V23833-E0124-A001_技术文档

Fiber Optics

X2

V23833-E0124-A001

V23833-E0134-A001

1310 nm Module

10 Gigabit Pluggable Transceiver

Compatible with X2 MSA Issue 1.0b

Preliminary Data Sheet

Features

Standards

• Compatible with IEEE 802.3ae™-2002

• Compatible with Fibre Channel 10GFC Draft 3.5

• Compatible with X2 MSA Issue 1.0b

Optical

File: 2105

• IEEE Ethernet: Serial 1310 nm 10GBASE-LR

• T11 Fibre Channel: Serial 1310 nm 1200-SM-LL-L

• 10 Gigabit Fibre Channel: 10.51875 Gbit/s

• 10 Gigabit Ethernet: 10.3125 Gbit/s

• Transmission distance up to 10 km¹⁾

• Uncooled directly modulated

Distributed Feedback (DFB) laser at 1310 nm

• SC connector options, single mode fiber

• Full duplex transmission mode

File: 2106

1)

Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation.

Ordering Information

Part Number

Standards

Personality

Mid

V23833-E0124-A001

V23833-E0134-A001

10G Ethernet / 10G Fibre Channel

High

Preliminary Product Information

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Applications

• DOM

– Loss Of Signal from receiver

– Laser safety alarm (with reset function)

– Supply voltage monitor

– Transmit power

– Module temperature

– Received power

– Transmit bias current monitor

Mechanical

• Mid personality: 89.05 mm x 40.05 mm x 19.25 mm

• High personality: 89.05 mm x 40.05 mm x 27.9 mm

• Mid personality version on PCI card

• Mid and high personality versions for front panel mounting

• Belly-to-belly applications

• Built-in heat sink

Electrical

• Hot pluggable

• Power supply: +5.0 V, +3.3 V, Adaptable Power Supply (APS: +1.8 V)

• Total power consumption: 3.3 W typical

• XAUI electrical interface

• Management and control via MDIO 2-wire bus

• 70-pin connector

Applications

• 10 Gbit/s Ethernet and Fibre Channel transmission systems for Long Range (LR)

• Integration on PCI card

• Belly-to-belly for high density applications

• Enterprise and campus network applications

• Storage applications

• Backplane and switch applications

• Core and edge routers

• Aggregation point for lower date rate

• X2 evaluation kit V23833-G9909-Z001 available upon request

Preliminary Product Information

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Pin Configuration

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

GND

5.0 V

3.3 V

APS

1

2

3

4

5

6

7

8

GND

RESERVED

GND

TX LANE3–

TX LANE3+

GND

APS

TX LANE2–

TX LANE2+

GND

LASI

RESET

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

VEND SPECIFIC

TX ON/OFF

TX LANE1–

TX LANE1+

GND

RESERVED

MOD DETECT

VEND SPECIFIC

MDIO

TX LANE0–

TX LANE0+

GND

Toward Bezel

GND

MDC

GND

52

51

50

PRTAD4

RX LANE3–

RX LANE3+

GND

PRTAD3

PRTAD2

49

48

PRTAD1

RX LANE2–

RX LANE2+

GND

PRTAD0

47

46

45

44

43

42

41

40

39

38

37

36

VEND SPECIFIC

APS SET

RESERVED

APS SENSE

APS

RX LANE1–

RX LANE1+

GND

RX LANE0–

RX LANE0+

GND

APS

3.3 V

RESERVED

GND

5.0 V

GND

Top of Transceiver PCB

Bottom of Transceiver PCB

(as viewed through top)

File: 2301

Figure 1

X2 Transceiver Electrical Pad Layout

Preliminary Product Information

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Pin Configuration

Connector Pin Assignments

Pin No. Signal Name

1

GND

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

GND

2

GND

3

GND

Reserved

GND

4

+5.0 V DC Power

+3.3 V DC Power

APS

5

6

TX LANE3–

TX LANE3+

GND

7

8

APS

9

LASI

TX LANE2–

TX LANE2+

GND

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

RESET

Vendor Specific

TX ON/OFF

Reserved

MOD DETECT

Vendor Specific

MDIO

TX LANE1–

TX LANE1+

GND

TX LANE0–

TX LANE0+

GND

MDC

GND

PRTAD4

GND

PRTAD3

RX LANE3–

RX LANE3+

GND

PRTAD2

PRTAD1

PRTAD0

RX LANE2–

RX LANE2+

GND

Vendor Specific

APS SET

Reserved

APS SENSE

APS

RX LANE1–

RX LANE1+

GND

APS

RX LANE0–

RX LANE0+

GND

+3.3 V DC Power

+5.0 V DC Power

GND

Reserved

GND

Preliminary Product Information

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Pin Configuration

Pin Description

Signal Name Level

I/O

Pin No.

Description

Management and Monitoring Ports

MDIO

Open Drain I/O

17

Management Data I/O. Requires

external 10 - 22 kΩ pull-up to 1.8 V

on host.

MDC

1.2 V

CMOS

I

18

19

20

21

22

23

9

Management Data Clock Input

Port Address Input bit 4

Port Address Input bit 3

Port Address Input bit 2

Port Address Input bit 1

Port Address Input bit 0

PRTAD4

PRTAD3

PRTAD2

PRTAD1

PRTAD0

LASI

1.2 V

CMOS

1.2 V

CMOS

1.2 V

CMOS

1.2 V

CMOS

1.2 V

CMOS

Open Drain O

Link Alarm Status Interrupt Output.

Open Drain Compatible Output with

10 - 20 kΩ pull-up on host.

Logic high = Normal Operation

Logic low = Status Flag Triggered

RESET

Open Drain I

10

Reset Input.

Open Drain Compatible Input with

10 kΩ pull-up to APS internal to

transceiver.

Logic high = Normal Operation

Logic low = RESET

Note: 1.8 V is APS

Vendor

Specific

11,15,16,24 Vendor Specific Pins. Leave

unconnected when not used.

TX ON/OFF Open Drain I

12

TX ON/OFF Input.

Open Drain Compatible Input with

10 kΩ pull-up to APS internal to

transceiver.

Logic high = Transmitter On

Logic low = Transmitter Off

Note: 1.8 V is APS

MOD

O

14

Pulled low inside transceiver

DETECT

through a 1 kΩ resistor to Ground

Preliminary Product Information

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Pin Configuration

Pin Description (cont’d)

Signal Name Level

Transmit Functions

Reserved

I/O

Pin No.

Description

I

68

67

Reserved For Future Use

Reserved

TX LANE 3– AC-coupled, I

65

64

Module XAUI Input Lane 3–

Module XAUI Input Lane 3+

TX LANE 3+ Internally

I

biased

differential

XAUI

TX LANE 2–

TX LANE 2+

I

62

61

Module XAUI Input Lane 2–

Module XAUI Input Lane 2+

TX LANE 1–

TX LANE 1+

I

59

58

Module XAUI Input Lane 1–

Module XAUI Input Lane 1+

TX LANE 0–

TX LANE 0+

I

56

55

Module XAUI Input Lane 0–

Module XAUI Input Lane 0+

Receive Functions

Reserved

O

38

39

Reserved For Future Use

RX LANE 0+ AC-coupled, O

41

42

Module XAUI Output Lane 0+

Module XAUI Output Lane 0–

RX LANE 0– Internally

O

biased

differential

XAUI

RX LANE 1+

RX LANE 1–

O

44

45

Module XAUI Output Lane 1+

Module XAUI Output Lane 1–

RX LANE 2+

RX LANE 2–

O

47

48

Module XAUI Output Lane 2+

Module XAUI Output Lane 2–

RX LANE 3+

RX LANE 3–

O

50

51

Module XAUI Output Lane 3+

Module XAUI Output Lane 3–

Preliminary Product Information

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Pin Configuration

Pin Description (cont’d)

Signal Name Level

DC Power

I/O

Pin No.

Description

GND

0 V DC

I

1,2,3,33,34, Ground connection for signal

35,36,37,40, ground on the module

43,46,49,52,

53,54,57,60,

63,66,69,70

APS

+1.8 V

I

7,8,28,29

27

Input from Adaptive Power Supply

APS SENSE +1.8 V

O

APS Sense Output. Connected to

the APS input inside transceiver.

APS SET

GND

I

25

Feedback input from APS.

Connected to GND through a

zero Ω resistor inside the

transceiver.

3.3 V

5.0 V

+3.3 V DC

+5.0 V DC

I

5,6,30,31

4,32

DC Power Input, +3.3 V DC,

Nominal

DC Power Input, +5.0 V DC,

Nominal

Reserved

26

13

Reserved for APD. Do not connect.

Reserved. Do not connect.

Preliminary Product Information

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Description

System Block Diagram (10 Gbit/s Ethernet)

V

cc

Hot Swap Control

Data Management

MDIO

MDC

Management

Data Interface

BIST

Laser

DFB

10 Gbit/s

SerDes

&

CDR

+CMU

Driver

Laser

10GbE

MAC

+

10 Gbit/s Optical

(Single Mode

Fiber)

8B/10B

XGXS

4x 3.125 Gbit/s

SerDes

8B/10B

XGXS

4x

3.125 Gbit/s

SerDes

64B/66B

Encoder/

Decoder

XAUI

4x 3.125 Gbit/s

TIA

RS

LA

70-pin Edge

Connector

File: 2302

Figure 2

Optical Interface Standard Specifications

• IEEE 802.3ae™-2002 clause 52, 10GBASE-LR

• Fibre Channel 10GFC Draft 3.5, 1200-SM-LL-L

• X2 MSA Issue 1.0b

Fiber Type

Differential Group Delay

Maximum (ps)

Operating Range

(meters)¹⁾

B1.1 SMF

10

2 to 10,000

B1.3 SMF

1)

Operating range as defined by IEEE and Fibre Channel standards. Longer reach possible depending upon link

implementation.

Preliminary Product Information

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Description

Electrical Interface Standard Specifications

• IEEE 802.3ae™-2002 clause 45 & 47

• X2 MSA Issue 1.0b

Environment: Thermal Management Recommendations

Operating air inlet temperature:

Operating Airflow:

Operating Humidity:

0°C - 50°C

3.5 m/s maximum defined per X2 MSA

0% - 95% RH non-condensing

Module can withstand and operate with case temperature of 75°C for up to 96 hrs/yr.

Transceiver requires airflow across cooling fins. Maximum airflow required per X2 MSA

is 3.5 m/s. Actual airflow required to provide adequate cooling for Infineon transceiver

TBD.

Fibers and Connectors

The transceiver has SC receptacles for both Tx and Rx. The transceiver is designed for

single mode SC cables, 0° polished endface (PC).

70-pin Connector

The module interface connector is a 70-pin, printed circuit board edge connection with a

0.5 mm pitch. The appropriate mating connector for the customer PCB is a 70-pin SMT,

dual row, right angled, edge connector, 0.5 mm pitch (TycoAmp part number 1367337-1,

Molex part number 74441-0003 or equivalent).

Cage Requirement

The X2 rail system required to mount the X2 module is fully defined by the MSA.

Preliminary Product Information

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Description

DOM Parameters

Parameter

Values

Unit

min.

typ.

max.

Transceiver Temperature Monitor

Accuracy¹⁾

±5

°C

Transmit Bias Current Monitor Accuracy²⁾

Transmit Power Monitor Accuracy³⁾

Receive Power Monitor Accuracy³⁾

±10

±3

%

dB

±3

1)

0 to 70°C case temperature.

0 to 12.5 mA.

0 to 6.5 mW.

2)

3)

Regulatory Compliance

Feature

Standard

EIA/JESD22-A114-B

Comments

ESD:

Class 1a (> 500 V)

Electrostatic Discharge (MIL-STD 883D

to the Electrical Pins

(HBM)

Method 3015.7)

Immunity:

EN 61000-4-2

IEC 61000-4-2

Discharges ranging from ±2 kV to

±15 kV to the front end / faceplate /

receptacle cause no damage to

module (under recommended

conditions).

Against Electrostatic

Discharge (ESD) to the

Module Receptacle

Immunity:

Against Radio

Frequency

EN 61000-4-3

IEC 61000-4-3

With a field strength of 3 V/m, noise

frequency ranges from 10 MHz to

2 GHz. No effect on module

performance between the

specification limits.

Electromagnetic Field

Emission:

FCC 47 CFR

Noise frequency range:

Electromagnetic

Interference (EMI)

Part 15, Class B

EN 55022 Class B

CISPR 22

30 MHz to 40 GHz

Radiated emission does not exceed

specified limits when measured

inside a shielding enclosure with

MSA conform cutout.

Preliminary Product Information

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Technical Data

Absolute Maximum Ratings

Parameter

Symbol

Limit Values

Unit

min.

max.

85

65

80

6

Storage Ambient Temperature¹⁾

Operating Ambient Temperature¹⁾

Operating Case Temperature¹⁾

Supply Voltage +5.0 V

T_As

–20

0

°C

V

T_Ao

T_Co

V₅

0

Supply Voltage +3.3 V

V₃

0

4

V

Supply Voltage APS

V_aps

ST_d

Rx_{P max}

0

2

V

Static Discharge Voltage, All Pins

Average Receive Optical Power

500

1.5

V

dBm

1)

Non condensing.

Exceeding any one of these values may permanently destroy the device.

Recommended Operating Conditions

Parameter

Symbol

Values

typ.

Unit

min.

max.

70

Operating Case Temperature¹⁾T_C

0

°C

W

Transceiver Total Power

Consumption

3.3

3.5

P

Supply Voltage +5.0 V

Supply Current +5.0 V

Supply Voltage +3.3 V

Supply Current +3.3 V

Supply Voltage APS

V_CC5

I_CC5

4.75

3.14

1.746

5.0

50

5.25

3.47

1.854

V

mA

V

V_CC3

I_CC3

3.3

550

1.8

700

mA

V

V_{CC aps}

I_{CC aps}

Supply Current APS

mA

1)

Worst case thermal location, see Figure 9.

Preliminary Product Information

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Technical Data

Optical Characteristics

(V_CC5= 4.75 V to 5.25 V, V_CC3= 3.14 V to 3.47 V, V_{CC aps}= 1.746 V to 1.854 V, T_C= 0°C to 70°C)

Parameter

Symbol

Values

typ.

Unit

min.

max.

Transmitter

Launch Power in OMA minus

TDP

P_O-OMA

–6.2

dBm

Average Launch Power

Center Wavelength Range

Spectral Width (–20 dB)

Side Mode Suppression Ratio

Extinction Ratio

P_O-Avg

λ_C-Tx

σ_I

–8.2

–1

0.5

dBm

nm

1290

1310

0.5

1330

0.6

nm

SMSR

ER

30

dB

3.5

5

dB

Relative Intensity Noise₁₂OMA RIN

–128

dB/Hz

dBm

Optical Modulation Amplitude

(OMA)

OMA

–5.2

Transmitter and Dispersion

Penalty

TDP

3.2

dB

Average Launch Power of OFF P_O-OFF

–30

dBm

Transmitter

Optical Return Loss Tolerance ORL_T

12

dB

Transmitter Reflectance

Eye Mask Definition

REF_Tx

–12

According to IEEE and Fibre Channel

Receiver

Stressed Receiver Sensitivity

Sensitivity in OMA¹⁾

P_IN-S

–10.3

–12.6

0.5

dBm

dB

P_IN

Average Receive Power

Loss Of Signal Assert Level

Loss Of Signal Hysteresis

Receiver Reflectance

Center Wavelength Range

P_IN-max

P_LOSa

P_LOSh

REF_Rx

λ_C-Rx

–17

2

–13

4

1

–12

1355

12.3

dB

1260

nm

Electrical 3 dB Upper Cut-off

3dB_CO

GHz

Frequency

1)

Receiver sensitivity is informative only. Measured with an ideal transmitter.

Preliminary Product Information

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Technical Data

Electrical DC Characteristics

(V_CC5= 4.75 V to 5.25 V, V_CC3= 3.14 V to 3.47 V, V_{CC aps}= 1.746 V to 1.854 V, T_C= 0°C to 70°C)

Parameter

Symbol

Values

typ.

Unit

min.

max.

1.2 V CMOS (1.8 V CMOS Compatible¹⁾) I/O DC Characteristics

(PRTAD; LASI; RESET; TX_ONOFF)

External Pull-up Resistor for

Open Drain

Output High Voltage²⁾

Output Low Voltage²⁾

Input High Voltage

R_pullup

10

1

22

kΩ

V_oh

V_ol

V_ih

V_il

V

0.15

1.854

0.36

120

V

0.84

20

V

Input Low Voltage

Input Pull-down Current³⁾

V

I_pd

µA

XAUI I/O DC Characteristics

(TXLANE[0..3]; RXLANE[0..3])

Differential Input Amplitude

(pk-pk)⁴⁾

V_{in_xaui}

200

800

2500

1600

mV

Differential Output Amplitude

(pk-pk)⁴⁾

V_{out_xaui}

MDIO I/O DC Characteristics

(MDIO; MDC)

Output Low Voltage⁵⁾

Output Low Current

Input High Voltage

Input Low Voltage

Pull-up Supply Voltage

Input Capacitance

Load Capacitance

V_OL

I_OL

–0.3

0.2

V

4

mA

V

V_IH

0.84

–0.3

1.746

1.854

0.36

1.854

10

V_IL

V

V_PU

C_IN

1.8

V

pF

Ω

C_LOAD

R_LOAD

470

External Pull-up Resistance

200

1)

For 1.8 V CMOS V_oh= 1.65 V min., V_ol= 0.15 V max., V_ih= 1.17 V min., V_il= 0.63 V max.

_pull-up= 10 kΩ to 1.8 V.

V_in= 1.8 V.

2)

3)

4)

5)

R

AC coupled.

I

_OL= 100 µA.

Preliminary Product Information

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Technical Data

Electrical AC Characteristics

(V_CC5= 4.75 V to 5.25 V, V_CC3= 3.14 V to 3.47 V, V_{CC aps}= 1.746 V to 1.854 V, T_C= 0°C to 70°C)

Parameter

Symbol

Values

typ.

Unit

min.

max.

XAUI Input AC Characteristics

(TXLANE[0..3])

Baud Rate

R_XAUIIN

3.125

100

Gbit/s

ppm

Ω

Baud Rate Tolerance

Differential Input Impedance

Differential Return Loss¹⁾

Input Differential Skew²⁾

Jitter Amplitude Tolerance³⁾

R_TOLXAUI–100

100

120

Z_INXAUI

|S₁₁|

80

10

dB

t_SKEWIN

75

ps

J_XAUITOL

XAUI Output AC Characteristics

(RXLANE[0..3])

Baud Rate

R_XAUIIN

3.125

100

Gbit/s

ppm

ps

Baud Rate Variation

R_XAUIVAR–100

100

Rise and Fall Times

20% - 80%

t_r,t_f

40

Output Differential Skew

t_SKEWOUT

15

ps

Ω

Output Differential Impedance Z_OUTXAUI80

Differential Output Return Loss¹⁾|S₂₂|

10

Total Jitter⁴⁾

120

dB

UI

TJ_XAUI

DJ_XAUI

0.35

0.17

Deterministic Jitter⁴⁾

Power-On Reset AC Characteristics

Power-On Reset and

TX_ONOFF Characteristics

According to XENPAK MSA Issue 3.0 Draft 4.0,

2002-9-9

MDIO I/O AC Characteristics

(MDIO; MDC)

MDIO Data Hold Time

MDIO Data Setup Time

t_HOLD

t_SU

10

ns

Delay from MDC Rising Edge to t_DELAY

MDIO Data Change

300

2.5

MDC Clock Rate

f_MAX

MHz

1)

100 MHz to 2.5 GHz.

At crossing point.

Per IEEE 802.3ea.

At near-end. No pre-equalization. 1 UI = 320 ps.

2)

3)

4)

Preliminary Product Information

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Eye Safety

This laser based single mode transceiver is a Class 1 product. It complies with IEC

60825-1 and FDA 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser

Notice 50, dated July 26, 2001.

To meet laser safety requirements the transceiver shall be operated within the Absolute

Maximum Ratings.

Attention: All adjustments have been made at the factory prior to shipment of the

devices. No maintenance or alteration to the device is required.

Tampering with or modifying the performance of the device will result

in voided product warranty.

Note: Failure to adhere to the above restrictions could result in a modification that is

considered an act of “manufacturing”, and will require, under law, recertification of

the modified product with the U.S. Food and Drug Administration (ref. 21 CFR

1040.10 (i)).

Preliminary Product Information

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Application Notes

File: 2517

Dimensions in mm

Figure 3

PCB Cage Footprint

Preliminary Product Information

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Application Notes

File: 2518

Dimensions in mm

Figure 4

Host PCI Bezel Opening

Preliminary Product Information

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Application Notes

GND

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

GND

1

2

GND

RESERVED

GND

3

5.0 V

4

3.3 V

5

TX LANE3−

TX LANE3+

GND

3.3 V

6

APS

7

APS

8

TX LANE2−

TX LANE2+

GND

LASI

9

RESET

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

VEND SPECIFIC

TX ON/OFF

RESERVED

MOD DETECT

VEND SPECIFIC

MDIO

TX LANE1−

TX LANE1+

GND

TX LANE0−

TX LANE0+

GND

MDC

Toward Bezel

GND

PRTAD4

PRTAD3

PRTAD2

PRTAD1

PRTAD0

VEND SPECIFIC

APS SET

RESERVED

APS SENSE

APS

RX LANE3−

RX LANE3+

GND

RX LANE2−

RX LANE2+

GND

RX LANE1−

RX LANE1+

GND

RX LANE0−

RX LANE0+

GND

APS

3.3 V

RESERVED

GND

5.0 V

GND

Lower Row

Upper Row

File: 2505

Figure 5

Host Board Pad Layout

Preliminary Product Information

18

2004-02-24

V23833-E0124-A001

V23833-E0134-A001

Package Outlines

Dimensions in mm

File: 2209

Figure 6

Mechanical Dimensions - High Personality

Preliminary Product Information

19

2004-02-24

V23833-E0124-A001

V23833-E0134-A001

Package Outlines

Dimensions in mm

File: 2208

Figure 7

Mechanical Dimensions - Mid Personality

17.45

Laser class

Description

Part number

33.5

Country of origin

YYYY:

WW:

nnnnnnnn: serial number

year of production

week of production

Optional marking

(MS/ES)

MMMMM: month of production

Dimensions in mm

File: 2401

Figure 8

Label Description

Preliminary Product Information

20

2004-02-24

V23833-E0124-A001

V23833-E0134-A001

Package Outlines

Dimensions in mm

File: 2205

Figure 9

X2 Temperature Reference Point

Preliminary Product Information

21

2004-02-24

V23833-E0124-A001

V23833-E0134-A001

Revision History:

2004-02-24

DS0

Previous Version:

none

Page

Subjects (major changes since last revision)

Edition 2004-02-24

Published by Infineon Technologies AG,

St.-Martin-Strasse 53,

81669 München, Germany

Attention please!

The information herein is given to describe certain components and shall not be considered as a guarantee of

characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding

circuits, descriptions and charts stated herein.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.


型号：	V23833-E0124-A001
厂家：	Infineon
描述：	Transceiver 光纤
文件：	总22页 (文件大小：646K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

V23833-E0124-A001 [INFINEON]

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