TLE493D-W2B6 A0 [INFINEON]
Infineon´s 3D magnetic sensor family TLE493D offers accurate three dimensional sensing with extremely low-power consumption. Within its small 6-pin package the sensor provides direct measurement of the x-, y-, and z components of a magnetic field. Thus the sensor family is ideally suited for the measurement of:;型号: | TLE493D-W2B6 A0 |
厂家: | Infineon |
描述: | Infineon´s 3D magnetic sensor family TLE493D offers accurate three dimensional sensing with extremely low-power consumption. Within its small 6-pin package the sensor provides direct measurement of the x-, y-, and z components of a magnetic field. Thus the sensor family is ideally suited for the measurement of: |
文件: | 总21页 (文件大小:926K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLE493D-W2B6
Low Power 3D Hall Sensor with I2C Interface and Wake Up Function
1
Overview
Quality Requirement Category: Automotive | Industry
PG-TSOP6-6-8
Features
•
•
•
•
•
•
•
•
•
•
3D magnetic flux density sensing of ±160 mT.
Programmable flux resolution down to 65 µT (typ.).
X-Y angular measurement mode
Diagnostic measurements to check digital parts, analog parts and Hall probe of the sensor
Power down mode with 7 nA (typ) power consumption
12-bit data resolution for each measurement direction plus 10-bit temperature sensor
Variable update frequencies and power modes (configurable during operation)
Temperature range Tj = -40°C…125°C, supply voltage range = 2.8 V…3.5 V
Triggering by external µC possible via I2C protocol
Interrupt signal to indicate a valid measurement to the microcontroller
Applications
The TLE493D-W2B6 is designed for all kinds of sensing applications, including the following:
•
•
•
•
Gear stick position
Control elements in the top column module and multi function steering wheel
Multi function knobs
Pedal/valve position sensing
Benefits
•
•
•
•
•
•
Component reduction due to 3D magnetic measurement principle
Wide application range addressable due to high flexibility
Platform adaptability due to device configurability
Supporting functional safety by means of integrated diagnostics
Very low system power consumption due to Wake Up mode
Disturbance of smaller stray fields are neglectable compared to the high magnetic flux measurement
range
Data Sheet
www.infineon.com
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TLE493D-W2B6
Overview
Table 1
Ordering Information
Product Type
Marking1)
Ordering Code
Package
Default address
write / read
TLE493D-W2B6 A0
TLE493D-W2B6 A1
TLE493D-W2B6 A2
TLE493D-W2B6 A3
EC
ED
EE
EF
SP001605334
SP001605340
SP001605344
SP001605348
PG-TSOP6-6-8
PG-TSOP6-6-8
PG-TSOP6-6-8
PG-TSOP6-6-8
6AH / 6BH
44H / 45H
F0H / F1H
88H / 89H
1) Engineering samples are marked with “SA”.
Data Sheet
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Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
2.1
2.1.1
2.1.2
2.1.3
2.2
2.3
2.4
2.5
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power mode control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wake Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Definition of Magnetic Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Sensitive Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Overview of Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interface and Timing Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4
4.1
4.2
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Data Sheet
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Functional Description
2
Functional Description
This three dimensional Hall effect sensor can be configured by the microcontroller. The measurement data is
provided in digital format to the microcontroller. The microcontroller is the master and the sensor is the slave.
It also provides test functions and the capability to wake up a sleeping system.
2.1
General
Description of the Block diagram and its functions.
F-OSC
LP-OSC
Power Mode Control
VDD
GND
Bias
Wake Up
SCL; /INT
Lateral
Hall plates
Z-Direction
Digital tracking,
demodulation &
I²C interface
ADC
MUX
SDA
Vertical
Hall plates
Y-Direction
Temperature
Figure 1
Block Diagram
The IC consists of three main functional units containing the following building blocks:
•
•
•
The power mode control system, containing a low-power oscillator, basic biasing, accurate restart,
undervoltage detection and a fast oscillator.
The sensing unit, which contains the HALL biasing, HALL probes with multiplexers and successive tracking
ADC, as well as a temperature sensor is implemented.
The I2C interface, containing the register files and I/O pads
2.1.1
Power mode control
The power mode control provides the power distribution in the IC, a power-on reset function and a specialized
low-power oscillator as the clock source. It also manages the start-up behavior.
•
On start-up, this unit:
–
–
activates the biasing, provides an accurate reset detector and fast oscillator
sensor enters low power mode and can be configured via I2C interface
•
After re-configuration, a measurement cycle is performed, which consists of the following steps:
–
–
–
activating internal biasing, checking for the restart condition and providing the fast oscillator
HALL biasing
measuring the three HALL probe channels sequentially (including the temperature). This is enabled by
default
–
reentering configured mode
Data Sheet
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Functional Description
In any case functions are only executed if the supply voltage is high enough, otherwise the restart circuit will
halt the state machine until the required level is reached and restart afterwards. The functions are also
restarted if a restart event occurs in between (see parameter ADC restart level).
2.1.2
Sensing
Measures the magnetic field in X, Y and Z direction. Each X-, Y- and Z-Hall probe is connected sequentially to a
multiplexer, which is then connected to an Analog to Digital Converter (ADC). Optional, the temperature
(default = activated) can be determined as well after the three Hall channels.
2.1.3
Wake Up
For each of the three magnetic channels (X/Y/Z), the Wake Up function has an upper and lower comparison
threshold. Each component of the applied field is compared to the lower and upper threshold. If one of the
results is above or below these thresholds, an interrupt pulse /INT is generated. This is called a Wake Up
function. The sensor signals a certain field strength change to the microcontroller. As long as all components
of the field stay within the envelope, no interrupt signal will be provided. Note however that the /INT can also
be inhibited during I2C activities, by activated collision avoidance. An Wake Up interrupt /INT is the logical OR
among all Wake Up interrupt envelopes of the three channels.
2.2
Pin Configuration (top view)
Figure 2 shows the pinout of the TLE493D-W2B6.
Figure 2
TLE493D-W2B6 pinout
Table 2
Pin No.
1
TSOP6 pin description and configuration (see Figure 2)
Name
Description
SCL
Interface serial clock pin (input)
/INT
Interrupt pin, signals a finished measurement cycle, open-drain
2
3
4
5
6
GND
GND
VDD
GND
SDA
Connect to GND
Ground Pin
Supply Pin
Connect to GND
Interface serial data pin (input/output), open-drain
Data Sheet
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Functional Description
2.3
Definition of Magnetic Field
A positive field is considered as South-Pole facing the corresponding Hall element.
Figure 3 shows the definition of the magnetic directions X, Y, Z of the TLE493D-W2B6.
Figure 3
Definition of Magnetic Field Direction
2.4
Sensitive Area
The magnetic sensitive area for the Hall measurement is shown in Figure 4.
Figure 4
Center of Sensitive Area (dimensions in mm)
Data Sheet
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Functional Description
2.5
Application Circuit
The use of an interrupt line is optional, but highly recommended to ensure proper and efficient readout of the
sensor data.
The pull-up resistor values of the I2C bus have to be calculated in such a way as to fulfill the rise- and fall time
specification of the interface for the given worst case parasitic (capacitive) load of the actual application
setup.
Please note: too small resistive R1/2 values have to be prevented to avoid unnecessary power consumption
during interface transmissions, especially for low-power applications.
VDD
Power
Supply
R1
R2
GND
RSDA
VDD
VDD
SDA
TLE493D
CBuf
RSCL
C1
µC
SCL
(/INT)
GND
GND
R1 = 1.2kΩ
R2 = 1.2kΩ
C1 = 100nF
Optional (recommended for wire harness): RSDA, RSCL
SDA, SCL capacitance < 200 pF each, including all stray capacitances
Figure 5
Application Circuit with external power supply and µC
For additional EMC precaution in harsh environments, C1 may be implemented by two 100 nF capacitors in
parallel, which should be already given by CBuf near the µC and/or power supply.
Data Sheet
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Specification
3
Specification
This sensor is intended to be used in an automotive environment. This chapter describes the environmental
conditions required by the device (magnetic, thermal and electrical).
3.1
Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Furthermore, only single error cases
are assumed. More than one stress/error case may also damage the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During
absolute maximum rating overload conditions the voltage on VDD pin with respect to ground (GND) must not
exceed the values defined by the absolute maximum ratings.
Table 3
Absolute Maximum Ratings
Symbol
Parameter
min
-40
-0.3
–
typ
–
max
125
3.5
±1
Unit
°C
V
Note/Condition
Junction temperature
Voltage on VDD
Tj
VDD
Bmax
Vmax
–
Magnetic field
–
T
Voltage range on any pin to
GND
-0.1
–
3.5
V
open-drain outputs are not
current limited.
Table 4
Ambient temperature TA = 25°C
ESD Protection1)
Parameter
Symbol
Values
Unit
Note or Test Condition
Min.
Typ.
Max.
ESD voltage (HBM)2)
ESD voltage (CDM)3)
VESD
–
–
–
–
–
–
±2.0
±0.75
±0.5
kV
kV
kV
R = 1.5 kΩ, C = 100 pF
for corner pins
all pins
1) Characterization of ESD is carried out on a sample basis, not subject to production test.
2) Human Body Model (HBM) tests according to ANSI/ESDA/JEDEC JS-001.
3) Charged Device Model (CDM), ESD susceptibility according to JEDEC JESD22-C101.
Data Sheet
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Specification
3.2
Operating Range
To achieve ultra low power consumption, the chip does not use a conventional, power-consuming restart
procedure. The focus of the restart procedure implemented is to ensure a proper supply for the ADC operation
only. So it inhibits the ADC until the sensor supply is high enough.
Table 5
Operating Range
Symbol
Parameter
min
-40
2.8
typ
–
max
125
3.5
Unit
°C
Note/Condition
Operating temperature Tj
Tj = Ta +3 K in fast mode
Supply voltage
VDD
3.3
V
Supply voltage must be above
restart level
ADC restart level
Vres
2.2
–
2.5
50
–
2.8
–
V
min. ADC operating level
ADC restart hysteresis
Register stable level
Vres-hys
Vreg
mV
V
–
2.5
Register values are stable above
this voltage level
The sensor relies on a proper supply ramp defined with tPUP, VOUS and IDD-PUP, see Figure 6. The I2C reset feature
of the sensor shall be used by the µC after Power Up. If supply monitoring is used in the system (e.g. brown-
out detector etc.), it is also recommended to use the I2C reset of the sensor following events detected by this
monitor.
In any case, an external supply switch (either provided by a System-Basis-Chip solution which includes a
supply-enable feature, a Bias-Resistor-Transistor device, a capable µC GPIO pin, etc.) shall allow a power-
cycle of the sensor as backup for high availability applications to cope with any form of VDD ramps (including
potential EMC influences), see Figure 6.
At Power Up, SDA and SCL shall be pulled to VDD using R1 and R2 of Figure 5 and not be driven to low by any
device or µC on SDA and SCL.
VDD
3.3V
tPUP
tAPC
t
Figure 6
VDD power up and power-cycle for high availability
Data Sheet
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Specification
Table 6
VDD power up and power-cycle
Parameter
Symbol
min
–
typ
–
max
10
Unit
µs
µs
V
Note/Condition
Power Up ramp time
Availability power cycle1) tAPC
tPUP
–
150
3.3
400
3.5
Power Up over-
undershoot
VOUS
3
Envelope which must not be
exceeded at the end of a Power Up.
Power Up current
consumption
IDD-PUP
–
10
mA
Current consumption during tPUP
1) Not subject to production test - verified by design.
3.3
Electrical Characteristics
This sensor provides different operating modes and a digital communication interface. The corresponding
electrical parameters are listed in Table 7. Regarding current consumption more information are available in
Chapter 3.6.
Table 7
Electrical Setup
Values for VDD = 3.3 V ±5 %, Tj = -40°C to +125°C (unless otherwise specified)
Parameter
Supply current 1)
Symbol min typ
max Unit Note/Condition
130 nA Tj = 25°C; power down mode
Fast mode
IDD_pd
IDD_fm
VIL
–
7
1
3.4
–
5
mA
Input voltage low threshold2)
Input voltage high threshold2)
Input voltage hysteresis2)
–
30
–
%VDD all input pads
%VDD all input pads
%VDD all input pads
VIH
70
5
–
VIHYS
–
Output voltage low level @ 3 mA load VOL
–
–
0.4
V
all output pads, static load
1) Currents at pull up resistors (Figure 5) needs to be considered for power supply dimensioning.
2) Based on I2C standard 1995 for VDD related input levels
Data Sheet
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Specification
3.4
Magnetic Characteristics
The magnetic parameters are specified for an end of line production scenario and for an application life time
scenario.
The magnetic measurement values are provided in the two’s complement with 12 bit or 8 bit resolution in the
registers with the symbols Bx, By and Bz. Two examples, how to calculate the magnetic flux are shown in
Table 11 and Table 12.
Table 8
Values for Tj = +25°C, 0 h and VDD = 3.3 V (unless otherwise specified)
Initial Magnetic Characteristics1)
Parameter
Symbol
min
typ
max
Unit
Note/Condition
Magnetic linear range2) (full range)
Magnetic linear range2)3) (short range) Bxyz_LINSR
Bxyz_LIN
±160 ±200 ±230 mT
±100 ±135 ±150 mT
-40°C < Tj < +125°C
Sensitivity X, Y, Z (full range)
Sensitivity X, Y, Z (short range)
Sx, Sy, Sz
SxSR, SySR, SzSR 11
-1.8
5.5
7.7
10.5
21
LSB12/
mT
15.4
±0.2
Z-Offset (full range and short range) B0Z
+1.8
mT
XY-Offset (full range and short range) B0xy
-0.75 ±0.2
+0.75 mT
X to Y magnetic matching4)
MXY
-15
-25
95
±1
+15
+25
182
91
%
%
Up to min.
X/Y to Z magnetic matching4)
Resolution, 12-bit5) (full range)
Resolution, 12-bit5) (short range)
Resolution, 8-bit5) (full range)
Resolution, 8-bit5) (short range)
MX/YZ
Res12
Res12_SR
Res8
0
Bxyz_LIN or Bxyz_LINSR
130
65
µT/
LSB12
47.5
1.52
0.76
–
2.08
1.04
0.1
2.91
1.46
0.5
mT/
LSB8
Res8_SR
Bineff
Magnetic initial noise (rms)
(full range and short range)
mT
rms = 1 sigma
Magnetic hysteresis 2)
(full range and short range)
BHYS
–
1
–
LSB12 due to quantization
effects
1) Magnetic test on wafer level. It is assumed that initial variations are stored and compensated in the external µC during
module test and calibration.
2) Not subject to production test - verified by design/characterization.
3) The short range setting does not have an analogue saturation behavior due to internal offsets and the compensation
thereof.
4) See the magnetic matching definition in Equation (3.1) and Equation (3.2).
5) Resolution is calculated as 1/Sensitivity (and multiplied by 16 for 8-bit value).
Equation for parameter “X to Y magnetic matching”:
(3.1)
(3.2)
ꢅꢆꢃ ꢇ ꢅꢈ
ꢅꢆ ꢉ ꢅꢈ
ꢀꢁꢂ ꢃꢄ 100ꢃ ∙ 2ꢃ ∙ꢃ
ꢃꢊ%ꢋ
Equation for parameter “X/Y to Z magnetic matching”:
ꢅꢆ ꢉ ꢅꢈꢃ ꢇ 2ꢃ ∙ ꢅꢍ
ꢅꢆ ꢉ ꢅꢈ ꢉ 2ꢃ ∙ ꢅꢍ
ꢀꢁ/ꢂꢌ ꢃꢄ ꢃ100ꢃ ∙ 2ꢃ ∙ꢃ
ꢃꢊ%ꢋ
Data Sheet
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Specification
Table 9
Sensor Drifts1) valid for both full range and short range (unless indicated)
Values for VDD = 3.3 V ±5 %, Tj = -40°C to 125°C, static magnetic field within full magnetic linear range (unless
otherwise specified)
Parameter
Symbol
min
typ
±5
–
max
+15
Unit
%
Note/Condition
Sensitivity drift X, Y, Z
Offset drift X, Y
Offset drift Z
SxD, SyD, SzD -15
TC0
BO_DXY
BO_DZ
BO_DZ
-0.45
+0.45 mT
+1.6 mT
+0.45 mT
@ 0 mT, TC0
-1.6
-0.45
-3.5
-15
–
@ 0 mT, TC0
Offset drift Z
–
@ 0 mT, TC0, Z Hall spintest
X to Y magnetic matching drift2) MXY_D
X/Y to Z magnetic matching drift2) MX/YZ_D
±1
±10
+3.5
+15
%
%
TC0
TC0
1) Not subject to production test, verified by design/characterization. Drifts are changes from the initial characteristics
due to external influences.
2) See the magnetic matching definition in Equation (3.1) and Equation (3.2).
Table 10
Values for VDD = 3.3 V ±5 %, Tj = -40°C to 125°C (unless otherwise specified)
Temperature compensation, non-linearity and noise1)
Parameter
Temperature compensation2)
(full range and short range)
Symbol min
typ
±0
max
Unit
Note/Condition
TC0
TC1
TC2
TC3
DNL
–
–
–
–
–
–
–
–
–
–
–
–
ppm/K Bx, By and Bz (default)
Bx, By and Bz (option 1)
Bx, By and Bz (option 2)
Bx, By and Bz (option 3)
LSB12 Bx, By and Bz
-750
-1500
+350
±2
–
–
–
Differential Non Linearity (full range)
–
Differential Non Linearity (short range) DNLSR
±4
–
Integral Non Linearity (full range)
Integral Non Linearity (short range)
Magnetic noise (rms)
INL
±2
–
LSB12 Bx, By and Bz
LSB12 Bx, By and Bz
INLSR
BNeff
±4
–
–
1
mT
mT
mT
rms = 1 sigma
Z-Magnetic noise (rms)
BNeffZ
BNeffXY
–
0.5
0.25
rms = 1 sigma,
-40°C < Tj < +85°C
XY-Magnetic noise (rms)
–
1) Not subject to production test, verified by design/characterization.
2) TCX must be set before magnetic flux trimming and measurements with the same value.
Data Sheet
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Specification
Conversion register value to magnetic field value:
Table 11
Magnetic conversion table for 12Bit
MSB
Bit10 Bit9
Bit8
256
1
Bit7
128
0
Bit6
64
0
Bit5
32
0
Bit4
16
0
Bit3
8
Bit2
4
Bit1
2
LSB
1
[Dec]
-2048 1024 512
[Bin] e.g. 1
1
1
1
1
1
1
The conversion is realized by the two’s complement. Please use following table for transformation:
Example for 12-bit read out: 1111 0000 1111B: -2048 + 1024 + 512 + 256 + 0 + 0 + 0 + 0 + 8 + 4 + 2 +1 = -241 LSB12
Calculation of magnetic flux: -241 LSB12 * 0.13 mT/LSB12 = -31.3 mT
Table 12
Magnetic conversion table for 8Bit
MSB
-128
0
Bit10
64
Bit9
32
0
Bit8
16
1
Bit7
8
Bit6
4
Bit5
2
LSB
1
[Dec]
[Bin] e.g.
1
1
1
0
1
Example for 8-bit read out: 0101 1101B: 0 + 64 + 0 + 16 + 8 + 4 + 0 + 1 = 93 LSB8
Calculation of magnetic flux: 93 LSB8 * 2.08 mT/LSB8 = 193.4 mT
3.5
Temperature Measurement
By default, the temperature measurement is activated. The temperature measurement can be disabled if it is
not needed and to increase the speed of repetition of the magnetic values.
Table 13
Temperature Measurement Characteristics1)
Parameter
Symbol
T25
min
1000
0.21
–
typ
max
1360
0.27
–
Unit
Note/Condition
Digital value @ 25°C
Temperature resolution, 12-bit
Temperature resolution, 8-bit
1180
0.24
3.84
LSB12
TRes12
TRes8
K/LSB12
K/LSB8
referring to Tj
referring to Tj
1) The temperature measurement is not trimmed on the sensor. An external μC can measure the sensor during module
production and implement external trimming to gain higher accuracies.
Temperature values are based on 12 bit resolution. Please note: only bit 11 ... 2 are listed in the bitmap registers.
Table 14
Temperature conversion table for 12Bit
The bits MSB to Bit2 are read out from the temperature value registers. Bit1 and LSB are added to get a 12-bit
value for calculation.
MSB
-2048
0
Bit10
1024
1
Bit9
512
0
Bit8
256
1
Bit7
128
0
Bit6
64
0
Bit5
32
1
Bit4
16
0
Bit3
8
Bit2
4
[Dec]
[Bin] e.g.
1
1
Example for 12-bit calculation: 0110 1010 11B: 0 + 1024 + 0 + 256 + 0 + 0 + 32 + 0 + 8 + 4 = 1324 LSB12
Calculation to temperature: (1324 LSB12 - 1180 LSB12) * 0.24 K/LSB12 + 25°C ≈ 60°C
Data Sheet
13
Ver. 1.2
2019-04-09
TLE493D-W2B6
Specification
3.6
Overview of Modes
For a good adaptation on application requirements this sensor is equipped with different modes. An overview
is listed in Table 15.
Table 15
Mode
Overview of modes1)
Measurements
2)
Typ. fUpdate
–
Description
Power Down
No measurements
Bx, By, Bz, T
Bx, By, Bz
Bx, By
Lowest possible supply current IDD.
Low Power Mode
(full range and
short range)
0.05 Hz - 770 Hz Cyclic measurements and ADC-conversions
(8 steps)
with different update rates.
Fast Mode
(full range)
Bx, By, Bz, T
Bx, By, Bz
Bx, By
5.7 kHz
7.5 kHz
8.4 kHz
4.2 kHz
5.5 kHz
6.2 kHz
Measurements and ADC conversions are
running continuously.
An I2C clock speed ≥ 800 kHz and use of the
interrupt /INT is required.
Fast Mode
(short range)
Bx, By, Bz, T
Bx, By, Bz
Bx, By
Master-Controlled Mode Bx, By, Bz, T
Up to Fast Mode Measurements triggered by the
values. microcontroller via I2C.
(full range and
short range)
Bx, By, Bz
Bx, By
1) Not subject to production test - verified by design/characterization.
2) This is the frequency at which specified measurements are updated.
I2C triggered Master-Controlled Mode typical IDD current consumption estimation formula:
Equation IDD full range
(3.3)
(3.4)
ꢎꢏꢏ ꢐ ꢎꢑꢑˍꢒꢓ ∙ 0.18ꢃꢓꢔꢃ ∙ ꢒ
ꢕꢖꢗꢘꢙꢚ
Equation IDD short range
ꢎꢏꢏ ꢐ ꢎꢑꢑˍꢒꢓ ∙ 0.24ꢃꢓꢔꢃ ∙ ꢒꢕꢖꢗꢘꢙꢚ
The average supply current IDDin the 8 Low Power Modes and I2C triggered mode will decrease by about 25 %
if the temperature measurement is disabled and will decrease by about 50% if the temperature and Bz
measurement is disabled.
Data Sheet
14
Ver. 1.2
2019-04-09
TLE493D-W2B6
Specification
3.7
Interface and Timing Description
This chapter refers to how to set the boundary conditions in order to establish a proper interface
communication.
Table 16
Interface and timing1)
Parameter
Symbol min
typ
2.5
40
max Unit Note/Condition
End of Conversion /INT pulse
tINT
1.8
30
3.2
50
μs
μs
low-active (when activated)
read after rising /INT edge
Time window to read first value
(full range)
tRD1
Time window to read first value
(short range)
tRD1_SR
tRDn
tRDn_SR
tclk_E
42
32
44
-25
56
43
59
–
70
μs
μs
μs
%
read after rising /INT edge
consecutive reads
Time window to read next value
(full range)
54
Time window to read next value
(short range)
74
consecutive reads
Internal clock accuracy
I2C timings
+25
Allowed I2C bit clock frequency2)
Low period of SCL clock
High period of SCL clock
fI2C_clk
tL
–
400
–
1000 kHz
0.5
0.4
0.4
–
–
–
μs
μs
μs
1.3 μs for 400-kHz mode
0.6 μs for 400-kHz mode
0.6 μs for 400-kHz mode
tH
–
SDA fall to SCL fall hold time
tSTA
–
(hold time start condition to clock)
SCL rise to SDA rise su. time
(setup time clock to stop condition)
tSTOP
tWAIT
0.4
0.4
–
–
–
–
μs
μs
0.6 μs for 400-kHz mode
0.6 μs for 400-kHz mode
SDA rise to SDA fall hold time
(wait time from stop to start cond.)
SDA setup before SCL rising
SDA hold after SCL falling
Fall time SDA/SCL signal3)
Rise time SDA/SCL signal3)
tSU
0.1
0
–
–
μs
μs
µs
µs
tHOLD
tFALL
tRISE
–
–
–
0.25
0.5
0.3
–
–
R = 1.2 kΩ
1) Not subject to production test - verified by design/characterization
2) Dependent on R-C-combination on SDA and SCL. Ensure reduced capacitive load for speeds above 400 kHz.
3) Dependent on used R-C-combination.
The fast mode, shown in Figure 7, requires a very strict I2C behavior synchronized with the sensor conversions
and high bit rates. In this mode, a fresh measurement cycle is started immediately after the previous cycle was
completed.
Other modes are available for more relaxed timing and also for a synchronous microcontroller operation of
sensor conversions. In these modes, a fresh measurement cycle is only started if it is triggered by an internal
or external trigger source.
In the default measurement configuration (Bx, By, Bz and T), shown in Figure 7, the measurement cycle ends
after the temperature measurement.
In 3-channel measurement configuration (Bx, By and Bz), the temperature channel is not converted and
updated. Thus, the measurement cycle ends after the Bz measurement.
Data Sheet
15
Ver. 1.2
2019-04-09
TLE493D-W2B6
Specification
In X/Y angular measurement configuration (Bx and By), the Bz and temperature channel are not converted and
updated. Thus, the measurement cycle ends after the By measurement.
*) setup/hold time for i2c readout to register value.
first register
address is0,
trigger bits are0
SCL falling edge SCL falling edge SCL falling edge SCL falling edge
shadowed LSBs
from prev.
MSBs read
status output starts
with odd parity bit of
last 6bytes transmitted
time must be either:
or:
addressing options;
R/W bit is1
@ ACK bit
@ ACK bit
@ ACK bit
@ ACK bit
1
1
reads X[n-1]
reads Y[n-1]
reads Z[n-1]
reads T[n-1]
tS/H
≥
tS/H
≤
-
fi2 c_clk
fi2 c_clk
(update after read)
u(pdate before read)
i2c bus protocol
SCL / SDA
X[n-1]LSBs Z[n-1]LSBs
Y[ n- 1]LSBs T[n-1]LSBs
S
i2c_adr sens_reg X[n-1]MSBs Y[n-1]MSBs Z[n-1]MSBs T[n-1]MSBs
STATUS
P
S
i2 c_adr sens_reg X[n-1]MSBs
MÆ S MÆ S SÆ M
transmission direction
MÆ S
MÆ S
SÆ M
SÆ M
SÆ M
SÆ M
SÆ M
SÆ M
SÆ M
tS/H *)
tS/H *)
corresponds to10 bit addressing:
two bytes following a S condition
(i2c standard 1995, section 13.1)
µC can start
readout after
/INT (=SCL) is
high again
tS/H *)
t
S/H *)
/INT (= SCL pin)
X value register
tINT
1 / update_rate (fast mode)
tRDn
tRD1
X[n-1]
tRDn
tRDn
tRD1
X[n]
Y[n-1]
Y[n]
Y value register
Z value register
T value register
Z[n-1]
By
Z[n]
T[n-1]
T[n]
Bx
ADC conversion
chan. (fast mode)
Bx
Bz
T
Figure 7
I2C readout frame, ADC conversion and related timing
tRISE
tFALL
tH
tL
tSTOP
tWAIT
tSTA
70% VDD
30% VDD
SCL
pin
70% VDD
30% VDD
SDA
pin
tHOLD
tSU
1 bit transfer
I2C timing specification
STOP cond.
START cond.
Figure 8
Data Sheet
16
Ver. 1.2
2019-04-09
TLE493D-W2B6
Package Information
4
Package Information
4.1
Package Parameters
Table 17
Package Parameters
Symbol
Parameter
Limit Values
Unit
Notes
Min.
–
Typ. Max.
Thermal resistance1)
Junction ambient
RthJA
RthJL
–
200
K/W
K/W
Junction to air
for PG-TSOP-6-6-8
Thermal resistance
Junction lead
–
–
100
Junction to lead
for PG-TSOP-6-6-8
Soldering moisture level2)
MSL 1
260°C
1) According to Jedec JESD51-7
2) Suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020D.1 (March 2008)
Figure 9
Image of TLE493D-W2B6 in TSOP6
Figure 10 Footprint PG-TSOP6-6-8 (compatible to PG-TSOP6-6-5, all dimensions in mm)
Data Sheet
17
Ver. 1.2
2019-04-09
TLE493D-W2B6
Package Information
4.2
Package Outlines
Figure 11 Package Outlines (all dimensions in mm)
Data Sheet
18
Ver. 1.2
2019-04-09
TLE493D-W2B6
Package Information
Figure 12 Packing (all dimensions in mm)
Further information about the package can be found here:
http://www.infineon.com/cms/packages/SMD_-_Surface_Mounted_Devices/TSOP/TSOP6.html
Data Sheet
19
Ver. 1.2
2019-04-09
TLE493D-W2B6
Revision History
5
Revision History
Revision History
Page or Item
Subjects (major changes since previous revision)
Ver. 1.2, 2019-04-09
Chapter 3.2 text “I2C reset” updated.
Ver. 1.1, 2019-02-08
Figure 4, Figure 11 and Figure 12 updated.
Ver. 1.0, 2018-01-24
Initial version
Data Sheet
20
Ver. 1.2
2019-04-09
Trademarks
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Edition 2019-04-09
Published by
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hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
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