KC80526NY650128 [INTEL]

Microprocessor, 32-Bit, 650MHz, CMOS, PBGA495, BGA2-495;


型号：	KC80526NY650128
厂家：	INTEL
描述：	Microprocessor, 32-Bit, 650MHz, CMOS, PBGA495, BGA2-495
文件：	总2页 (文件大小：178K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

product brief

Intel^®Celeron^®Processor - Low

Power for Applied Computing

Product Highlights

300 MHz and 400 MHz:

Built on the Intel 0.18 micron process

128K Full speed on-die L2 cache operating

at core frequency

Low profile, surface mount BGA package

BGA (31 x 27 x 2.5mm), (BGA2)

495 leads in area array

Tcase: 0 to 100C

650 MHz:

Ultra-Low Voltage 650 MHz

Built on the Intel 0.13 micron process

650 MHz processor speed

256K Full speed on-die L2 cache operating at

core frequency

100 MHz processor side bus

Low profile, surface mount µFCBGA package

8.3W TDP (max), 7.0W TDP (typ)

µFCBGA package (35 x 35 mm)

Supported with Intel 440MX and Intel 815E

chipsets

479 balls in area array

Tcase: 0 to 100C

Product Overview

Functional features

MMX technology

The Intel^®Celeron^®processors - Low Power,

Ultra Low Power and Ultra Low Voltage now

Floating Point Unit (FPU)

Dynamic Execution Micro-Architecture

provide an exceptional value for thermally

sensitive and space constrained applied

computing applications by combining the

optimal balance of cost, performance, and low

power. Available in the small form factor BGA

package at 300 and 400 MHz with 128K of

on-die L2 cache or the µFCBGA package at

650 MHz with 256K of on-die L2 cache. These

features make it ideal for value-based, low-

profile, low-power applied computing

applications, such as data communications,

telecommunications, industrial automation and

transaction terminals.

The 300 MHz processor, at just 1.1V and 5.7

W TDP (max), and the 650 MHz processor,

also at 1.1V and with a 8.3W TDP (max), are

ideal solutions for communication appliances

such as set-top boxes, network attached

storage, web pads and other applications with

lower power envelopes and BOM

On-Die L2 Cache with Error Checking and

Correcting (ECC)

Low Power 400 MHz

400 MHz processor speed

100 MHz processor side bus

10.1W TDP (max). 6.5 W TDP (typ)

Supported with the Intel 815, Intel 815E,

Intel^®440BX AGPset and Intel^®440MX

Chipsets

Ultra-Low Power 300 MHz

300 MHz processor speed

100 MHz processor side bus

5.7W TDP (max), 4.2 W TDP (typ)

Supported with the Intel 815, Intel 815E, and the

Intel 440MX Chipsets

requirements.

Product Description

The Embedded Intel^®Architecture low power family features a 100 MHz processor side bus, designed for a faster transfer of data,

to yield an increase in performance. The 128K/256K of on-die L2 cache combined with the efficiencies of the 0.18 and 0.13 micron

manufacturing processes offers good low power processor performance for value based systems. The compact form factor results in a

low profile, meeting small space requirement. This enables a variety of value-based designs for thermally sensitive and space

constrained environments.

I N T E L C E L E R O N P R O C E S S O R S - L O W P O W E R , U LT R A L O W P O W E R ,

& U LT R A L O W V O LTA G E

CORE SPEED

(MHz)

EXTERNAL

BUS SPEED (MHz)

CACHE

THERMAL DESIGN

POWER (MAX)

PRODUCT NUMBER

VOLTAGE

T^CASE

PACKAGE

RJ80530VY650256

KC80526LY400128

KC80526LL300128

650

400

300

100

256K

128K

8.3 watts

10.1 watts

5.7 watts

1.1V

1.35V

1.1V

0-100C

479 µFCBGA

495 BGA

CORE SPEED

EXTERNAL

THERMAL DESIGN

Intel Access

Developer’s Site

developer.intel.com

Embedded Intel^®Architecture Home Page

developer.intel.com/design/intarch

developer.intel.com/design/litcentr

Other Intel Support:

Intel Literature Center

(800) 548-4725 7a.m. to 7 p.m. CST (U.S. and Canada)

International locations please contact your local sales office.

General Information Hotline

(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST

Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise,

to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such

products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel

products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent,

copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

Intel, the Intel logo, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or

other countries.

*Other names and brands may be claimed as the property of others.

For more information, visit the Intel Web site at: developer.intel.com

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Intel Corporation

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Printed on Recycled Paper

Order Number: 273348-003 Printed in USA/0502/LM/AvM/IL20707C/500

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