V23818-N15-L36 [INFINEON]
Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x5/2x10 Pinning with LC⢠Connector; 小巧的外形单模1300 nm的多速率高达2.5 Gbit / s的收发器2× / 2×10与LCA钢钉?? ¢连接器型号: | V23818-N15-L36 |
厂家: | Infineon |
描述: | Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x5/2x10 Pinning with LC⢠Connector |
文件: | 总27页 (文件大小:765K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Fiber Optics
Small Form Factor
V23818-N15-Lxx/Lxxx
Single Mode 1300 nm
Multirate up to 2.5 Gbit/s Transceiver
2x5/2x10 Pinning with LC™ Connector
Features
• Small Form Factor transceiver
• RJ-45 style LC™ connector system
• Half the size of SC Duplex 1x9 transceiver
• Optimized for SDH STM-16 / SONET OC-48
• Single power supply (3.3 V)
• Extremely low power consumption
• Loss of optical signal indicator
File: 1119
• Laser disable input
• LVPECL differential inputs and outputs
• Suitable for multirate applications up to 2.5 Gbit/s
• Distance up to 2 km on single mode fiber (SMF)
• Class 1 FDA and IEC laser safety compliant
• Multisource footprint
• Small footprint for high channel density
• UL 94 V-0 certified
File: 1120
• Compliant with FCC (Class B) and EN 55022
• Tx and Rx power monitor
For ordering information see next page.
LC™ is a trademark of Lucent.
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Ordering Information
Ordering Information
Part Number
Pinning Signal
Detect
Operating
Temperature if SD is Low
Data Outputs
Collar In- Out-
put put
V23818-N15-L17
V23818-N15-L16
V23818-N15-L353
V23818-N15-L356
V23818-N15-L354
V23818-N15-L355
V23818-N15-L37
V23818-N15-L36
V23818-N15-L47
V23818-N15-L46
V23818-N15-L457
2x10
LVPECL –5...70°C
–40...85°C
Switched to Low yes
DC DC
LVTTL
–5...70°C
–40...85°C
–5...70°C
AC AC
LVTTL
no
2x5
LVPECL –5...70°C
–40...85°C
Switched to Low yes
DC DC
AC AC
LVTTL
–5...70°C
–40...85°C
–5...70°C
–40...85°C
2x10
LVTTL
LVTTL
Active
yes
AC AC
AC AC
V23818-N15-L356-C 2x10
Switched to Low yes1)
1)
Incorporates non-standard collar type (see Figure 20 on Page 26).
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
Pin Configuration
HL
MS
MS
Tx
Rx
HL
HL
20 19 18 17 16 15 14 13 12 11
TOP VIEW
1
2 3 4 5 6 7 8 9 10
HL
File: 1335
Figure 1
2x10 Pin Connect Diagram
2x10 Pin Description
Pin
No.
Symbol Level/Logic
Description
1
PDBias DC current
PIN photo detector bias current
Receiver signal ground
Receiver signal ground
Not connected
2
VEEr
VEEr
Ground
Ground
3
4
NC
5
NC
Not connected
6
VEEr
Ground
Receiver signal ground
7
VCCr
SD
Power supply
Receiver power supply
8
LVTTL or LVPECL output1) Receiver optical input level monitor
9
RD–
RD+
VCCt
LVPECL output
LVPECL output
Power supply
Ground
Receiver data out bar
10
11
12
13
14
15
16
17
18
19
20
MS
Receiver data out
Transmitter power supply
Transmitter signal ground
Transmitter disable
VEEt
TDis
TD+
TD–
LVTTL input
LVPECL input
LVPECL input
Ground
Transmitter data in
Transmitter data in bar
Transmitter signal ground
Laser diode bias current monitor
Laser diode bias current monitor
Laser diode optical power monitor
Laser diode optical power monitor
Mounting studs
VEEt
BMon–
BMon+
PMon–
PMon+
DC voltage
DC voltage
DC voltage
DC voltage
HL
Housing leads
1)
LVPECL output active high for V23818-N15-L17/L16/L417/L373.
LVTTL output active high for V23818-N15-L353/L356/L457/L355/L354.
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
HL
MS
MS
Tx
Rx
HL
HL
10 9 8 7 6
TOP VIEW
1 2 3 4 5
HL
File: 1331
Figure 2
2x5 Pin Connect Diagram
2x5 Pin Description
Pin
No.
Symbol Level/Logic
Description
1
VEEr
VCCr
SD
Ground
Receiver signal ground
Receiver power supply
2
Power supply
3
LVTTL or LVPECL output1) Receiver optical input level monitor
4
RD–
RD+
VCCt
VEEt
TDis
TD+
TD–
LVPECL output
LVPECL output
Power supply
Ground
Receiver data out bar
Receiver data out
5
6
Transmitter power supply
Transmitter signal ground
Transmitter disable
Transmitter data in
Transmitter data in bar
Mounting studs
7
8
LVTTL input
LVPECL input
LVPECL input
9
10
MS
HL2)
Housing leads
1)
LVPECL output active high for V23818-N15-L37/L36.
LVTTL output active high for V23818-N15-L47/L46.
2)
Housing leads removed for V23818-N15-L46WH. Due to possible EMI performance issues, use of this
transceiver should be restricted to applications where the chassis is completely sealed and the transceiver
encapsulated within.
V
EEr / VEEt
For 2x10 transceivers, connect pins 2, 3, 6, 12 and 16 to signal ground. For 2x5
transceivers, connect pins 1 and 7 to signal ground.
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
V
CCr / VCCt
For 2x10 transceivers a 3.3 V DC power supply must be applied at pins 7 and 11. For
2x5 transceivers a 3.3 V DC power supply must be applied at pins 2 and 6. A
recommended power supply filter network is given in the termination scheme. Locate
power supply filtering directly at the transceiver power supply pins. Proper power supply
filtering is essential for good EMI performance.
TD+ / TD–
Transmitter data LVPECL level inputs. For V23818-N15-L353/L356/L457/L354/L355/
L47/L46/L373 terminated and AC coupled internally. For V23818-N15-L17/L16/L417/
L37/L36 use termination and coupling as shown in the termination scheme.
RD– / RD+
Receiver data LVPECL level outputs. For V23818-N15-L353/L356/L457/L354/L355/
L47/L46/L373 biased and AC coupled internally. For V23818-N15-L17/L16/L417/L37/
L36 use termination and coupling as shown in the termination scheme.
TDis
A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input
must be applied. Leave pin unconnected if feature not required.
SD
LVTTL output for V23818-N15-L353/L356/L457/L354/L355/L47/L46.
LVPECL output for V23818-N15-L17/L16/L417/L37/L36/L373.
A logical high output indicates normal optical input levels to the receiver. Low optical
input levels at the receiver result in a low output. Signal Detect can be used to determine
a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source.
However it is not a detection of a bad link due to data-related errors.
MS
Mounting studs are provided for transceiver mechanical attachment to the circuit board.
They also provide an optional connection of the transceiver to the equipment chassis
ground. The holes in the circuit board must be tied to chassis ground.
HL
Housing leads are provided for additional signal grounding. The holes in the circuit board
must be included and tied to signal ground.
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
2x10 Transceiver Additional Functionality
PDBias
Connect pin 1 to VCC through a bias resistor, of a value not exceeding 2 kΩ, as shown in
Figure 3 to monitor PIN photo detector bias current. Leave pin floating if not used.
Typical behaviour is shown in Figure 4 and Figure 5 using a 2 kΩ load.
V
CC
≤ 2 kΩ
V
bias
Pin 1
File: 1307
Figure 3
Photo Detector Bias Interface
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
Typical Responsitivity of PIN Photo Detector Bias Current Monitor
400
300
200
100
0
0
100
200
300
400
Received Optical Power (µW)
File: 1308
Figure 4
Linear Response
400
300
200
100
0
−30
−24
−18
−12
−6
0
Received Optical Power (dBm)
File: 1309
Figure 5
Logarithmic Response
Data Sheet
7
2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
BMon– / BMon+
The DC voltage measured across pins 17 and 18 is proportional to the laser bias current.
Use the equation:
Ibias = Vbias/10 Ω
Use this output to monitor laser performance and EOL conditions. A schematic and
typical behaviour are shown in Figure 6 and Figure 7. Ibias @ ambient 25°C < 60 mA.
Leave pins floating if function is not required.
V
CC
Pin 18
3 kΩ
10 Ω
Pin 17
3 kΩ
V
EE
File: 1310
Figure 6
Bias Monitor – Transceiver Internal
0.36
0.32
0.28
0.24
0.2
0.16
0.12
0.08
0.04
0
0
10
20
30
40
50
60
70
Temperature (˚C)
File: 1312
Figure 7
Typical Variations of Bias Monitor Voltage over Temperature
Data Sheet
8
2003-08-18
V23818-N15-Lxx/Lxxx
Pin Configuration
PMon– / PMon+
The DC voltage that can be measured across pins 19 and 20 is proportional to the laser
monitor diode current through a 200 Ω resistor in its path. This output remains constant
and can be used to monitor correct operation of laser control circuitry, a deviation
indicates faulty behaviour. A schematic and typical behaviour are shown in Figure 8 and
Figure 9. The SFF MSA defines that Vmon must be in the range of 0.01 V and 0.2 V. The
Infineon OC-48 transceiver has a nominal range of 0.04 to 0.08 V. Leave pins
unconnected if feature is not required.
V
CC
Pin 20
3 kΩ
200 Ω
Pin 19
3 kΩ
R
V
EE
File: 1311
Figure 8
Power Monitor – Transceiver Internal
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
0
10
20
30
40
50
60
70
Temperature (˚C)
File: 1313
Figure 9
Typical Behaviour of Power Monitor Voltage over Temperature
Data Sheet
9
2003-08-18
V23818-N15-Lxx/Lxxx
Description
Description
The Infineon 2.5 Gigabit single mode transceiver – part of the Infineon Small Form Factor
transceiver family – is based on the Physical Medium Depend (PMD) sublayer and
baseband medium, type 2000 Base-LX, compliant with ITU-T G.957 STM-16, S-16.1 and
SONET OC-48 SR-1.
This transceiver is also suitable for multirate applications. The performance at lower
datarates may vary from application to application and is link dependent. Refer to
Infineon Application Note 97 for more information.
The appropriate fiber optic cable is 9 µm single mode fiber with LC connector.
The Infineon OC-48 single mode transceiver is a single unit comprised of a transmitter,
a receiver, and an LC receptacle. This design frees the customer from many alignment
and PC board layout concerns.
This transceiver supports the LC connectorization concept, which competes with UTP/
CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop
applications while providing the advantages of fiber optic technology. The transmission
distance is up to 2 km.
The module is designed for low cost LAN, WAN, and up to 2.5 Gbit/s applications. It can
be used as the network end device interface in mainframes, workstations, servers, and
storage devices, and in a broad range of network devices such as bridges, routers, hubs,
and local and wide area switches.
This transceiver operates at up to 2.5 Gbit/s from a single power supply (+3.3 V). The
full differential data inputs and outputs are LVPECL compatible.
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Description
Functional Description of SFF Transceiver
This transceiver is designed to transmit serial data via single mode fiber.
BMon-
BMon+
Automatic
Shut-Down
Tx
TDis
Coupling Unit
3k
3k
3k
e/o
Laser
Laser
Driver
TD-
10
TD+
o/e
Power
Control
200
Monitor
Single
Mode
Fiber
PMon-
3k
Rx
PMon+
Coupling Unit
Receiver
RD-
o/e
RD+
SD
PDBias
File: 1357
Figure 10
Functional Diagram 2x10 Pin Rows
Automatic
Shut-Down
Tx
TDis
Coupling Unit
e/o
Laser
TD−
TD+
Laser
Driver
o/e
Power
Control
Monitor
Single
Mode
Fiber
Rx
Coupling Unit
RD−
RD+
SD
o/e
Limiting
Amp
TIA
File: 1351
Figure 11
Functional Diagram 2x5 Pin Rows
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Description
The receiver component converts the optical serial data into an electrical data (RD+ and
RD–). The Signal Detect output (SD) shows whether an optical signal is present.
The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD–)
into optical serial data.
The module has an integrated shutdown function that switches the laser off in the event
of an internal failure.
Reset is only possible if the power is turned off, and then on again. (VCCt switched below
VTH).
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging. The power control uses
the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a
controlling signal, to prevent the laser power from exceeding the operating limits.
Data Sheet
12
2003-08-18
V23818-N15-Lxx/Lxxx
Description
Regulatory Compliance
Feature
Standard
Comments
ESD:
EIA/JESD22-A114-B
Class 1C
Electrostatic Discharge (MIL-STD 883D
to the Electrical Pins
Method 3015.7)
Immunity:
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
Immunity:
Against Radio
Frequency
EN 61000-4-3
IEC 61000-4-3
With a field strength of 3 V/m, noise
frequency ranges from 10 MHz to
2 GHz. No effect on transceiver
performance between the
Electromagnetic Field
specification limits.
Emission:
FCC 47 CFR Part 15, Noise frequency range:
Electromagnetic
Interference (EMI)
Class B
EN 55022 Class B
CISPR 22
30 MHz to 18 GHz
*)
(13.97)
.550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
File: 1501
Figure 12
Transceiver Pitch
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min.
max.
Package Power Dissipation
Supply Voltage
0.9
W
V
VCC–VEE
VIDpk-pk
4
Data Input Levels
VCC+0.5 VEE–0.5
V
Differential Data Input Voltage Swing
PIN PDBias Voltage
5
4
V
V
Storage Ambient Temperature
–40
85
°C
°C/s
Hand Lead Soldering
Temp/Time
260/10
Wave Soldering Temp/Time
Aqueous Wash Pressure
260/10
< 110
°C/s
psi
Exceeding any one of these values may destroy the device immediately.
Data Sheet
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2003-08-18
V23818-N15-Lxx/Lxxx
Technical Data
Recommended Operating Conditions
Parameter
Symbol
Limit Values
Unit
°C
min.
–40
–5
typ.
max.
85
Ambient Temperature1), 3)
Ambient Temperature2), 3)
Power Supply Voltage
Transmitter
TAMB
70
VCC–VEE 3.14
3.3
3.46
V
Supply Current Tx
ICCt
110
mA
mV
mV
Data Input High Voltage
VIH–VCC –1165
–880
3200
Differential Data Input Voltage VIDpk-pk 500
Swing4)
Data Input Low Voltage
VIL–VCC
–1810
–1475
120
mV
ps
Data Input Rise/Fall Time
(20% - 80%)
ti
Receiver
Supply Current Rx
Input Center Wavelength
ICCr
120
mA
nm
λRx
1260
1580
1)
Only for V23818-N15-Lx6/Lxx6.
Not for V23818-N15-Lx6/Lxx6.
Ambient operating temperature requires a 2 ms–1 airflow over the device.
2)
3)
4)
V23818-N15-L353/L356/L457/L354/L355/L47/L46/L373 are internally AC coupled. External coupling
capacitors required only for V23818-N15-L17/L16/L417/L37/L36.
The electro-optical characteristics described in the following tables are valid only for use
under the recommended operating conditions.
Data Sheet
15
2003-08-18
V23818-N15-Lxx/Lxxx
Technical Data
Transmitter Electro-Optical Characteristics
Transmitter
Symbol
Limit Values
typ.
Unit
min.
–10
–8
max.
–3
Output Power (Average)1)
Output Power (Average)2)
Center Wavelength
PO
dBm
–3
λC
1266
1360
4
nm
nm
dB
dB
Spectral Width (RMS)
Side Mode Suppression Ratio
Extinction Ratio (Dynamic)
Optical Eye Mask
σ
SMSR
ER
30
8.2
ED
Compliant with ITU-T G.957
3)
Reset Threshold for VCCt
VTH
2.2
2.99
V
Power on Delay3)
Jitter Generation4)
Jitter Generation4)
Rise Time5)
tDEL
JGEp-p
JGERMS
tR
30
ms
UI
UI
ps
ps
V
0.04
0.004
70
Fall Time5)
tF
225
TDis Assert Voltage TTL
TDis Deassert Voltage TTL
TDis Assert Time6)
TDis Deassert Time7)
VTDH
VTDL
tASS
tDAS
2
0.8
1
V
0.4
ms
µs
0.06
10
1)
Not for V23818-N15-L354/L355.
Only for V23818-N15-L354/L355.
2)
3)
Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tDEL
Jitter Generation under worst case conditions reaches a maximum value of 0.06 UI pk-pk/0.006 UI RMS.
Measured using 20% - 80% levels without bandwidth filtering.
.
4)
5)
6)
7)
T
T
Dis assertion to laser shutdown.
Dis reassertion to laser startup.
Data Sheet
16
2003-08-18
V23818-N15-Lxx/Lxxx
Technical Data
Jitter
The transceiver is specified to meet the SONET Jitter performance as outlined in ITU-T
G.958 and Telcordia GR-253.
Jitter Generation is defined as the amount of jitter that is generated by the transceiver.
The Jitter Generation specifications are referenced to the optical OC-48 signals. If no or
minimum jitter is applied to the electrical inputs of the transmitter, then Jitter Generation
can simply be defined as the amount of jitter on the Tx optical output. The SONET
specifications for Jitter Generation are 0.01 UI RMS, maximum and 0.1 UI pk-pk,
maximum. Both are measured with a 12 kHz - 20 MHz filter in line. A UI is a Unit Interval,
which is equivalent to one bit slot. At OC-48, the bit slot is 400 ps, so the Jitter Generation
specification translates to 4 ps RMS, max. and 40 ps pk-pk, max.
Data Sheet
17
2003-08-18
V23818-N15-Lxx/Lxxx
Technical Data
Receiver Electro-Optical Characteristics
Receiver
Symbol
Limit Values
Unit
min.
–3
typ.
max.
Sensitivity (Average Power)1)
Saturation (Average Power)
Signal Detect Assert Level2)
PIN
–19
dBm
dBm
dBm
dBm
dB
PSAT
PSDA
–19
Signal Detect Deassert Level3) PSDD
–30
Signal Detect Hysteresis
PSDA
3
–PSDD
Signal Detect Assert Time2)
Signal Detect Deassert Time3) tDAS
Data Output High Voltage4)
tASS
0.1
ms
ms
mV
mV
0.35
–650
1000
VOH–VCC –1110
VODpk-pk 500
Differential Data Output
Voltage Swing
Data Output Low Voltage4)
VOL–VCC
–1800
–1300
mV
mV
Signal Detect Output High
Voltage PECL5), 6)
VSDH VEE VCC
–
VCC
–820
–1200
SDL–VEE VCC
–1900
2.4
Signal Detect Output Low
Voltage PECL5), 6)
V
VCC
–1580
mV
V
Signal Detect Output High
Voltage TTL5), 7)
VSDH
VSDL
Signal Detect Output Low
Voltage TTL5), 7)
0.5
1
V
Photo Detector Bias
Responsivity8)
PDBiasRES 0.5
A/W
Photo Detector Bias Offset
PDBiasOFF
5
15
µA
dB
Reflectance
PREF
–33
–27
1)
Minimum average optical power at which the BER is less than 1x10–10. Measured with a 223–1 NRZ PRBS as
recommended by ANSI T1E1.2, SONET OC-48, and ITU-T G.957 S-16.1.
An increase in optical power above the specified level will cause the Signal Detect to switch from a low state
to a high state (high active output).
A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state
to a low state.
2)
3)
4)
5)
Load is 100 Ω differential.
Internal load is 510 Ω to GND, no external load necessary. Signal Detect is a high active output. High level
means signal is present, low level means loss of signal.
For V23818-N15-L17/L16/L417/L37/L36/L373.
6)
7)
8)
For V23818-N15-L353/L356/L457/L354/L355/L47/L46.
Monitor current needs to be sunk to VCC
.
Data Sheet
18
2003-08-18
V23818-N15-Lxx/Lxxx
Eye Safety
Eye Safety
This laser based single mode transceiver is a Class 1 product.
It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11.
The transceiver has been certified with FDA under accession number 9520890.
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Attention: All adjustments have been made at the factory prior to shipment of the
devices. No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result
in voided product warranty.
Note: Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Data
Wavelength
1300 nm
< 2 mW
Total Output Power
(as defined by IEC: 7 mm aperture at 14 mm distance)
Total Output Power
(as defined by FDA: 7 mm aperture at 20 cm distance)
< 180 µW
6°
Beam Divergence
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
File: 1401
Figure 13
Required Labels
Indication of
laser aperture
and beam
20 19 18 17 16 15 14 13 12 11
Tx
Rx
Top view
1
2 3 4 5 6 7 8 9 10
File: 1334
Figure 14
Laser Emission
Data Sheet
19
2003-08-18
V23818-N15-Lxx/Lxxx
EMI-Recommendations
EMI-Recommendations
To avoid electromagnetic radiation exceeding the required limits please take note of the
following recommendations.
When Gigabit switching components are found on a PCB (multiplexers, clock recoveries
etc.) any opening of the chassis may produce radiation also at chassis slots other than
that of the device itself. Thus every mechanical opening or aperture should be as small
as possible.
On the board itself every data connection should be an impedance matched line (e.g.
strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should
be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched
line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:
for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not planned, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an εr of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
Data Sheet
20
2003-08-18
V23818-N15-Lxx/Lxxx
Recommended Termination Schemes
Recommended Termination Schemes
2x10 DC/DC Transceiver
18
20
19 17
VCC SerDes
12,16
14
VEEt
VCC
TD+
C6
+
SerDat Out
ECL/
Laser
Driver
PECL
Driver
100 Ω
C8
TD− 15
C7
SerDat Out −
TDis 13
TDis
C1
11
L1
L2
VCCt
VCC
3.3 V
SFF Transceiver
Serializer/
Deserializer
VCCr
7
C3 C10
C2
Signal
Detect
SD
8
1
SD
PDBias
Limiting
Amplifier
RD−
9
C4
RD−
Pre-
Amp
SerDat In −
Receiver
PLL etc.
C9
RD+ 10
2,3,6
C5
RD+
SerDat In +
VEEr
C1/2/3
= 4.7 ... 10 µF
C4/5/6/7 = 100 nF
C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
L1/2*)
R1
= 1 ... 4.7 µH
= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or
100 Ω differential is provided. Check for termination inside of SerDes chip).
= 150 Ω
R2/3
R4/5
= Biasing (depends on SerDes chip).
Place R1/4/5 close to SerDes chip.
Place R2/3 close to Infineon transceiver.
*)
The inductors may be replaced by appropriate Ferrite beads.
File: 1390
Figure 15
Data Sheet
21
2003-08-18
V23818-N15-Lxx/Lxxx
Recommended Termination Schemes
2x10 AC/AC Transceiver
VCC SerDes
20
19 17
18
VEEt 12,16
14
VCC
TD+
SerDat Out +
ECL/
Laser
Driver
PECL
Driver
100 Ω
C4
TD− 15
SerDat Out −
TDis
13
11
TDis
L1
VCCt
VCC
3.3 V
C1
SFF Transceiver
Serializer/
Deserializer
L2
VCCr
7
C3 C6
C2
Signal
Detect
SD
8
1
SD
PDBias
Limiting
Amplifier
RD−
9
Pre-
Amp
SerDat In −
Receiver
PLL etc.
C5
RD+ 10
2,3,6
SerDat In +
VEEt
C1/2/3
C4/5/6
= 4.7 ... 10 µF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
L1/2*)
R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω
differential is provided. Check for termination inside of SerDes chip.
R5/6
= Biasing (depends on SerDes chip).
Place R1/2/3/4/5/6 close to SerDes chip.
*)
The inductors may be replaced by appropriate Ferrite beads.
File: 1391
Figure 16
Data Sheet
22
2003-08-18
V23818-N15-Lxx/Lxxx
Recommended Termination Schemes
2x5 DC/DC Transceiver
VCC SerDes
7
9
VEEt
VCC
TD+
C6
+
SerDat Out
ECL/
Laser
100 Ω
Driver
PECL
Driver
C8
TD− 10
C7
SerDat Out −
TDis
8
6
TDis
C1
L1
L2
VCCt
VCC
3.3 V
SFF Transceiver
Serializer/
Deserializer
VCCr
2
C3 C10
C2
Signal
Detect
SD
3
4
SD
Limiting
Amplifier
RD−
C4
RD−
Pre-
Amp
SerDat In −
Receiver
PLL etc.
C9
RD+
5
1
C5
RD+
SerDat In +
VEEr
C1/2/3
= 4.7 ... 10 µF
C4/5/6/7 = 100 nF
C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
L1/2*)
R1
= 1 ... 4.7 µH
= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or
100 Ω differential is provided. Check for termination inside of SerDes chip).
= 150 Ω
R2/3
R4/5
= Biasing for outputs depending on Serializer.
Place R1/4/5 close to SerDes chip.
Place R2/3 close to Infineon transceiver.
*)
The inductors may be replaced by appropriate Ferrite beads.
File: 1392
Figure 17
Data Sheet
23
2003-08-18
V23818-N15-Lxx/Lxxx
Recommended Termination Schemes
2x5 AC/AC Transceiver
VCC SerDes
7
9
VEEt
VCC
TD+
+
SerDat Out
ECL/
PECL
Driver
Laser
100 Ω
Driver
C4
TD− 10
SerDat Out −
TDis
8
6
TDis
C1
L1
L2
VCCt
VCC
3.3 V
SFF Transceiver
Serializer/
Deserializer
VCCr
2
C3 C6
C2
Signal
Detect
SD
3
4
SD
Limiting
Amplifier
RD−
RD−
Pre-
Amp
SerDat In −
Receiver
PLL etc.
C5
RD+
5
1
RD+
SerDat In +
VEEr
C1/2/3
C4/5/6
= 4.7 ... 10 µF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
L1/2*)
R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω
differential is provided. Check for termination inside of SerDes chip.
R5/6
= Biasing (depends on SerDes chip).
Place R1/2/3/4/5/6 close to SerDes chip.
*)
The inductors may be replaced by appropriate Ferrite beads.
File: 1393
Figure 18
Data Sheet
24
2003-08-18
V23818-N15-Lxx/Lxxx
Package Outlines
Package Outlines
a) recommended bezel position
Drawing shown is 2x10 pinning with collar
Dimensions in mm [inches]
File: 1213
Figure 19
Data Sheet
25
2003-08-18
V23818-N15-Lxx/Lxxx
Package Outlines
Advanced Collar
Dimensions in mm [inches]
File: 1505
Figure 20
Non-standard Collar
Data Sheet
26
2003-08-18
V23818-N15-Lxx/Lxxx
Revision History:
2003-08-18
DS1
Previous Version:
2003-03-10
Page
Subjects (major changes since last revision)
“Preliminary Data Sheet” deleted
V23818-N15-L373, V23818-N15-L417, V23818-N15-L46WH deleted
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2003-08-18
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2003.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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