9
VDD
VDDP
VSS
Oscillator
Digital Circuitry
Power Supply
VDDOSC
VSSOSC
TC1163/TC1164Logic Symbol
1) Alternate functions for CAN module is not applicable for TC1163.
Figure 2-2
TC1163/TC1164 Logic Symbol
Data Sheet
7
V1.0, 2008-04
TC1163/TC1164
Preliminary
General Device Information
2.3
Pin Configuration
Figure 2-3 shows the TC1163/TC1164 pin configuration.
OCDSDBG0/OUT40/IN40/P5.0
OCDSDBG1/OUT41/IN41/P5.1
OCDSDBG2/OUT42/IN42/P5.2
OCDSDBG3/OUT43/IN43/P5.3
OCDSDBG4/OUT44/IN44/P5.4
OCDSDBG5/OUT45/IN45/P5.5
OCDSDBG6/OUT46/IN46/P5.6
OCDSDBG7/OUT47/IN47/P5.7
1
2
3
4
5
6
7
8
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
P3.4/MTSR0
P3.7/SLSI0/SLSO02/SLSO12
P3.3/MRST0
P3.2/SCLK0
P3.8/SLSO06/TXD1A
P3.6/SLSO01/SLSO11/SLSO01&SLSO11
P3.5/SLSO00/SLSO10/SLSO00&SLSO10
VSS
VDDP
TRCLK
VDD
VDDP
VSS
9
VDD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
HDRST
PORST
NMI
BYPASS
TESTMODE
BRKIN
BRKOUT
TCK
TRST
TDO
TMS
TDI
P1.7/IN23/OUT23/OUT79
P1.6/IN22/OUT22/OUT78
P1.5/IN21/OUT21/OUT77
P1.4/IN20/EMG_IN/OUT20/OUT76
VDDOSC3
VDDOSC
VSSOSC
XTAL2
XTAL1
VSS
OCDSDBG8/RDATA0B/P5.8
OCDSDBG9/RVALID0B/P5.9
OCDSDBG10/RREADY0B/P5.10
OCDSDBG11/RCLK0B/P5.11
OCDSDBG12/TDATA0/P5.12
OCDSDBG13/TVALID0B/P5.13
OCDSDBG14/TREADY0B/P5.14
OCDSDBG15/TCLK0/P5.15
N.C.
VSSAF
VDDAF
VDDMF
VSSMF
VFAREF
VFAGND
TC1163/TC1164
AN35
AN34
AN33
AN32
AN31
AN30
AN29
AN28
AN7
AN27
AN26
AN25
AN24
AN23
AN22
AN21
AN20
VDDP
VDD
98
97
96
95
94
93
92
91
P1.3/IN19/OUT19/OUT75
P1.11/IN27/IN51/SCLK1B/OUT27/OUT51
P1.10/IN26/IN50/OUT26/OUT50/SLSO17
P1.9/IN25/IN49/MRST1B/OUT25/OUT49
P1.8/IN24/IN48/MTSR1B/OUT24/OUT48
P1.2/IN18/OUT18/OUT74
P1.1/IN17/OUT17/OUT73
P1.0/IN16/OUT16/OUT72
90
89
P4.3/IN31/IN55/OUT31/OUT55/SYSCLK
N.C.
1) Not applicable to TC1163
TC1163/TC1164 Pinning
Figure 2-3
TC1163/TC1164 Pinning for PG-LQFP-176-2 Package
Data Sheet
8
V1.0, 2008-04
TC1163/TC1164
Preliminary
General Device Information
2.4
Pad Driver and Input Classes Overview
The TC1163/TC1164 provides different types and classes of input and output lines. For
understanding of the abbreviations in Table 2-2 starting at the next page, Table 2-1
gives an overview on the pad type and class types.
Table 2-1
Class
Pad Driver and Input Classes Overview
Power
Type
Sub Class
Speed
Grade
Termination
Supply
A
3.3V
LVTTL I/O, A1
6 MHz
No
LVTTL
outputs
(e.g. GPIO)
A2
(e.g. serial
I/Os)
40 MHz
Series termination
recommended
A3
80 MHz/ Yes, series
termination
(e.g. BRKIN,
BRKOUT)
A4
80 MHz
Yes, series
termination
(e.g.Trace Clock)
C
D
3.3V
LVDS
–
–
50 MHz
–
Parallel termination
–
Analog
input
Data Sheet
9
V1.0, 2008-04
TC1163/TC1164
Preliminary
General Device Information
2.5
Pin Definitions and Functions
Table 2-2 shows the TC1163/TC1164 pin definitions and functions.
Table 2-2
Symbol Pins I/O Pad
Driver Supply
Class
Pin Definitions and Functions
Power Functions
Parallel Ports
P0
I/O A1
VDDP
Port 0
Port 0 is a 16-bit bi-directional general-
purpose I/O port which can be alternatively
used for GPTA I/O lines or external trigger
inputs.
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
145
146
147
148
166
167
173
IN0 / OUT0 /
IN1 / OUT1 /
IN2 / OUT2 /
IN3 / OUT3 /
IN4 / OUT4 /
IN5 / OUT5 /
IN6 / OUT6 /
REQ2
IN7 / OUT7 /
REQ3
IN8 / OUT8 /
IN9 / OUT9 /
IN10 / OUT10 / OUT66 line of GPTA
IN11 / OUT11 / OUT67 line of GPTA
IN12 / OUT12 / OUT68 line of GPTA
IN13 / OUT13 / OUT69 line of GPTA
IN14 / OUT14 / OUT70 line of GPTA
OUT56 line of GPTA
OUT57 line of GPTA
OUT58 line of GPTA
OUT59 line of GPTA
OUT60 line of GPTA
OUT61 line of GPTA
OUT62 line of GPTA
External trigger input 2
OUT63 line of GPTA
External trigger input 3
OUT64 line of GPTA
OUT65 line of GPTA
P0.7
174
P0.8
P0.9
149
150
151
152
168
169
175
P0.10
P0.11
P0.12
P0.13
P0.14
REQ4
IN15 / OUT15 / OUT71 line of GPTA
REQ5 External trigger input 5
External trigger input 4
P0.15
176
In addition, the state of the port pins are
latched into the software configuration input
register SCU_SCLIR at the rising edge of
HDRST. Therefore, Port 0 pins can be used
for operating mode selections by software.
Data Sheet
10
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
P1
I/O
VDDP
Port 1
Port 1 is a 15-bit bi-directional general
purpose I/O port which can be alternatively
used for GPTA I/O lines, SSC1 and ADC0
interface.
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
P1.8
91
92
93
98
107
108
109
110
94
A1
A1
A1
A1
A1
A1
A1
A1
A2
IN16 / OUT16 / OUT72 line of GPTA
IN17 / OUT17 / OUT73 line of GPTA
IN18 / OUT18 / OUT74 line of GPTA
IN19 / OUT19 / OUT75 line of GPTA
IN20 / OUT20 / OUT76 line of GPTA
IN21 / OUT21 / OUT77 line of GPTA
IN22 / OUT22 / OUT78 line of GPTA
IN23 / OUT23 / OUT79 line of GPTA
IN24 / OUT24 / IN48 / OUT48 line of GPTA
MTSR1B
SSC1 master transmit
output / slave rec. input B
P1.9
95
A2
IN25 / OUT25 / IN49 / OUT49 line of GPTA
MRST1B
SSC1 master receive input /
slave transmit output B
P1.10
P1.11
P1.12
P1.13
P1.14
96
97
73
72
71
A2
A2
A1
A1
A1
IN26 / OUT26 / IN50 / OUT50 line of GPTA
SLSO17 SSC1 slave select output 7
IN27 / OUT27 / IN51 / OUT51 line of GPTA
SCLK1B
AD0EMUX0
SSC1 clock input / output B
ADC0 external multiplexer
control output 0
AD0EMUX1
AD0EMUX2
ADC0 external multiplexer
control output 1
ADC0 external multiplexer
control output 2
In addition, P1.4 also serves as emergency
shut-off input for certain I/O lines (e.g. GPTA
related outputs).
Data Sheet
11
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
P2
I/O
VDDP
Port 2
Port 2 is a 14-bit bi-directional general-
purpose I/O port which can be alternatively
used for GPTA I/O, and interface for MLI0,
MSC0 or SSC0/1.
P2.0
P2.1
74
75
A2
A2
TCLK0
MLI0 transmit channel clock
output A
IN32 / OUT32 line of GPTA
TREADY0A MLI0 transmit channel ready
input A
IN33 / OUT33 line of GPTA
SLSO03
SLSO13
TVALID0A
SSC0 slave select output 3
SSC1 slave select output 3
MLI0 transmit channel valid
output A
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
76
77
78
79
80
81
A2
A2
A1
A2
A1
A1
IN34 / OUT34 line of GPTA
TDATA0 MLI0 transmit channel data
output A
IN35 / OUT35 line of GPTA
RCLK0A MLI0 receive channel clock
input A
IN36 / OUT36 line of GPTA
RREADY0A MLI0 receive channel ready
output A
IN37 / OUT37 line of GPTA
RVALID0A MLI0 receive channel valid
input A
IN38 / OUT38 line of GPTA
RDATA0A MLI0 receive channel data
input A
IN39 / OUT39 line of GPTA
Data Sheet
12
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
P2.8
P2.9
164
160
A2
SLSO04
SLSO14
EN00
SLSO05
SLSO15
EN01
SSC0 Slave Select output 4
SSC1 Slave Select output 4
MSC0 enable output 0
SSC0 Slave Select output 5
SSC1 Slave Select output 5
MSC0 enable output 1
A2
P2.10
P2.11
P2.12
161
162
163
A2
A2
A2
MRST1A
SSC1 master receive input /
slave transmit output A
SSC1 clock input/output A
MSC0 clock output B
SSC1 master transmit out /
slave receive input A
SCLK1A
FCLP0B
MTSR1A
SOP0B
SLSI1
SDI0
MSC0 serial data output B
SSC1 slave select input
MSC0 serial data input
P2.13
165
A1
Data Sheet
13
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
P3
I/O
VDDP
Port 3
Port 3 is a 16-bit bi-directional general-
purpose I/O port which can be alternatively
used for ASC0/1, SSC0/1 and CAN lines.
P3.0
P3.1
136
135
A2
A2
RXD0A
TXD0A
ASC0 receiver inp./outp. A
ASC0 transmitter output A
This pin is sampled at the rising edge of
PORST. If this pin and the BYPASS input pin
are both active, then oscillator bypass mode is
entered.
P3.2
P3.3
129
130
A2
A2
SCLK0
MRST0
SSC0 clock input/output
SSC0 master receive input/
slave transmit output
P3.4
P3.5
P3.6
P3.7
132
126
127
131
A2
A2
A2
A2
MTSR0
SSC0 master transmit
output/slave receive input
SSC0 slave select output 0
SSC1 slave select output 0 2)
SSC0 slave select output 1
SSC1 slave select output 12)
SSC0 slave select input
SSC0 slave select output 2
SSC1 slave select output 2
SSC0 slave select output 6
ASC1 transmitter output A
ASC1 receiver inp./outp. A
External trigger input 0
SLSO00
SLSO10
SLSO01
SLSO11
SLSI0
SLSO02
SLSO12
SLSO06
TXD1A
P3.8
128
A2
P3.9
138
137
144
143
A2
A1
A1
A2
RXD1A
REQ0
P3.10
P3.11
P3.12
REQ1
External trigger input 1
RXDCAN01)
RXD0B
CAN node 0 receiver input
ASC0 receiver inp./outp. B
CAN node 0 transm. output
ASC0 transmitter output B
CAN node 1 receiver input
ASC1 receiver inp./outp. B
CAN node 1 transm. output
ASC1 transmitter output B
P3.13
P3.14
P3.15
142
134
133
A2
A2
A2
TXDCAN01)
TXD0B
RXDCAN11)
RXD1B
TXDCAN11)
TXD1B
Data Sheet
14
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
P4
I/O
VDDP
Port 4 / Hardware Configuration Inputs
P4.[3:0]
HWCFG[3:0]
Boot mode and boot location
inputs; inputs are latched
with the rising edge of
HDRST.
During normal operation, Port 4 pins may be
used as alternate functions for GPTA or
system clock output.
P4.0
P4.1
P4.2
P4.3
86
87
88
90
A1
A1
A2
A2
IN28 / OUT28 / IN52 / OUT52 line of GPTA
IN29 / OUT29 / IN53 / OUT53 line of GPTA
IN30 / OUT30 / IN54 / OUT54 line of GPTA
IN31 / OUT31 / IN55 / OUT55 line of GPTA
SYSCLK
System Clock Output
Data Sheet
15
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Class
I/O A2
Symbol Pins I/O Pad
P5
VDDP
Port 5
Port 5 is a 16-bit bi-directional general-
purpose I/O port. In emulation, it is used as a
trace port for OCDS Level 2 debug lines. In
normal operation, it is used for GPTA I/O or
the MLI0 interface.
P5.0
P5.1
P5.2
P5.3
P5.4
P5.5
1
2
3
4
5
6
OCDSDBG0
OCDS L2 Debug Line 0
(Pipeline Status Sig. PS0)
IN40 / OUT40 line of GPTA
OCDSDBG1 OCDS L2 Debug Line 1
(Pipeline Status Sig. PS1)
IN41 / OUT41 line of GPTA
OCDSDBG2 OCDS L2 Debug Line 2
(Pipeline Status Sig. PS2)
IN42 / OUT42 line of GPTA
OCDSDBG3 OCDS L2 Debug Line 3
(Pipeline Status Sig. PS3)
IN43 / OUT43 line of GPTA
OCDSDBG4 OCDS L2 Debug Line 4
(Pipeline Status Sig. PS4)
IN44 / OUT44 line of GPTA
OCDSDBG5 OCDS L2 Debug Line 5
(Break Qualification Line
BRK0)
IN45 / OUT45 line of GPTA
OCDSDBG6 OCDS L2 Debug Line 6
(Break Qualification Line
BRK1)
IN46 / OUT46 line of GPTA
OCDSDBG7 OCDS L2 Debug Line 7
P5.6
P5.7
7
8
(Break Qualification Line
BRK2)
IN47 / OUT47 line of GPTA
Data Sheet
16
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Class
Symbol Pins I/O Pad
P5.8
13
14
15
16
17
18
19
20
OCDSDBG8
OCDS L2 Debug Line 8
(Indirect PC Addr. PC0)
MLI0 receive channel data
input B
OCDS L2 Debug Line 9
(Indirect PC Addr. PC1)
MLI0 receive channel valid
input B
RDATA0B
P5.9
OCDSDBG9
RVALID0B
P5.10
P5.11
P5.12
P5.13
P5.14
P5.15
OCDSDBG10 OCDS L2 Debug Line 10
(Indirect PC Addr. PC2)
RREADY0B
MLI0 receive channel ready
output B
OCDSDBG11 OCDS L2 Debug Line 11
(Indirect PC Addr. PC3)
RCLK0B
MLI0 receive channel clock
input B
OCDSDBG12 OCDS L2 Debug Line 12
(Indirect PC Addr. PC04)
TDATA0
MLI0 transmit channel data
output B
OCDSDBG13 OCDS L2 Debug Line 13
(Indirect PC Addr. PC05)
TVALID0B
MLI0 transmit channel valid
output B
OCDSDBG14 OCDS L2 Debug Line 14
(Indirect PC Address PC6)
TREADY0B
MLI0 transmit channel ready
input B
OCDSDBG15 OCDS L2 Debug Line 15
(Indirect PC Address PC7)
TCLK0
MLI0 transmit channel clock
output B
Data Sheet
17
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
MSC0 Outputs
C
VDDP
LVDS MSC Clock and Data Outputs4)
MSC0 Differential Driver Clock Output
Positive A
FCLP0A 157 O
FCLN0
156 O
MSC0 Differential Driver Clock Output
Negative
SOP0A 159 O
MSC0 Differential Driver Serial Data Output
Positive A
SON0
158 O
MSC0 Differential Driver Serial Data Output
Negative
Data Sheet
18
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
Analog Inputs
AN[35:0]
I
D
–
Analog Input Port
The Analog Input Port provides altogether 36
analog input lines to ADC0 and FADC.
AN[31:0]: ADC0 analog inputs [31:0]
AN[35:32]: FADC analog differential inputs
Analog input 0
Analog input 1
Analog input 2
Analog input 3
Analog input 4
Analog input 5
Analog input 6
Analog input 7
Analog input 8
Analog input 9
Analog input 10
Analog input 11
Analog input 12
Analog input 13
Analog input 14
Analog input 15
Analog input 16
Analog input 17
Analog input 18
Analog input 19
Analog input 20
Analog input 21
Analog input 22
Analog input 23
Analog input 24
Analog input 25
Analog input 26
Analog input 27
Analog input 28
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
67
66
65
64
63
62
61
36
60
59
58
57
56
55
50
49
48
47
46
45
44
43
42
41
40
39
38
37
35
34
33
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
AN16
AN17
AN18
AN19
AN20
AN21
AN22
AN23
AN24
AN25
AN26
AN27
AN28
AN29
AN30
Analog input 29
Analog input 30
Data Sheet
19
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
AN31
AN32
AN33
AN34
AN35
32
31
30
29
28
I
D
–
Analog input 31
Analog input 32
Analog input 33
Analog input 34
Analog input 35
System I/O
TRST
TCK
114 I
115 I
111 I
113 O
112 I
A23)
A23)
A13)
A2
VDDP
VDDP
VDDP
VDDP
VDDP
VDDP
VDDP
JTAG Module Reset/Enable Input
JTAG Module Clock Input
TDI
JTAG Module Serial Data Input
TDO
TMS
BRKIN
JTAG Module Serial Data Output
JTAG Module State Machine Control Input
OCDS Break Input (Alternate Output)4)5)
OCDS Break Output (Alternate Input)4)5)
A23)
117 I/O A3
116 I/O A3
BRK
OUT
TRCLK
9
O
A4
VDDP
Trace Clock for OCDS_L2 Lines4)
Non-Maskable Interrupt Input
NMI
120 I
A26)7) VDDP
HDRST 122 I/O A28)
VDDP
Hardware Reset Input /
Reset Indication Output
PORST 121 I
A26)7) VDDP
A13)
VDDP
Power-on Reset Input
9)
BYPASS 119 I
PLL Clock Bypass Select Input
This input has to be held stable during power-
on resets. With BYPASS = 1, the spike filters
in the HDRST, PORST and NMI inputs are
switched off.
TEST
118 I
A26)10) VDDP
Test Mode Select Input
MODE
For normal operation of the TC1163/TC1164,
this pin should be connected to high level.
XTAL1
XTAL2
102 I
103 O
n.a.
VDDOSC Oscillator/PLL/Clock Generator
Input/Output Pins
Data Sheet
20
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
N.C.
21,
89
–
–
–
Not Connected
These pins are reserved for future extension
and must not be connected externally.
Power Supplies
VDDM
VSSM
54
53
24
25
23
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
ADC Analog Part Power Supply (3.3 V)
ADC Analog Part Ground for VDDM
FADC Analog Part Power Supply (3.3 V)
FADC Analog Part Ground for VDDMF
VDDMF
VSSMF
VDDAF
FADC Analog Part Logic Power Supply
(1.5 V)
VSSAF
22
52
51
26
27
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
FADC Analog Part Logic Ground for VDDAF
ADC Reference Voltage
VAREF0
VAGND0
VFAREF
VFAGND
VDDOSC
ADC Reference Ground
FADC Reference Voltage
FADC Reference Ground
105 –
Main Oscillator and PLL Power Supply
(1.5 V)
VDDOSC3 106 –
–
–
–
–
–
–
–
–
Main Oscillator Power Supply (3.3 V)
Main Oscillator and PLL Ground
Power Supply for Flash (3.3 V)
Core Power Supply (1.5 V)
VSSOSC
VDDFL3
VDD
104 –
141 –
10,
–
68,
84,
99,
123,
153,
170
Data Sheet
21
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 2-2
General Device Information
Pin Definitions and Functions (cont’d)
Power Functions
Driver Supply
Symbol Pins I/O Pad
Class
VDDP
11,
–
–
–
Port Power Supply (3.3 V)
69,
83,
100,
124,
154,
171,
139
VSS
12,
–
–
–
Ground
70,
85,
101,
125,
155,
172,
140,
82
1) Not applicable to TC1163
2) The logical AND function of the two slave select outputs is available as a third alternate output function.
3) These pads are I/O pads with input only function. Its input characteristics are identical with the input
characteristics as defined for class A pads.
4) In case of a power-fail condition (one or more power supply voltages drop below the specified voltage range),
an undefined output driving level may occur at these pins.
5) Programmed by software as either break input or break output.
6) These pads are input only pads with input characteristics.
7) Input only pads with input spike filter.
8) Open drain pad with input spike filter.
9) The dual input reset system of TC1163/TC1164 assumes that the PORST reset pin is used for power on reset
only.
10) Input only pads without input spike filter.
Data Sheet
22
V1.0, 2008-04
TC1163/TC1164
Preliminary
General Device Information
Table 2-3
List of Pull-up/Pull-down Reset Behavior of the Pins
Pins
PORST = 0
Pull-up
PORST = 1
All GPIOs, TDI, TMS, TDO
HDRST
Drive-low
Pull-up
BYPASS
Pull-up
High-impedance
Pull-down
TRST, TCK
TRCLK
High-impedance
High-impedance
BRKIN, BRKOUT, TESTMODE Pull-up
NMI, PORST
Pull-down
Data Sheet
23
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3
Functional Description
Chapter 3 provides an overview of the TC1163/TC1164 functional description.
3.1
System Architecture and On-Chip Bus Systems
The TC1163/TC1164 has two independent on-chip buses (see also TC1163/TC1164
block diagram on Page 2-6):
• Local Memory Bus (LMB)
• System Peripheral Bus (SPB)
The LMB Bus connects the CPU local resources for data and instruction fetch. The Local
Memory Bus interconnects the memory units and functional units, such as CPU and
PMU. The main target of the LMB bus is to support devices with fast response times,
optimized for speed. This allows the DMI and PMI fast access to local memory and
reduces load on the FPI bus. The Tricore system itself is located on LMB bus.
The Local Memory Bus is a synchronous, pipelined, split bus with variable block size
transfer support. It supports 8-, 16-, 32- and 64-bit single transactions and variable
length 64-bit block transfers.
The SPB Bus is mainly governed by the PCP and is accessible to the CPU via the LMB
Bus bridge. The System Peripheral Bus (SPB Bus) in TC1163/TC1164 is an on-chip FPI
Bus. The FPI Bus interconnects the functional units of the TC1163/TC1164, such as the
DMA and on-chip peripheral components. The FPI Bus is designed to be quick to be
acquired by on-chip functional units, and quick to transfer data. The low setup overhead
of the FPI Bus access protocol guarantees fast FPI Bus acquisition, which is required for
time-critical applications.The FPI Bus is designed to sustain high transfer rates. For
example, a peak transfer rate of up to 320 Mbyte/s can be achieved with a 80 MHz bus
clock and 32-bit data bus. Multiple data transfers per bus arbitration cycle allow the FPI
Bus to operate at close to its peak bandwidth.
Both the LMB Bus and the SPB Bus runs at full CPU speed. The maximum CPU speed
is 80 MHz.
Additionally, two simplified bus interfaces are connected to and controlled by the DMA
Controller:
• DMA Bus
• SMIF Interface
Data Sheet
24
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.2
On-Chip Memories
As shown in the TC1163/TC1164 block diagram on Page 2-6, some of the
TC1163/TC1164 units provide on-chip memories that are used as program or data
memory.
• Program memory in PMU
– 16 Kbyte Boot ROM (BROM)
– 1024 Kbyte Program Flash (PFlash)
• Program memory in PMI
– 8 Kbyte Scratch-Pad RAM (SPRAM)
– 8 Kbyte Instruction Cache (ICACHE)
• Data memory in PMU
– 16 Kbyte Data Flash (DFlash)
– 8 Kbyte Overlay RAM (OVRAM)
• Data memory in DMI
– 40 Kbyte Local Data RAM (LDRAM)
• Memory of PCP2
– 12 Kbyte Code Memory (CMEM) with parity error protection
– 8 Kbyte Parameter RAM (PRAM) with parity error protection
• On-chip SRAM with parity error protection
Features of Program Flash
• 1024 Kbyte on-chip program Flash memory
• Usable for instruction code or constant data storage
• 256-byte program interface
– 256 bytes are programmed into PFLASH page in one step/command
• 256-bit read interface
– Transfer from PFLASH to CPU/PMI by four 64-bit single cycle burst transfers
• Dynamic correction of single-bit errors during read access
• Detection of double-bit errors
• Fixed sector architecture
– Eight 16 Kbyte, one 128 Kbyte, one 256 Kbyte and one 512 Kbyte sectors
– Each sector separately erasable
– Each sector separately write-protectable
• Configurable read protection for complete PFLASH with sophisticated read access
supervision, combined with write protection for complete PFLASH (protection against
“Trojan horse” software)
• Configurable write protection for each sector
– Each sector separately write-protectable
– With capability to be re-programmed
– With capability to be locked forever (OTP)
• Password mechanism for temporary disabling of write and read protection
• On-chip generation of programming voltage
Data Sheet
25
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
• JEDEC-standard based command sequences for PFLASH control
– Write state machine controls programming and erase operations
– Status and error reporting by status flags and interrupt
• Margin check for detection of problematic PFLASH bits
Features of Data Flash
• 16 Kbyte on-chip data Flash memory, organized in two 8 Kbyte banks
• Usable for data storage with EEPROM functionality
• 128 Byte of program interface
– 128 bytes are programmed into one DFLASH page by one step/command
• 64-bit read interface (no burst transfers)
• Dynamic correction of single-bit errors during read access
• Detection of double-bit errors
• Fixed sector architecture
– Two 8 Kbyte banks/sectors
– Each sector separately erasable
• Configurable read protection (combined with write protection) for complete DFLASH
together with PFLASH read protection
• Password mechanism for temporary disabling of write and read protection
• Erasing/programming of one bank possible while reading data from the other bank
• Programming of one bank while erasing the other bank possible
• On-chip generation of programming voltage
• JEDEC-standard based command sequences for DFLASH control
– Write state machine controls programming and erase operations
– Status and error reporting by status flags and interrupt
• Margin check for detection of problematic DFLASH bits
Data Sheet
26
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.3
Memory Maps
This chapter gives an overview of the TC1163/TC1164 memory map and describes the
address locations and access possibilities for the units, memories, and reserved areas
as “seen” from different on-chip buses’ (SPB and LMB) point of view.
3.3.1
Architectural Address Map
Table 3-1 shows the overall architectural address map as defined for the TriCore and as
implemented in TC1163/TC1164.
Table 3-1
TC1163/TC1164 Architectural Address Map
Seg-
Contents
Size
Description
ment
0-7
Global
8 x 256
Mbyte
Reserved (MMU space); cached
8
Global
Memory
256 Mbyte Reserved (246 Mbyte); PMU, Boot ROM;
cached
9
Global
256 Mbyte FPI space; cached
Memory
10
11
12
13
Global
Memory
256 Mbyte Reserved (246 Mbyte), PMU, Boot ROM; non-
cached
Global
Memory
256 Mbyte FPI space; non-cached
Local LMB
Memory
256 Mbyte Reserved; bottom 4 Mbyte visible from FPI bus
in segment 14; cached
DMI
64 Mbyte
64 Mbyte
96 Mbyte
16 Mbyte
16 Mbyte
Local Data Memory RAM; non-cached
Local Code Memory RAM; non-cached
Reserved; non-cached
PMI
EXT_PER
EXT_EMU
BOOTROM
Reserved; non-cached
Boot ROM space, Boot ROM mirror;
non-cached
Data Sheet
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V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-1
Functional Description
TC1163/TC1164 Architectural Address Map (cont’d)
Contents Size Description
Seg-
ment
14
EXTPER
128 Mbyte Reserved;
non-speculative; non-cached; no execution
CPU[0 ..15]
16 x 8
Non-speculative; non-cached; no execution
image region Mbyte
15
LMB_PER
CSFRs
INT_PER
256
Mbyte
CSFRs of CPUs[0 ..15];
LMB & FPI Peripheral Space;
non-speculative; non-cached;
no execution
Data Sheet
28
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.3.2
How to Read the Address Maps
The bus-specific address maps describe how the different bus master devices react on
accesses to on-chip memories and modules, and which address ranges are valid or
invalid for the corresponding buses.
The FPI Bus address map shows the system addresses from the point of view of the
SPB master agents. SPB master agents are PCP2 and OCDS, and DMA.
The LMB address map shows the system addresses from the point of view of the LMB
master agents. LMB master agents are PMI and DMI.
Table 3-2 defines the acronyms and other terms that are used in the address maps
(Table 3-3 to Table 3-5).
Table 3-2
Term
Definition of Acronyms and Terms
Description
…BE
Means “Bus error” generation.
…BET
SPBBE
SPBBET
Means “Bus error & trap” generation.
A bus access is terminated with a bus error on the SPB.
A bus access is terminated with a bus error on the SPB and a DSE
trap (read access) or DAE trap (write access).
LMBBE
A bus access is terminated with a bus error on the LMB.
LMBBET
A bus access is terminated with a bus error on the LMB and a DSE
trap (read access) or DAE trap (write access).
access
ignore
A bus access is allowed and is executed.
A bus access is ignored and is not executed. No bus error is
generated.
trap
32
A DSE trap (read access) or DAE trap (write access) is generated.
Only 32-bit word bus accesses are permitted to that
register/address range.
nE
A bus access generates no bus error, although the bus access
points to an undefined address or address range. This is valid e.g.
for CPU accesses (MTCR/MFCR) to undefined addresses in the
CSFR range.
Data Sheet
29
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.3.3
Contents of the Segments
This section summarizes the contents of the segments.
Segments 0-7
These segments are reserved segments in the TC1163/TC1164.
Segment 8
From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows
accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM).
From the CPU point of view (PMI and DMI), this memory segment allows cached
accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM).
Segment 9
This memory segment is reserved in the TC1163/TC1164.
Segment 10
From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows
accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM).
From the CPU point of view (PMI and DMI), this memory segment allows non-cached
accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM).
Segment 11
This memory segment is reserved in the TC1163/TC1164.
Segment 12
From the SPB point of view (PCP, DMA, and Cerberus), this memory segment is
reserved in the TC1163/TC1164.
From the CPU point of view (PMI and DMI), this memory segment allows cached
accesses to the PMU memory, OVRAM.
Segment 13
From the SPB point of view (PCP, DMA and Cerberus), this memory segment is
reserved in the TC1163/TC1164.
From the CPU point of view (PMI and DMI), this memory segment allows non-cached
accesses to the PMI scratch-pad RAM, read access to the boot ROM and test ROM
(BROM and TROM) and the DMI memories (LDRAM).
Data Sheet
30
V1.0, 2008-04
TC1163/TC1164
Preliminary
Segment 14
Functional Description
From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows
accesses to the PMU Overlay memory (OVRAM), the DMI Local Data RAM (LDRAM),
and the PMI scratch-pad RAM (SPRAM).
From the CPU point of view (PMI and DMI), this memory segment is reserved in the
TC1163/TC1164.
Segment 15
From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows
accesses to all SFRs and CSFRs, the PCP memories, and the MLI transfer windows.
From the CPU point of view (PMI and DMI), this memory segment allows accesses to all
SFRs and CSFRs, the PCP memories, and the MLI transfer windows.
Data Sheet
31
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.3.4
Address Map of the FPI Bus System
Table 3-3 and Table 3-4 shows the address maps of the FPI Bus System.
3.3.4.1 Segments 0 to 14
Table 3-3 shows the address maps of segments 0 to 14 as it is seen from the SPB bus
masters PCP, DMA and OCDS.
Table 3-3
SPB Address Map of Segment 0 to 14
Seg- Address
ment Range
Size
Description
Access Type
Read
Write
0-7
0000 0000H - 8 byte
0000 0007H
Reserved (virtual address MPN trap
space)
MPN trap
0000 0008H - 8 × 256
SPBBE
SPBBE
7FFF FFFFH
Mbyte
Data Sheet
32
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-3
Functional Description
SPB Address Map of Segment 0 to 14 (cont’d)
Seg- Address
ment Range
Size
Description
Access Type
Read
Write
8
8000 0000H - 1 Mbyte Program Flash (PFLASH) access
800F FFFFH
access1)
8010 0000H -
8017 7FFFH
≈ 0.5
Mbyte
Reserved
access2)
access1)2)
8017 8000H -
807F FFFFH
6.5 Mbyte Reserved
LMBBE & LMBBE
SPBBE
8080 0000H - 246
8FDF FFFFH Mbyte
Reserved
LMBBE & LMBBE
SPBBE
8FE0 0000H -
8FE0 1FFFH
8 Kbyte
8 Kbyte
Data Flash (DFLASH)
Bank 0
access
access1)
8FE0 2000H -
8FE0 3FFFH
Reserved
access2)
access1)2)
8FE0 4000H -
8FE0 FFFFH
48 Kbyte Reserved
LMBBE & LMBBE
SPBBE
8FE1 0000H -
8FE1 1FFFH
8 Kbyte
8 Kbyte
Data Flash (DFLASH)
Bank 1
access
access1)
8FE1 2000H -
8FE1 3FFFH
Reserved
access2)
access1)2)
8FE1 4000H -
8FF1 FFFFH
1 Mbyte Reserved
LMBBE & LMBBE
SPBBE
8FF2 0000H - 256
Reserved
Reserved
8FF5 FFFFH
Kbyte
8FF6 0000H - 624
8FFF BFFFH
Kbyte
8FFF C000H - 16 Kbyte Boot ROM (BROM)
8FFF FFFFH
access
9
9000 0000H - 256
9FFF FFFFH Mbyte
Reserved
SPBBE
SPBBE
Data Sheet
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V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-3
Functional Description
SPB Address Map of Segment 0 to 14 (cont’d)
Seg- Address
ment Range
Size
Description
Access Type
Read
Write
10
A000 0000H - 1 Mbyte Program Flash (PFLASH) access
A00F FFFFH
access1)
A010 0000H -
A017 FFFFH
≈ 0.5
Mbyte
Reserved
access2)
access1)2)
A017 8000H -
A07F FFFFH
6.5 Mbyte Reserved
LMBBE & LMBBE
SPBBE
A080 0000H - 246
AFDF FFFFH Mbyte
Reserved
LMBBE & LMBBE
SPBBE
AFE0 0000H - 8 Kbyte
AFE0 1FFFH
Data Flash (DFLASH)
Bank 0
access
access1)
AFE0 2000H - 8 Kbyte
AFE0 3FFFH
Reserved
access2)
access1)2)
AFE0 4000H - 48 Kbyte Reserved
AFE0 FFFFH
LMBBE & LMBBE
SPBBE
AFE1 0000H - 8 Kbyte
AFE1 1FFFH
Data Flash (DFLASH)
Bank 1
access
access1)
AFE1 2000H - 8 Kbyte
AFE1 3FFFH
Reserved
access2)
access1)2)
AFE1 4000H - 1 Mbyte Reserved
AFF1 FFFFH
LMBBE & ignore
SPBBE
AFF2 0000H - 256
Reserved
AFF5 FFFFH
Kbyte
AFF6 0000H - 624
Reserved
AFFF BFFFH Kbyte
AFFF C000H - 16 Kbyte Boot ROM (BROM)
AFFF FFFFH
access
11
12
B000 0000H - 256
BFFF FFFFH Mbyte
Reserved
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
C000 0000H - 8 Kbyte
C000 1FFFH
Overlay memory
(OVRAM)
C000 2000H - ≈ 256
Reserved
CFFF FFFFH Mbyte
Data Sheet
34
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-3
Functional Description
SPB Address Map of Segment 0 to 14 (cont’d)
Seg- Address
ment Range
Size
Description
Access Type
Read
Write
13
D000 0000H - 40 Kbyte DMI Local Data RAM
SPBBE
SPBBE
D000 9FFFH
(LDRAM)
D000 A000H - ≈ 64
Reserved
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
D3FF FFFFH
Mbyte
D400 0000H -
D400 1FFFH
8 Kbyte
PMI Scratch-Pad RAM
(SPRAM)
D400 2000H -
D7FF FFFFH
≈ 64
Mbyte
Reserved
D800 0000H - 112
DEFF FFFFH Mbyte
Reserved
DF00 0000H - ≈ 16
DFFF FFEFH Mbyte
Reserved (for Boot Rom) SPBBE
microROM SPBBE
DFFF FFF0H - 16 byte
DFFF FFFFH
Data Sheet
35
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-3
Functional Description
SPB Address Map of Segment 0 to 14 (cont’d)
Seg- Address
ment Range
Size
Description
Access Type
Read
Write
14
E000 0000H - 128 MB
E7FF FFFFH
Reserved
LMBBE
LMBBE
E800 0000H - 8 Kbyte
E800 1FFFH
Overlay memory
(OVRAM)
access
LMBBE
access
access2)
LMBBE
access
access2)
LMBBE
LMBBE
access
LMBBE
access
access2)
LMBBE
access
access2)
LMBBE
LMBBE
E800 2000H - ≈ 4
Reserved
E83F FFFFH
Mbyte
E840 0000H -
E840 9FFFH
40 Kbyte DMI Local Data RAM
(LDRAM)
E840 A000H - 16 Kbyte Reserved
E840 DFFFH
E840 E000H - ≈ 1 Mbyte Reserved
E84F FFFFH
E850 0000H -
E850 1FFFH
8 Kbyte
8 Kbyte
PMI Scratch-Pad RAM
(SPRAM)
E850 2000H -
E850 3FFFH
Reserved
E850 4000H -
E85F FFFFH
≈ 1 Mbyte Reserved
E860 C000H - ≈ 122
Reserved
EFFF FFFFH Mbyte
15
F000 0000H - 256
see Table 3-4
FFFF FFFFH
Mbyte
1) Only applicable when writing Flash command sequences.
2) Read and write accesses to this address range will not generate any traps.
Data Sheet
36
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.3.4.2 Segment 15
Table 3-4 shows the address map of segment 15 as seen from the SPB bus masters
PCP, DMA and OCDS. Please note that access in Table 3-4 means only that an access
to an address within the defined address range is not automatically incorrect or ignored.
If an access is really addressing a correct address, it can be found in the detailed tables
in the TC116x User’s Manual, Register Overview’s chapter.
Table 3-4
Unit
SPB Address Map of Segment 15
Address
Range
Size
Access Type
Read
Write
System Control Unit (SCU) and
Watchdog Timer (WDT)
F000 0000H - 256
access
access
access
SPBBE
access
SPBBE
access
SPBBE
access
access
access
access
access
access
F000 00FFH
byte
System Peripheral Bus Control Unit F000 0100H - 256
(SBCU)
access
access
SPBBE
access
SPBBE
access
SPBBE
access
access
access
access
access
F000 01FFH
byte
System Timer (STM)
F000 0200H - 256
F000 02FFH
byte
–
Reserved
F000 0300H -
F000 03FFH
On-Chip Debug Support (Cerberus) F000 0400H - 256
F000 04FFH
byte
Reserved
F000 0500H -
F000 07FFH
–
MicroSecond Bus Controller 0
(MSC0)
F000 0800H - 256
F000 08FFH
byte
Reserved
F000 0900H -
F000 09FFH
–
Async./Sync. Serial Interface 0
(ASC0)
F000 0A00H - 256
F000 0AFFH byte
F000 0B00H - 256
F000 0BFFH byte
F000 0C00H - 256
F000 0CFFH byte
F000 0D00H - 256
F000 0DFFH byte
F000 0E00H - 256
Async./Sync. Serial Interface 1
(ASC1)
Port 0
Port 1
Port 2
F000 0EFFH
byte
Data Sheet
37
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Table 3-4
Unit
SPB Address Map of Segment 15 (cont’d)
Address
Range
Size
Access Type
Read
Write
Port 3
F000 0F00H - 256
F000 0FFFH byte
F000 1000H - 256
F000 10FFH byte
F000 1100H - 256
access
access
Port 4
access
access
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
access
access
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
SPBBE
access
SPBBE
SPBBE
SPBBE
access
SPBBE
access1)
Port 5
F000 11FFH
byte
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
F000 1200H -
F000 12FFH
–
F000 1300H -
F000 13FFH
–
–
–
–
–
F000 1400H -
F000 14FFH
F000 1500H -
F000 15FFH
F000 1600H -
F000 16FFH
F000 1700H -
F000 17FFH
General Purpose Timer Array 0
(GPTA0)
F000 1800H - 8 × 256 access
F000 1FFFH
byte
Reserved
Reserved
Reserved
F000 2000H -
F000 27FFH
–
SPBBE
SPBBE
SPBBE
F000 2800H -
F000 2FFFH
–
–
F000 3000H -
F000 3BFFH
Direct Memory Access Controller
(DMA)
F000 3C00H - 3 × 256 access
F000 3EFFH byte
Reserved
F000 3F00H - –
F000 3FFFH
F000 4000H - 8 Kbyte access1)
F000 5FFFH
SPBBE
MultiCAN Controller (CAN)
Data Sheet
38
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Table 3-4
Unit
SPB Address Map of Segment 15 (cont’d)
Address
Range
Size
Access Type
Read
Write
Reserved
F000 6000H -
F003 FFFFH
–
–
SPBBE
SPBBE
Reserved
F004 0000H -
F004 3EFFH
SPBBE
access
SPBBE
SPBBE
access
SPBBE
nE, 32
PCP Registers
Reserved
F004 3F00H - 256
F004 3FFFH
byte
F004 4000H -
F004 FFFFH
–
PCP Data Memory (PRAM)
Reserved
F005 0000H - 8 Kbyte nE, 32
F005 1FFFH
F005 2000H -
F005 FFFFH
–
SPBBE
SPBBE
nE, 32
PCP Code Memory (PCODE)
Reserved
F006 0000H - 12
F006 2FFFH
nE, 32
Kbyte
F006 3000H -
F007 FFFFH
–
–
–
SPBBE
SPBBE
SPBBE
access
access
access
SPBBE
SPBBE
SPBBE
access
access
access
access
SPBBE
SPBBE
Reserved
F008 0000H -
F00F FFFFH
Reserved
F010 0000H -
F010 00FFH
Synchronous Serial Interface 0
(SSC0)
F010 0100H - 256
F010 01FFH byte
F010 0200H - 256
F010 02FFH byte
F010 0300H - 256
F010 03FFH byte
F010 0400H - 2 × 256 access
Synchronous Serial Interface 1
(SSC1)
Fast Analog-to-Digital Converter
(FADC)
Analog-to-Digital Converter 0
(ADC0)
F010 05FFH
byte
Reserved
F010 0600H -
F010 07FFH
–
SPBBE
SPBBE
Reserved
F010 0800H -
F010 9FFFH
–
Data Sheet
39
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Table 3-4
Unit
SPB Address Map of Segment 15 (cont’d)
Address
Range
Size
Access Type
Read
Write
Reserved
F010 A000H - –
F010 BFFFH
SPBBE
SPBBE
Micro Link Interface 0 (MLI0)
Reserved
F010 C000H - 256
access
access2)
access
SPBBE
access
access2)
SPBBE
access
access2)
SPBBE
access
access
SPBBE
SPBBE
access
access2)
access
SPBBE
access
access2)
SPBBE
access
access2)
SPBBE
access
access
SPBBE
SPBBE
LMBBE
F010 C0FFH
F010 C100H - 256
F010 C1FFH byte
F010 C200H - 256
F010 C2FFH byte
byte
Memory Checker (MCHK)
Reserved
F010 C300H - –
F01D FFFFH
MLI0 Small Transfer Windows
Reserved
F01E 0000H - 4 × 8
F01E 7FFFH
F01E 8000H - 4 × 8
F01E FFFFH Kbyte
Kbyte
Reserved
F01F 0000H - –
F01F FFFFH
MLI0 Large Transfer Windows
Reserved
F020 0000H - 4 × 64
F023FFFFH
Kbyte
F024 0000H - 4 × 64
F027 FFFFH
Kbyte
–
Reserved
F028 0000H -
F7E0 FEFFH
CPU
CPU Slave Interface
Registers (CPS)
F7E0 FF00H - 256
F7E0 FFFFH byte
CPU Core SFRs & GPRs F7E1 0000H - 64
F7E1 FFFFH
Kbyte
Reserved
Reserved
Reserved
F7E2 0000H - –
F7FF FFFFH
F800 0000H -
F800 03FFH
–
F800 0400H -
F800 04FFH
–
LMBBE &
SPBBE
Data Sheet
40
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Table 3-4
Unit
SPB Address Map of Segment 15 (cont’d)
Address
Range
Size
Access Type
Read
Write
Program Memory Unit (PMU)
Reserved
F800 0500H - 256
access
access
F800 05FFH
byte
F800 0600H -
F800 0FFFH
–
LMBBE &
SPBBE
LMBBE
access
LMBBE
LMBBE
LMBBE
LMBBE
LMBBE
access
access
access
access
LMBBE
Flash Register
Reserved
F800 1000H - 5 Kbyte access
F800 23FFH
F800 2400H -
F801 00FFH
–
–
–
LMBBE &
SPBBE
Reserved
F801 0100H -
F801 01FFH
LMBBE &
SPBBE
Reserved
F801 0200H -
F87F F9FFH
LMBBE &
SPBBE
Reserved
F87F FA00H - –
F87F FAFFH
LMBBE &
SPBBE
Reserved
F87F FB00H - –
F87F FBFFH
LMBBE &
SPBBE
CPU
DMI Registers
PMI Registers
F87F FC00H - 256
F87F FCFFH byte
access
access
access
access
F87F FD00H - 256
F87F FDFFH byte
Local Memory Bus Control Unit
(LBCU)
F87F FE00H - 256
F87F FEFFH
byte
LFI Bridge
F87F FF00H - 256
F87F FFFFH
byte
–
Reserved
F880 0000H -
FFFF FFFFH
LMBBE &
SPBBE
1) For TC1163, read and write accesses to this address range will not generate any traps.
2) Read and write accesses to this address range will not generate any traps.
Data Sheet
41
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.3.5
Address Map of the Local Memory Bus (LMB)
Table 3-5 shows the address map as seen from the LMB bus masters (PMI and DMI).
Table 3-5 LMB Address Map
Seg- Address
ment Range
Size
Description
Action
Write
Read
0-71) 0000 0000H - 8 byte
0000 0007H
Reserved (virtual address MPN trap MPN trap
space)
0000 0008H - 8 × 256
SPBBET
SPBBE
7FFF FFFFH Mbyte
81)
8000 0000H - 1 Mbyte
800F FFFFH
Program Flash (PFLASH) access
access2)
access2)3)
LMBBET
LMBBET
access2)
access2)3)
LMBBET
access2)
access2)3)
LMBBET
8010 0000H -
8017 7FFFH
≈ 0.5
Mbyte
Reserved
access3)
LMBBET
LMBBET
access
8017 8000H -
807F FFFFH
6.5 Mbyte Reserved
8080 0000H - 246
8FDF FFFFH Mbyte
Reserved
8FE0 0000H - 8 Kbyte
8FE0 1FFFH
Data Flash (DFLASH)
Bank 0
8FE0 2000H - 8 Kbyte
8FE0 3FFFH
Reserved
access3)
LMBBET
access
8FE0 4000H - 48 Kbyte Reserved
8FE0 FFFFH
8FE1 0000H - 8 Kbyte
8FE1 1FFFH
Data Flash (DFLASH)
Bank 1
8FE1 2000H - 8 Kbyte
8FE1 3FFFH
Reserved
access3)
LMBBET
8FE1 4000H - 1 Mbyte
8FF1 FFFFH
Reserved
8FF2 0000H - 256 Kbyte Reserved
8FF5 FFFFH
8FF6 0000H - 624 Kbyte Reserved
8FFF BFFFH
8FFF C000H - 16 Kbyte Boot ROM (BROM)
8FFF FFFFH
access
Data Sheet
42
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-5
Functional Description
LMB Address Map (cont’d)
Seg- Address
ment Range
Size
Description
Action
Read
Write
91)
9000 0000H - 256
Reserved
SPBBET
SPBBE
9FFF FFFFH Mbyte
104)
A000 0000H - 1 Mbyte
A00F FFFFH
Program Flash (PFLASH) access
access2)
access2)3)
LMBBET
LMBBET
access2)
access2)3)
LMBBET
access2)
access2)3)
LMBBET
A010 0000H - ≈ 0.5
Reserved
access3)
LMBBET
LMBBET
access
A017 FFFFH
Mbyte
A017 8000H - 6.5 Mbyte Reserved
A07F FFFFH
A080 0000H - 246
AFDF FFFFH Mbyte
Reserved
AFE0 0000H - 8 Kbyte
AFE0 1FFFH
Data Flash (DFLASH)
Bank 0
AFE0 2000H - 8 Kbyte
AFE0 3FFFH
Reserved
access3)
LMBBET
access
AFE0 4000H - 48 Kbyte Reserved
AFE0 FFFFH
AFE1 0000H - 8 Kbyte
AFE1 1FFFH
Data Flash (DFLASH)
Bank 1
AFE1 2000H - 8 Kbyte
AFE1 3FFFH
Reserved
access3)
LMBBET
AFE1 4000H - 1 Mbyte
AFF1 FFFFH
Reserved
AFF2 0000H - 256 Kbyte Reserved
AFF5 FFFFH
AFF6 0000H - 624 Kbyte Reserved
AFFF BFFFH
AFFF C000H - 16 Kbyte Boot ROM (BROM)
AFFF FFFFH
access
114)
B000 0000H - 256
Reserved
SPBBET
SPBBE
BFFF FFFFH Mbyte
Data Sheet
43
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-5
Functional Description
LMB Address Map (cont’d)
Seg- Address
ment Range
Size
Description
Action
Read
Write
121)
C000 0000H - 8 Kbyte
C000 1FFFH
Overlay memory
(OVRAM)
access
access
C000 2000H - 256
Reserved
LMBBET
LMBBET
CFFF FFFFH Mbyte
134)
D000 0000H - 40 Kbyte DMI Local Data RAM
D000 9FFFH (LDRAM)
access
SPBBE
access
SPBBE
D000 A000H - 16 Kbyte Reserved
D000 DFFFH
access
access
SPBBE5)
SPBBE5)
D000 E000H - 64 Mbyte Reserved
D3FF FFFFH
LMBBET
access
LMBBET
access
D400 0000H - 8 Kbyte
D400 1FFFH
PMI Scratch-Pad RAM
(SPRAM)
D400 2000H - 8 Kbyte
D400 3FFFH
Reserved
access3)
LMBBET
access3)
LMBBET
D400 4000H - ≈ 64
Reserved
Reserved
D7FF FFFFH
D800 0000H - 112
DEFF FFFFH Mbyte
Mbyte
DF00 0000H - 16 Mbyte Reserved (for Boot Rom)
DFFF FFEFH
144)
E000 0000H - 128
E7FF FFFFH Mbyte
Reserved
LMBBET
LMBBET
LMBBET
LMBBET
E800 0000H - 128
Reserved
EFFF FFFFH
Mbyte
Data Sheet
44
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-5
Functional Description
LMB Address Map (cont’d)
Seg- Address
ment Range
Size
Description
Action
Read
Write
15
F000 0000H - 128
F7FF FFFFH Mbyte
Address map is identical SPBBET
to FPI Bus segment 15
address map (see
SPBBE
Table 3-5)
Reserved areas give an
bus error.
F800 0000H - 1 Kbyte
F800 03FFH
Reserved
LMBBET
LMBBET
access
LMBBET
LMBBET
access
F800 0400H - 256 byte Reserved
F800 04FFH
F800 0500H - 256 byte Program Memory Unit
F800 05FFH
(PMU)
F800 0600H - ≈ 2 Kbyte Reserved
F800 0FFFH
LMBBET
access
LMBBET
access
F800 1000H - 5 Kbyte
F800 23FFH
Flash Registers
F800 2400H - ≈ 8 Mbyte Reserved
F87F FBFFH
LMBBET
access
LMBBET
access
F87F FC00H - 256 byte Data Memory Interface
F87F FCFFH
F87F FD00H - 256 byte Program Memory
F87F FDFFH Interface Unit
Unit
access
access
F87F FE00H - 256 byte LBCU register space
F87F FEFFH
access
access
F87F FF00H - 256 byte LFI Bus Bridge
F87F FFFFH
access
access
F880 0000H - ≈ 119
Reserved
LMBBET
LMBBET
FFFF FFFFH Mbyte
1) Cached area
2) Only applicable when writing Flash command sequences
3) Read and write accesses to this address range will not generate any traps.
4) Non-cached area
5) If accessible, read and write accesses to this address range will not generate any traps.
Data Sheet
45
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.4
Memory Protection System
The TC1163/TC1164 memory protection system specifies the addressable range and
read/write permissions of memory segments available to the current executing task. The
memory protection system controls the position and range of addressable segments in
memory. It also controls the types of read and write operations allowed within
addressable memory segments. Any illegal memory access is detected by the memory
protection hardware, which then invokes the appropriate Trap Service Routine (TSR) to
handle the error. Thus, the memory protection system protects critical system functions
against both software and hardware errors. The memory protection hardware can also
generate signals to the Debug Unit to facilitate tracing illegal memory accesses.
There are two Memory Protection Register Sets in the TC1163/TC1164, numbered 0
and 1, which specify memory protection ranges and permissions for code and data. The
PSW.PRS bit field determines which of these is the set currently in use by the CPU. As
the TC1163/TC1164 uses a Harvard-style memory architecture, each Memory
Protection Register Set is broken down into a Data Protection Register Set and a Code
Protection Register Set. Each Data Protection Register Set can specify up to four
address ranges to receive a particular protection modes. Each Code Protection Register
Set can specify up to two address ranges to receive a particular protection modes.
Each Data Protection Register Sets and Code Protection Register Sets determines the
range and protection modes for a separate memory area. Each set contains a pair of
registers which determine the address range (the Data Segment Protection Registers
and Code Segment Protection Registers) and one register (Data Protection Mode
Register) which determines the memory access modes that applies to the specified
range.
3.5
Peripheral Control Processor
The Peripheral Control Processor (PCP2) in the TC1163/TC1164 performs tasks that
would normally be performed by the combination of a DMA controller and its supporting
CPU interrupt service routines in a traditional computer system. It could easily be
considered as the host processor’s first line of defence as an interrupt-handling engine.
The PCP can unload the CPU from having to service time-critical interrupts. This
provides many benefits, including:
• Avoiding large interrupt-driven task context-switching latencies in the host processor
• Reducing the cost of interrupts in terms of processor register and memory overhead
• Improving the responsiveness of interrupt service routines to data-capture and data-
transfer operations
• Easing the implementation of multitasking operating systems
The PCP2 has an architecture that efficiently supports DMA-type transactions to and
from arbitrary devices and memory addresses within the TC1163/TC1164 and also has
reasonable stand-alone computational capabilities.
Data Sheet
46
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
The PCP2 in the TC1163/TC1164 contains an improved version of the TC1775’s PCP
with the following enhancements:
• Optimized context switching
• Support for nested interrupts
• Enhanced instruction set
• Enhanced instruction execution speed
• Enhanced interrupt queueing
The PCP2 is made up of several modular blocks as follows (see Figure 3-1):
• PCP Processor Core
• Code Memory (CMEM)
• Parameter Memory (PRAM)
• PCP Interrupt Control Unit (PICU)
• PCP Service Request Nodes (PSRN)
• System bus interface to the Flexible Peripheral Interface (FPI Bus)
Code
Memory
CMEM
Parameter
Memory
PRAM
PCP
Processor
Core
PCP Service
Req. Nodes
PSRNs
PCP Interrupt
Control Unit
PICU
FPI-Interface
FPI Bus
PCP Interrupt
Arbitration Bus
CPU Interrupt
Arbitration Bus
MCB06135
Figure 3-1
PCP2 Block Diagram
Data Sheet
47
V1.0, 2008-04
TC1163/TC1164
Preliminary
Table 3-6
Functional Description
PCP2 Instruction Set Overview
Instruction Group
DMA primitives
Load/Store
Description
Efficient DMA channel implementation
Transfer data between PRAM or FPI memory and the general
purpose registers, as well as move or exchange values
between registers
Arithmetic
Add, subtract, compare and complement
Divide and multiply
Divide/Multiply
Logical
And, Or, Exclusive Or, Negate
Shift right or left, rotate right or left, prioritize
Set, clear, insert and test bits
Jump conditionally, jump long, exit
No operation, Debug
Shift
Bit Manipulation
Flow Control
Miscellaneous
Data Sheet
48
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.6
DMA Controller and Memory Checker
The DMA Controller of the TC1163/TC1164 transfers data from data source locations to
data destination locations without intervention of the CPU or other on-chip devices. One
data move operation is controlled by one DMA channel. Eight DMA channels are
provided in one DMA Sub-Block. The Bus Switch provides the connection of the DMA
Sub-Block to the two FPI Bus interfaces and an MLI bus interface. In the
TC1163/TC1164, the FPI Bus interfaces are connected to the System Peripheral Bus
and the DMA Bus. The third specific bus interface provides a connection to Micro Link
Interface modules (two MLI modules in the TC1163/TC1164) and other DMA-related
devices (Memory Checker module in the TC1163/TC1164). Clock control, address
decoding, DMA request wiring, and DMA interrupt service request control are
implementation-specific and managed outside the DMA controller kernel. Figure 3-2
shows the implementation details and interconnections of the DMA module.
fDMA
DMA Controller
Clock
Control
System
Periphera
Bus
DMA Sub-Block 0
DMA
Requests
of
On-chip
Periph.
Units
DMA
Channels
00-07
Request
Selection/
Bus
Switch
DMA Bus
MLI0
Arbitration
Transaction
Control Unit
Address
Decoder
Memory
Checker
Interrupt
Request
Nodes
Arbiter/
Switch
Control
SR[15:0]
DMA Interrupt Control
TC1163/TC1164 DMA Block Diagram
Figure 3-2
DMA Controller Block Diagram
Data Sheet
49
V1.0, 2008-04
TC1163/TC1164
Preliminary
Features
Functional Description
• 8 independent DMA channels
– 8 DMA channels in the DMA Sub-Block
– Up to 8 selectable request inputs per DMA channel
– 2-level programmable priority of DMA channels within the DMA Sub-Block
– Software and hardware DMA request
– Hardware requests by selected on-chip peripherals and external inputs
• Programmable priority of the DMA Sub-Blocks on the bus interfaces
• Buffer capability for move actions on the buses (at least 1 move per bus is buffered).
• Individually programmable operation modes for each DMA channel
– Single Mode: stops and disables DMA channel after a predefined number of DMA
transfers
– Continuous Mode: DMA channel remains enabled after a predefined number of
DMA transfers; DMA transaction can be repeated.
– Programmable address modification
• Full 32-bit addressing capability of each DMA channel
– 4 Gbyte address range
– Support of circular buffer addressing mode
• Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit
• Micro Link bus interface support
• Register set for each DMA channel
– Source and destination address register
– Channel control and status register
– Transfer count register
• Flexible interrupt generation (the service request node logic for the MLI channels is
also implemented in the DMA module)
• All buses connected to the DMA module must work at the same frequency.
• Read/write requests of the System Bus side to the peripherals on DMA Bus are
bridged to the DMA Bus (only the DMA is the master on the DMA bus), allowing easy
access to these peripherals by PCP and CPU
Memory Checker
The Memory Checker Module (MCHK) makes it possible to check the data consistency
of memories. Any SPB bus master may access the memory checker. It is preferable the
DMA does it as described hereafter. It uses DMA 8-bit, 16-bit, or 32-bit moves to read
from the selected address area and to write the value read in a memory checker input
register. With each write operation to the memory checker input register, a polynomial
checksum calculation is triggered and the result of the calculation is stored in the
memory checker result register.
The memory checker uses the standard Ethernet polynomial, which is given by:
G32 = x32+ x26+ x23+ x22+ x16+ x12+ x11+ x10+ x8+ x7+ x5+ x4+ x2+ x +1
Data Sheet
50
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Note: Although the polynomial above is used for generation, the generation algorithm
differs from the one that is used by the Ethernet protocol.
3.7
Interrupt System
The TC1163/TC1164 interrupt system provides a flexible and time-efficient means of
processing interrupts. An interrupt request can be serviced either by the CPU or by the
Peripheral Control Processor (PCP). These units are called “Service Providers”.
Interrupt requests are called “Service Requests” rather than “Interrupt Requests” in this
document because they can be serviced by either Service Providers.
Each peripheral in the TC1163/TC1164 can generate service requests. Additionally, the
Bus Control Units, the Debug Unit, the PCP, and even the CPU itself can generate
service requests to either of the two Service Providers.
As shown in Figure 3-3, each TC1163/TC1164 unit that can generate service requests
is connected to one or multiple Service Request Nodes (SRN). Each SRN contains a
Service Request Control Register mod_SRCx, where “mod” is the identifier of the
service requesting unit and “x” an optional index. Two arbitration buses connect the
SRNs with two Interrupt Control Units, which handle interrupt arbitration among
competing interrupt service requests, as follows:
• The Interrupt Control Unit (ICU) arbitrates service requests for the CPU and
administers the CPU Interrupt Arbitration Bus.
• The Peripheral Interrupt Control Unit (PICU) arbitrates service requests for the PCP
and administers the PCP Interrupt Arbitration Bus.
The PCP can make service requests directly to itself (via the PICU), or it can make
service requests to the CPU. The Debug Unit can generate service requests to the PCP
or the CPU. The CPU can make service requests directly to itself (via the ICU), or it can
make service requests to the PCP. The CPU Service Request Nodes are activated
through software.
Depending on the selected system clock frequency fSYS, the number of fSYS clock cycles
per arbitration cycle must be selected as follows:
• fSYS < 60 MHz: ICR.CONECYC = 1 and PCP_ICR.CONECYC = 1
• fSYS > 60 MHz: ICR.CONECYC = 0 and PCP_ICR.CONECYC = 0
Data Sheet
51
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
PCP
Interrupt
CPU
Interrupt
Arbitration Bus
Arbitration Bus
Service
Requestors
Service Req.
PCP Interrupt
Control Unit
Interrupt
Service
Nodes
Providers
PICU
Int. Req.
Int. Ack.
CCPN
PIPN
2
2
2
4
MSC0
MLI0
2 SRNs
4 SRNs
3 SRNs
3 SRNs
4 SRNs
4 SRNs
6 SRNs
4 SRNs
2 SRNs
38 SRNs
2 SRNs
1 SRN
4
Service Req.
Nodes
4
PCP2
3
5
5
3
5 SRNs
SSC0
SSC1
ASC0
ASC1
MultiCAN1)
ADC0
FADC
GPTA0
STM
3
5
3
5
2
3
5 SRNs
2 SRNs
5 SRNs
5
3
4
2
4
4
5
5
4
5
Software
and
Breakpoint
4
4
6
6
Interrupts
CPU Interrupt
Control Unit
6
CPU
4
4
ICU
4
Int. Req.
2
Int. Ack.
CCPN
2
2
PIPN
38
38
2
38
2
Service Req.
Nodes
Service
Requestors
1
1
1
1
4
4
1
1
1
1
2
1
1
4
1
1
1 SRN
1 SRN
4 SRNs
1 SRN
1 SRN
LBCU
SBCU
1
1
FPU
1
1
1
Flash
1 SRN
1
DMA
2
2
Ext. Int
2 SRNs
2
Cerberus
DMA Bus
1) MultiCAN module and the 6 SRNs are not applicable to TC1163.
TC1163/TC1164 Interrupt System
Figure 3-3
Block Diagram of the TC1163/TC1164 Interrupt System
Data Sheet
52
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.8
Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1)
Figure 3-4 shows a global view of the functional blocks and interfaces of the two
Asynchronous/Synchronous Serial Interfaces, ASC0 and ASC1.
fASC
Clock
Control
P3.0 /
RXD0A
A2
A2
RXD_I0
RXD_I1
RXD_O
TXD_O
P3.1 /
TXD0A
Address
Decoder
ASC0
Module
(Kernel)
P3.12 /
RXD0B
A2
A2
EIR
TBIR
TIR
P3.13 /
TXD0B
Interrupt
Control
RIR
ASC0_RDR
ASC0_TDR
Port 3
Control
To
DMA
P3.9 /
RXD1A
A2
A2
RXD_I0
RXD_I1
RXD_O
TXD_O
P3.8 /
TXD1A
ASC1
Module
(Kernel)
P3.14 /
RXD1B
A2
A2
EIR
TBIR
TIR
P3.15 /
TXD1B
Interrupt
Control
RIR
ASC1_RDR
ASC1_TDR
To
DMA
MCB06211c
Figure 3-4
Block Diagram of the ASC Interfaces
The ASC provides serial communication between the TC1163/TC1164 and other
microcontrollers, microprocessors, or external peripherals.
The ASC supports full-duplex asynchronous communication and half-duplex
synchronous communication. In Synchronous Mode, data is transmitted or received
synchronous to a shift clock that is generated by the ASC internally. In Asynchronous
Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be
Data Sheet
53
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
selected. Parity, framing, and overrun error detection are provided to increase the
reliability of data transfers. Transmission and reception of data is double-buffered. For
multiprocessor communication, a mechanism is included to distinguish address bytes
from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator
provides the ASC with a separate serial clock signal, which can be accurately adjusted
by a prescaler implemented as fractional divider.
Features
• Full-duplex asynchronous operating modes
– 8-bit or 9-bit data frames, LSB first
– Parity-bit generation/checking
– One or two stop bits
– Baud rate from 5.0 Mbit/s to 1.19 bit/s (@ 80 MHz module clock)
– Multiprocessor mode for automatic address/data byte detection
– Loop-back capability
• Half-duplex 8-bit synchronous operating mode
– Baud rate from 10.0 Mbit/s to 813.8 bit/s (@ 80 MHz module clock)
• Double-buffered transmitter/receiver
• Interrupt generation
– On a transmit buffer empty condition
– On a transmit last bit of a frame condition
– On a receive buffer full condition
– On an error condition (frame, parity, overrun error)
Data Sheet
54
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.9
High-Speed Synchronous Serial Interfaces (SSC0 and SSC1)
Figure 3-5 shows a global view of the functional blocks and interfaces of the two high-
speed Synchronous Serial Interfaces, SSC0 and SSC1.
MRSTA
MRSTB
MTSR
A2 P3.4 /MTSR0
fSSC0
fCLC0
Master
Slave
Clock
Control
MTSRA
MTSRB
MRST
A2 P3.3 /MRST0
A2 P3.2 /SCLK0
A2 P3.7 /SLSI0
Address
Decoder
SCLKA
SCLKB
SCLK
Slave
Master
SSC0
Module
(Kernel)
Port 3
Control
SLSI1
SLSI[7:2]1)
EIR
TIR
RIR
P3.5 /SLSO00 /
A2 SLSO10 / SLSO00
AND SLSO10
Slave
Interrupt
Control
SLSO[2:0]
P3.6 /SLSO01 /
A2
SSC0_RDR
SSC0_TDR
SLSO11 / SLSO01
AND SLSO11
To
DMA
SLSO[5:3]
SLSO6
SLSO7 1)
Master
P3.7 /SLSO02 /
A2
M/S Select1)
Enable 1)
SLSO12
P3.8 /SLSO06
A2
P2.1 /SLSO03 /
SLSO13
A2
A2
A2
SLSO[2:0]
SLSO[5:3]
fSSC1
P2.8 /SLSO04 /
SLSO14
Clock
Control
fCLC1
Master
P2.9 /SLSO05 /
SLSO15
SLSO6 1)
SLSO7
Address
Decoder
A1 P2.13 /SLSI1
Port 2
Control
SLSI1
SLSI[7:2] 1)
Slave
MRSTA
MRSTB
MTSR
A2
P2.12 /MTSR1A
SSC1
Module
(Kernel)
EIR
TIR
RIR
Master
Interrupt
Control
MTSRA
MTSRB
MRST
A2 P2.10 /MRST1A
A2 P2.11 /SCLK1A
Slave
SSC1_RDR
SSC1_TDR
To
DMA
A2 P1.10 /SLSO17
A2 P1.8 /MTSR1B
A2 P1.9 /MRST1B
A2 P1.11 /SCLK1B
MCB06225_c
M/S Select1)
Enable 1)
Port 1
Control
SCLKA
SCLKB
SCLK
Slave
Master
1) These lines are not connected
Figure 3-5
Block Diagram of the SSC Interfaces
Data Sheet
55
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
The SSC supports full-duplex and half-duplex serial synchronous communication up to
40.0 MBaud (@ 80 MHz module clock). The serial clock signal can be generated by the
SSC itself (Master Mode) or can be received from an external master (Slave Mode). Data
width, shift direction, clock polarity and phase are programmable. This allows
communication with SPI-compatible devices. Transmission and reception of data is
double-buffered. A shift clock generator provides the SSC with a separate serial clock
signal. Seven slave select inputs are available for Slave Mode operation. Eight
programmable slave select outputs (chip selects) are supported in Master Mode.
Features
• Master and Slave Mode operation
– Full-duplex or half-duplex operation
– Automatic pad control possible
• Flexible data format
– Programmable number of data bits: 2 to 16 bits
– Programmable shift direction: LSB or MSB shift first
– Programmable clock polarity: Idle low or idle high state for the shift clock
– Programmable clock/data phase: Data shift with leading or trailing edge of the shift
clock
• Baud rate generation from 40.0 Mbit/s to 610.36 bit/s (@ 80 MHz module clock)
• Interrupt generation
– On a transmitter empty condition
– On a receiver full condition
– On an error condition (receive, phase, baud rate, transmit error)
• Flexible SSC pin configuration
• Seven slave select inputs SLSI[7:1] in Slave Mode
• Eight programmable slave select outputs SLSO[7:0] in Master Mode
– Automatic SLSO generation with programmable timing
– Programmable active level and enable control
Data Sheet
56
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.10
Micro Second Bus Interface (MSC0)
The MSC interface provides a serial communication link typically used to connect power
switches or other peripheral devices. The serial communication link includes a fast
synchronous downstream channel and a slow asynchronous upstream channel.
Figure 3-6 shows a global view of the MSC interface signals.
SR15 (from CAN)
fMSC0
FCLP
Clock
Control
C
C
C
C
FCLP0A
FCLN0
SOP0A
SON0
fCLC0
FCLN
SOP
SON
Address
Decoder
A2 P2.11 / FCLP0B
A2 P2.12 / SOP0B
MSC0
Module
(Kernel)
SR[1:0]
Interrupt
Control
EN0
EN1
P2.8 / EN00
A2
SR[3:2]
16
To DMA
Port 2
Control
A2 P2.9 / EN01
ALTINL[15:0]
(from GPTA)
ALTINH[15:0]
16
SDI[0]1)
P2.13 / SDI0
A1
EMGSTOPMSC
(from SCU)
1) SDI[7:1] are connected to high level
MCA06255
Figure 3-6
Block Diagram of the MSC Interface
The downstream and upstream channels of the MSC module communicate with the
external world via nine I/O lines. Eight output lines are required for the serial
communication of the downstream channel (clock, data, and enable signals). One out of
eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The
source of the serial data to be transmitted by the downstream channel can be MSC
register contents or data that is provided at the ALTINL/ALTINH input lines. These input
lines are typically connected to other on-chip peripheral units (for example with a timer
unit like the GPTA). An emergency stop input signal makes it possible to set bits of the
serial data stream to dedicated values in emergency cases.
Data Sheet
57
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Clock control, address decoding, and interrupt service request control are managed
outside the MSC module kernel. Service request outputs are able to trigger an interrupt
or a DMA request.
Features
• Fast synchronous serial interface to connect power switches in particular, or other
peripheral devices via serial buses
• High-speed synchronous serial transmission on downstream channel
– Serial output clock frequency: fFCL = fMSC/2
– Fractional clock divider for precise frequency control of serial clock fMSC
– Command, data, and passive frame types
– Start of serial frame: Software-controlled, timer-controlled, or free-running
– Programmable upstream data frame length (16 or 12 bits)
– Transmission with or without SEL bit
– Flexible chip select generation indicates status during serial frame transmission
– Emergency stop without CPU intervention
• Low-speed asynchronous serial reception on upstream channel
– Baud rate: fMSC divided by 4, 8, 16, 32, 64, 128, or 256
– Standard asynchronous serial frames
– Parity error checker
– 8-to-1 input multiplexer for SDI lines
– Built-in spike filter on SDI lines
Data Sheet
58
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.11
MultiCAN Controller (CAN)
Note: Section 3.11 is not applicable to TC1163.
Figure 3-7 shows a global view of the MultiCAN module with its functional blocks and
interfaces.
fCAN
MultiCAN Module Kernel
Clock
Control
fCLC
P3.15 /
TXDCAN1
P3.14 /
RXDCAN1
Address
Decoder
A2
A2
TXDC1
RXDC1
TXDC0
RXDC0
Message
Object
Buffer
CAN
Node 1
Linked
List
Control
Port 3
Control
DMA
CAN
Node 0
P3.13 /
TXDCAN0
P3.12 /
RXDCAN0
64
Objects
A2
A2
INT_O
[1:0]
Interrupt
Control
INT_O
[5:2]
INT_O15
CAN Control
MCA06281
Figure 3-7
Block Diagram of MultiCAN Module
The MultiCAN module contains two independently-operating CAN nodes with Full-CAN
functionality that are able to exchange Data and Remote Frames via a gateway function.
Transmission and reception of CAN frames is handled in accordance with CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
Both CAN nodes share a common set of message objects. Each message object can be
individually allocated to one of the CAN nodes. Besides serving as a storage container
for incoming and outgoing frames, message objects can be combined to build gateways
between the CAN nodes or to setup a FIFO buffer.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to the message object list of the CAN node, and it transmits
only messages belonging to this message object list. A powerful, command-driven list
controller performs all message object list operations.
Data Sheet
59
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
The bit timings for the CAN nodes are derived from the module timer clock (fCAN), and
are programmable up to a data rate of 1 Mbit/s. External bus transceivers are connected
to a CAN node via a pair of receive and transmit pins.
MultiCAN Features
• CAN functionality conforms to CAN specification V2.0 B active for each CAN node
(compliant to ISO 11898)
• Two independent CAN nodes
• 64 independent message objects (shared by the CAN nodes)
• Dedicated control registers for each CAN node
• Data transfer rate up to 1Mbit/s, individually programmable for each node
• Flexible and powerful message transfer control and error handling capabilities
• Full-CAN functionality: message objects can be individually
– assigned to one of the two CAN nodes
– configured as transmit or receive object
– configured as message buffer with FIFO algorithm
– configured to handle frames with 11-bit or 29-bit identifiers
– provided with programmable acceptance mask register for filtering
– monitored via a frame counter
– configured for Remote Monitoring Mode
• Automatic Gateway Mode support
• 6 individually programmable interrupt nodes
• CAN analyzer mode for bus monitoring
Data Sheet
60
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.12
Micro Link Serial Bus Interface (MLI0)
The Micro Link Interface is a fast synchronous serial interface that allows data exchange
between microcontrollers of the 32-bit AUDO microcontroller family without intervention
of a CPU or other bus masters. Figure 3-8 shows how two microcontrollers are typically
connected together via their MLI interfaces. The MLI operates in both microcontrollers
as a bus master on the system bus.
Controller 1
CPU
Controller 2
CPU
Peripheral
A
Peripheral
B
Peripheral
C
Peripheral
D
Memory
MLI
MLI
Memory
System Bus
System Bus
MCA06061
Figure 3-8
Features
Typical Micro Link Interface Connection
• Synchronous serial communication between MLI transmitters and MLI receivers
located on the same or on different microcontroller devices
• Automatic data transfer/request transactions between local/remote controller
• Fully transparent read/write access supported (= remote programming)
• Complete address range of remote controller available
• Specific frame protocol to transfer commands, addresses and data
• Error control by parity bit
• 32-bit, 16-bit, and 8-bit data transfers
• Programmable baud rates
– MLI transmitter baud rate: max. fMLI/2 (= 40 Mbit/s @ 80 MHz module clock)
– MLI receiver baud rate: max. fMLI
• Multiple remote (slave) controllers are supported
MLI transmitter and MLI receiver communicate with other off-chip MLI receivers and MLI
transmitters via a 4-line serial I/O bus each. Several I/O lines of these I/O buses are
available outside the MLI module kernel as four-line output or input buses.
Data Sheet
61
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Figure 3-9 shows a global view of the functional blocks of the MLI module with its
interfaces.
A2 P2.0 / TCLK0
TCLK
A2 P2.1 / TREADY0A
TREADYA
A2 P2.2 / TVALID0A
A2 P2.3 / TDATA0
TREADYB
TREADYD
fMLI0
Clock
Control
Port 2
Control
TVALIDA
TVALIDB
TVALIDD
TDATA
P2.4 / RCLK0A
A1
A2 P2.5 / RREADY0A
A1 P2.6 / RVALID0A
A1 P2.7 / RDATA0A
Address
Decoder
MLI0
Module
RCLKA
SR[3:0] (Kernel)
Interrupt
Control
RCLKB
RCLKD
A2 P5.15 / TCLK0
RREADYA
RREADYB
RREADYD
RVALIDA
RVALIDB
RVALIDD
RDATAA
RDATAB
RDATAD
SR[4:7]
To DMA
Cerberus
A2 P5.14 / TREADY0B
P5.13 / TVALID0B
A2
BRKOUT
A2 P5.12 / TDATA0
A2 P5.11 / RCLK0B
A2 P5.10 / RREADY0B
A2 P5.9 / RVALID0B
Port 5
Control
A2 P5.8 / RDATA0B
TC1163/TC1164 MLI Block Diagram
Figure 3-9
Block Diagram of the MLI Module
Data Sheet
62
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.13
General Purpose Timer Array
The GPTA provides a set of timer, compare, and capture functionalities that can be
flexibly combined to form signal measurement and signal generation units. They are
optimized for tasks typical of electrical motor control applications, but can also be used
to generate simple and complex signal waveforms needed in other industrial
applications.
The TC1163/TC1164 contains one General Purpose Timer Array (GPTA0). Figure 3-10
shows a global view of the GPTA module.
GPTA
Clock Generation Unit
FPC0
DCM0
FPC1
FPC2
FPC3
FPC4
FPC5
PDL0
PDL1
DCM1
DCM2
DCM3
DIGITAL
PLL
Clock
Conn.
fGPTA Clock Distribution Unit
Signal
Generation Unit
GT0
GT1
GTC00
GTC01
GTC02
GTC03
LTC00
LTC01
LTC02
LTC03
Global
Timer
Cell Array
Local
Timer
Cell Array
GTC30
GTC31
LTC62
LTC63
I/O Line Sharing Unit
Interrupt Sharing Unit
MCB06063
Figure 3-10 Block Diagram of the GPTA Module
Data Sheet
63
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.13.1
Functionality of GPTA0
The General Purpose Timer Array GPTA0 provides a set of hardware modules required
for high-speed digital signal processing:
• Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation.
• Phase Discrimination Logic units (PDL) decode the direction information output by a
rotation tracking system.
• Duty Cycle Measurement Cells (DCM) provide pulse-width measurement
capabilities.
• A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA
module clock ticks during an input signal’s period.
• Global Timer units (GT) driven by various clock sources are implemented to operate
as a time base for the associated Global Timer Cells.
• Global Timer Cells (GTC) can be programmed to capture the contents of a Global
Timer on an external or internal event. A GTC may also be used to control an external
port pin depending on the result of an internal compare operation. GTCs can be
logically concatenated to provide a common external port pin with a complex signal
waveform.
• Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may also be
logically tied together to drive a common external port pin with a complex signal
waveform. LTCs — enabled in Timer Mode or Capture Mode — can be clocked or
triggered by various external or internal events.
Input lines can be shared by an LTC and a GTC to trigger their programmed operation
simultaneously.
The following list summarizes the specific features of the GPTA unit.
Clock Generation Unit
• Filter and Prescaler Cell (FPC)
– Six independent units
– Three basic operating modes:
Prescaler, Delayed Debounce Filter, Immediate Debounce Filter
– Selectable input sources:
Port lines, GPTA module clock, FPC output of preceding FPC cell
– Selectable input clocks:
GPTA module clock, prescaled GPTA module clock, DCM clock, compensated or
uncompensated PLL clock
– fGPTA/2 maximum input signal frequency in Filter Modes
• Phase Discriminator Logic (PDL)
– Two independent units
– Two operating modes (2- and 3-sensor signals)
– fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input
signal frequency in 3-sensor Mode
Data Sheet
64
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
• Duty Cycle Measurement (DCM)
– Four independent units
– 0 - 100% margin and time-out handling
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Digital Phase Locked Loop (PLL)
– One unit
– Arbitrary multiplication factor between 1 and 65535
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Clock Distribution Unit (CDU)
– One unit
– Provides nine clock output signals:
f
GPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock
Signal Generation Unit
• Global Timers (GT)
– Two independent units
– Two operating modes (Free-Running Timer and Reload Timer)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Global Timer Cell (GTC)
– 32 units related to the Global Timers
– Two operating modes (Capture, Compare and Capture after Compare)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Local Timer Cell (LTC)
– 64 independent units
– Three basic operating modes (Timer, Capture and Compare) for 63 units
– Special compare modes for one unit
– 16-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Interrupt Control Unit
• 111 interrupt sources, generating up to 38 service requests
Data Sheet
65
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
I/O Sharing Unit
• Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and
MSC interface
Data Sheet
66
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.14
Analog-to-Digital Converter (ADC0)
Section 3.14 shows the global view of the ADC module with its functional blocks and
interfaces and the features which are provided by the module.
VDDM
VDD
VAGND0 VSS VSSM VAREF0
P1.14 /
AD0EMUX2 (GRPS)
GPRS
fADC
fCLC
A1
A1
Clock
Control
Port 1
Control
EMUX0
EMUX1
P1.13 /AD0EMUX1
A1 P1.12 /AD0EMUX0
ASGT
8
2
6
From Ports
From MSC0
From GPTA
SW0TR, SW0GT
ETR, EGT
QTR, QGT
TTR, TGT
Address
Decoder
External
Request
Unit
(SCU)
ADC0
Module
Kernel
AIN0
D
D
D
AN0
SR[3:0]
SR[7:4]
Group 0
AIN15
Interrupt
Control
AN15
AN16
AIN16
Group 1
AIN30
AN30
AN31
D
D
To DMA
AIN31
0
Die
Temperature
1
Measurement
SCU_CON.DTSON
MCA06427
Figure 3-11 Block Diagram of the ADC Module
The ADC module has 16 analog input channels. An analog multiplexer selects the input
line for the analog input channels from among 32 analog inputs. Additionally, an external
analog multiplexer can be used for analog input extension. External Clock control,
address decoding, and service request (interrupt) control are managed outside the ADC
module kernel. External trigger conditions are controlled by an External Request Unit.
This unit generates the control signals for auto-scan control (ASGT), software trigger
control (SW0TR, SW0GT), the event trigger control (ETR, EGT), queue control (QTR,
QGT), and timer trigger control (TTR, TGT).
An automatic self-calibration adjusts the ADC module to changing temperatures or
process variations. Figure 3-11 shows the global view of the ADC module with its
functional blocks and interfaces.
Data Sheet
67
V1.0, 2008-04
TC1163/TC1164
Preliminary
Features
Functional Description
• 8-bit, 10-bit, 12-bit A/D conversion
• Conversion time below 2.5µs @ 10-bit resolution
• Extended channel status information on request source
• Successive approximation conversion method
• Total Unadjusted Error (TUE) of ±2 LSB @ 10-bit resolution
• Integrated sample & hold functionality
• Direct control of up to 16 analog input channels
• Dedicated control and status registers for each analog channel
• Powerful conversion request sources
• Selectable reference voltages for each channel
• Programmable sample and conversion timing schemes
• Limit checking
• Flexible ADC module service request control unit
• Automatic control of external analog multiplexers
• Equidistant samples initiated by timer
• External trigger and gating inputs for conversion requests
• Power reduction and clock control feature
• On-chip die temperature sensor output voltage measurement
Data Sheet
68
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.15
Fast Analog-to-Digital Converter Unit (FADC)
The on-chip FADC module of the TC1163/TC1164 basically is a 2-channel A/D converter
with 10-bit resolution that operates by the method of the successive approximation.
As shown in Figure 3-12, the main FADC functional blocks are:
• The Input Stage — contains the differential inputs and the programmable amplifier
• The A/D Converter — is responsible for the analog-to-digital conversion
• The Data Reduction Unit — contains programmable antialiasing and data reduction
filters
• The Channel Trigger Control block — determines the trigger and gating conditions
for the two FADC channels
• The Channel Timers — can independently trigger the conversion of each FADC
channel
• The A/D Control block is responsible for the overall FADC functionality
The FADC module is supplied by the following power supply and reference voltage lines:
• VDDMF/VDDMF:FADC Analog Part Power Supply (3.3 V)
• VDDAF/VDDAF:FADC Analog Part Logic Power Supply (1.5 V)
• VFAREF/VFAGND:FADC Reference Voltage (3.3 V)/FADC Reference Ground
Data Sheet
69
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
VFAREF VDDAF VDDMF
VFAGND VSSAF
VSSMF
fFADC
fCLC
Clock
Control
FAIN0P
FAIN0N
FAIN1P
FAIN1N
AN32
AN33
AN34
AN35
D
D
D
D
Address
Decoder
SR[1:0]
SR[3:2]
Interrupt
Control
FADC
Module
Kernel
DMA
OUT1
OUT9
OUT18
OUT26
OUT2
OUT10
OUT19
OUT27
P3.10 / REQ0
P3.11 / REQ1
P0.14 / REQ4
P0.15 / REQ5
A1
A1
A1
A1
GPTA0
GS[7:0]
TS[7:0]
PDOUT2
PDOUT3
External Request Unit
(SCU)
MCA06445
Figure 3-12 Block Diagram of the FADC Module
Features
• Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
• 10-bit A/D conversion
– Higher resolution by averaging of consecutive conversions is supported
• Successive approximation conversion method
• Two differential input channels
• Offset and gain calibration support for each channel
• Differential input amplifier with programmable gain of 1, 2, 4 and 8 for each channel
• Free-running (Channel Timers) or triggered conversion modes
• Trigger and gating control for external signals
• Built-in Channel Timers for internal triggering
• Channel timer request periods independently selectable for each channel
• Selectable, programmable anti-aliasing and data reduction filter block
Data Sheet
70
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.16
System Timer
The TC1163/TC1164’s STM is designed for global system timing applications requiring
both high precision and long period.
Features
• Free-running 56-bit counter
• All 56 bits can be read synchronously
• Different 32-bit portions of the 56-bit counter can be read synchronously
• Flexible interrupt generation based on compare match with partial STM content
• Driven by maximum 80 MHz (= fSYS, default after reset = fSYS/2)
• Counting starts automatically after a reset operation
• STM is reset by:
– Watchdog reset
– Software reset (RST_REQ.RRSTM must be set)
– Power-on reset
• STM (and clock divider STM_CLC.RMC) is not reset at a hardware reset (HDRST =
0)
• STM can be halted in debug/suspend mode (via STM_CLC register)
The STM is an upward counter, running either at the system clock frequency fSYS or at a
fraction of it. The STM clock frequency is fSTM = fSYS/RMC with RMC = 0-7 (default after
reset is fSTM = fSYS/2, selected by RMC = 010B). RMC is a bit field in register STM_CLC.
In case of a power-on reset, a watchdog reset, or a software reset, the STM is reset. After
one of these reset conditions, the STM is enabled and immediately starts counting up. It
is not possible to affect the content of the timer during normal operation of the
TC1163/TC1164. The timer registers can only be read but not written to.
The STM can be optionally disabled for power-saving purposes, or suspended for
debugging purposes via its clock control register. In suspend mode of the
TC1163/TC1164 (initiated by writing an appropriate value to STM_CLC register), the
STM clock is stopped but all registers are still readable.
Due to the 56-bit width of the STM, it is not possible to read its entire content with one
instruction. It needs to be read with two load instructions. Since the timer would continue
to count between the two load operations, there is a chance that the two values read are
not consistent (due to possible overflow from the low part of the timer to the high part
between the two read operations). To enable a synchronous and consistent reading
operation of the STM content, a capture register (STM_CAP) is implemented. It latches
the content of the high part of the STM each time when one of the registers STM_TIM0
to STM_TIM5 is read. Thus, STM_CAP holds the upper value of the timer at exactly the
same time when the lower part is read. The second read operation would then read the
content of the STM_CAP to get the complete timer value.
Data Sheet
71
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
The STM can also be read in sections from seven registers, STM_TIM0 through
STM_TIM6, that select increasingly higher-order 32-bit ranges of the STM. These can
be viewed as individual 32-bit timers, each with a different resolution and timing range.
The content of the 56-bit System Timer can be compared with the content of two
compare values stored in the STM_CMP0 and STM_CMP1 registers. Interrupts can be
generated on a compare match of the STM with the STM_CMP0 or STM_CMP1
registers.
The maximum clock period is 256 × fSTM. At fSTM = 80 MHz, for example, the STM counts
28.56 years before overflowing. Thus, it is capable of timing the entire expected product
life-time of a system without overflowing continuously.
Figure 3-13 shows an overview on the System Timer with the options for reading parts
of the STM contents.
Data Sheet
72
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
STM Module
31
23
15
7
0
STM_CMP0
Compare Register 0
31
23
15
7
0
STM_CMP1
Compare Register1
STMIR1
STMIR0
55
47
39
31
23
15
7
0
Interrupt
Control
56-Bit System Timer
Enable /
Disable
00H
00H
STM_CAP
STM_TIM6
Clock
Control
fSTM
STM_TIM5
STM_TIM4
Address
Decoder
STM_TIM3
STM_TIM2
STM_TIM1
STM_TIM0
PORST
MCB06185
Figure 3-13 General Block Diagram of the STM Module Registers
Data Sheet
73
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.17
Watchdog Timer
The WDT provides a highly reliable and secure way to detect and recover from software
or hardware failure. The WDT helps to abort an accidental malfunction of the
TC1163/TC1164 in a user-specified time period. When enabled, the WDT will cause the
TC1163/TC1164 system to be reset if the WDT is not serviced within a user-
programmable time period. The CPU must service the WDT within this time interval to
prevent the WDT from causing a TC1163/TC1164 system reset. Hence, routine service
of the WDT confirms that the system is functioning as expected.
In addition to this standard “Watchdog” function, the WDT incorporates the End-of-
Initialization (Endinit) feature and monitors its modifications. A system-wide line is
connected to the WDT_CON0.ENDINIT bit, serving as an additional write-protection for
critical registers (besides Supervisor Mode protection). Registers protected via this line
can only be modified when Supervisor Mode is active and bit ENDINIT = 0.
A further enhancement in the TC1163/TC1164’s WDT is its reset prewarning operation.
Instead of resetting the device upon the detection of an error immediately (the way that
standard Watchdogs do), the WDT first issues a Non-Maskable Interrupt (NMI) to the
CPU before resetting the device at a specified time period later. This step gives the CPU
a chance to save the system state to the memory for later investigation of the cause of
the malfunction; an important aid in debugging.
Features
• 16-bit Watchdog counter
• Selectable input frequency: fSYS/256 or fSYS/16384
• 16-bit user-definable reload value for normal Watchdog operation, fixed reload value
for Time-Out and Prewarning Modes
• Incorporation of the ENDINIT bit and monitoring of its modifications
• Sophisticated Password Access mechanism with fixed and user-definable password
fields
• Proper access always requires two write accesses. The time between the two
accesses is monitored by the WDT and is limited.
• Access Error Detection: Invalid password (during first access) or invalid guard bits
(during second access) trigger the Watchdog reset generation
• Overflow Error Detection: An overflow of the counter triggers the Watchdog reset
generation.
• Watchdog function can be disabled; access protection and ENDINIT monitor function
remain enabled.
• Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system
malfunction is assumed and the TC1163/TC1164 is held in reset until a power-on or
hardware reset occurs. This prevents the device from being periodically reset if, for
instance, connection to the external memory has been lost such that system
initialization could not even be performed.
Data Sheet
74
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
• Important debugging support is provided through the reset prewarning operation by
first issuing an NMI to the CPU before finally resetting the device after a certain
period of time.
3.18
System Control Unit
The System Control Unit (SCU) of the TC1163/TC1164 handles several system control
tasks. The system control tasks of the SCU are:
• Clock system selection and control
• Reset and boot operation control
• Power management control
• Configuration input sampling
• External Request Unit
• System clock output control
• On-chip SRAM parity control
• Pad driver temperature compensation control
• Emergency stop input control for GPTA outputs
• GPTA input IN1 control
• Pad test mode control for dedicated pins
• ODCS level 2 trace control
• NMI control
• Miscellaneous SCU control
Data Sheet
75
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.19
Boot Options
The TC1163/TC1164 booting schemes provide a number of different boot options for the
start of code execution. Table 3-7 shows the boot options available in the
TC1163/TC1164.
Table 3-7
BRKIN
TC1163/TC1164 Boot Selections
HWCFG TESTMODE Type of Boot
[3:0]
BootROM
Exit Jump
Address
Normal Boot Options
1
0000B
1
Enter bootstrap loader mode 1:
Serial ASC0 boot via ASC0 pins
D400 0000H
1)
0001B
Enter bootstrap loader mode 2:
Serial CAN boot via P3.12 and
P3.13 pins
0010B
0011B
Start from internal PFLASH
A000 0000H
Alternate boot mode (ABM): Start Defined in
from internal PFLASH after CRC ABM header
check is correctly executed; enter or D400 0000H
a serial bootstrap loader mode2) if
CRC check fails
1111B
Enter bootstrap loader mode 3:
Serial ASC0 boot via P3.12 and
P3.13 pins
D400 0000H
–
others
Debug Boot Options
Reserved; execute stop loop
0
0000B
others
1
Tri-state chip
–
–
irrel.
Reserved; execute stop loop
1) This option is not applicable to TC1163.
2) The type of the alternate bootstrap loader mode is selected by the value of the SCU_SCLIR.SWOPT[2:0] bit
field, which contains the levels of the P0.[2:0] latched in with the rising edge of the HDRST.
Data Sheet
76
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.20
Power Management System
The TC1163/TC1164 power management system allows software to configure the
various processing units so that they automatically adjust to draw the minimum
necessary power for the application. There are three power management modes:
• Run Mode
• Idle Mode
• Sleep Mode
The operation of each system component in each of these states can be configured by
software. The power-management modes provide flexible reduction of power
consumption through a combination of techniques, including stopping the CPU clock,
stopping the clocks of other system components individually, and individually clock-
speed reduction of some peripheral components.
Besides these explicit software-controlled power-saving modes, special attention has
been paid to automatic power-saving in those operating units which are not required at
a certain point of time, or idle in the TC1163/TC1164. In that case, they are shut off
automatically until their operation is required again.
Table 3-8 describes the features of the power management modes.
Table 3-8
Mode
Power Management Mode Summary
Description
Run
The system is fully operational. All clocks and peripherals are enabled,
as determined by software.
Idle
The CPU clock is disabled, waiting for a condition to return it to Run
Mode. Idle Mode can be entered by software when the processor has no
active tasks to perform. All peripherals remain powered and clocked.
Processor memory is accessible to peripherals. A reset, Watchdog
Timer event, a falling edge on the NMI pin, or any enabled interrupt event
will return the system to Run Mode.
Sleep
The system clock signal is distributed only to those peripherals
programmed to operate in Sleep Mode. The other peripheral module will
be shut down by the suspend signal. Interrupts from operating
peripherals, the Watchdog Timer, a falling edge on the NMI pin, or a
reset event will return the system to Run Mode. Entering this state
requires an orderly shut-down controlled by the Power Management
State Machine.
In typical operation, Idle Mode and Sleep Mode may be entered and exited frequently
during the run time of an application. For example, system software will typically cause
the CPU to enter Idle Mode each time it has to wait for an interrupt before continuing its
tasks. In Sleep Mode and Idle Mode, wake-up is performed automatically when any
Data Sheet
77
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
enabled interrupt signal is detected, or when the count value (WDT_SR.WDTTIM)
changes from 7FFFH to 8000H.
3.21
On-Chip Debug Support
Figure 3-14 shows a block diagram of the TC1163/TC1164 OCDS system.
OCDS
BCU
L1
SPB
Peripheral
Unit 1
OCDS
L2
OCDS
L1
PCP
SPB
Peripheral
Unit n
OCDS
L2
OCDS
L1
TriCore
16
OCDS2[15:0]
Watch-
dog
Timer
DMA
TDO
TDI
OSCU
TMS
TCK
TRST
JTAG
Controller
JDI
Debug
I/F
BRKIN
MCBS
Break
Switch
BRKOUT
MCB06195
Figure 3-14 OCDS System Block Diagram
The TC1163/TC1164 basically supports two levels of debug operation:
• OCDS Level 1 debug support
• OCDS Level 2 debug support
Data Sheet
78
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
OCDS Level 1 Debug Support
The OCDS Level 1 debug support is mainly assigned for real-time software debugging
purposes which have a demand for low-cost standard debugger hardware.
The OCDS Level 1 is based on a JTAG interface that is used by the external debug
hardware to communicate with the system. The on-chip Cerberus module controls the
interactions between the JTAG interface and the on-chip modules. The external debug
hardware may become master of the internal buses, and read or write the on-chip
register/memory resources. The Cerberus also makes it possible to define breakpoint
and trigger conditions as well as to control user program execution (run/stop, break,
single-step).
OCDS Level 2 Debug Support
The OCDS Level 2 debug support makes it possible to implement program tracing
capabilities for enhanced debuggers by extending the OCDS Level 1 debug functionality
with an additional 16-bit wide trace output port with trace clock. With the trace extension,
the following four trace capabilities are provided (only one of the four trace capabilities
can be selected at a time):
• Trace of the CPU program flow
• Trace of the PCP2 program flow
• Trace of the DMA Controller transaction requests
• Trace of the DMA Controller Move Engine status information
Data Sheet
79
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.22
Clock Generation and PLL
The TC1163/TC1164 clock system performs the following functions:
• Acquires and buffers incoming clock signals to create a master clock frequency
• Distributes in-phase synchronized clock signals throughout the TC1163/TC1164’s
entire clock tree
• Divides a system master clock frequency into lower frequencies required by the
different modules for operation.
• Dynamically reduces power consumption during operation of functional units
• Statically reduces power consumption through programmable power-saving modes
• Reduces electromagnetic interference (EMI) by switching off unused modules
The clock system must be operational before the TC1163/TC1164 can function, so it
contains special logic to handle power-up and reset operations. Its services are
fundamental to the operation of the entire system, so it contains special fail-safe logic.
Features
• PLL operation for multiplying clock source by different factors
• Direct drive capability for direct clocking
• Comfortable state machine for secure switching between basic PLL, direct or
prescaler operation
• Sleep and Power-Down Mode support
The TC1163/TC1164 Clock Generation Unit (CGU) as shown in Figure 3-15 allows a
very flexible clock generation. It basically consists of an main oscillator circuit and a
Phase- Locked Loop (PLL). The PLL can converts a low-frequency external clock signal
from the oscillator circuit to a high-speed internal clock for maximum performance.
The system clock fSYS is generated from an oscillator clock fOSC in either one of the four
hardware/software selectable ways:
• Direct Drive Mode (PLL Bypass):
In Direct Drive Mode, the TC1163/TC1164 clock system is directly driven by an
external clock signal. input, i.e. fCPU = fOSC and fSYS = fOSC. This allows operation of
the TC1163/TC1164 with a reasonably small fundamental mode crystal.
• VCO Bypass Mode (Prescaler Mode):
In VCO Bypass Mode, fCPU and fSYS are derived from fOSC by the two divider stages,
P-Divider and K-Divider. The system clock fSYS is equal to fCPU
• PLL Mode:
.
In PLL Mode, the PLL is running. The VCO clock fVCO is derived from fOSC, divided by
the P factor, multiplied by the PLL (N-Divider). The clock signals fCPU and fSYS are
derived from fVCO by the K-Divider. The system clock fSYS is equal to fCPU
• PLL Base Mode:
.
In PLL Base Mode, the PLL is running at its VCO base frequency and fCPU and fSYS
Data Sheet
80
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
are derived from fVCO only by the K-Divider. In this mode, the system clock fSYS is
equal to fCPU
.
XTAL1
XTAL2
Clock Generation Unit (CGU)
fOSC
Oscillator
Circuit
1:1
Divider
fSYS
fCPU
M
U
X
1 M
U
P
Divi-
der
≥1
K:1
Divider
fVCO
X
Phase
VCO
0
Osc. Run
Detect.
Detect.
N
Divider
PLL
Lock
Detector
OGC MOSC OSCR PDIV OSC
[2:0] DISC
PLL_
LOCK
NDIV VCO_
[6:0] SEL[1:0] BYPASS [3:0] FSL BYPASS
VCO_
KDIV SYS PLL_
BYPASS
Register
OSC_CON
Register PLL_CLC
OSC_
BYPASS
System Control Unit (SCU)
MCA06083
Figure 3-15 Clock Generation Unit
Recommended Oscillator Circuits
The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal
oscillator or an external stable clock source. It basically consists of an inverting amplifier
and a feedback element with XTAL1 as input, and XTAL2 as output.
When using a crystal, a proper external oscillator circuitry must be connected to both
pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz
to 25 MHz. Additionally, it is necessary to have two load capacitances CX1 and CX2, and
depending on the crystal type, a series resistor RX2, to limit the current. A test resistor RQ
may be temporarily inserted to measure the oscillation allowance (negative resistance)
of the oscillator circuitry. RQ values are typically specified by the crystal vendor. The CX1
and CX2 values shown in Figure 3-16 can be used as starting points for the negative
resistance evaluation and for non-productive systems. The exact values and related
operating range are dependent on the crystal frequency and have to be determined and
optimized together with the crystal vendor using the negative resistance method.
Data Sheet
81
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
Oscillation measurement with the final target system is strongly recommended to verify
the input amplitude at XTAL1 and to determine the actual oscillation allowance (margin
negative resistance) for the oscillator-crystal system.
When using an external clock signal, the signal must be connected to XTAL1. XTAL2 is
left open (unconnected). The external clock frequency can be in the range of 0 - 40 MHz
if the PLL is bypassed, and 4 - 40 MHz if the PLL is used.
The oscillator can also be used in combination with a ceramic resonator. The final
circuitry must also be verified by the resonator vendor.
Figure 3-16 shows the recommended external oscillator circuitries for both operating
modes, external crystal mode and external input clock mode. A block capacitor is
recommended to be placed between VDDOSC/VDDOSC3 and VSSOSC
.
VDDOSC VDDOSC3
VDDOSC VDDOSC3
fOSC
fOSC
External Clock
XTAL1
XTAL1
Signal
4 - 40
MHz
4 - 25
MHz
TC1163/TC1164
Oscillator
TC1163/TC1164
Oscillator
RQ
RX2
CX2
XTAL2
XTAL2
CX1
Fundamental
Mode Crystal
VSSOSC
VSSOSC
1)
1)
Crystal Frequency CX1
,
CX2
RX2
4 MHz
33 pF
0
0
0
0
8 MHz
18 pF
12 pF
10 pF
12 MHz
16 - 25 MHz
1) Note that these are evaluation start values!
TC1163/TC1164 Oscillator Circuitry
Figure 3-16 Oscillator Circuitries
Note: For crystal operation, it is strongly recommended to measure the negative
resistance in the final target system (layout) to determine the optimum parameters
for the oscillator operation. Please refer to the minimum and maximum values of
the negative resistance specified by the crystal supplier.
Data Sheet
82
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.23
Power Supply
The TC1163/TC1164 has several power supply lines for different voltage classes:
• 1.5 V: Core logic, oscillator and A/D converter supply
• 3.3 V: I/O ports, Flash memories, oscillator, and A/D converter supply with reference
voltages
Figure 3-17 shows the power supply concept of the TC1163/TC1164 with the power
supply pins and its connections to the functional units.
VDDAF VDDMF
VFAREF
(3.3V)
VFAGND
VDDM
(3.3V)
VSSM
VAREF
(3.3V)
VAGND
(1.5V)
(3.3V)
VSSAF VSSMF
2
2
2
2
2
TC1163/TC1164
FADC
ADC
VSSA
VDDA
(1.5 V)
1
1
PLL
Core
Flash
Memories
OSC
Ports
9
8
7
3
1
VDDOSC3 (3.3 V)
VDDOSC (1.5 V)
VSSOSC
VSS
VDD
(1.5 V)
VDDP
(3.3 V)
VDDFL3
3.3 V
TC1163/TC1164PwrSupply
Figure 3-17 Power Supply Concept of TC1163/TC1164
Data Sheet
83
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
3.24
Identification Register Values
Table 3-9 shows the address map and reset values of the TC1163/TC1164 Identification
Registers.
Table 3-9
Short Name
SCU_ ID
MANID
TC1163/TC1164 Identification Registers
Address
Reset Value
002C C002H
0000 1820H
0000 8B02H
0000 0001H
0000 0007H
0000 6A0AH
0000 C006H
0000 6307H
0028 C001H
0000 4402H
0000 4402H
0029 C004H
001A C012H
002B C012H
0000 4510H
0027 C012H
0030 C001H
0025 C006H
001B C001H
0015 C006H
000A C005H
002E C012H
0041 C002H
0008 C004H
000B C004H
000F C005H
000C C005H
Stepping
F000 0008H
F000 0070H
F000 0074H
F000 0078H
–
–
CHIPID
–
RTID
AA-Step
AB-Step
SBCU_ID
STM_ID
F000 0108H
F000 0208H
F000 0408H
F000 0808H
F000 0A08H
F000 0B08H
F000 1808H
F000 3C08H
F000 4008H
F010 0108H
F010 0308H
F010 0408H
F010 C008H
F010 C208H
F7E0 FF08H
F7E1 FE18H
F800 0508H
F800 2008H
F87F FC08H
F87F FD08H
F87F FE08H
F87F FF08H
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
CBS_ JDPID
MSC0_ ID
ASC0_ ID
ASC1_ ID
GPTA0_ ID
DMA_ID
CAN_ID1)
SSC0_ ID
FADC_ ID
ADC0_ID
MLI0_ ID
MCHK_ ID
CPS_ID
CPU_ID
PMU_ID
FLASH_ID
DMI_ID
PMI_ID
LBCU_ID
LFI_ID
Data Sheet
84
V1.0, 2008-04
TC1163/TC1164
Preliminary
Functional Description
1) The address and reset value of CAN_ID is not applicable to TC1163.
Data Sheet
85
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4
Electrical Parameters
Chapter 4 provides the characteristics of the electrical parameters which are
implementation-specific for the TC1163/TC1164.
4.1
General Parameters
The general parameters are described here to aid the users in interpreting the
parameters mainly in Section 4.2 and Section 4.3. The absolute maximum ratings and
its operating conditions are provided for the appropriate setting in the TC1163/TC1164.
4.1.1
Parameter Interpretation
The parameters listed in this section partly represent the characteristics of the
TC1163/TC1164 and partly its requirements on the system. To aid interpreting the
parameters easily when evaluating them for a design, they are marked with an two-letter
abbreviation in column “Symbol”:
• CC
Such parameters indicate Controller Characteristics which are a distinctive feature of
the TC1163/TC1164 and must be regarded for a system design.
• SR
Such parameters indicate System Requirements which must provided by the
microcontroller system in which the TC1163/TC1164 designed in.
Data Sheet
86
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.1.2
Pad Driver and Pad Classes Summary
This section gives an overview on the different pad driver classes and its basic
characteristics. More details (mainly DC parameters) are defined in Section 4.2.1.
Table 4-1
Pad Driver and Pad Classes Overview
Class Power Type
Supply
Sub Class Speed Load Leakage1) Termination
Grade
A
3.3V
LVTTL A1
6 MHz 100 pF 500 nA
No
I/O,
(e.g. GPIO)
LVTTL
outputs
A2
(e.g. serial
I/Os)
40
MHz
50 pF 6 µA
50 pF 6 µA
Series
termination
recommended
A3
80
Series
(e.g. BRKIN, MHz/
BRKOUT)
termination
recommended
(for f > 25 MHz)
A4
80
25 pF 6 µA
Series
(e.g. Trace MHz
Clock)
termination
recommended
C
D
3.3V
–
LVDS
–
50
MHz
–
Parallel
termination2),
100Ω ± 10%
Analog inputs, reference voltage inputs
1) Values are for TJmax = 125 °C.
2) In applications where the LVDS pins are not used (disabled), these pins must be either left unconnected, or
properly terminated with the differential parallel termination of 100Ω ± 10%.
Data Sheet
87
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.1.3
Absolute Maximum Ratings
Table 4-2 shows the absolute maximum ratings of the TC1163/TC1164 parameters.
Table 4-2
Absolute Maximum Rating Parameters
Parameter
Symbol
Limit Values
Unit Notes
Min.
SR -40
Max.
85
Ambient temperature
Storage temperature
Junction temperature
TA
TST
TJ
°C
°C
°C
V
Under bias
SR -65
SR -40
SR –
150
125
2.25
–
Under bias
–
Voltage at 1.5 V power supply VDD
pins with respect to VSS
1)
Voltage at 3.3 V power supply VDDP
pins with respect to VSS
SR –
3.75
V
V
–
2)
Voltage on any Class A input VIN
pin and dedicated input pins
with respect to VSS
SR -0.5
V
DDP + 0.5
Whateveris
lower
or
max. 3.7
Voltage on any Class D
analog input pin with respect VAREFx
to VAGND
VAIN,
SR -0.5
SR -0.5
V
DDM + 0.5 V
Whateveris
lower
or max. 3.7
Voltage on any Class D
analog input pin with respect VFAREF
VAINF,
V
DDMF + 0.5 V
Whateveris
lower
or max. 3.7
to VSSAF
CPU & LMB Bus Frequency
FPI Bus Frequency
fCPU
fSYS
SR –
SR –
803)
803)
MHz –
4)
MHz
1) Applicable for VDD, VDDOSC, VDDPLL, and VDDAF
2) Applicable for VDDP, VDDFL3, DDM, and VDDMF
.
V
.
3) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
4) The ratio between fCPU and fSYS is fixed at 1:1.
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > related VDD or
VIN < VSS) the voltage on the related VDD pins with respect to ground (VSS) must
not exceed the values defined by the absolute maximum ratings.
Data Sheet
88
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.1.4
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the TC1163/TC1164. All parameters specified in the following table refer to
these operating conditions, unless otherwise noted.
Table 4-3
Operating Condition Parameters
Symbol
Parameter
Limit
Values
Unit Notes
Conditions
Min. Max.
Digital supply voltage1)
VDD
VDDOSC
SR
SR
1.42 1.582)
V
V
–
VDDP
VDDOSC3
3.13 3.473)
For Class A
pins
(3.3V ± 5%)
VDDFL3
VSS
SR
SR
SR
3.13 3.473)
0
V
–
–
–
Digital ground voltage
V
Ambient temperature under TA
-40
+85
°C
bias
Analog supply voltages
–
–
–
–
See separate
specification
Page 4-95,
Page 4-102
4)
CPU clock
fCPU
ISC
SR
SR
SR
–
805)
+5
MHz –
6)
Short circuit current
-5
–
mA
Absolute sum of short circuit Σ|ISC|
currents of a pin group (see
Table 4-4)
20
mA See note7)
Absolute sum of short circuit Σ|ISC|
currents of the device
SR
SR
–
100
1
mA See note 7)
Inactive device pin current
IID
CL
-1
mA Voltage on all
power supply
pins VDDx = 0
External load capacitance
SR
–
See
DC
pF
Depending on
pin class
chara
cterist
ics
Data Sheet
89
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
1) Digital supply voltages applied to the TC1163/TC1164 must be static regulated voltages which allow a typical
voltage swing of ±5%.
2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 µs and the cumulated summary of the pulses does not exceed 1 h.
3) Voltage overshoot to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less than
100 µs and the cumulated summary of the pulses does not exceed 1 h.
4) The TC1163/TC1164 uses a static design, so the minimum operation frequency is 0 MHz. Due to test time
restriction no lower frequency boundary is tested, however.
5) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
6) Applicable for digital outputs.
7) See additional document “TC1796 Pin Reliability in Overload“ for overload current definitions.
Data Sheet
90
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-4
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Group
Pins
1
2
3
4
5
TRCLK, P5.[7:0], P0.[7:6], P0.[15:14]
P0.[13:12], P0.[5:4], P2.[13:8], SOP0A, SON0, FCLP0A, FCLN0
P0.[11:8], P0.[3:0], P3.[13:11]
P3[10:0], P3.[15:14]
HDRST, PORST, NMI, TESTMODE, BRKIN, BRKOUT, BYPASS, TCK,
TRST, TDO, TMS, TDI, P1.[7:4]
6
7
8
P1.[3:0], P1.[11:8], P4.[3:0]
P2.[7:0], P1.[14:12]
P5.[15:8]
Data Sheet
91
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.2
DC Parameters
The electrical characteristics of the DC Parameters are detailed in this section.
4.2.1
Input/Output Pins
Table 4-5 provides the characteristics of the input/output pins of the TC1163/TC1164.
Table 4-5
Input/Output DC-Characteristics (Operating Conditions apply)
Symbol Limit Values Unit Test Conditions
Parameter
Min.
Max.
General Parameters
Pull-up current1)
|IPUH| CC 10
100
200
150
200
10
µA VIN < VIHAmin
;
class A1/A2/Input pads.
20
CC 10
20
µA VIN < VIHAmin
;
class A3/A4 pads.
Pull-down
current1)
|IPDL
|
µA VIN > VILAmax
;
class A1/A2/Input pads.
µA VIN > VILAmax
;
class A3/A4 pads.
Pin capacitance1) CIO
CC –
pF f = 1 MHz
(Digital I/O)
TA = 25 °C
Input only Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%)
Input low voltage VILA
class A1/A2 pins
SR -0.3
0.34 ×
VDDP
V
V
–
Input high voltage VIHA
SR 0.64 × VDDP
+
Whatever is lower
class A1/A2 pins
VDDP
0.3 or
max. 3.6
Ratio VIL/VIH
CC 0.53
–
–
–
–
Input low voltage VILA3 SR –
0.8
V
class A3 pins
Input high voltage VIHA3 SR 2.0
class A3 pins
–
–
V
V
–
2)5)
Input hysteresis
HYSA CC 0.1 ×
VDDP
Input leakage
current
IOZI
CC –
±3000
±6000
nA ((VDDP/2)-1) < VIN
< ((VDDP/2)+1)
otherwise3)
Data Sheet
92
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-5
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Limit Values
Min. Max.
Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%)
Unit Test Conditions
Output low
voltage4)
VOLA CC –
0.4
V
IOL = 2 mA for strong driver
mode, (Not applicable to
Class A1 pins)
IOL = 1.8 mA for medium
driver mode, A2 pads
IOL = 1.4 mA for medium
driver mode, A1 pads
IOL = 370 µA for weak
driver mode
Output high
voltage3)
VOHA CC 2.4
–
V
IOH = -2 mA for strong
driver mode, (Not
applicable to Class A1
pins)
I
OH = -1.8 mA for medium
driver mode, A1/A2 pads
OH = -370 µA for weak
driver mode
OH = -1.4 mA for strong
I
VDDP
-
–
V
I
0.4
driver mode, (Not
applicable to Class A1
pins)
I
OH = -1 mA for medium
driver mode, A1/A2 pads
OH = -280 µA for weak
I
driver mode
Input low voltage VILA
class A1/2 pins
SR -0.3
0.34 ×
VDDP
V
V
–
Input high voltage VIHA
SR 0.64 × VDDP
+
Whatever is lower
class A1/2 pins
VDDP
0.3 or
3.6
Ratio VIL/VIH
CC 0.53
–
–
–
2)5)
Input hysteresis
Data Sheet
HYSA CC 0.1 ×
–
V
VDDP
93
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-5
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test Conditions
Min.
Max.
Input leakage
current Class
A2/3/4 pins
IOZA24 CC –
±3000
nA ((VDDP/2)-1) < VIN
<((VDDP/2)+1)
±6000
±500
otherwise3)
Input leakage
current
IOZA1 CC –
nA 0 V <VIN < VDDP
Class A1 pins
Class C Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%)
Output low voltage VOL
CC 815
CC
mV Parallel termination
100 Ω ± 1%
Output high
voltage
VOH
1545
600
mV
Output differential VOD
voltage
CC 150
CC 1075
CC 40
mV
mV
–
Output offset
voltage
VOS
1325
140
Output impedance R0
Class D Pads
see ADC Characteristics
–
–
–
–
1) Not subject to production test, verified by design / characterization.
2) The pads that have spike filter function in the input path: PORST, HDRST, NMI do not have hysteresis.
3) Only one of these parameters is tested, the other is verified by design characterization
4) Max. resistance between pin and next power supply pin 25 Ω for strong driver mode
(verified by design characterization).
5) Function verified by design, value is not subject to production test - verified by design/characterization.
Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It cannot
be guaranteed that it suppresses switching due to external system noise.
Data Sheet
94
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.2.2
Analog to Digital Converter (ADC0)
Table 4-6 provides the characteristics of the ADC module in the TC1163/TC1164.
Table 4-6
ADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Typ. Max.
Unit Test Conditions /
Remarks
Min.
SR 3.13
SR 1.42
Analog supply
voltage
VDDM
VDD
3.3
1.5
3.471)
1.582)
V
V
–
Power supply for
ADC digital part,
internal supply
Analog ground
voltage
VSSM
SR -0.1
–
0.1
V
–
Analog reference VAREFx
SR VAGNDx+ VDDM VDDM+ V
–
voltage 17)
1V
0.05
1)3)4)
Analog reference VAGNDx
SR VSSMx - 0
VAREF
- 1 V
V
V
–
ground 17)
0.05V
Analog reference VAREFx
-
SR VDDM/2
VDDM
+ 0.05
voltage range5)17) VAGNDx
Analog input
voltage range
VAIN
IDDM
tPUC
SR VAGNDx
SR
–
VAREFx
4
–
6)
VDDM
supply current
2.5
–
mA
rms
Power-up
calibration
time
CC –
3840 fADC
–
CLK
Internal ADC
clocks
fBC
fANA
tS
CC 2
–
–
40
10
MHz fBC = fANA × 4
MHz fANA = fBC / 4
CC 0.5
Sample time
CC 4 × (CHCONn.STC
+ 2) × tBC
µs
–
8 × tBC
–
–
µs
Data Sheet
95
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-6
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Limit Values
Typ. Max.
Unit Test Conditions /
Remarks
Min.
Conversion time tC
CC tS + 40 × tBC + 2 × tDIV µs
tS + 48 × tBC + 2 × tDIV µs
tS + 56 × tBC + 2 × tDIV µs
For 8-bit
conversion
For 10-bit
conversion
For 12-bit
conversion
Total unadjusted TUE7)
error 5)
CC –
–
–
–
–
±1
±2
±4
±8
LSB For 8-bit conv.
LSB For 10-bit conv.
LSB For 12-bit conv.8)9)
–
–
–
LSB For 12-bit
conv.10)9)
DNL error11)5)
INL error11)5)
Gain error11)5)
Offset error11)5)
TUEDNL
TUEINL
TUEGAIN
TUEOFF
CC –
CC –
CC –
CC –
CC –1000
–200
±1.5 ±3.0
±1.5 ±3.0
±0.5 ±3.5
±1.0 ±4.0
LSB For 12-bit conv.12)
9)
LSB For 12-bit conv.12)
9)
LSB For 12-bit conv.12)
9)
LSB For 12-bit conv.12)
9)
14)
Input leakage
IOZ1
–
300
nA
nA
(0% VDDM) < VIN <
(2% VDDM
(2% VDDM) < VIN <
(95% VDDM
(95% VDDM) < VIN
< (98% VDDM
(98% VDDM) < VIN
< (100% VDDM
current at analog
inputs AN0, AN1
and AN31.
)
400
)
see Figure 4-313)
–200
1000 nA
3000 nA
)
–200
)
Data Sheet
96
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-6
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Limit Values
Typ. Max.
Unit Test Conditions /
Remarks
Min.
14)
Input leakage
current at analog
inputs AN2 to
AN30, see
IOZ1
CC –1000
–
200
nA
nA
(0% VDDM) < VIN <
(2% VDDM
(2% VDDM) < VIN <
(95% VDDM
(95% VDDM) < VIN
< (98% VDDM
(98% VDDM) < VIN
< (100% VDDM
)
–200
–200
300
)
Figure 4-3
1000 nA
3000 nA
)
–200
)
Input leakage
current at VAREF
IOZ2
CC –
–
±1
µA
0 V < VAREF
DDM, no
<
V
conversion
running
Input current at
VAREF
IAREF
CC –
35
–
75
25
µA
0 V < VAREF
<
17)
15)
rms VDDM
9)
Total capacitance CAREFTOT CC –
of the voltage
pF
reference
inputs16)17)
9)18)
Switched
CAREFSW CC –
15
1
20
pF
capacitance at
the positive
reference voltage
input 17)
Resistance of the RAREF
reference voltage
input path16)
CC –
1.5
kΩ
500 Ohm
increased for
AN[1:0] used as
reference input 9)
6)9)
Total capacitance CAINTOT
of the analog
CC –
CC –
–
–
25
7
pF
pF
inputs16)
9)19)
Switched
CAINSW
capacitance at
the analog
voltage inputs
Data Sheet
97
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-6
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Limit Values
Typ. Max.
1.5
Unit Test Conditions /
Remarks
Min.
CC –
9)
ON resistance of RAIN
the transmission
gates in the
1
kΩ
analog voltage
path
ON resistance for RAIN7T
the ADC test
(pull-down for
AIN7)
CC 200
CC –
300 1000
Ω
Test feature
available only for
AIN7
9)
Current through IAIN7T
resistance for the
ADC test (pull-
15
30
mA Test feature
available only for
AIN7
rms peak
9)
down for AIN7)
1) Voltage overshoot to 4 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
summary of the pulses does not exceed 1 h.
2) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
summary of the pulses does not exceed 1 h.
3) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoot).
4) If the reference voltage VAREF increases or the VDDM decreases, so that VAREF = ( VDDM + 0.05 V to
V
DDM + 0.07 V), then the accuracy of the ADC decreases by 4LSB12.
5) If a reduced reference voltage in a range of VDDM/2 to VDDM is used, then the ADC converter errors increase.
If the reference voltage is reduced with the factor k (k<1), then TUE, DNL, INL Gain and Offset errors increase
with the factor 1/k.
If a reduced reference voltage in a range of 1 V to VDDM/2 is used, then there are additional decrease in the
ADC speed and accuracy.
6) Current peaks of up to 6 mA with a duration of max. 2 ns may occur
7) TUE is tested at VAREF = 3.3 V, VAGND = 0 V and VDDM = 3.3 V
8) ADC module capability.
9) Not subject to production test, verified by design / characterization.
10) Value under typical application conditions due to integration (switching noise, etc.).
11) The sum of DNL/INL/Gain/Offset errors does not exceed the related TUE total unadjusted error.
12) For 10-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with factor 0.25.
For 8-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with 0.0625.
13) The leakage current definition is a continuous function, as shown in Figure 4-3. The numerical values defined
determine the characteristic points of the given continuous linear approximation - they do not define step
function.
14) Only one of these parameters is tested, the other is verified by design characterization.
Data Sheet
98
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
15) IAREF_MAX is valid for the minimum specified conversion time. The current flowing during an ADC conversion
with a duration of up to tC = 25µs can be calculated with the formula IAREF_MAX = QCONV/tC. Every conversion
needs a total charge of QCONV = 150pC from VAREF
.
All ADC conversions with a duration longer than tC = 25µs consume an IAREF_MAX = 6µA.
16) For the definition of the parameters see also Figure 4-2.
17) Applies to AIN0 and AIN1, when used as auxiliary reference inputs.
18) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this smaller capacitances are successively switched to the reference voltage.
19) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before the sampling moment.
Because of the parasitic elements the voltage measured at AINx is lower then VAREF/2.
A/D Converter Module
Sample
Time tS
Programmable
Clock Divider
(1:1) to (1:256)
fANA
fDIV
fBC
Fractional
Divider
Programmable
Counter
fCLC
1:4
CON. CTC
CHCONn. STC
fTIMER
Arbiter
(1:20)
Control Unit
(Timer)
Control/Status Logic
Interrupt Logic
External Trigger Logic
External Multiplexer Logic
Request Generation Logic
MCA04657_mod
Figure 4-1
ADC0 Clock Circuit
Data Sheet
99
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Analog Input Circuitry
RAIN, On
REXT
ANx
VAIN
CEXT
CAINSW
=
CAINTOT - CAINSW
VAGNDx
RAIN7T
Reference Voltage Input Circuitry
RAREF, On
VAREFx
VAREF
CAREFTOT - CAREFSW
CAREFSW
VAGNDx
Analog_InpRefDiag
Figure 4-2
ADC0 Input Circuits
Data Sheet
100
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Ioz1
3uA
AN0, AN1 and AN31
1uA
400nA
300nA
VIN[VDDM%]
-200nA
95% 98%100%
2%
-1uA
Ioz1
3uA
AN2 to AN30
1uA
300nA
200nA
V
IN[VDDM%]
-200nA
2%
95% 98%100%
-1uA
Figure 4-3
ADC0 Analog Inputs Leakage
Data Sheet
101
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.2.3
Fast Analog to Digital Converter (FADC)
Table 4-7 provides the characteristics of the FADC module in the TC1163/TC1164.
Table 4-7
FADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit
Remarks
Conditions
Min.
Max.
±1
12)
DNL error
EDNL
EINL
CC –
CC –
LSB
LSB
%
12)
INL error
Gradient error1)12)
±4
EGRAD CC –
±3
2)With calibration,
gain 1, 2
–
±5
±6
%
%
Without calibration
gain 1, 2, 4
–
Without calibration
gain 8
3)
Offset error12)
EOFF
CC –
–
±204)
±604)
±60
mV
mV
mV
2)With calibration
Without calibration
–
Reference error of
EREF
CC –
internal VFAREF/2
6)
Input leakage current IOZ1
at analog inputs
CC –1000
–200
300
nA
nA
nA
nA
(0% VDDM) < VIN <
(2% VDDM
(2% VDDM) < VIN <
(95% VDDM
(95% VDDM) < VIN <
(98% VDDM
(98% VDDM) < VIN <
)
AN32 to AN35.
400
5) see Figure 4-5
)
–200
1000
3000
)
–200
(100% VDDM
)
Analog supply
voltages
VDDMF SR 3.13
VDDAF SR 1.42
VSSAF SR -0.1
3.477)
1.588)
0.1
V
V
V
–
–
–
Analog ground
voltage
Analog reference
voltage
VFAREF SR 3.13
3.477)9)
V
V
V
Nominal 3.3 V
Analog reference
ground
VFAGND SR VSSAF
-
VSSAF
+0.05V
–
–
0.05V
Analog input voltage VAINF SR VFAGND VDDMF
range
Data Sheet
102
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-7
FADC Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit
Remarks
Conditions
Min.
Max.
9
Analog supply
currents
IDDMF SR –
IDDAF SR –
mA
mA
–
10)
17
Input current at each IFAREF CC –
VFAREF
150
µA
rms
Independent of
conversion
Input leakage current IFOZ2
at VFAREF
CC –
CC
±500
±8
nA
0 V < VIN < VDDMF
11)
Input leakage current IFOZ3
at VFAGND
µA
Conversion time
tC
CC –
CC –
21
CLK of For 10-bit conv.
fADC
Converter Clock
fADC
80
MHz
–
12)
Input resistance of
the analog voltage
path (Rn, Rp)
RFAIN CC 100
200
kΩ
Channel Amplifier
Cutoff Frequency
fCOFF
tSET
CC 2
CC
MHz
–
–
Settling Time of a
Channel Amplifier
after changing ENN
or ENP
5
µsec
1) Calibration of the gain is possible for the gain of 1 and 2, and not possible for the gain of 4 and 8.
2) Callibration should be performed at each power-up. In case of continuous operation, callibration should be
performed minimum once per week.
3) The offset error voltage drifts over the whole temperature range typically ±2 LSB.
4) Applies when the gain of the channel equals one. For the other gain settings, the offset error increases; it must
be multiplied with the applied gain.
5) The leakage current definition is a continuous function, as shown in Figure 4-5. The numerical values defined
determine the characteristic points of the given continuous linear approximation - they do not define step
function.
6) Only one of these parameters is tested, the other is verified by design characterization.
7) Voltage overshoot to 4 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
summary of the pulses does not exceed 1 h.
8) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
sum of the pulses does not exceed 1 h.
9) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoots).
10) Current peaks of up to 40 mA with a duration of max. 2 ns may occur
Data Sheet
103
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
11) This value applies in power-down mode.
12) Not subject to production test, verified by design / characterization.
The calibration procedure should run after each power-up, when all power supply
voltages and the reference voltage have stabilized. The offset calibration must run first,
followed by the gain calibration.
FADC Analog Input Stage
RN
FAINxN
-
+
VFAREF/2
VFAGND
+
-
RP
FAINxP
FADC Reference Voltage
Input Circuitry
VFAREF
IFAREF
VFAREF
VFAGND
FADC_InpRefDiag
Figure 4-4
FADC Input Circuits
Data Sheet
104
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Ioz1
3uA
AN32 to AN35
1uA
400nA
300nA
V
IN[VDDM%]
-200nA
95% 98%100%
2%
-1uA
Figure 4-5
Analog Inputs AN32-AN35 Leakage
Data Sheet
105
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.2.4
Oscillator Pins
Table 4-8 provides the characteristics of the oscillator pins in the TC1163/TC1164.
Table 4-8
Oscillator Pins Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit values
Max.
Unit Test Conditions
Min.
Frequency Range
fOSC CC 4
25
MHz –
Input low voltage at
XTAL11)
VILX SR -0.2
0.3 ×
VDDOSC3
V
–
Input high voltage at
XTAL11)
VIHX SR 0.7 ×
VDDOSC3
+ 0.2
V
–
VDDOSC3
Input current at XTAL1 IIX1
CC –
±25
µA
0 V < VIN < VDDOSC3
1) If the XTAL1 pin is driven by a crystal, reaching a minimum amplitude (peak-to-peak) of 0.3 × VDDOSC3 is
necessary.
Note: It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimal parameters
for the oscillator operation. Please refer to the limits specified by the crystal
supplier.
Data Sheet
106
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.2.5
Temperature Sensor
Table 4-9 provides the characteristics of the temperature sensor in the TC1163/TC1164.
Table 4-9
Temperature Sensor Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Max.
Unit Remarks
Min.
Temperature TSR SR -40
150
°C
–
Sensor Range
Start-up time tTSST SR
after resets
10
µs
inactive
Temperature TTS CC TTS = (ADC_Code - 487) × 0.396 - 40 °C
of the die at
10-bit ADC
result
the sensor
location
TTS = (ADC_Code - 1948) × 0.099 - 40 °C
12Bit ADC
result
Sensor
TTSA CC
±10
°C
Inaccuracy
A/D Converter fANA SR –
clock for DTS
10
MHz Conversion
with ADC0
signal
Data Sheet
107
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.2.6
Power Supply Current
Table 4-10 provides the characteristics of the power supply current in the
TC1163/TC1164.
Table 4-10 Power Supply Current (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test
Conditions /
Min. Typ. Max.
Remarks
PORST low current at IDD_PORST CC
–
–
63
mA The PLL
VDD
running at the
base frequency
mA The PLL
PORST low current at IDDP_PORST CC
–
–
5
VDDP
running at the
base frequency
Active mode core
supply current1)
IDD
CC
CC
CC
CC
CC
CC
SR
–
–
–
–
–
–
–
–
–
–
–
–
260
–
mA
f
CPU = 80MHz
fCPU/fSYS = 1:1
Active mode analog
supply current
IDDAx;
IDDMx
mA See
ADC0/FADC
Oscillator and PLL
core power supply
IDDOSC
5
mA
–
Oscillator and PLL
pads power supply
IDDOSC3
3.62) mA
–
–
FLASH power supply IDDFL3
current
45
25
mA
LVDS port supply
ILVDS
mA LVDS pads
active
3)
(via VDDP
)
Maximum Allowed
Power Dissipation4)
PDmax
PD × RTJA < 40°C
–
At worst case,
TA = 85 °C
1) Infineon Power Loop: CPU running, all peripherals active. The power consumption of each custom application
will most probably be lower than this value, but must be evaluated separately.
2) Estimated value; double-bonded at package level with VDDP
.
3) In case the LVDS pads are disabled, the power consumption per pair is negligible (less than 1mA).
4) For the calculation of the junction to ambient thermal resistance RTJA, see Chapter 5.1.
Data Sheet
108
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3
AC Parameters
All AC parameters are defined with the temperature compensation disabled, which
means that pads are constantly kept at the maximum strength.
4.3.1
Testing Waveforms
The testing waveforms for rise/fall time, output delay and output high impedance are
shown in Figure 4-6, Figure 4-7 and Figure 4-8.
VDDP
90%
90%
10%
10%
VSS
tF
tR
rise_fall
Figure 4-6
Rise/Fall Time Parameters
VDDP
VDDE / 2
VDDE / 2
Test Points
VSS
Mct04881_LL.vsd
Figure 4-7
Testing Waveform, Output Delay
VLoad + 0.1 V
VLoad - 0.1 V
VOH - 0.1 V
Timing
Reference
Points
VOL - 0.1 V
MCT04880_LL
Figure 4-8
Testing Waveform, Output High Impedance
Data Sheet
109
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.2
Output Rise/Fall Times
Table 4-11 provides the characteristics of the output rise/fall times in the
TC1163/TC1164.
Table 4-11 Output Rise/Fall Times (Operating Conditions apply)
Parameter
Symbol
Limit Values Unit Test Conditions
Min. Max.
Class A1 Pads
Rise/fall times1)
Class A1 pads
tRA1, tFA1
50
140
18000
150
ns
Regular (medium) driver, 50 pF
Regular (medium) driver, 150 pF
Regular (medium) driver, 20 nF
Weak driver, 20 pF
550
Weak driver, 150 pF
65000
Weak driver, 20 000 pF
Class A2 Pads
Rise/fall times 1)
Class A2 pads
tFA2, tFA2
3.3
6
5.5
16
ns
Strong driver, sharp edge, 50 pF
Strong driver, sharp edge, 100pF
Strong driver, med. edge, 50 pF
Strong driver, soft edge, 50 pF
Medium driver, 50 pF
50
140
18000
150
550
65000
Medium driver, 150 pF
Medium driver, 20 000 pF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
Class A3 Pads
Rise/fall times 1)
Class A3 pads
t
FA3, tFA3
2.5
2.0
2
ns
ns
ns
50 pF
25 pF
Class A4 Pads
Rise/fall times 1)
Class A4 pads
tFA4, tFA4
Class C Pads
Rise/fall times
Class C pads
trC, tfC
1) Not all parameters are subject to production test, but verified by design/characterization and test correlation.
Data Sheet
110
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.3
Power Sequencing
There is a restriction for the power sequencing of the 3.3 V domain as shown in
Figure 4-9. It must always be higher than 1.5 V domain - 0.5 V. The gray area shows the
valid range for V3.3V relative to an exemplary V1.5V ramp. VDDP, VDDOSC3, VDDM, VDDMF
,
VDDFL3 belong to the 3.3 V domain. The VDDM and VDDMF subdomains are connected with
antiparallel ESD protection diodes. There are no other such connections between the
subdomains. VDD , VDDOSC and VDDAF belong to the 1.5 V domain.
Power Supply Voltage
3.3V
V3.3
V1.5
3
.
3
1.5V
3
.
3
V3.3 > V1.5 - 0.5V
Time
VDDP
(3.3V)
PORST
Time
PowerSeq
Figure 4-9
Power Up Sequence
All ground pins VSS must be externally connected to one single star point in the system.
The difference voltage between the ground pins must not exceed 200 mV.
The PORST signal must be activated at latest before any power supply voltage falls
below the levels shown on the figure below. In this case, only the memory row of a Flash
memory that was the target of the write at the moment of the power loss will contain
unreliable content. Additionally, the PORST signal should be activated as soon as
possible. The sooner the PORST signal is activated, the less time the system operates
outside of the normal operating power supply range.
Data Sheet
111
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Power Supply Voltage
3.3V
VDDP
VDDP
VDDPmin
3.13V
-5%
2.9V
-12%
VPORST3.3
t
PORST
t
VDD
1.5V
VDD
VDDmin
VPORST1.5min
1.42V
-5%
1.32V
-12%
t
PORST
t
PowerDown3.3_1.5_reset_only_LL.vsd
Figure 4-10 Power Down / Power Loss Sequence
Data Sheet
112
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.4
Power, Pad and Reset Timing
Table 4-12 provides the characteristics of the power, pad and reset timing in the
TC1163/TC1164.
Table 4-12 Power, Pad and Reset Timing Parameters
Parameter
Symbol
Limit Values
Unit
Min.
CC 0.6
Max.
Min. VDDP voltage to ensure defined
VDDPPA
–
V
pad states1)
Oscillator start-up time2)
tOSCS
tPOA
CC –
10
–
ms
ms
Minimum PORST active time after
power supplies are stable at operating
levels
SR 10
HDRST pulse width
tHD
CC 1024 clock –
cycles3)
fSYS
PORST rise time
Setup time to PORST rising edge4)
Hold time from PORST rising edge4) tPOH
Setup time to HDRST rising edge5)
Hold time from HDRST rising edge5) tHDH
tPOR
tPOS
SR –
50
ms
ns
ns
ns
ns
SR 0
–
–
–
–
SR 100
SR 0
tHDS
SR 100 +
(2 × 1/fSYS
)
Ports inactive after PORST reset
active6)7)
tPIP
tPI
CC –
CC –
150
ns
ns
V
Ports inactive after HDRST reset
active8)
150 +
5 × 1/fSYS
Minimum VDDP PORST activation
VPORST3.3 SR –
VPORST1.5 SR –
2.9
threshold.9)
Minimum VDD PORST activation
1.32
V
threshold. 9)
Power-on Reset Boot Time10)
tBP
CC 2.15
CC 500
3.50
800
ms
Hardware/Software Reset Boot Time tB
µs
at fCPU=80MHz11)
1) This parameter is valid under assumption that PORST signal is constantly at low-level during the power-
up/power-down of the VDDP
.
2) This parameter is verified by device characterization. The external oscillator circuitry must be optimized by the
customer and checked for negative resistance as recommended and specified by crystal suppliers.
3) Any HDRST activation is internally prolonged to 1024 FPI bus clock (fSYS) cycles.
Data Sheet
113
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4) Applicable for input pins TESTMODE, TRST, BRKIN, and TXD1A with noise suppression filter of PORST
switched-on (BYPASS = 0).
5) The setup/hold values are applicable for Port 0 and Port 4 input pins with noise suppression filter of HDRST
switched-on (BYPASS = 0), independently whether HDRST is used as input or output.
6) Not subject to production test, verified by design / characterization.
7) This parameter includes the delay of the analog spike filter in the PORST pad.
8) Not subject to production test, verified by design / characterization.
9) In case of power loss during internal flash write, prevents Flash write to random address.
10) Booting from Flash, the duration of the boot-time is defined between the rising edge of the PORST and the
moment when the first user instruction has entered the CPU and its processing starts.
11) Booting from Flash, the duration of the boot time is defined between the following events:
1. Hardware reset: the falling edge of a short HDRST pulse and the moment when the first user instruction has
entered the CPU and its processing starts, if the HDRST pulse is shorter than 1024 × TSYS
.
If the HDRST pulse is longer than 1024 × TSYS, only the time beyond the 1024 × TSYS should be added to the
boot time (HDRST falling edge to first user instruction).
2. Software reset: the moment of starting the software reset and the moment when the first user instruction
has entered the CPU and its processing starts
VDDPPA
VDDPPA
VDDP
VDDPR
VDD
t
oscs
OSC
t
POA
t
POA
PORST
HDRST
Pads
t
hd
t
hd
2)
1)
1)
2)
2)
t
pi
Pad-
state
undefined
Pad-
state
undefined
1) as programmed
2) Tri-state, pull device active
reset_beh
Figure 4-11 Power, Pad and Reset Timing
Data Sheet
114
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.5
Phase Locked Loop (PLL)
Section 4.3.5 provides the characteristics of the PLL parameters and its operation in the
TC1163/TC1164.
Note: All PLL characteristics defined on this and the next page are verified by design
characterization.
Table 4-13 PLL Parameters (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit
Min.
Max.
Accumulated jitter
DP
See Figure 4-12
–
VCO frequency range
fVCO
400
500
600
140
150
200
–
500
600
700
320
400
480
200
MHz
MHz
MHz
MHz
MHz
MHz
µs
PLL base frequency1)
fPLLBASE
PLL lock-in time
tL
1) The CPU base frequency which is selected after reset is calculated by dividing the limit values by 16 (this is
the K factor after reset).
Phase Locked Loop Operation
When PLL operation is enabled and configured, the PLL clock fVCO (and with it the CPU
clock fCPU) is constantly adjusted to the selected frequency. The relation between fVCO
and fSYS is defined by: fVCO = K × fCPU. The PLL causes a jitter of fCPU and affects the
clock outputs TRCLK and SYSCLK (P4.3) which are derived from the PLL clock fVCO
.
There are two formulas that define the (absolute) approximate maximum value of jitter
DP in ns dependent on the K-factor, the CPU clock frequency fCPU in MHz, and the
number P of consecutive fCPU clock periods.
5 × P
fcpu[MHz]
(4.1)
P × K < 900
P × K ≥ 900
Dp[ns] = ± ----------------------------- + 0 , 9
4500
(4.2)
Dp[ns] = ± ---------------------------------------- + 0 , 9
fcpu[MHz] × K
K : K-Divider Value
P : Number of fCPU periods
DP : Jitter in ns
fCPU : CPU frequency in MHz
Data Sheet
115
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Note: The frequency of system clock fSYS can be selected to be either fCPU or fCPU/2.
With rising number P of clock cycles the maximum jitter increases linearly up to a value
of P that is defined by the K-factor of the PLL. Beyond this value of P the maximum
accumulated jitter remains at a constant value. Further, a lower CPU clock frequency
fCPU results in a higher absolute maximum jitter value.
Figure 4-12 illustrates the jitter curve for several K/ fCPU combinations.
TC1163/TC1164 PLL Jitter (Preliminary)
±13.0
±12.0
fCPU = 80 MHz (K = 5)
fCPU = 40 MHz (K = 10)
±11.0
±10.0
fCPU = 66 MHz ( K = 7)
±9.0
±8.0
fCPU = 40 MHz
(K = 17)
fCPU = 80 MHz (K = 8)
fCPU = 66 MHz (K = 10)
±7.0
±6.0
±5.0
±4.0
±3.0
±2.0
±1.0
±0.0
1
25
50
75
100
125
150
175
oo
P [Periods]
TC1163/TC1164 PLL Jitter
Figure 4-12 Approximated Maximum Accumulated PLL Jitter for Typical CPU
Clock Frequencies fCPU (overview)
Data Sheet
116
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
TC1163/TC1164 PLL Jitter (preliminary )
±1.40
±1.30
±1.20
±1.10
fCPU = 40 MHz
fCPU = 66 MHz
fCPU = 80 MHz
±1.00
±0.90
1
2
3
4
5
P [Periods]
TC1163/TC1164 PLL Jitter -Detail
Figure 4-13 Approximated Maximum Accumulated PLL Jitter for Typical CPU
Clock Frequencies fCPU (detail)
Note: The maximum peak-to-peak noise on the main oscillator and PLL power supply
(measured between VDDOSC and VSSOSC) is limited to a peak-to-peak voltage of
VPP = 10 mV. This condition can be achieved by appropriate blocking to the supply
pins and using PCB supply and ground planes.
Data Sheet
117
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.6
Debug Trace Timing
VSS = 0 V; VDDP = 3.13 to 3.47 V (Class A); TA = -40 °C to +85 °C;
CL (TRCLK) = 25 pF; CL (TR[15:0]) = 50 pF
Table 4-14 Debug Trace Timing Parameter1)
Parameter
Symbol
Limit Values
Unit
Min.
CC -1
Max.
TR[15:0] new state from TRCLK
t9
4
ns
1) Not subject to production test, verified by design/characterization.
TRCLK
t9
Old State
New State
TR[15:0]
Trace_Tmg
Figure 4-14 Debug Trace Timing
Data Sheet
118
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.7
Timing for JTAG Signals
(Operating Conditions apply, CL = 50 pF)
Table 4-15 TCK Clock Timing Parameter
Parameter
Symbol
Limit Values
Unit
Min.
SR 25
Max.
TCK clock period1)
TCK high time
tTCK
t1
–
–
–
4
4
ns
ns
ns
ns
ns
SR 10
SR 10
SR –
SR –
TCK low time
t2
TCK clock rise time
t3
TCK clock fall time
t4
1) fTCK should be lower or equal to fSYS
0.9 VDD
0.5 VDD
0.1 VDD
TCK
t1
t2
t4
t3
tTCK
Figure 4-15 TCK Clock Timing
Data Sheet
119
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
Table 4-16 JTAG Timing Parameter1)
Parameter
Symbol
Limit
Values
Unit Test
Conditions /
Remarks
Min. Max.
TMS setup to TCK
TMS hold to TCK
t1
t2
t1
t2
t3
SR 6.0
–
ns
ns
ns
ns
–
–
–
–
SR 6.0
–
–
–
TDI setup to TCK
SR 6.0
SR 6.0
TDI hold to TCK
TDO valid output from TCK2)
CC –
3.0
14.5 ns
–
CL = 50 pF3)4)
CL = 20 pF
TDO high impedance to valid output
from TCK2)
t4
t5
CC –
15.5 ns
CL = 50 pF3)4)
TDO valid output to high impedance
from TCK2)
CC –
14.5 ns
CL = 50 pF4)
1) Not subject to production test, verified by design / characterization.
2) The falling edge on TCK is used to capture the TDO timing.
3) By reducing the load from 50 pF to 20 pF, a reduction of approximately 1.0 ns in timing is expected.
4) By reducing the power supply range from +/-5 % to +5/-2 %, a reduction of approximately 0.5 ns in timing is
expected.
Data Sheet
120
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
TCK
t1
t2
TMS
TDI
t1
t2
t4
t5
t3
TDO
Figure 4-16 JTAG Timing
Note: The JTAG module is fully compliant with IEEE1149.1-2000 with JTAG clock at
20 MHz. The JTAG clock at 40 MHz is possible with the modified timing diagram
shown in Figure 4-16.
Data Sheet
121
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.8
Peripheral Timings
Section 4.3.8 provides the characteristics of the peripheral timings in the
TC1163/TC1164.
Note: Peripheral timing parameters are not subject to production test. They are verified
by design/characterization.
4.3.8.1 Micro Link Interface (MLI) Timing
Table 4-17 provides the characteristics of the MLI timing in the TC1163/TC1164.
Table 4-17 MLI Timing (Operating Conditions apply, CL = 50 pF)
Parameter
Symbol
Limit Values
Unit
Min.
CC 23)
Max.
TCLK clock period1)2)
RCLK clock period
t30
t31
t35
–
–
8
1/fSYS
1/fSYS
ns
SR
CC
1
0
MLI outputs delay from TCLK
MLI inputs setup to RCLK
MLI inputs hold to RCLK
t36
t37
t38
SR
SR
CC
4
4
0
–
–
8
ns
ns
ns
RREADY output delay from RCLK
1) TCLK signal rise/fall times are the same as the A2 Pads rise/fall times.
2) TCLK high and low times can be minimum 1 × TMLI
3) TMLImin = TSYS = 1/fSYS. When fSYS = 80MHz, t30 = 25ns
Data Sheet
122
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
t30
0.9 VDDP
0.1 VDDP
TCLKx
t35
t35
TDATAx
TVALIDx
TREADYx
RCLKx
t30
t37
t36
RDATAx
RVALIDx
t38
t38
RREADYx
MLI_Tmg_1.vsd
Figure 4-17 MLI Interface Timing
Note: The generation of RREADYx is in the input clock domain of the receiver. The
reception of TREADYx is asynchronous to TCLKx.
Data Sheet
123
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.8.2 Micro Second Channel (MSC) Interface Timing
Table 4-18 provides the characteristics of the MSC timing in the TC1163/TC1164.
Table 4-18 MSC Interface Timing (Operating Conditions apply, CL = 50 pF)
Parameter
Symbol
Limit Values
Unit
Min.
Max.
FCLP clock period1)2)
t40
t45
CC 2 × TMSC
–
ns
ns
3)
SOP/ENx outputs delay from FCLP
CC -10
10
SDI bit time
SDI rise time
SDI fall time
t46
t48
t49
SR 8 × TMSC
–
ns
ns
ns
SR
SR
100
100
1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times.
2) FCLP signal high and low can be minimum 1 × TMSC
.
3) TMSCmin = TSYS = 1/fSYS. When fSYS = 80MHz, t40 = 25ns
t40
0.9 VDDP
0.1 VDDP
FCLP
t45
t45
SOP
EN
t48
t49
0.9 VDDP
0.1 VDDP
SDI
t46
t46
MSC_Tmg_1.vsd
Figure 4-18 MSC Interface Timing
Note: The data at SOP should be sampled with the falling edge of FCLP in the target
device.
Data Sheet
124
V1.0, 2008-04
TC1163/TC1164
Preliminary
Electrical Parameters
4.3.8.3 Synchronous Serial Channel (SSC) Master Mode Timing
Table 4-19 provides the characteristics of the SSC timing in the TC1163/TC1164.
Table 4-19 SSC Master Mode Timing (Operating Conditions apply, CL = 50 pF)
Parameter
Symbol
Limit Values
Unit
Min.
Max.
SCLK clock period1)2)
t50
t51
CC 2 × TSSC
–
8
ns
ns
3)
MTSR/SLSOx delay from SCLK
CC 0
MRST setup to SCLK
MRST hold from SCLK
t52
t53
SR 10
SR 5
–
–
ns
ns
1) SCLK signal rise/fall times are the same as the A2 Pads rise/fall times.
2) SCLK signal high and low times can be minimum 1 × TSSC
3) TSSCmin = TSYS = 1/fSYS. When fSYS = 80 MHz, t50 = 25ns
.
t50
SCLK1)2)
t51
t51
MTSR1)
t52
t53
Data
valid
MRST1)
t51
SLSOx2)
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0
and the first SCLK high pulse is in the first one of a transmission.
SSC_Tmg_1.vsd
Figure 4-19 SSC Master Mode Timing
Data Sheet
125
V1.0, 2008-04
TC1163/TC1164
Preliminary
Package and Reliability
5
Package and Reliability
Chapter 5 provides the information of the TC1163/TC1164 package and reliability
section.
5.1
Package Parameters (PG-LQFP-176-2)
Table 5-1 provides the thermal characteristics of the package.
Table 5-1
Thermal Characteristics of the Package
Symbol Limit Values
Parameter
Unit Notes
Min.
Max.
Thermal resistance junction RTJCT CC
–
5.4
K/W –
K/W –
case top1)
Thermal resistance junction RTJL CC
–
21.5
leads1)
1) The thermal resistances between the case top and the ambient (RTCAT), the leads and the ambient (RTLA) are
to be combined with the thermal resistances between the junction and the case top (RTJCT ), the junction and
the leads (RTJL) given above, in order to calculate the total thermal resistance between the junction and the
ambient (RTJA). The thermal resistances between the case top and the ambient (RTCAT ), the leads and the
ambient (RTLA) depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA
can be obtained from the upper four partial thermal resistances.
Data Sheet
126
V1.0, 2008-04
TC1163/TC1164
Preliminary
Package and Reliability
5.2
Package Outline
Figure 5-1 shows the package outlines of the TC1163/TC1164.
PG-LQFP-176-2
Plastic Low Profile Quad Flat Package
Figure 5-1
Package Outlines PG-LQFP-176-2
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
V1.0, 2008-04
SMD = Surface Mounted Device
Data Sheet
127
TC1163/TC1164
Preliminary
Package and Reliability
5.3
Flash Memory Parameters
The data retention time of the TC1163/TC1164’s Flash memory (i.e. the time after which
stored data can still be retrieved) depends on the number of times the Flash memory has
been erased and programmed.
Table 5-2
Flash Parameters
Symbol
Parameter
Limit Values
Unit
Notes
Min.
Max.
Program Flash
tRET
15
–
years Max. 1000
erase/program cycles
Retention Time,
Physical Sector1)2)
Program Flash
Retention Time,
Logical Sector1)2)
tRETL
15
–
years Max. 50
erase/program cycles
Data Flash Endurance
(128 Kbyte)
NE
15 000
–
–
–
–
Max. data retention
time 2 years
Data Flash Endurance, NE8
EEPROM Emulation
(8 × 16 Kbyte)
120 000
Max. data retention
time 2 years
Programming Time per tPR
–
–
5
5
ms
s
–
Page3)
Program Flash Erase
Time per 256-Kbyte
sector
tERP
f
CPU = 80 MHz
CPU = 80 MHz
Data Flash Erase Time tERD
–
0.625 s
f
per 16-Kbyte sector
Wake-up time
tWU
4300 × 1/fCPU + 40µs
1) Storage and inactive time included.
2) At average weighted junction temperature TJ = 100 °C.
3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The
reprogramming takes additional 5ms.
Data Sheet
128
V1.0, 2008-04
TC1163/TC1164
Preliminary
Package and Reliability
5.4
Quality Declaration
Table 5-3 shows the characteristics of the quality parameters in the TC1163/TC1164.
Table 5-3
Quality Parameters
Symbol
Parameter
Limit Values Unit
Notes
Min.
Max.
ESD susceptibility
accordingtoHumanBody
Model (HBM)
VHBM
–
2000
V
Conforming to
EIA/JESD22-
A114-B
ESD susceptibility of the VHBM1
LVDS pins
–
–
500
500
V
V
–
ESD susceptibility
VCDM
Conforming to
according to Charged
Device Model (CDM) pins
JESD22-C101-C
Moisture Sensitivity Level –
(MSL)
–
3
–
Conforming to
J-STD-020C for
240°C
Note: Information about soldering can be found on the “package” information page
under: http://www.infineon.com/products.
Data Sheet
129
V1.0, 2008-04
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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